8. 8
Chuck stage flatness-Surface Profiler
產品特徵
Chuck stage 表面平坦度,
將會影響晶圓製程良率,
尤其20奈米級以下製程規
格更在意。我們提供檢測
的解決方案。
• 系統解析:1.91 um
• FOV : 1.222 mm x
0.917 mm
Example
9. 9
New system – Datamanager
• Inspection / Review equipments interface
• Standardization of defect data format
• In-line defect monitoring
• Data upload to DMS / MES
• User friendly operation
10. 10
New system – Wafer loader
• Use for 2” ~8” wafer size
• Can connect mostly measurement system
• Customized design
11. 11
New system – LS100
• Use for LED sapphire wafer
• Auto detect and calculate the defect ,
reduce human mistake
• Programmable data report
• High throughput and accuracy
12. 12
New system – 3D IC overlay
•Front to back side overlay metrology solution
Overlay verification and CD measurement for
3D IC / WLP up to full field 300 mm wafer
•Easy, fast, high precision
Excellent optical design for easy use and fast
measurement with high precision
•Diverse analysis options
Feature diverse overlay marks analysis options
13. 13
New system – AVI smart machine system
•Wafer movement position identify
system
• Use for all equipment and all
wafer transfer module.
• Use CMOS CCD to record the
wafer movement trajectory.
• Use artificial intelligence to identify
the robot or mechanical system
malfunction.
15. 15
Contact Us
Thank you for support CXsemi, if you have any inquiry, please contact:
Ivan Hsieh Ptero Hsiao
(Sales Manager) (Application Leader)
Tel: +886-3-6589877 ext. 19 Tel: +886-3-6589877 ext.18
Mobile: +886-935-997380 Mobile: +886-978-192115
E-mail: ivan.hsieh@cxsemi.com.tw E-mail: ptero.hsiao@cxsemi.com.tw
Addres
1F., No.15, Ziqiang 3rd Rd., Zhubei City, Hsinchu County 30264,Taiwan (R.O.C)