1. PRODUCT OVERVIEW
he KLA-Tencor 300 UV Series is
the first reticle inspection family
using UV illumination for the inspec-
tion of DUV reticles. With the higher
resolution UV wavelength and new
defect detection technology, the 300UV
systems can inspect reticles with
advanced design rules, critical OPC
structures, and many phase shift types,
all common elements of advanced inte-
grated circuit technology.
The UV systems are built on KLA-
Tencor's field-proven 300 Series reticle
inspection platform, adding advanced UV
optics, defect detection algorithms, and
review tools. Whether providing die-to-die,
die-to-database, or KLA-Tencor's patented
STARlightTM
contamination inspection, the new
300UV Series enables the industry's
highest quality of advanced reticles.
Captures new defect classes
Resolution enhancement techniques are
being used successfully to push the limits
of optical lithography creating new
challenges for reticle fabrication and
quality assurance. While low k, printing,
sub-resolution OPC structures, and new
phase-shifting materials improve
lithography performance, they have also
generated new classes of critical reticle
defects that can cause wafer yield loss —
UV-opaque stains and transmission
defects, as well as small defects on and
near OPC structures. KLA-Tencor's
300UV Series can capture these new,
T
KLA-Tencor
300UV Series
UV Wavelength
Reticle
Inspection
System

2. 300UV Series
difficult to detect defects,
providing critical reticle
quality assurance to
eliminate yield killing
reticle defects.
UV inspection for
DUV lithography
As lithography has
shifted to shorter exposure
wavelengths, many more
organic materials which
contaminate reticles are opaque
and can cause yield reductions.
Unlike the previous visible light
systems, the 300UV Series can detect
UV-wavelength defects, such as stains
and particles, both with transmitted light
pattern inspection mode (die-to-die and
die-to-database) as well as with
STARlight mode. The UV-wavelength is
also important for inspecting phase
UV inspection illumination enables
superior detection of UV-sensitive
contaminants. It also lowers EAPSM
coating transmittance, resulting in
higher contrast imaging and better
defect sensitivity.
shift masks that are used in both I-line
and DUV lithography. The image
contrast of many phase shifting materials
improves significantly with UV
illumination, leading to greater
sensitivity. This means that even older
generation EPSM reticles can benefit
from UV-wavelength inspection.
Conquering complex OPC structures
On today'
s advanced reticles, lithography
engineers commonly use OPC technology
to improve lithography performance.
This is done by selectively adding small
amounts of bias as well as sub-resolution
edge jogs, serifs, hammerheads, and assist
lots to the reticle pattern. Although these
sub-resolution features do not print
directly, small defects on or near a struc-
ture can cause serious wafer problems.
The UV system'
s advanced OPC defect
detection algorithm offers unparalleled
sensitivity to defects on and near small
OPC structures. This algorithm surpasses
current generation algorithms which will
often miss these types of defects. The
OPC algorithm employs new data-base
image processing techniques that
carefully model the input database to
match the intricacies of the geometry.
Based on the 300 Series, the UV systems
provide new state-of-the-art technology
for laser scanning image acquisition, and
defect detection algorithms.

3. Through this advanced technology, it is
now possible to properly inspect critical
OPC reticles and find defects that are
missed by older technology equipment.
OPC Older Technology
With advanced database modeling technology, the OPC
algorithm accurately matches OPC structures and
detects critical OPC defects, with low false detections.
STARlight UV — Superior
performance on reticle contamination
In addition to high performance pattern
inspection, the 300UV Series can also be
configured with KLA-Tencor's patented
STARlight technology to provide the
industry's most sophisticated and
advanced reticle contamination
inspection. With STARlight UV, it is
now possible to detect smaller
contaminants on smaller linewidth
reticles than ever before in addition to
detecting UV wavelength stains and
particles. All are critical to assuring a
high quality reticle.
STARlight UV uses simultaneous
transmitted and reflected UV illumina-
tion and KLA-Tencor's STARlight defect
detection algorithm to locate all sizes of
particles, stains, thin-chrome, ESD, etc,
both in the clear areas and on the
chrome, all without the complication of
die-to-die or die-to-database inspection.
STARlight UV accomplishes this with an
easy to use inspection mode which
maintains a high degree of immunity to
false detections, even on fine design
rules and OPC structures.
Multiple review features ensure
proper defect classification
For advanced reticles, it is essential for
the inspection system to find all defects
within specification. However, if the
operator mis-classifies a defect it can be
just as problematic as not finding it.
Several new views and tools have been
developed to further enhance the
operator'
s ability to correctly classify
difficult-to-recognize defects such as
CD and OPC defects. These new views
and tools are added to the already
impressive list of review features such
as high quality reflected light imaging,
pseudo-color, defect bounding box,
defective pixel markers, and size grid.
Sharpen Edge removes the "fuzzy
edge" look of the standard view and
makes it much easier for an operator to
identify small extension type defects.
Displacement Image shows a type of
overlay image in which the matching
geometry is suppressed and non-matching
defective geometry is enhanced. This
makes it much easier for an operator to
identify small corner, truncation, CD,
and OPC shape type defects.
Assisted Sizing improvements give
the operator the ability to determine the
approximate size of a defect beyond the
standard "grid". One function is a box
(with a dimension readout) that can be
sized, moved, and rotated to overlay a
defect, while a second is a moveable
"arrow" which closely approximates the
CD difference between the test and
reference geometry in four different
directions; this is especially useful when
dispositioning CD type defects.

4. Flexible and upgradable platform
to protect your investment
The 300UV Series platform provides
exceptional flexibility and upgradability.
This unique platform has numerous
configurations and options to allow each
user to select a system for their current
needs, with the assurance of upgrade
paths to meet future requirements. One
can choose among die-to-die, die-to-
database, or STARlight inspection modes
or any combination; and any system in
the field can be converted to any other
configuration. There are a selection of
defect detection algorithms to choose
from to provide high quality inspection of
a variety of reticle types from OPC to
PSM. To optimize throughput, there are a
selection of pixel sizes, image compare
processing
modules, and database rendering
modules. Multiple pixels can be installed
to allow the fastest throughput possible
for each defect specification level required
to maximize overall productivity. The
300UV Series offers unparalleled con-
figuration flexibility and upgradability to
protect your investment.
Enabling capability for 0.15 pm
technology and beyond
While KLA-Tencor's 300UV Series of
Reticle Inspection Systems offer class-
leading performance and features to meet
the critical requirements of the 0.18 pm
generation, the system also has sufficient
performance and enhancement
opportunities to extend it into the 0.15
pm generation to further protect your
investment.
The 300UV Series platform provides the flexibility to configure a system that is best suited for your reticle
inspection requirements.
KLA-Tencor Corporation
160 Rio Robles
San Jose, CA 95134-1809
Tel 408-875-3000
Fax 408-875-4144
www.kla-tencor.com
STARlight is a trademark of KLA-Tencor Corporation. Printed in USA 9/98 R-RI-3012