1. Multilayer Products
2016/04/20 Multilayer Chip Components for RF & EMI Solution 1
Mag.Layers
Jacky Cheng

2. Agenda
1. Core Technology of Multilayer
2. Main Customer/ Marketing
3. Materials (Ferrite and Ceramics)
4. Focused on Design House
5. Process of Multilayer
6. Product Portfolio
2016/04/20 Multilayer Chip Components for RF & EMI Solution 2

3. Core Technology
3
Advanced materials & materials matching
technology (K33/K5/K7.8/K60)
Circuit & component design; 3D EM simulation; IP
library; 3D Power inductor simulation
Automatic multilayer circuit processing eng.
RF measurement & automatic testing technology
Advanced ferrite core loss measurement
Advance hybrid material on ferrite and ceramic
Near Field Technique/ NFC/WPC/A4WP
2016/04/20 Multilayer Chip Components for RF & EMI Solution 3

4. Notebook & Peripherals: Quanta,
Compal, Wistron, Asus, MSI, ...
Wireless Communication: Foxconn,
Gemtek, Unihan, Sercomm, USI, Asus,
Cyberlink, Alfa, Foxlink, Cameo, .....
MB & VGA: Asus,
Gigbyte, MSI, ECS,
Foxconn, Palit, PC
Partner, ...
Setop Box & Cable Modem: Motorola,
Technicolor, ZTE, Sercomm, Unihan,
Zinwell, AZtek, ...
EMS: Foxconn,
Flextronics, Jabil,
Sanmina-SCI,
Celestica, ...
Phones & GPS: Compal, Arima, Chi-mei,
Simcom, Long Cheer, Garmin, TomTom,
Mediatech, .....
LCD Display: LG,
Wistron, USI,
Compal, Forward-
CPT, Amtran,
Hann Star, TST, .....
Main Customers
SAMSUNG
2016/04/20 Multilayer Chip Components for RF & EMI Solution 4

5. Material Technique
RF Components
RF Inductor
LTCC(1980)
Low Temperature Cofired Ceramic
Dk= 5;7;20;40 Au,Ag,Cu
RF Module
Substrate, Packaging
Chip Power Inductor
Bead, Inductor
Ferrite Ui= 250;470; Ui ~ 3
Common Mode filter
2016/04/20 Multilayer Chip Components for RF & EMI Solution 5

6. Design Technique
MagLayers
PN
Inductanc
e
(uH)
RDC
(Ω)
Isat Typ.
IDC Typ.
(Max)
GMPI-
201209-
2R2MS
2.2 ± 20%
0.15
±
25%
500 1100
ANSYS Maxwell Magnetic Simulation
3A
ANSYS HFSS EM Simulation
S parameter
S parameter; Spice model
2016/04/20 Multilayer Chip Components for RF & EMI Solution 6

7. WLAN/BT/IOT
Focused on Design House
Provide total multilayer passives solution for the main trend IC solutions
Bandpass Filter, Highpass Filter,
Lowpass Filter, Balun, Diplexer,
Balanced Bandpass Filter,
Chip Antenna, External Dipole,
Metal Stamping Antenna,
FEM, TX modules
3G/LTE
Balun, Coupler, Lowpass Filter,
Antenna Switch Module
Power Line Bead, Power inductor
2016/04/20 Multilayer Chip Components for RF & EMI Solution 7

8. Multilayer Ferrite Process
Cutting Co-Firing Terminating
ElectroplatingTestingVisual InspectionPacking
Lamination
2016/04/20 Multilayer Chip Components for RF & EMI Solution 8

9. Green Sheet Punching
Appearance Inspection/ Testing
Via Hole Punching
Ceramic Powder
Binder Solvent
Ball MixingMaterial Preparation Green Sheet Casting
Pattern Printing Stacking & Pre-lamination Hot Pressure Lamination
Cutting Co-firing PlatingTermination
LTCC Manufacture Process
2016/04/20 Multilayer Chip Components for RF & EMI Solution 9

10. Product Roadmap
2013 2014 2015
1608
1005
1005
Filter
Balun
Diplexer
DiscreteIPD
Miniaturized
High Integration
Smaller size
2017
Multi-band
integration
Dual-band
Balun /
Balance Filter
1608 1005
=> Low profile and high attenuation
=> Multi-band integrated
2520 2012
Triplexer for
GPS/BT/WLAN
LPF+BPF/HPF
BPF+BPF
0605
0605
=> Low profile, Low loss
Wide-band Coupler for LTE
(0.7~2.7GHz)
Filters for SAW replacement
Filters for MoCA2.0
=> Low loss, High attenuation
Unit: mm
2016
1608
Balun for LTE
LPF for LTE
Components for Wearable, IOT, IOE
=> Low loss
Components for 10 GHz and higher freq.
2018
Power Inductor 2520 2012 1608
2520 2016 => Low profile, multiphase, high switching
Common Filter 1210 0806 0605 0504 => Low profile, high speed CM rejection
2019
Active module
GSPI SeriesGFCD Series
GMPI GMPA Power module/substrate
integration
2016/04/20 Multilayer Chip Components for RF & EMI Solution 10

11. Product Portfolio
EMI
Products
Power Line
Products
Bead – GMLB A/B/R/L Series
Bead – GMLB W Series
Bead – GMLB P Series
CMF – GMCF Series
Bead – GMLB X Series
(under develop)
Power Inductor –
GMPI S/B/H Series
Power Inductor –
GMPA Series
Power Inductor – Dual Phase
GFCD Series (under develop)
Power Inductor –
GSPI Series (under develop)
RF
Products
Antenna – LTA/DBA Series
Filter – LTL/LTB/LTH Series
Coupler – LTC Series
Diplexer – LTD Series
Balun – LTU Series
Balance Filter – BBF Series
IPD – DLU Series
HF Inductor – HFI Series
HF Inductor – HFK Series
HF Inductor – HFQ Series
(high Q)
2016/04/20 Multilayer Chip Components for RF & EMI Solution 11

12. Introduction of RF Components
2016/04/20 Multilayer Chip Components for RF & EMI Solution 12

13. RF Product Line - Application Band
Item 0.7~2.7
GHz
0.7~0.9
GHz
1.125
~1.675
GHz
1.575
GHz
1.71~2.7
GHz
1.8~2
GHz
2.4~2.5
GHz
2.3~2.7
GHz
3.3~3.8
GHz
4.9~5.95
GHz
Application LTE GSM MoCa GPS LTE GSM
LTE
WiFi BT LTE
WiMax
WiMax WiFi
LPF Series √ √ √ √ √ √ √
BPF Series √ √ √ √ √ √
HPF Series √ √
LTU Series √ √ √ √ √ √
LTC Series √ √ √ √ √ √ √
BBF Series √ √ √
LTD Series √ √ √ √
2016/04/20 Multilayer Chip Components for RF & EMI Solution 13

14. 5GHz
HPF
2GHz
LPF
900MHz LPF
New Product of Filters(1/2)
2016/04/20 Multilayer Chip Components for RF & EMI Solution 14

15. 3.2 mm x 2.5 mm
BPF for MoCA application
New Product of Filters(2/2)
2016/04/20 Multilayer Chip Components for RF & EMI Solution 15

16. Balun
50 : 50
50 ohm 25 ohm
50 : 100
Balun
R/2+jX/2 ohm
R/2+jX/2 ohm
Matching
Circuit
RF IC
R+jX R-jX
50 ohm
Balance Impedance
25 ohm 50 ohm Balun
Balun
50 ohm
50 ohm
50 ohm
2016/04/20 Multilayer Chip Components for RF & EMI Solution 16

17. Balun for PCS application
1.0 mm x 0.5 mm
New Product of Balun(1/2)
2016/04/20 Multilayer Chip Components for RF & EMI Solution 17

18. Balun for LTE application
0.6 mm x 0.5 mm
New Product of Balun(2/2)
2016/04/20 Multilayer Chip Components for RF & EMI Solution 18

19. Antenna
Port
Low Freq.Port
HPF
LPF
900 MHz 1800 MHz
900 MHz 1800 MHz
900 MHz 1800 MHz
High Freq.Port
Diplexer
2016/04/20 Multilayer Chip Components for RF & EMI Solution 19

20. 2.0 mm x 1.2 mm
New Product of Diplexer(1/2)
2016/04/20 Multilayer Chip Components for RF & EMI Solution 20

21. 1.575/2.4/5GHz Triplexer
2.0 mm x 1.2 mm
New Product of Diplexer(2/2)
2016/04/20 Multilayer Chip Components for RF & EMI Solution 21

22. Two or more function blocks, such as impedance matching circuits,
filters, couplers and baluns and power combiner/divider, are
integrated into one package.
Band 1 Band 2
Band 1
TX
Band 1
RX
LPF Coupler
Example
Integrated Passive Device(IPD)
2016/04/20 Multilayer Chip Components for RF & EMI Solution 22

23. DLU–2012-12GS1-B3
High Band
Low Band
Integration of Baluns(GSM/DCS)
New Product of IPD
2016/04/20 Multilayer Chip Components for RF & EMI Solution 23

24. Multilayer High Frequency Inductor
Electrical Characteristic:
PART NO.
Inductance
(nH)
at 100 MHz
Tolerance
Q Min.
100 MHz
Q Typical
800 MHz
S.R.F.
(MHz) Min.
RDC(Ω)
Max.
IDC(mA)
Max.
HFK-060303 Series 1.0 ~100
S ±0.3nH
J ±5%
4~5 9~22 900~10000 3.74~0.1
1 60~470
PRODUCT NO. A B C D
HFK-060303 0.6±0.03 0.3±0.03 0.33 max. 0.15±0.05
Dimensions:
MAGLAYERS P/N Size(mm) MURATA TDK
HFK-0603 Series 0.6*0.3*0.3 LQP03TG Series MLG0603S Series
Series Cross Reference:
Dimensions in mm
2016/04/20 Multilayer Chip Components for RF & EMI Solution 24

25. Multilayer High Frequency Inductor
High Q solution:
Electrical Characteristic:
PART NO.
Inductance
(nH)
at 500 MHz
Tolerance
Q Min.
500 MHz
Q Typical
800 MHz
S.R.F.
(MHz) Min.
RDC(Ω)
Max.
IDC(mA)
Max.
HFQ-060303 Series 0.6 ~100
±0.1nH
±0.2nH
±0.3nH
± 3%
± 5%
6~15 8~40 800~10000 3.74~0.1
1 60~470
PRODUCT NO. A B C D
HFQ-060303 0.6±0.03 0.3±0.03 0.33 max. 0.15±0.05
Dimensions:
MAGLAYERS P/N Size(mm) MURATA TDK
HFQ-0603 Series 0.6*0.3*0.3 LQP03TN Series MLG0603P Series
Series Cross Reference:
Dimensions in mm
2016/04/20 Multilayer Chip Components for RF & EMI Solution 25

26. Introduction of EMI Components
2016/04/20 Multilayer Chip Components for RF & EMI Solution 26

27. A
B
R
W
P
L
Effective Range of Noise Suppression
1MHz 10 MHz 100 MHz 1GHz
Low Speed Signal Line, Ringing Prevention(Audio
Signal, CMOS IC)
Medium Current Line (300mA to 1A)
High Speed Signal Line (LCD panel, Clock Signal,
RAM Bus)
Large Current Line (1A to 6A)
General Signal Line (I/O Port)
Application
GHz-Band Noise Suppression
Bead-Effective Application Bands
2013 2014 2015 20172016 2018
Ultra Large Current Line (6A to 10A)X
1608/1005 0603(0201) 0402(01005)
2016/04/20 Multilayer Chip Components for RF & EMI Solution 27

28. Ultra Small 0402(01005) Bead
Electrical Characteristic:
PRODUCT NO. A B C D
GMLB-040202 0.4±0.02 0.2±0.02 0.2±0.02 0.1+0.04/-0.03
Dimensions: Dimensions in mm
Part Number
Impedance (Ω)
at 100 MHz
RDC (Ω) Max. IDC (mA) Max.
Operating
Temp. Range (℃)
GMLB-040202-0010A-N8 10±5Ω 0.07 750
-55 ~ +125
GMLB-040202-0075A-N8 75±25% 0.45 260
GMLB-040202-0120A-N8 120±25% 0.6 220
GMLB-040202-0150A-N8 150±25% 0.65 200
GMLB-040202-0180A-N8 180±25% 0.75 200
GMLB-040202-0240A-N8 240±25% 0.9 200
2016/04/20 Multilayer Chip Components for RF & EMI Solution 28

29. GMLB-555018-0100X-N1
DCR 6mΩ and Rated Current 6A for PLC Application
∣Z∣, R, and X vs. FREQUENCY
℃ vs. DC Current
Physical Dimensions
(mm/inch)
0
20
40
60
80
100
120
140
160
180
1 10 100 1000
Impedance(ohm)
Frequency(mhz)
0
10
20
30
40
50
60
0 2 4 6 8 10 12 14 16 18
△T
DC Current(A)
A 5.5[.220] ± 0.2[.008]
B 5.0[.200] ± 0.2[.008]
C 1.8[.071] Max
D 0.76[.030] ± 0.3[.012]
Electrical Characteristics
Z @ 100 MHz(Ω) DCR(Ω) Rated Current
Nominal 100
Minimum 75
Maximum 125 0.006 6000 mA
New Product of Power Bead – X Type
2016/04/20 Multilayer Chip Components for RF & EMI Solution 29

30. GMLB-555018-0800X-N1
DCR 15mΩ and Rated Current 8A for PLC Application.
0
100
200
300
400
500
600
700
800
900
1 10 100 1000
Impedance(ohm)
Frequency(mhz)
0
10
20
30
40
50
60
0 2 4 6 8 10 12
△T
DC Current(A)
∣Z∣, R, and X vs. FREQUENCY
Physical Dimensions
(mm/inch)
A 5.5[.220] ± 0.2[.008]
B 5.0[.200] ± 0.2[.008]
C 1.8[.071] Max
D 0.76[.030] ± 0.3[.012]
℃ vs. DC Current
Electrical Characteristics
Z @ 100 MHz(Ω) DCR(Ω) Rated Current
Nominal 800
Minimum 600
Maximum 1000 0.015 8000 mA
New Product of Power Bead – X Type
2016/04/20 Multilayer Chip Components for RF & EMI Solution 30

31. Common Mode Filter
2013 2014 2015 20172016 2018
1210
in JIS 0806
0605
Array
USB 3.0
USB 3.1
USB 3.0 (5 Gbps) USB 3.1 (10 Gbps)
D+/D- Pair Propagation Delay D+/D- Pair Propagation Delay
D+/D- Pair Propagation Delay D+/D- Pair Propagation Delay
Differential Crosstalk between
D+/D- Pair and SS Pairs
Differential Crosstalk between
D+/D- and SS+ Signal
2016/04/20 Multilayer Chip Components for RF & EMI Solution 31

32. MAGLAYERS P/N Size(mm) Impedance RDC(Ω) Max.
Cut off frequency
(GHz)
IDC (mA)Max. Rated Voltage(V)
GMCF-060503-0012-MHA1 0.6*0.5*0.3 12±5 2.5 8 50 5
GMCF-060503-0035-MHA1 0.6*0.5*0.3 35±20% 6.5 6.5 50 5
GMCF-060503-0060-MHA1 0.6*0.5*0.3 60±25% 4.75 3.5 50 5
GMCF-060503-0090-MHA1 0.6*0.5*0.3 90±25% 6.5 3 50 5
GMCF-080604-0012-MHA1 0.85*0.65*0.4 12±5 2.5 8.5 130 5
GMCF-080604-0030-MHA1 0.85*0.65*0.4 30±25% 1.5 4 150 5
GMCF-080604-0047-MHA1 0.85*0.65*0.4 47±20% 4 5 100 5
GMCF-080604-0090-MHA1 0.85*0.65*0.4 90±20% 5 4 100 5
GMCF-121006-0040-MHA1 1.25*1.0*0.6 40±25% 2.5 5 100 5
GMCF-121006-0090-MHA1 1.25*1.0*0.6 90±25% 4.5 3 100 5
GMCF-121006-0090-MHB1 1.25*1.0*0.6 90±20% 2.5 6 150 5
GMCF Series
2016/04/20 Multilayer Chip Components for RF & EMI Solution 32

33. Comparison of GMCF Series
0.0
0.5
1.0
1.5
2.0
2.5
3.0
1 10 100 1000 10000
InsertionLoss(dB)
Frequency(MHz)
Sdd21 Murata
Maglayers
0
5
10
15
20
25
30
35
1 10 100 1000 10000
InsertionLoss(dB)
Frequency(MHz)
Scc21 Murata
Maglayers
Frequency Maglayers(Sdd21) Murata(Sdd21)
1.25GHz 0.49 0.687
2.5GHz 0.95 1.347
3.75GHz 1.21 1.89
5GHz 1.61 2.565 3 dB cutoff : 9 GHz
Frequency Maglayers (Scc21) Murata (Scc21)
1.25G 8.71 17.96
2.5G 17.1 16.79
3.75G 19.5 11.85
5G 13.9 8.56
Better CM rejection
GMCF-080604-0012-MHA1
0.0
0.5
1.0
1.5
2.0
2.5
3.0
1 10 100 1000 10000
InsertionLoss(dB)
Frequency(MHz)
Sdd21 Maglayers
0
5
10
15
20
25
30
35
1 10 100 1000 10000
InsertionLoss(dB)
Frequency(MHz)
Scc21 Maglayers
Frequency Maglayers (Sdd21)
1.25G 0.47
2.5G 0.86
3.75G 1.13
5G 1.75
3 dB cutoff : 10 GHz
Frequency Maglayers (Scc21)
1.25G 10.64
2.5G 19.93
3.75G 24.38
5G 18.32
GMCF-060503-0012-MHA1
Suitable for USB 3.0
2016/04/20 Multilayer Chip Components for RF & EMI Solution 33

34. Introduction of Power Line Components
2016/04/20 Multilayer Chip Components for RF & EMI Solution 34

35. Multilayer Power Inductor Trend
Low Profile
for Terminal/LGA type
High Converting
Efficiency
Down Sizing
High Current
T<1.00mm
T<0.70mm
T<0.50mm
T<0.35mm
1608
2012 or 2016
2520
3225
1005
Low AC Loss/
Low DC resistance
300mA
500mA
1000mA
1500mA
2000mA
A chip
B chip
GMPI-series
Saturation Current Improved
Low DCR Version
Maximize benefits: Equipments/ Capacity
GMWI
LGA type
2016/04/20 Multilayer Chip Components for RF & EMI Solution 35

36. Multilayer Power Inductor (Ⅰ)
General Side Termination
Product Number Size
Inductance Range RDC Range Rated Current
(μH) (Ω) (mA)
GMPI-160808 P1 Series 1.6x0.8x0.8 0.47μH~2.2μH 0.08Ω~0.715Ω 800mA~1000mA
GMPI-160808 S Series 1.6x0.8x0.8 1.0μH~2.2μH 0.13Ω~0.3Ω 750mA~1200mA
GMPI-160808 B Series 1.6x0.8x0.8 1.0μH~2.2μH 0.23Ω~0.36Ω 600mA~900mA
GMWI-160808 R Series 1.6x0.8x0.8 1.0μH~4.7μH 0.09Ω~0.24Ω 600mA~1000mA
GMPI-201205 F1 Series 2.0x1.2x0.5 0.47μH~2.2μH 0.15Ω~0.43Ω 600mA~1100mA
GMPI-201209 S Series 2.0x1.2x0.9 0.47μH~4.7μH 0.06Ω~0.2Ω 900mA~2000mA
GMPI-201209 B Series 2.0x1.2x0.9 0.47μH~4.7μH 0.11Ω~0.23Ω 900mA~1300mA
GMWI-201209 R Series 2.0x1.2x0.9 0.47μH~4.7μH 0.07Ω~0.18Ω 700mA~1400mA
GMPI-201610 F1 Series 2.0x1.6x1.0 0.47μH~4.7μH 0.06Ω~0.16Ω 900mA~1300mA
GMPI-252005 F1 Series 2.5x2.0x0.5 0.47μH~1.0μH 0.08Ω~0.1Ω 900mA~1200mA
GMPI-252010 /12 F1 Series 2.5x2.0x1.0 0.47μH~4.7μH 0.04Ω~0.125Ω 1100mA~1800mA
2016/04/20 Multilayer Chip Components for RF & EMI Solution 36

37. Multilayer Power Inductor (Ⅱ)
Test Frequency :5MHz
GMPA Series
Items Ls (uH) RDC (Ω) ISAT SRF
252005-R33 Specification 0.33 ± 20% 0.05 Max. 1400mA 140 Min.
252005-R47 Specification 0.47 ± 20% 0.13 Max. 1000mA 100Min.
201210-2R2 Specification 2.2 ± 20% 0.15 ± 25% 500mA
252010-2R2 Specification 2.2 ± 20% 0.08 ± 25% 700mA
2016/04/20 Multilayer Chip Components for RF & EMI Solution 37

38. Multilayer Power Inductor (Ⅲ)
GFCD Series:
(Unit : mm)
A B C
2.5 ± 0.2 2.0 ± 0.2 1.2 max. ※
Inductance @ 5MHz DC Resistance Rated Current (Isat)
Phase(I,2) Phase(3,4) RDC(1,2) RDC(3,4) Phase 1
Isat
Phase 2
Isat
0.85μH ±
20%
0.85μH ±
20%
32mΩ Max. 32mΩ Max. 550mA Typ. 550mA Typ.
Under develop
2016/04/20 Multilayer Chip Components for RF & EMI Solution 38

39. Under develop
Stilted inductor for more
flexible layout
MUF/MTF series
Current available dimensions:
8x8~12x12mm
Stilted lead
frame
Power choke
Space for other
components: IC,
capacitor or resistor.
LTCC
With
embedded
components
Stilted Power Inductor Solution
GSPI series(Under-develop)
Multilayer small size stilted power inductor
2016/04/20 Multilayer Chip Components for RF & EMI Solution 39

40. MAG.LAYERS
Scientific Technics Co., Ltd
Welcome Your Comments & Inquiries !
2016/04/20 Multilayer Chip Components for RF & EMI Solution 40