This document provides information about the components used in a tablet from 2012, including the processor, memory, radio frequency chips, power management integrated circuit (PMIC), audio chips, touch screen controller, motion sensors, camera chips, and other chips. The main processor is an Apple A6X running at 1.4GHz with an ARMv7 dual-core design and PowerVR graphics. Memory includes LPDDR2 and NAND flash from suppliers such as Elpida and SK Hynix. Radio functionality is provided by chips from Broadcom and Murata. The PMIC and audio chips are manufactured by Apple.

1. Tablet in 2012

2.  Apple New iPad
(Apple 4th Generation iPad)
 Apple iPad mini
 Google Nexus 7
 Amazon Kindle Fire HD 7”
 SAMSUNG Galaxy Note 10.1
 ASUS Transformer Prime
 2013 Tablet guide

4.  Apple 338S116, audio codec
 Texas Instruments TPS61045
 16/32/64GB NAND Flash
 Apple A6X, SAMSUNG 32nm HKMG process
1.4GHz, Dual core ARMv7, Imagination PowerVR 554MP4+ GPU
 Apple 343S0622‐A1, PMIC
 NXP CBTL1608
 Apple 338S1077, Class‐D Audio Amplifiers

5.  Broadcom BCM5974
 Broadcom BCM5973A
 Texas Instruments CD3240B0
 LPDDR2‐1066, x32/dual‐channel
Supplier: Elpida/SK Hynix
 Fairchild 6676BZ
 Fairchild 6683
 Murata 339S0171, BRCM BCM4334 SDIO WiFi/High Speed UART BT SoC

7. Manufacturer Device Function
▼Processor
Apple Apple A6X Microprocessor ‧1.4GHz, ARMv7, Dual‐core
‧Imagination PowerVR SGX 554MP4+
‧32nm process
▼Memory
Elpida/SK Hynix ‧32‐bit, Dual‐channel, 4Gb LPDDR2‐1066
B4064B3MA‐1D‐F
‧Two memory chip on the system main board
H9TCNNN4KDBMUR
‧Supplier: Elpida/SK Hynix
SK Hynix 16/32/64GB NAND Flash Main storage
▼Radio Frequency
Murata 339S0171
Broadcom BCM4334
(BRCM BCM4334 SDIO WiFi/ High
‧ Dual‐band 2.4 GHz and 5 GHz IEEE 802.11 a/b/g/n Wi‐Fi connectivity
Speed UART BT SoC)
‧ Single‐stream IEEE 802.11n support for 20 MHz and 40 MHz channels provides PHY
layer rates up to 150 Mbps for typical upper‐layer throughput in excess of 90 Mbps
‧ Supports the IEEE 802.11n STBC (space‐time block coding) and LDPC (low‐density
parity check) options for improved range and power efficiency
‧ Complies with Bluetooth Core Specification Version 4.0 + HS with provisions for
supporting future specifications
‧ Bluetooth Class 1 transmitter operation
Qualcomm MDM9615M Baseband Processor
‧Rel 9 LTE TDD/FDD Cat 3(100/50Mbps)
‧Rel 9 DCHSPA+(42/5.76Mbps)
‧TD‐SCDMA(4.2/2.2Mbps)
‧QICE
‧Integrated Memory
RTR8600 Multi‐band/mode RF transceiver for 3G and 4G LTE bands
▼PMIC
Apple Apple 343S0622‐A1
PMIC for Apple A6 Processor
(Dialog Semiconductor )
Qualcomm PM8018 PMIC for Qualcomm MDM9615M baseband processor

8. Manufacturer Device Function
▼Audio
Apple Apple 338S116
Audio Codec
(Cirrus Logic)
Apple 338S1077
Low Power Class‐D Audio Amplifiers
(Cirrus Logic)
▼Touch Screen Controller
Texas Instruments CD3240B0 Line Driver
Broadcom BCM5974 Touch Screen Controller
BCM5973A1
▼MEMs
STMicroelectronics AGD8/2234 chip marking
MEMS motion sensor: three‐axis digital output gyroscope
(STMicroelectronics L3G4200D)
A233 /33DH chip marking MEMS digital output motion sensor ultra low‐power high performance 3‐axes nano
(STMicroelectronics LIS331DLH) accelerometer
AKM AK8975 3‐axis Electronic Compass
▼Camera
Omnivision OV290BA Front Camera, 5 Mp CMOS Image Sensor
OV2C3B8E Rear Camera, 1.2MP CMOS Image Sensor
▼Others
NXP Semiconductor CBTL1608
Parade DP635 LCD timing controller
Integrated Memory Logic iML7990 Programmable gamma buffer
RichTek RT9910 Power management IC for the touchscreen display
Failchild FDMC6683 MOSFET
FDMC6676BZ PowerTrench MOSFET
Texas Instruments TPS61045

10.  16/32/64GB NAND Flash
 STMicroelectronics L3G4200D
 STMicroelectronics LIS331DLH
 Apple 338S1116, audio codec
 AKM AK8963
 Apple A5; 32nm process, Dual core Cortex‐A9, Imagination PowerVR 543MP2+
 Apple 343S0593‐A5, PMIC
 Apple 338S1077, Class‐D Audio Amplifiers
 Fairchild 6676BZ
 Fairchild 6683
 NXP CBTL1608
 Murata 339S0171, BRCM BCM4334 SDIO WiFi/High Speed UART BT SoC

11. Touch Screen Solution
Rear Camera
BROADCOM BROADCOM Omnivision
BCM5976 BCM5976
Front Camera
Omnivision
LVDS
STM I2C/SPI ALS
L3G4200D
x32;LPDDR2
STM I2C/SPI 4Gb(2Gbx2)
LIS331DLH LPDDR2‐800
x32;LPDDR2 Elpida
PoP Package
AKM I2C/SPI
AK8963
NAND Flash NAND Flash
16GB/32GB/64GB
Hynix
Apple Apple I2S
338S1077 338S1116
I2C Apple
343S0593‐A5
PMIC
UART SDIO
Qualcomm NXP
RTR8600 Qualcomm CBTL1608
0
MDM9615M Murata
339S0171
Broadcom
Qualcomm Lightning BCM4334
PM8018 8‐pin
connector

12. Manufacturer Device Function
▼Processor
Apple Apple A5 ‧1GHz, ARM Cortex‐A9, Dual‐core
‧Imagination PowerVR 543MP2+ GPU
‧SAMSUNG 32nm HKMG process
▼Memory
Elpida ‧32‐bit, Dual‐channel, 4Gb LPDDR2‐800
E4064P3PM‐8D‐5
‧PoP package
SK Hynix 16/32/64GB NAND Flash Main storage
▼Radio Frequency
Murata 339S0171
Broadcom BCM4334
(BRCM BCM4334 SDIO WiFi/ High
‧ Dual‐band 2.4 GHz and 5 GHz IEEE 802.11 a/b/g/n Wi‐Fi connectivity
Speed UART BT SoC)
‧ Single‐stream IEEE 802.11n support for 20 MHz and 40 MHz channels provides PHY
layer rates up to 150 Mbps for typical upper‐layer throughput in excess of 90 Mbps
‧ Supports the IEEE 802.11n STBC (space‐time block coding) and LDPC (low‐density
parity check) options for improved range and power efficiency
‧ Complies with Bluetooth Core Specification Version 4.0 + HS with provisions for
supporting future specifications
‧ Bluetooth Class 1 transmitter operation
Qualcomm MDM9615M Baseband Processor
‧Rel 9 LTE TDD/FDD Cat 3(100/50Mbps)
‧Rel 9 DCHSPA+(42/5.76Mbps)
‧TD‐SCDMA(4.2/2.2Mbps)
‧QICE
‧Integrated Memory
RTR8600 Multi‐band/mode RF transceiver for 3G and 4G LTE bands
▼PMIC
Apple Apple 343S0593‐A5 PMIC for Apple A6 Processor
Qualcomm PM8018 PMIC for Qualcomm MDM9615M baseband processor

13. Manufacturer Device Function
▼Audio
Apple Apple 338S1116
Audio Codec
(Cirrus Logic)
Apple 338S1077
Low Power Class‐D Audio Amplifiers
(Cirrus Logic)
▼Touch Screen Controller
Broadcom BCM5976C0KUB6G Touch Screen Controller
▼MEMs
STMicroelectronics AGD3 2236 J5CAO chip marking
MEMS motion sensor: three‐axis digital output gyroscope
(STMicroelectronics L3G4200D)
(2230 DSH EWFFR chip marking) MEMS digital output motion sensor ultra low‐power high performance 3‐axes nano
STMicroelectronics LIS331DLH accelerometer
AKM AK8963 Electronic Compass ‐ 3‐Axis, w/ built‐in ADC & 14‐16‐bit selectable digital output
▼Camera
Omnivision OV2C3BEE Front Camera, 5 Mp CMOS Image Sensor
OV2C3B8E Rear Camera, 1.2MP CMOS Image Sensor
▼Others
Fairchild PCHPS FDMC 6676BZ PowerTrench MOSFET
BC7BE F0MC 6683 MOSFET
NXP Semiconductor CBTL1608

14. The playground is open.

15.  SK Hynix H5TC2G83CFR‐H9A, 2Gb DDR3L
 nVIDIA® Tegra® 3 processor
 MAXIM MAX77612A
 Texas Instruments TPS63020
 Fairchild FDMC6675BZ
 AzureWave AW‐NH665
 NXP PN544
 Broadcom BCM4751
 Invensense MPU‐6050

16.  Kingston KE44B‐26BN/8GB; 8GB eMMC
 Realtek ALC5642 audio codec
ELAN eKTF36248WS
 ELAN eKTH10368WS
 Texas Instruments 22C96ST LVDS83B
 Texas Instruments TI20 MI60
 SK Hynix H5TC2G83CFR‐H9A, 2Gb DDR3L

18. Manufacturer Device Function
▼Processor
nVidia NVIDIA® Tegra® 3 1.5GHz, ARM CortexTM‐A9, Quad‐core
▼Memory
SK Hynix H5TC2G83CFR‐H9A 2Gb DDR3L
Kingston KE44B‐26BN/8GB 8/16GB eMMC
▼Radio Frequency
AzureWave AW‐NH665 802.11b/g/n Wi‐Fi + Bluetooth EDR
Broadcom BCM4751 GPS receiver
▼PMIC
MAXIM MAX77612A PMIC for NVIDIA® Tegra® 3
▼Audio
Realtek ALC5642 Audio codec
▼Touch Screen Controller
ELAN Microelectronics ELAN eKTH10368WS
Touch screen
ELAN eKTF36248WS
▼MEMs
3‐axis MEMS gyroscope, a 3‐axis MEMS accelerometer, and a Digital Motion
Invensense MPU‐6050
Processor. (DMP.) hardware accelerator engine

19. Manufacturer Device Function
▼Video
Texas Instruments 22C96ST LVDS83B FlatLink 10‐135MHz Transmitter
HYDIS HV070WX1‐1E0 7", 1280*800, IPS panel
▼Others
Texas Instruments TPS63020 High efficiency single inductor buck‐boost converter with 4‐A switchs
Fairchild FDMC6675BZ 30V P‐Channel Power Trench MOSFET
NXP PN544(65N04) NFC controller

21.  Wolfson WM8962E audio codec
 Texas Instruments OMAP4460, 1.2GHz
Elpida B8164B3PF‐1D‐F 8Gb LPDDR2, PoP package
micro‐USB
 Texas Instruments TWL6032 PMIC
micro‐HDMI
 SAMSUNG KLMAG2GE4A, 16GB eMMC
 Broadcom BCM2076, GPS and GLONASS AGPS,
Bluetooth 4.0, and FM Receiver/Transmitter
 Broadcom BCM43239, 2T2R WiFi

22.  InvenSense MPU‐6050M gyroscope / accelerometer

24. Manufacturer Device Function
▼Processor
Texas Instruments TI OMAP4, OMAP4460 1.2GHz ARM CortexTM‐A9, Dual‐core, Application Processor with Imagination PowerVR SGX540 GFX
▼Memory
Elpida B8164B3PF‐1D‐F 8Gb LPDDR2, PoP package
SAMSUNG KLMAG2GE4A 16GB eMMC
or or
KLMBG4GE4A 32GB eMMC
▼Radio Frequency
Broadcom BCM43239 802.11 a/b/g/n 2T2R WiFi
BCM2076 Multifunction Monolithic IC with GPS and GLONASS AGPS, Bluetooth 4.0, and FM
Receiver/Transmitter
▼PMIC
Texas Instruments TWL6032 PMIC for TI OMAP4460
▼Audio
Wolfson WM8962E Audio Codec
▼Touch Screen Controller
Atmel maXTouch™ mXT768E Touch screen controller
▼MEMs
3‐axis MEMS gyroscope, a 3‐axis MEMS accelerometer, and a Digital Motion Processor. (DMP.)
Invensense MPU‐6050M
hardware accelerator engine

27. Wacom Pen controller
ABOV MC96FR332A
Unknown  STMicronelectronics
SAMSUNG eMMC; 16/32/64GB
 SAMSUNG Exynos 4 Quad LSM330DLC
SAMSUNG K3PE0E000M‐XGC1 LPDDR2
Atmel mXT1664S
touch screen Controller
 Suspect to be the BOM
option for MAXIM  Suspect to be the BOM
MAX77693 PMIC option for WWAN
 MAXIM MAX77686 PMIC  Wolfson WM1811
 Doestek DTC34LM85AM
 Silicon Image Sil9244 MHL transmitter
 AKM 8975
 Murata/SEMCO WiFi/BT SoC
module, BRCM BCM4334

28. 10.1" MHL Rear‐facing camera:
1280*800 5MP pixel
Silicon
Image
Atmel LVDS SiI9244 Front‐facing camera:
mXT1664S MHL™ Transmitter 1.9M pixel
Doestek
34LM85AM
2
IC HDMI
Wacom x32; LPDDR2 SAMSUNG
W8008 K3PE0E000M‐
XGC1
x32; LPDDR2
16Gb LPDDR2
STM I2C/SPI
LSM330DLC
SAMSUNG
eMMC KLMAG2GE4A
2 eMMC
AKM I C/SPI 16/32/64GB
AK8975
MAXIM
I2C
Wolfson I2S MAX77686
WM1811AE PMIC
SDIO
Murata MAXIM
I2C MAX77693
/SEMCO UART
PMIC
BRCM4334
USB/I2C I2C USB SDIO
Skyworks
SKY77604
Skyworks F0514A ABOV
SKY13397
MC96FR332 USB Port
430 A
Infineon
Winbond
SMARTi™ UE2
W949D5CBHX5I

29. Manufacturer Part Number Function
▼Processor
SAMSUNG Exynos 4 Quad, Exynos 4412 1.4GHz, ARM CortexTM‐A9, Quad‐core, with ARM Mail‐400 GFX integrated, 32nm/High‐K
▼Memory
SAMSUNG K3PE0E000M‐XGC1 16Gb LPDDR2‐800, 32‐bit/Dual Channel, LPDDR2‐1066
KLMAG2GE4A SAMSUNG eMMC; 16/32/64GB
Winbond W949D5CBHX5I 512Mb LPDDR1
▼Radio Frequency
Intel/Infineon XG626(Marked PMB9811) Baseband processor:
‧ ARM11™ architecture
‧ 3GPP Rel7 HSPA+ platform supports HSPA category 14 (21 Mbit per second)
in the downlink and category 7 (11.5 Mbit per second) in the uplink.
‧ EDGE multislot class 33
PMB5712 SMARTi UE2 RF Transceiver
Skyworks SKY77604 Power Amplifier
SKY13397 RF Switch
Murata/SEMCO N/A Broadcom BCM4334
‧ Dual‐band 2.4 GHz and 5 GHz IEEE 802.11 a/b/g/n Wi‐Fi connectivity
‧ Single‐stream IEEE 802.11n support for 20 MHz and 40 MHz channels provides PHY
layer rates up to 150 Mbps for typical upper‐layer throughput in excess of 90 Mbps
‧ Supports the IEEE 802.11n STBC (space‐time block coding) and LDPC (low‐density
parity check) options for improved range and power efficiency
‧ Complies with Bluetooth Core Specification Version 4.0 + HS with provisions for
supporting future specifications
‧ Bluetooth Class 1 transmitter operation
▼PMIC
MAXIM MAX77686 PMIC for SAMSUNG Exynos AP

30. Manufacturer Part Number Function
▼Audio
Wolfson Microelectronics WM1811AE Audio Codec
▼Touch Screen Controller
Atmel mXT1664S Touch screen controller
Wacom W8008 for SAMSUNG S Pen
▼MEMs
AKM AKM8975 Electronic compass
STMicroelectronics LSM330DLC 3D accelerometer and 3D gyroscope
▼Video
Doestek DTC34LM85AM LVDS transmitter
Silicon Image SiI9244BO MHL™ Transmitter
SAMSUNG N/A Front camera, 5.0MP
Murata N/A Rear camera, 1.9MP
▼Others
ABOV MC96FR332A 8‐bit Microcontroller
Unknown F0514A Unknown

31. The metallic spun finish with ultra-slim and light features of the Transformer Prime
sets a new benchmark in the art of tablet

32. Broadcom BCM47511 Nuvoton NPCE795LA0BX
32GB/64GB eMMC; Konix KXTF9
Winbond 25X40BVIG
AzureWave AW‐NH615 Hynix/Kinston
Invensense MPU‐3050
Fortemedia FM34
Fujitsu Image Processor
Voice Processor Texas Instruments
NVIDIA® Tegra® 3
TPS659110 PMIC
Realtek ALC5631
LVDS Transmitter;
audio codec Elpida 8Gb LPDDR2
TI/THine
memory

33. 10.1",
Super IPS LCD
LVDS LVDS Korea
Transmitter MBG043
1280*800
Atmel
mXT768E
I2C CMOS HDMI 8Gb*1pcs
Kionix I2C LPDDR2 Elpida
KXTF9 B8132B2MA
32/64GB
Invensense I2C eMMC
eMMC
MPU‐3050 Hynix/Kingston
TI
I2S/PCM I2C
Fortemedia TPS659II02
FM34NE 395
PMIC
I2S/PCM
SDIO
Realtek
ALC5631
I2C SPI USB UART UART SDIO
0
nuvonTon I2C nuvonTon winbond BROADCOM AzureWave
Docking NPCE795 NPCE795 25X40BVIG BCM4751 AW‐NH615
Station

34. Manufacturer Device Function
▼Processor
nVidia NVIDIA® Tegra® 3 1.5GHz, ARM CortexTM‐A9, Quad‐core
▼Memory
Elpida B8132B2MA‐6D‐F 8Gb LPDDR2
Hynix H26M64002BNR e‐NAND 32/64GB eMMC
Kingston KE4BT5D6A 32/64GB eMMC
▼Radio Frequency
AzureWave AW‐NH615 802.11b/g/n Wi‐Fi + Bluetooth EDR
Broadcom BCM47511 GPS receiver
▼PMIC
Texas Instruments TPS659110 PMIC for NVIDIA® Tegra® 3
▼Audio
Realtek ALC5631 Audio codec
Fortemedia FM34NE Voice Processor
▼Touch Screen Controller
Atmel MXT768E Touch screen controller

35. Manufacturer Device Function
▼MEMs
Invensense MPU‐3050 Three‐axis gyroscope
Kionix KXTF9 3‐axis accelerometer and inclinometers
▼Video
Texas Instruments SN75LVDS83B FlatLink 10‐135MHz LVDS Transmitter
THine TH133B LVDS Transmitter
Fujitsu MBG048 Image processor
▼Others
TPS51125A Dual‐Synchronous, Step‐Down Controller
Texas Instruments
bq24725 2‐4 Cell Li+ Battery SMBus Charge Controller
FPF2700 AccuPower FPF2700 Integrated Load Switch
Fairchild
FDMC4435BZ 30V P‐Channel Power Trench MOSFET
Nuvoton NPCE795LA0BX Embedded controller
Winbond 25X40BVIG 4Mb serial flash

36. Tablet System
Display MHL
MIPI‐CSI
Rear‐facing camera:
Wacom Touch
Touch Screen
Silicon Image
Screen Controller MHL Transmitter
Controller MIPI‐CSI Front‐facing camera:
I2C/UART/
LVDS/eDP
SPI HDMI
/MIPI
2
I C/SPI
Gyro LPDDR2/DDR3L
System
LPDDR2/DDR3L Memory
I2C/SPI
accle
NAND Flash
NF/eMMC
I2C/SPI or
Compass eMMC
I2C/SPI
ALS
USB/C2C/HSIC Baseband Mobile
Processor DDR
Pressure I2C/SPI
Sensor
SDIO
WiFi/BT
I2C Soc
PMIC UART
I2S I2C/UART/ UART USB SDIO
SPI
voice I2S Audio GNSS
NFC
processor Receiver
Codec
USB Port

37. 2013 Tablet Guide Tablet Components, Key Suppliers and Market Share 2012E
Source: Nomura

38. 2013 Tablet Guide Tablet Components, Key Suppliers and Market Share 2012E
Source: Nomura

39. 2013 Tablet Guide Tablet Components, Key Suppliers and Market Share 2012E
Source: Nomura

40. 2013 Tablet Guide Tablet Components, Key Suppliers and Market Share 2012E
Source: Nomura

41. 2013 Tablet Guide Tablet Components, Key Suppliers and Market Share 2012E
Source: Nomura

42. 2013 Tablet Guide Tablet Components, Key Suppliers and Market Share 2012E
Source: Nomura