The key market players in the global radiation-hardened electronics for space applications market include 3D Plus (HEICO Corporation), Analog Device, Anaren Inc (TTM Technologies), BAE Systems, Cobham PLC, Data Device Corporation, Exxelia, General Dynamics, GSI Technology, Microchip Technology, Micropac Industries, Renesas Electronics Corporation, Solid State Devices Inc, STMicroelectronics, and Teledyne Technologies Incorporated among others.
The radiation-hardened electronics for space applications market is segregated into four major regions, namely North America, Europe, Asia-Pacific, and Rest-of-the-World. Data for each of these regions, along with country-level analyses, is provided in the market study.
View the full report of radiation-hardened electronics for space applications market made by Bis Research:
https://bisresearch.com/industry-report/radiation-hardened-electronics-space-applications-market.html
Download the sample report on radiation-hardened electronics for space applications market, exclusively made by Bis Research:
https://bisresearch.com/requestsample?id=1266&type=toc
How to Troubleshoot Apps for the Modern Connected Worker
Toc Key Companies in the Global Radiation Hardened Electronics for the Space Applications Industry
1. 1
All rights reserved at BIS Research Inc.
S
p
a
c
e
c
r
a
f
t
R
a
d
i
a
t
i
o
n
H
a
r
d
e
n
e
d
E
l
e
c
t
r
o
n
i
c
s
M
a
r
k
e
t
https://pxhere.com/en/photo/893729
Focus on Platform, Manufacturing
Technique, Material Type, and
Component Analysis and Forecast
2022-2032
April 2022
Radiation Hardened
Electronics for Space
Applications Market –
A Global Market
Analysis
Table of Content
3. 3
All rights reserved at BIS Research Inc.
S
p
a
c
e
c
r
a
f
t
R
a
d
i
a
t
i
o
n
H
a
r
d
e
n
e
d
E
l
e
c
t
r
o
n
i
c
s
M
a
r
k
e
t
Table of Content
Executive Summary
1. Markets
1.1 Industry Outlook
1.1.1 Radiation Hardened Market: Overview
1.1.1.1 New Space: An emerging business opportunity for LEO-focused small
satellites and Deep Space Missions
1.1.2 Comparison of Radiation-Hardened Products Standard
Requirements and Regulations (by End User)
1.1.3 Ongoing radiation hardening efforts in the space industry
1.1.4 Current and Futuristic Trends
1.1.5 Radiation-Hardened Electronics Manufacturers and Certifications
1.1.6 Value Chain Analysis
1.2 Business Dynamics
1.2.1 Business Drivers
1.2.2 Business Challenges
1.2.3 Business Strategies
1.2.3.1 Business Strategies
1.2.3.2 Corporate Strategies
1.2.4 Business Opportunities
2. Application
2.1 Global Radiation-Hardened Electronics for Space Applications
Market– by Platform
2.1.1 Market Overview
2.1.2 Demand Analysis of Radiation Hardened Electronics for Space
Applications Market by Platform
2.1.3 Satellite
2.1.3.1 Small Satellites (0-500 kg)
2.1.3.2 Medium Satellites (501-1,000 kg)
2.1.3.3 Large Satellites (1,001 kg and Above)
4. 4
All rights reserved at BIS Research Inc.
S
p
a
c
e
c
r
a
f
t
R
a
d
i
a
t
i
o
n
H
a
r
d
e
n
e
d
E
l
e
c
t
r
o
n
i
c
s
M
a
r
k
e
t
2.1.4 Launch Vehicle
2.1.4.1 Small and Medium Lift Launch Vehicle
2.1.4.2 Heavy Lift Launch Vehicle
2.1.5 Deep Space Probes
2.1.5.1 Lander
2.1.5.2 Rover
2.1.5.3 Orbiter
2.1.5.4 Space Station
3. Products
3.1 Global Radiation-Hardened Electronics for Space Applications Market –
by Manufacturing Technique
3.1.1 Demand Analysis of Radiation-Hardened Electronics for Space
Applications Market by Manufacturing Technique
3.1.2 Rad-Hard by Design (RHBD)
3.1.3 Rad-Hard by Process (RHBP)
3.1.4 Rad-Hard by Software (RHBS)
3.2 Global Radiation-Hardened Electronics for Space Applications Market-
By Material Type
3.2.1 Demand Analysis of Radiation-Hardened Electronics for Space
Applications Market by Material Type
3.2.2 Silicon
3.2.3 Gallium Nitride
3.2.4 Silicon Carbide
3.2.5 Others
3.3 Global Radiation-Hardened Electronics for Space Applications Market-
by Component
3.3.1 Microprocessors and Controllers
3.3.2 Discrete Semiconductors
3.3.3 Power Sources
3.3.4 Memory
3.3.5 Field-Programmable Gate Array
5. 5
All rights reserved at BIS Research Inc.
S
p
a
c
e
c
r
a
f
t
R
a
d
i
a
t
i
o
n
H
a
r
d
e
n
e
d
E
l
e
c
t
r
o
n
i
c
s
M
a
r
k
e
t
3.3.6 Analog and Mixed Signals
3.3.7 Application-Specific Integrated Circuit
3.3.8 Sensors
3.3.9 Others
4. Region
4.1 Global Radiation-Hardened Electronics for Space Applications Market
(by Region)
4.2 North America
4.2.1 Markets
4.2.1.1 Key Manufacturers and Suppliers in North America
4.2.1.2 Business Drivers
4.2.1.3 Business Challenges
4.2.2 Application
4.2.2.1 North America Radiation-Hardened Electronics for Space Applications
Market (by Platform)
4.2.3 North America (by Country)
4.2.3.1 U.S.
4.2.3.1.1 Markets
4.2.3.1.1.1 Key Manufacturers in the U.S.
4.2.3.1.2 Application
4.2.3.1.2.1 U.S. Radiation-Hardened Electronics for Space Applications Market (by
Platform)
4.2.4.2 Canada
4.2.4.2.1 Markets
4.2.3.1.1.1 Key Manufacturers in Canada
4.2.4.2.2 Application
4.2.4.2.2.1 Canada Radiation-Hardened Electronics for Space Applications Market
(by Platform)
4.3 Europe
4.3.1 Markets
4.3.1.1 Key Manufacturers and Suppliers in Europe
6. 6
All rights reserved at BIS Research Inc.
S
p
a
c
e
c
r
a
f
t
R
a
d
i
a
t
i
o
n
H
a
r
d
e
n
e
d
E
l
e
c
t
r
o
n
i
c
s
M
a
r
k
e
t
4.3.1.2 Business Drivers
4.3.1.3 Business Challenges
4.3.2 Application
4.3.2.1 Europe Radiation-Hardened Electronics for Space Applications Market
(by Platform)
4.3.4 Europe (by Country)
4.3.4.1 France
4.3.4.1.1 Markets
4.3.4.1.1.1 Key Manufacturers in France
4.3.4.1.2 Application
4.3.4.1.2.1 France Radiation-Hardened Electronics for Space Applications Market
(by Platform)
4.3.4.2 Germany
4.3.4.2.2 Markets
4.3.4.2.2.1 Key Manufacturers in Germany
4.3.4.2.3 Application
4.3.4.2.3.1 Germany Radiation-Hardened Electronics for Space Applications Market
(by Platform)
4.3.4.3 Russia
4.3.4.3.1 Markets
4.3.4.3.1.1 Key Manufacturers in Russia
4.3.4.3.2 Application
4.3.4.3.2.1 Russia Radiation-Hardened Electronics for Space Applications Market
(by Platform)
4.3.4.4 U.K.
4.3.4.4.1 Markets
4.3.4.4.1.1 Key Manufacturers in the U.K.
4.3.4.4.2 Application
4.3.4.4.2.1 U.K. Radiation-Hardened Electronics for Space Applications Market (by
Platform)
4.3.4.5 Rest-of-Europe
7. 7
All rights reserved at BIS Research Inc.
S
p
a
c
e
c
r
a
f
t
R
a
d
i
a
t
i
o
n
H
a
r
d
e
n
e
d
E
l
e
c
t
r
o
n
i
c
s
M
a
r
k
e
t
4.3.4.5.1 Markets
4.3.4.5.1.1 Key Manufacturers in Rest-of-Europe
4.3.4.5.2 Application
4.3.4.5.2.1 Rest-of-Europe Radiation-Hardened Electronics for Space Applications
Market (by Platform)
4.4 Asia-Pacific
4.4.1 Markets
4.4.1.1 Key Manufacturers and Suppliers in Asia-Pacific
4.4.1.2 Business Drivers
4.4.1.3 Business Challenges
4.4.2 Application
4.4.2.1 Asia-Pacific Radiation-Hardened Electronics for Space Applications
Market (by Platform)
4.4.3 Asia-Pacific (by Country)
4.4.3.1 China
4.4.3.1.1 Markets
4.4.3.1.1.1 Key Manufacturers in China
4.4.3.1.2 Application
4.4.3.1.2.1 China Radiation-Hardened Electronics for Space Applications Market
(by Platform)
4.4.3.2 India
4.4.3.2.1 Markets
4.4.3.2.1.1 Key Manufacturers in China
4.4.3.2.2 Application
4.4.3.2.2.1 India Radiation-Hardened Electronics for Space Applications Market (by
Platform)
4.4.3.3 Japan
4.4.3.3.1 Markets
4.4.3.3.1.1 Key Manufacturers in Japan
4.4.3.3.2 Application
8. 8
All rights reserved at BIS Research Inc.
S
p
a
c
e
c
r
a
f
t
R
a
d
i
a
t
i
o
n
H
a
r
d
e
n
e
d
E
l
e
c
t
r
o
n
i
c
s
M
a
r
k
e
t
4.4.3.3.2.1 Japan Radiation-Hardened Electronics for Space Applications Market
(by Platform)
4.4.3.4 Rest-of-Asia-Pacific
4.4.3.4.1 Markets
4.4.3.4.1.1 Key Manufacturers in Rest-of-Asia-Pacific
4.4.3.4.2 Application
4.4.3.4.2.1 Rest-of-Asia-Pacific Radiation-Hardened Electronics for Space
Applications Market (by Platform)
4.5 Rest-of-the-World
4.5.1 Markets
4.5.1.1 Business Drivers
4.5.1.2 Business Challenges
4.5.2 Application
4.5.2.1 Rest-of-the-World Radiation-Hardened Electronics for Space Applications
Market (by Application)
4.5.3 By Country
4.5.3.1 The Middle East and Africa
4.5.3.1.1 Key Manufacturers in the Middle East and Africa
4.5.3.1.2 Application
4.5.3.1.2.1 Middle East and Africa Radiation-Hardened Electronics for Space Applications
Market (by Platform)
4.5.3.2 South America
4.5.3.2.1 Key Manufacturers in South America
4.5.3.2.2 Application
4.5.3.2.2.1 South America Radiation-Hardened Electronics for Space Applications Market (by
Platform)
5. Markets - Competitive Benchmarking & Company Profiles
5.1 Market Share Analysis
5.2 Company Profiles
5.2.1 3D Plus (HEICO Corporation)
9. 9
All rights reserved at BIS Research Inc.
S
p
a
c
e
c
r
a
f
t
R
a
d
i
a
t
i
o
n
H
a
r
d
e
n
e
d
E
l
e
c
t
r
o
n
i
c
s
M
a
r
k
e
t
5.2.2 Analog Devices Inc.
5.2.3 Anaren Inc. (TTM Technologies).
5.2.4 BAE Systems
5.2.5 Cobham plc
5.2.6 Data Device Corporation
5.2.7 Exxelia
5.2.8 General Dynamics
5.2.9 GSI Technology
5.2.10 Microchip Technology Inc
5.2.11 Micropac Industries Inc.
5.2.12 Renesas Electronics Corporation
5.2.13 Solid State Devices Inc.
5.2.14 STMicroelectronics N.V
5.2.15 Teledyne Technologies Incorporated
5.2.16 Other Key Players
5.2.16.1 Texas Instruments Inc.
5.2.16.2 Maxim Integrated
5.2.16.3 Xilinx Inc.
5.2.16.4 Digikey
5.2.16.5 Vishay Intertechnology Inc.
5.2.16.6 Vorago Technologies
5.2.16.7 EPC Space LLC
5.2.16.8 VPT Inc.
6. Growth Opportunities & Recommendations
7. Research Methodology
10. 10
All rights reserved at BIS Research Inc.
S
p
a
c
e
c
r
a
f
t
R
a
d
i
a
t
i
o
n
H
a
r
d
e
n
e
d
E
l
e
c
t
r
o
n
i
c
s
M
a
r
k
e
t
Disclaimer
BIS Research Inc. provides valuable market intelligence to an exclusive group of customers in response to
orders. The report is licensed for the customer's internal use only and is subject to restrictions set henceforth.
This document and its contents are confidential and may not be further distributed, published or reproduced,
in whole or in part, by any medium or in any form for any purpose, without the express written consent of BIS
Research Inc. Customer will not disclose the contents of the report, whether directly in any media or indirectly
through incorporation in a database, marketing list, report or otherwise, or use or permit the use of Information
to generate any statistical or other information that is or will be provided to third parties; or voluntarily produce
Information in legal proceedings.
Market reports are based on expectations, estimates and projections as of the date such information is
available. Any recommendation contained in this report may not be suitable for all investors or businesses.
The market conclusions drawn are necessarily based upon a number of estimates and assumptions that, while
considered reasonable by BIS Research Inc. as of the date of such statements, are inherently subject to
market fluctuations and business, economic and competitive uncertainties and contingencies
For more details regarding permission, please contact us:
Email: sales@bisresearch.com
Tel: +1 510 404 8135
11. 11
All rights reserved at BIS Research Inc.
S
p
a
c
e
c
r
a
f
t
R
a
d
i
a
t
i
o
n
H
a
r
d
e
n
e
d
E
l
e
c
t
r
o
n
i
c
s
M
a
r
k
e
t
BIS RESEARCH INC.
39111 Paseo Padre PKWY, Suite 313 Fremont, CA 94538 -1686
E-mail: hello@bisresearch.com | Call Us: +1-510-404-8135
Global Delivery Center
Tower B First Floor, Tapasya Corporate Heights, Greater Noida Expressway,
Sector 126, Noida, U.P., 201303, India
Tel: +91 120 4261540 / 4261544
www.bisresearch.com