Ceprei march 2016

www.ecccorp.orgwww.iecq.org
• IECQ Annual Meeting Singapore April 2015.
• Presented v.2.0 to IECQ Exec - then at MC.
• At MC Dr Wan, CEPREI offers to be Convener WG.
• IECQ Chairwomen states Product too mature for WG.
• IECQ Secretary Links ECCC and BSI for AC Specification.
• September 2015: IECQ Spec. e-Labelling Published.
• June 2015: USNC Launches E-Label WG, Dell Convener.
• Schrempp (Dell) and ECCC each present at USNC Council.
• ITI published draft Standard. ECCC www.e-Labelling.com
• Schrempp agrees ITI and ECCC should Harmonize efforts.
History of ECCC e-Labelling

Current List of ITI Members

National Interest: e-Labelling
Per ITI: These countries have e-Labelling initiatives
• US
• Canada
• Malaysia
• Australia
• China
• Taiwan
• South Korea
• EU
Most are following similar paths to the US.

What is E Label?
• E Label is:
• Enhanced Labelling, Accessing, and Branding of Electronics Licenses Act of 2014
• “Directs FCC to provide (through rules or otherwise) that manufacturers of RF devices with
electronic displays (i.e. Screens) have the option of using electronic labelling instead of
physical labelling for their product”.
• E-LABEL Act’s stated purpose is to “provide for the non-exclusive use” of electronic
labelling on RF devices.
• Its reach is not limited to devices subject to certification or DECLATATION OF
CONFORMITY, so products currently subject to verification can now have the electronic
labeling option as well.
• ECCC acquired Domains E-LABEL.UK and E-LABELLING.COM

E-Labelling Standard
E-Labelling may be affixed to or
laser marked onto the surface of
electronic devices or components

Two Ways to Produce E Labels
Two separate directions to the Specification:
1. Printing an e-Label
2. Laser Marking an e-Label

ECCC Created E-Labelling Standard
Scope of the new Standard:
“E-Labelling, may be affixed to, or laser etched into the
surface of electronic devices and components.”
ECCC does not print the label.
ECCC created the Standard and QMS that was
audited by BSI for the knowledge to teach
how to produce a label that is compliant.

Printed Label on a Dell Laptop
X 3
X 3
X 2
X 2
X 2
There is space for
a 4th Label for a
new market with
different
regulatory
requirements

What Does e-Label Do?
Replaced this
With this

Print e-Label View from ITI

Why is E-Label so Powerful
From ThisYou Get All This
Because of Attachments!!!!!!

Key Elements of E-Labelling
• Affixable Printed Product or Laser Etched.
• Requires Small Piece of Product real estate.
• Replaces multiple regulatory marks with one.
• Information never out-of-date - always real-time.
• Tracks individual products not SKU’s or model #s
• Customs (ICE) can decode label with Smartphone.

What is the E-Label Mark
Similar to QR Code – Except Safe and Secure – Every e-Label is unique

For a Printed e-Label
• ECCC has developed the requirements for
producing and grading a printed e-label.
• ECCC & CTECCB are producing the auditor
training materials.
• ECCC has produced the calibration tools and
measurement methods.
• ECCC, CTECCB and IECQ will prepare the
audit and testing materials

Requirement to Print an E-Label
• Minimum 600 DPI Printer
• Minimum: Aven Mighty-Scope Digital Microscope (or equivalent)
with 1.3 M.P. resolution, 0 - 200 X with 6 co-axial LED’s.
• E-Labelling software/App
• Verifier Software.
• ECCC E-Labelling Print Calibration Master
Aven Mighty-Scope

E-Labelling Calibration Master
24 x 24 mm 18 x 18 mm 12 x 12 mm
ECCC E-Labelling Print Calibration Master
Copyright © 2015 ECCC All Rights Reserved Version 1.0
8 x 8 mm
DO NOT LAMINATE
Serial # 0123456789
ECCC E-Labelling Print Calibration Masters are digitally
printed by Memjet with1,600 DPI Resolutions and will
read 4.0 with the verifier if correctly positioned

Basic Principals Printed Label
• Products utilizing e-Labels must have a physical label on the
product at the time of importation, marketing or sale. It shall
be visible to purchaser at time of purchase.
• Access information in no more than 3 steps in a device’s
menu
• Removable label must survive normal shipping and handling.
• For devices imported in individual packages ready for sale,
the information may also be provided on the package. It
shall contain:
– FCC ID and DoC logo
– Any other such information required by specific rule - unless it is permitted
to be included in user manual or packaging inserts - even if electronically
displayed.

Marketing and Consumer View
Important Consumer Device Information:
• “user must be provided specific instructions on how to
access the information”. [748748, II (b) (iii)]
• “required to have a physical Label on the product at the
time of importation, marketing or Sales”. [748748, II (c)]
• “must clearly differentiate between the information
required to be on the surface of the product and the
information required for the User’s Manual”. [748748, II (d) (iv) (2)]

Requirement of the US Act
External Physical “Label” as
required by Act
i-Phone e-Label accessible after 3 steps?

i-Phone e-Label : 3 Step Access
3 Click Access:
Setting >
General >
Regulatory
Mandatory FCC:
Unique ID
FCC ID:
DOC (Logo)

e-Label: 1st Step after Decode

Select FCC Regulatory Option

Select Packaging Label

Select FCC Statement

E-Labelling for Components
• For past 3-years ECCC BOD members have
published at anti-counterfeiting conferences
for mature IC’s.
• Efforts centered on Laser Marking to prove
supply chain security.
• Connections were established with OEM’s.
• After Singapore meeting. Programs with small
IC OEM’s for laser marking e-Label -
concurrent with other marking.
•

Section of Laser Marked IC’s

Date China Entity Announcement
2Q14 Fuzhou Rockchip Signed a product development agreement with Intel for x86
Atom Processors
3Q14 Tsinghua Unigroup Acquired RDA Microelectronics for $907 million.
3Q14 Tsinghua Unigroup Intel acquired a 20% stake in Tsinghua for $1.5 Billion, which also
owns Spreadtrum and RDA Microelectronics
3Q14 Xiamen Government & Fujian
Electronics
Formed partnership with UMC to build a $2.6 billion 300nm fab
in Xiamen, China
1Q15 SMIC As part of Qualcomm’s settlement with China’s NDRC, the
company agreed to expand its partnership with SMIC
2Q15 Hua Capital Management &
other Chinese investors
US based CMOS image sensor specialist Omnivision agreed to be
purchased for $1.9 billion
2Q15 Uphill Investment U.S. based DRAM and SRAM specialist ISSI agreed to be
purchased for $731 million
2Q15 JAC Capital NXP announced that it was selling its RF power business to the
investment group for $1.8 billion
2Q15 SMIC & Huawei Announced that SMIC, Huawei, Qualcomm and IMEC would
form a joint R & D company for 14nm technology
2Q15 Hefei Construction Investment
and Holding
Formed a joint venture with Powerchip to construct a $2.2
billion LCD driver Fab in Hefei, China
2Q15 JCET-SC, SMIC Offered to purchase Singapore based OSAT STATS ChipPAC for
$780 million
3Q15 Tsinghua Unigroup Made a $23 billion offer to purchase U.S. based memory giant
Micron. Withdrawn – lack of political feasibility.
2015
Beijing IC Industrial
Development Fund & Other
Chinese Investors
In 2014 Chinese Investors contributed $465 million to SMIC’s
300mm diameter wafer and a further $350 million in 2015
4Q15 TSMC & Potentially Chinese
Investors
TSMC is expected to announce construction of a 300mm Fab in
China for 20/28 nm product and may partner with Chinese
Investors
1Q16 China Resources Holding and
Hua Capital Management
Offer of $2.9 Billon for Fairchild Semiconductor International
Blocked by CFIUS (Committee on Foreign Investment in US
4Q15 Nanchang Industrial Group, GO
Scale Capital & other investors
Offer of $3.3 Billion for 80% of Lumileds Division of Phillips
Electronics blocked by US CFIUS
China Entering IC’s Space

ECCC Request of CEPREI
• ECCC is seeking co-operation with CEPREI
• Guidance from CEPREI
• To work with designated clients
• Establish training.
• Harmonize efforts.
• Produce a global standard for e-Labelling.

Ceprei march 2016

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