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CXsemi Company Limited
Company Profile
Version: 2010 November
2
Company Overview
• Company name
CXsemi Company Limited
• Capital
US$650,000
• Establish : 2010
• Employee number : 8
• Website
www.cxsemi.com.tw
3
Our customer
• smic / tsmc / unisem / unionsemi
• IC : tsmc / umc / visc / mxic / psc / ASE / spil / amkor
• Epi : epsil / waferworks
• GaAs : Win / vpec / awsc
• Touch panel & PCB : TPK / unimicron
Taiwan area
China area
Japan / Singapore / Malaysia area
• Sony / Yamaha / Epson / Fuji / unisemi
4
Technology Service
Used tool
K-T
SFS6420
Nikon OM
New system
Surface
profiler
Film
Thickness
metrology
Chuck
stage
flatness
Smart vision
system
Robot
monitor
Cassette
mapping
Industry
4.0
5
晶圓表面輪廓儀 Surface Profiler
產品特徵
• 非接觸式形貌量測
( Optical profiler , non-contact )
• 高速擷取全域晶圓
( One shot image for the whole area)
• 高量測重複再現性
• 晶圓膜層應力分析
6
Warp and stress metrology
Resolution 0.1 μm
Bow accuracy ±2 μm
Warp accuracy ±2 μm
Measurement time About 10 seconds per wafer @ 8-inch
wafer 300 /hr
Surface Polish surface
Function Line profile measurement、film stress
conversion 、2D plot、3D plot
Warp and stress metrology
7
Warp and stress metrology
膜厚儀 Film thickness metrology
8
Chuck stage flatness-Surface Profiler
產品特徵
Chuck stage 表面平坦度,
將會影響晶圓製程良率,
尤其20奈米級以下製程規
格更在意。我們提供檢測
的解決方案。
• 系統解析:1.91 um
• FOV : 1.222 mm x
0.917 mm
Example
9
New system – Datamanager
• Inspection / Review equipments interface
• Standardization of defect data format
• In-line defect monitoring
• Data upload to DMS / MES
• User friendly operation
10
New system – Wafer loader
• Use for 2” ~8” wafer size
• Can connect mostly measurement system
• Customized design
11
New system – LS100
• Use for LED sapphire wafer
• Auto detect and calculate the defect ,
reduce human mistake
• Programmable data report
• High throughput and accuracy
12
New system – 3D IC overlay
•Front to back side overlay metrology solution
Overlay verification and CD measurement for
3D IC / WLP up to full field 300 mm wafer
•Easy, fast, high precision
Excellent optical design for easy use and fast
measurement with high precision
•Diverse analysis options
Feature diverse overlay marks analysis options
13
New system – AVI smart machine system
•Wafer movement position identify
system
• Use for all equipment and all
wafer transfer module.
• Use CMOS CCD to record the
wafer movement trajectory.
• Use artificial intelligence to identify
the robot or mechanical system
malfunction.
14
Smart vision system---Robot with wafer
-2
0
2
振幅位移mm
15
Contact Us
Thank you for support CXsemi, if you have any inquiry, please contact:
Ivan Hsieh Ptero Hsiao
(Sales Manager) (Application Leader)
Tel: +886-3-6589877 ext. 19 Tel: +886-3-6589877 ext.18
Mobile: +886-935-997380 Mobile: +886-978-192115
E-mail: ivan.hsieh@cxsemi.com.tw E-mail: ptero.hsiao@cxsemi.com.tw
Addres
1F., No.15, Ziqiang 3rd Rd., Zhubei City, Hsinchu County 30264,Taiwan (R.O.C)

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CXsemi profile -201601

  • 1. 1 CXsemi Company Limited Company Profile Version: 2010 November
  • 2. 2 Company Overview • Company name CXsemi Company Limited • Capital US$650,000 • Establish : 2010 • Employee number : 8 • Website www.cxsemi.com.tw
  • 3. 3 Our customer • smic / tsmc / unisem / unionsemi • IC : tsmc / umc / visc / mxic / psc / ASE / spil / amkor • Epi : epsil / waferworks • GaAs : Win / vpec / awsc • Touch panel & PCB : TPK / unimicron Taiwan area China area Japan / Singapore / Malaysia area • Sony / Yamaha / Epson / Fuji / unisemi
  • 4. 4 Technology Service Used tool K-T SFS6420 Nikon OM New system Surface profiler Film Thickness metrology Chuck stage flatness Smart vision system Robot monitor Cassette mapping Industry 4.0
  • 5. 5 晶圓表面輪廓儀 Surface Profiler 產品特徵 • 非接觸式形貌量測 ( Optical profiler , non-contact ) • 高速擷取全域晶圓 ( One shot image for the whole area) • 高量測重複再現性 • 晶圓膜層應力分析
  • 6. 6 Warp and stress metrology Resolution 0.1 μm Bow accuracy ±2 μm Warp accuracy ±2 μm Measurement time About 10 seconds per wafer @ 8-inch wafer 300 /hr Surface Polish surface Function Line profile measurement、film stress conversion 、2D plot、3D plot Warp and stress metrology
  • 7. 7 Warp and stress metrology 膜厚儀 Film thickness metrology
  • 8. 8 Chuck stage flatness-Surface Profiler 產品特徵 Chuck stage 表面平坦度, 將會影響晶圓製程良率, 尤其20奈米級以下製程規 格更在意。我們提供檢測 的解決方案。 • 系統解析:1.91 um • FOV : 1.222 mm x 0.917 mm Example
  • 9. 9 New system – Datamanager • Inspection / Review equipments interface • Standardization of defect data format • In-line defect monitoring • Data upload to DMS / MES • User friendly operation
  • 10. 10 New system – Wafer loader • Use for 2” ~8” wafer size • Can connect mostly measurement system • Customized design
  • 11. 11 New system – LS100 • Use for LED sapphire wafer • Auto detect and calculate the defect , reduce human mistake • Programmable data report • High throughput and accuracy
  • 12. 12 New system – 3D IC overlay •Front to back side overlay metrology solution Overlay verification and CD measurement for 3D IC / WLP up to full field 300 mm wafer •Easy, fast, high precision Excellent optical design for easy use and fast measurement with high precision •Diverse analysis options Feature diverse overlay marks analysis options
  • 13. 13 New system – AVI smart machine system •Wafer movement position identify system • Use for all equipment and all wafer transfer module. • Use CMOS CCD to record the wafer movement trajectory. • Use artificial intelligence to identify the robot or mechanical system malfunction.
  • 14. 14 Smart vision system---Robot with wafer -2 0 2 振幅位移mm
  • 15. 15 Contact Us Thank you for support CXsemi, if you have any inquiry, please contact: Ivan Hsieh Ptero Hsiao (Sales Manager) (Application Leader) Tel: +886-3-6589877 ext. 19 Tel: +886-3-6589877 ext.18 Mobile: +886-935-997380 Mobile: +886-978-192115 E-mail: ivan.hsieh@cxsemi.com.tw E-mail: ptero.hsiao@cxsemi.com.tw Addres 1F., No.15, Ziqiang 3rd Rd., Zhubei City, Hsinchu County 30264,Taiwan (R.O.C)