KMT Waterjet Systems Stone Cutting Presentation

KMT US Inc. - KMT Waterjet © Copyright 2009 – Property of KMT Waterjet Systems Inc. kmtwaterjet.com Cut Stone, Marble, Granite, Tile, Ceramic, and much more! KMT WATERJET SYSTEMS: STONE CUTTING KMT. Creating Value Through Precision. CUTTING SOLUTIONS www.kmtwaterjet.com

KMT Waterjet Cutting Process
Waterjet Cutting is:
An aggressive erosion process using energy focused in a stream of highly pressurized water.
Abrasive can be mixed with water at the last moment to cut through hard metals , stone , glass or pure water only to cut food .
KMT US Inc. - KMT Waterjet (Think of the Grand Canyon Created in One Day!)
Garnet:
Most widely used, cost effective and best balanced performance. Fine particles of sand.
Aluminum Oxide:
Very aggressive, increases wear of focusing tube and abrasive mixing chamber. Specialty applications.
Silicon Carbide:
Very aggressive, increases wear of focusing tube and abrasive mixing chamber. Specialty applications.
Types of Abrasive

KMT Waterjet Stone Cutting Benefits KMT US Inc. - KMT Waterjet
Small Cutting Width (Kerf)
High Speed Cuts
No Stress Impact
No Tool Sharpening – No Changing of Bits
Cold Cutting - No Heat Affected Zones
Omni-Directional Cutting
Environment Friendly – No Chemicals
One Dimensional to 6-Axis Cutting
Finished Edge Eliminates Secondary Processes
Rapid Prototyping – Minimal Set-up
Cuts Most Any Material
Cut Stone, Marble, Granite, Tile, Ceramic, Concrete,
Rock, Plaster and much more!

KMT Waterjet Stone Cutting Benefits KMT US Inc. - KMT Waterjet
Cuts Complex Shapes without discoloring stone
Minimal Tolerances (at ±0.003")
Can Pierce Material directly without the need for a pre-drilled starter hole
High or Low Speed surface pressure flexibility for thick or sensitive materials
No Dust or Toxic Fumes – Garnet is easily disposed or re-cycled
Single or Multiple Cutting Heads
Thick or Thin, Waterjet cutting is the most flexible process in manufacturing

KMT Waterjet for Cutting Stone KMT US Inc. - KMT Waterjet Waterjet cutting is one of the most versatile cutting processes around. Well suited for high-performance stone cutting, waterjet technology , when used with an abrasive additive, creates a clean, burr-free cut that does not require secondary finishing and does not leave a heat-affected zone. Nearly every type of cut is possible, from rapid hole drilling to detailed cuts for sinks, countertops, inlaid tile floors and more. Waterjet cutting systems are also less expensive than saw cutting systems, making them a solid choice for all types of stone industries. The addition of abrasive widens the range of cuts that waterjet technology can perform, but abrasive is often one of the most expensive components of a waterjet cutting system . To offset the costs of using abrasives in water jets to cut harder materials, KMT has developed a system that regulates the amount of abrasive used, controls the flow, & eliminates waste. Better abrasive management makes cutting with water a truly efficient process. Check out the article in Stone Business detailing the intricate stone cutting in Chicago’s Old St. Patrick’s Church

KMT Waterjet Vs. EDM
Wire EDM Strengths
Extremely precise parts are possible (±0.0001“)
Very thick parts (over 12“) can be made
Intentional taper can be put into a part for die clearance & other uses
KMT US Inc. - KMT Waterjet
Waterjet Strengths
Five to ten times faster in parts less than 1" thick (but, at ±0.003"), less precise as well
No Heat Affected Zone (HAZ)
Works well in non-conductive materials (such as glass , stone , plastic ) as well as conductive materials
Can pierce material directly without the need for a pre-drilled starter hole
Can produce large parts at reasonable costs

KMT Waterjet Vs. Laser KMT US Inc. - KMT Waterjet
Key Laser Strengths
Very fast production in thin, non-reflective materials such as sheet steel.
Accuracy to ±0.001" or better in thin material.
Key Waterjet Strengths
Can produce parts up to 2" thick in virtually any material while holding tolerances on the order of ±0.003" to ±0.005".
Can machine reflective, conductive and thicker materials.
Cuts without melting, providing a smooth uniform surface with very little burr or dross.
No heat-affected zone (HAZ), no noxious gas or vapors produced during cutting.
No minimum material cutting width

KMT Waterjet Vs. Plasma KMT US Inc. - KMT Waterjet
Key HD Plasma Strengths
Relatively low capital costs.
Very rapid production rates in thin sheet metal.
Key Waterjet Strengths
No melting or heat-affected zone, so no heat distortion or crusted area to impair secondary machining processes such as tapping holes.
Wider range of material capabilities.
Wider range of thickness capabilities.
Precision for intricate parts
See video comparing Plasma & KMT Waterjet Cutting side-by-side. >>>

KMT Waterjet Vs. Router
CNC Router Strengths
Inexpensive
Capable of holding tolerances of +- .001
Eliminates taper
Easy control of cutting depth
KMT US Inc. - KMT Waterjet
Waterjet Strengths
Capable of true 90 ° angles/corners.
One head for all applications, no need
to change bits.
Small cutting kerf
Can produce parts 2” or more in
thickness.

KMT US Inc. - KMT Waterjet SL-V 100 Plus KMT Product Portfolio SL-V E 50 S-30/S-50 SL-V 15 SL-V 200R Plus SL-V 50 Plus Streamline PRO ® 90,000psi

Waterjet Cutting System KMT US Inc. - KMT Waterjet 2 or 3 Dimension Table – Turnkey Solution Water Softener FEEDLINE IV ™ Cutting Table Cutting Heads AUTOLINE ™ PRO IDE™ PRO STREAMLINE ™ PRO High Pressure Pump ADS Hopper Filtration System Waste Water

KMT Products KMT US Inc. - KMT Waterjet
Pumps
Cutting Nozzles
PSC VFT
Aftermarket Parts

Contact KMT Waterjet Systems
We are always happy to supply more information, receive visitors, perform sample cutting, or help with any other request.
Contact us by e-mail
Call us at 1-800-826-9274
Request a quote
KMT Waterjet Systems Inc.
635 West 12th Street
Baxter Springs, KS 66713
KMT US Inc. - KMT Waterjet www.kmtwaterjet.com

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KMT Waterjet Systems Stone Cutting Presentation

by KMT Waterjet Systems on Dec 03, 2009

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KMT Waterjet Systems Stone Cutting Presentation — Presentation Transcript