production section work and discription, it's different section work and section disscription with their work.This presentation is mainly cover hall production
4. S.M.T section
• full form is Surface mount technology.
• For reduce the size of electronic device.
• Components having size in mm.
• Work is done by machines.
• Less manpower
• Work progress is very fluent
5. Process flow of S.M.T
ROW materials
Stencil printing
Finished good material
Peak and placed row material
Rework material
Reflow oven
8. Driver section
• electronic components manually placed
• Man power > machinery
• Error is high
• Work progress is good but less then S.M.T
section
• Finished good of S.M.T is used as a semi
finished good
9. Process flow of driver section
Pre forming area
M.I section
Finished good material(driver)
Wave soldering
epoxy section
Touch up section
10. raw material
S.M.T row material
• S.M.T Resisters
• S.M.T Diodes
• S.M.T Integrated circuit
• Led chip
• Soldering pest
• PCB
• S.M.D red glue
Driver raw material
• Resistors
• Diodes
• Integrated circuit
• Inductors
• Transformers
• Soldering wire
• flux
• N.T.C
• M.O.V
• Capacitors(ceramic and box
)
11.
12. • LED(light emitting diode):-chip of semiconductor(GaAs)
material-coated with phosphors
- p-n junction create with doped impurities
- Holes and electrons meet and photon is emitted
- Emitted Wavelength decide color(band gape)
- Reflective index made up of silicon
Color Wavelength range (nm) (lm/W)
- Red 620 < λ < 645 72
- Red-orange 610 < λ < 620 98
- Green 520 < λ < 55 93
- Cyan 490 < λ < 520 75
- Blue 460 < λ < 490 37
13. • Lumanous: how much visible lights are emit
by led chip.
• There is three type of led chip
• This is Temprature at which Aluminium emit
wavelength of this color
1. Warm white-3000k-900lm
2. Natural white-4000k-960lm
3. Cool day light-6000k-1000lm
• Resister:Typical examples of resistance codes
• 102 = 10 00 = 1,000 Ω = 1 kΩ
• 0R2 = 0.2 Ω
14. • S.M.T Capacitor: color give a knowledge of
value
o Light grey< 100 pF.
o Medium grey colour- 10 pF to 10 nF.
o Light brown colour- 1 nF to 100 nF.
o Medium brown colour - 10 nF to 1 μF.
o Dark brown colour- 100 nF to 10 μF.
o Dark grey colour-0.5 to 50 μF
16. Extruder section
• Diffuser and base is manufacture
• Square, round and mushroom type of diffuser
• 5.5 mm,6.6 mm,9.5 mm PCB slot
• 1 foot,2 foot,3 foot and 4 foot pcb
• Only diffuser is also manufacture for
aluminum base
• Machinery work
17. Process flow of extruder
Row materials(et-3117,et-3113)
Extruder process
Finished good material(housing)
Material cutting
Holing for holding and driver wire
20. Process flow of Assembly section
1) RM from various dept. and Store according to the BOM
2) Preparing SFG from RM through Assembly processes
3) SFG is put under Ageing
4) SFG undergoes Packing Processes
5) FG prepared
6) Dispatching FG to Stores
21. Assembly overview
C.O.B (round and square)packing
• Housing
• P.C.B
• Diffuser
• L.G.P
• White paper(reflector)
• Black spunch
• Driver
• i/p ,o/p wires
Batten packing
• Housing(base and diffuser)
• Driver
• Insulating material on
driver
• i/p & o/p wires
22. • High voltage test:130v,240v and 270v
batten- 3 hour
panel- 2 hour aging or burning process is taken
place
• Printing -automatic ink injector printer(date
and year)
-lesser printer (logo and driver
printing)
• Packaging-mini box and master box packing
with tape and strip