Tablet in 2012

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Tablet in 2012

  1. 1. Tablet in 2012
  2. 2.  Apple New iPad (Apple 4th Generation iPad) Apple iPad mini Google Nexus 7 Amazon Kindle Fire HD 7” SAMSUNG Galaxy Note 10.1 ASUS Transformer Prime 2013 Tablet guide
  3. 3.  Apple 338S116, audio codec Texas Instruments TPS61045 16/32/64GB NAND Flash  Apple A6X, SAMSUNG 32nm  HKMG process 1.4GHz, Dual core ARMv7, Imagination PowerVR 554MP4+ GPU Apple 343S0622‐A1, PMIC NXP CBTL1608 Apple 338S1077, Class‐D Audio Amplifiers
  4. 4.  Broadcom BCM5974 Broadcom BCM5973A Texas Instruments CD3240B0  LPDDR2‐1066, x32/dual‐channel Supplier: Elpida/SK Hynix Fairchild 6676BZ Fairchild 6683 Murata  339S0171, BRCM BCM4334 SDIO WiFi/High Speed UART BT SoC
  5. 5. Manufacturer Device Function▼Processor Apple Apple A6X Microprocessor ‧1.4GHz, ARMv7, Dual‐core ‧Imagination PowerVR SGX 554MP4+ ‧32nm process▼Memory Elpida/SK Hynix ‧32‐bit, Dual‐channel, 4Gb LPDDR2‐1066 B4064B3MA‐1D‐F ‧Two memory chip on the system main board H9TCNNN4KDBMUR ‧Supplier: Elpida/SK Hynix SK Hynix 16/32/64GB NAND Flash Main storage▼Radio Frequency Murata 339S0171  Broadcom BCM4334 (BRCM BCM4334 SDIO WiFi/ High  ‧ Dual‐band 2.4 GHz and 5 GHz IEEE 802.11 a/b/g/n Wi‐Fi connectivity  Speed UART BT SoC) ‧ Single‐stream IEEE 802.11n support for 20 MHz and 40 MHz channels provides PHY  layer rates up to 150 Mbps for typical upper‐layer throughput in excess of 90 Mbps  ‧ Supports the IEEE 802.11n STBC (space‐time block coding) and LDPC (low‐density parity check) options for improved range and power efficiency  ‧ Complies with Bluetooth Core Specification Version 4.0 + HS with provisions for supporting future specifications  ‧ Bluetooth Class 1 transmitter operation Qualcomm MDM9615M Baseband Processor ‧Rel 9 LTE TDD/FDD Cat 3(100/50Mbps) ‧Rel 9 DCHSPA+(42/5.76Mbps) ‧TD‐SCDMA(4.2/2.2Mbps) ‧QICE ‧Integrated Memory RTR8600 Multi‐band/mode RF transceiver for 3G and 4G LTE bands▼PMIC Apple Apple 343S0622‐A1 PMIC for Apple A6 Processor (Dialog Semiconductor ) Qualcomm PM8018 PMIC for Qualcomm MDM9615M baseband processor
  6. 6. Manufacturer Device Function▼Audio Apple Apple 338S116 Audio Codec (Cirrus Logic) Apple 338S1077 Low Power Class‐D Audio Amplifiers (Cirrus Logic)▼Touch Screen Controller Texas Instruments CD3240B0  Line Driver Broadcom BCM5974 Touch Screen Controller BCM5973A1▼MEMs STMicroelectronics AGD8/2234 chip marking MEMS motion sensor: three‐axis digital output gyroscope (STMicroelectronics L3G4200D) A233 /33DH chip marking MEMS digital output motion sensor ultra low‐power high performance 3‐axes  nano (STMicroelectronics LIS331DLH) accelerometer AKM AK8975 3‐axis Electronic Compass ▼Camera Omnivision OV290BA Front Camera, 5 Mp CMOS Image Sensor OV2C3B8E Rear Camera, 1.2MP CMOS Image Sensor ▼Others NXP Semiconductor CBTL1608 Parade DP635  LCD timing controller Integrated Memory Logic  iML7990 Programmable gamma buffer RichTek RT9910 Power management IC for the touchscreen display Failchild FDMC6683 MOSFET FDMC6676BZ PowerTrench MOSFET Texas Instruments TPS61045
  7. 7.  16/32/64GB NAND Flash  STMicroelectronics L3G4200D STMicroelectronics LIS331DLH Apple 338S1116, audio codec AKM AK8963 Apple A5; 32nm process, Dual core Cortex‐A9, Imagination PowerVR 543MP2+ Apple 343S0593‐A5, PMIC Apple 338S1077, Class‐D Audio Amplifiers Fairchild 6676BZ Fairchild 6683 NXP CBTL1608 Murata  339S0171, BRCM BCM4334 SDIO WiFi/High Speed UART BT SoC
  8. 8. Touch Screen Solution Rear Camera  BROADCOM BROADCOM Omnivision BCM5976 BCM5976 Front Camera  Omnivision  LVDS STM I2C/SPI ALS L3G4200D x32;LPDDR2 STM I2C/SPI 4Gb(2Gbx2) LIS331DLH LPDDR2‐800 x32;LPDDR2 Elpida PoP Package AKM I2C/SPI AK8963 NAND Flash NAND Flash 16GB/32GB/64GB HynixApple Apple I2S338S1077 338S1116 I2C Apple 343S0593‐A5 PMIC UART SDIO Qualcomm NXP RTR8600 Qualcomm CBTL1608 0 MDM9615M Murata 339S0171 Broadcom  Qualcomm Lightning  BCM4334 PM8018 8‐pin  connector
  9. 9. Manufacturer Device Function▼Processor Apple Apple A5 ‧1GHz, ARM Cortex‐A9, Dual‐core ‧Imagination PowerVR 543MP2+ GPU ‧SAMSUNG 32nm HKMG process▼Memory Elpida ‧32‐bit, Dual‐channel, 4Gb LPDDR2‐800 E4064P3PM‐8D‐5 ‧PoP package SK Hynix 16/32/64GB NAND Flash Main storage▼Radio Frequency Murata 339S0171  Broadcom BCM4334 (BRCM BCM4334 SDIO WiFi/ High  ‧ Dual‐band 2.4 GHz and 5 GHz IEEE 802.11 a/b/g/n Wi‐Fi connectivity  Speed UART BT SoC) ‧ Single‐stream IEEE 802.11n support for 20 MHz and 40 MHz channels provides PHY  layer rates up to 150 Mbps for typical upper‐layer throughput in excess of 90 Mbps  ‧ Supports the IEEE 802.11n STBC (space‐time block coding) and LDPC (low‐density parity check) options for improved range and power efficiency  ‧ Complies with Bluetooth Core Specification Version 4.0 + HS with provisions for supporting future specifications  ‧ Bluetooth Class 1 transmitter operation Qualcomm MDM9615M Baseband Processor ‧Rel 9 LTE TDD/FDD Cat 3(100/50Mbps) ‧Rel 9 DCHSPA+(42/5.76Mbps) ‧TD‐SCDMA(4.2/2.2Mbps) ‧QICE ‧Integrated Memory RTR8600 Multi‐band/mode RF transceiver for 3G and 4G LTE bands▼PMIC Apple Apple 343S0593‐A5 PMIC for Apple A6 Processor Qualcomm PM8018 PMIC for Qualcomm MDM9615M baseband processor
  10. 10. Manufacturer Device Function▼Audio Apple Apple 338S1116 Audio Codec (Cirrus Logic) Apple 338S1077 Low Power Class‐D Audio Amplifiers (Cirrus Logic)▼Touch Screen Controller Broadcom BCM5976C0KUB6G Touch Screen Controller▼MEMs STMicroelectronics AGD3 2236 J5CAO chip marking MEMS motion sensor: three‐axis digital output gyroscope (STMicroelectronics L3G4200D) (2230 DSH EWFFR chip marking) MEMS digital output motion sensor ultra low‐power high performance 3‐axes  nano STMicroelectronics LIS331DLH accelerometer AKM AK8963 Electronic Compass ‐ 3‐Axis, w/ built‐in ADC & 14‐16‐bit selectable digital output▼Camera Omnivision OV2C3BEE Front Camera, 5 Mp CMOS Image Sensor OV2C3B8E Rear Camera, 1.2MP CMOS Image Sensor ▼Others Fairchild PCHPS FDMC 6676BZ PowerTrench MOSFET BC7BE F0MC 6683 MOSFET NXP Semiconductor CBTL1608
  11. 11. The playground is open. 
  12. 12.  SK Hynix H5TC2G83CFR‐H9A, 2Gb DDR3L nVIDIA® Tegra® 3 processor MAXIM MAX77612A Texas Instruments TPS63020 Fairchild FDMC6675BZ AzureWave AW‐NH665 NXP PN544 Broadcom BCM4751 Invensense MPU‐6050
  13. 13.  Kingston KE44B‐26BN/8GB; 8GB eMMC Realtek ALC5642 audio codecELAN eKTF36248WS ELAN eKTH10368WS Texas Instruments 22C96ST LVDS83B Texas Instruments TI20 MI60 SK Hynix H5TC2G83CFR‐H9A, 2Gb DDR3L
  14. 14. Manufacturer Device Function▼Processor nVidia NVIDIA® Tegra® 3 1.5GHz, ARM CortexTM‐A9, Quad‐core▼Memory SK Hynix H5TC2G83CFR‐H9A 2Gb DDR3L Kingston KE44B‐26BN/8GB 8/16GB eMMC▼Radio Frequency AzureWave AW‐NH665  802.11b/g/n Wi‐Fi + Bluetooth  EDR Broadcom BCM4751 GPS receiver ▼PMIC MAXIM MAX77612A PMIC for NVIDIA® Tegra® 3▼Audio Realtek ALC5642 Audio codec▼Touch Screen Controller ELAN Microelectronics ELAN eKTH10368WS Touch screen ELAN eKTF36248WS▼MEMs 3‐axis MEMS gyroscope, a 3‐axis MEMS accelerometer, and a Digital Motion  Invensense MPU‐6050 Processor. (DMP.) hardware accelerator engine
  15. 15. Manufacturer Device Function▼Video Texas Instruments 22C96ST LVDS83B FlatLink 10‐135MHz Transmitter  HYDIS HV070WX1‐1E0 7", 1280*800, IPS panel▼Others Texas Instruments TPS63020 High efficiency single inductor buck‐boost converter with 4‐A switchs Fairchild FDMC6675BZ 30V P‐Channel Power Trench MOSFET  NXP PN544(65N04) NFC controller
  16. 16.  Wolfson WM8962E audio codec Texas Instruments OMAP4460, 1.2GHz Elpida B8164B3PF‐1D‐F 8Gb LPDDR2, PoP package micro‐USB  Texas Instruments TWL6032 PMICmicro‐HDMI  SAMSUNG KLMAG2GE4A, 16GB eMMC Broadcom BCM2076, GPS and GLONASS AGPS,  Bluetooth 4.0, and FM Receiver/Transmitter Broadcom BCM43239, 2T2R WiFi
  17. 17.  InvenSense MPU‐6050M gyroscope / accelerometer 
  18. 18. Manufacturer Device Function▼Processor Texas Instruments TI OMAP4, OMAP4460 1.2GHz ARM CortexTM‐A9, Dual‐core, Application Processor with Imagination PowerVR SGX540 GFX▼Memory Elpida B8164B3PF‐1D‐F 8Gb LPDDR2, PoP package SAMSUNG KLMAG2GE4A 16GB eMMC or or KLMBG4GE4A 32GB eMMC▼Radio Frequency Broadcom BCM43239 802.11 a/b/g/n 2T2R WiFi BCM2076 Multifunction Monolithic IC with GPS and GLONASS AGPS, Bluetooth 4.0, and FM  Receiver/Transmitter▼PMIC Texas Instruments TWL6032 PMIC for TI OMAP4460▼Audio Wolfson WM8962E Audio Codec▼Touch Screen Controller Atmel maXTouch™ mXT768E  Touch screen controller▼MEMs 3‐axis MEMS gyroscope, a 3‐axis MEMS accelerometer, and a Digital Motion Processor. (DMP.)  Invensense MPU‐6050M hardware accelerator engine
  19. 19. Wacom Pen controller ABOV MC96FR332A Unknown  STMicronelectronics SAMSUNG eMMC; 16/32/64GB  SAMSUNG Exynos 4 Quad LSM330DLC SAMSUNG K3PE0E000M‐XGC1 LPDDR2 Atmel mXT1664S  touch screen Controller  Suspect to be the BOM  option for MAXIM   Suspect to be the BOM  MAX77693 PMIC option for WWAN  MAXIM MAX77686 PMIC  Wolfson WM1811  Doestek DTC34LM85AM  Silicon Image Sil9244 MHL transmitter  AKM 8975 Murata/SEMCO WiFi/BT SoCmodule, BRCM BCM4334
  20. 20. 10.1" MHL Rear‐facing camera: 1280*800 5MP pixel Silicon Image Atmel LVDS SiI9244 Front‐facing camera: mXT1664S MHL™ Transmitter 1.9M pixel Doestek 34LM85AM 2 IC HDMI Wacom x32; LPDDR2 SAMSUNG W8008 K3PE0E000M‐ XGC1 x32; LPDDR2 16Gb LPDDR2 STM  I2C/SPI LSM330DLC SAMSUNG eMMC KLMAG2GE4A 2 eMMC AKM I C/SPI 16/32/64GB AK8975 MAXIM I2C Wolfson I2S MAX77686 WM1811AE PMIC SDIO Murata MAXIM I2C MAX77693 /SEMCO UART PMICBRCM4334 USB/I2C I2C USB SDIOSkyworksSKY77604Skyworks F0514A ABOVSKY13397 MC96FR332 USB Port 430 A InfineonWinbond SMARTi™ UE2W949D5CBHX5I
  21. 21. Manufacturer Part Number Function▼Processor SAMSUNG Exynos 4 Quad, Exynos 4412 1.4GHz, ARM CortexTM‐A9, Quad‐core, with ARM Mail‐400 GFX integrated, 32nm/High‐K▼Memory SAMSUNG K3PE0E000M‐XGC1 16Gb LPDDR2‐800, 32‐bit/Dual Channel, LPDDR2‐1066 KLMAG2GE4A SAMSUNG eMMC; 16/32/64GB Winbond W949D5CBHX5I 512Mb LPDDR1▼Radio Frequency Intel/Infineon XG626(Marked PMB9811) Baseband processor: ‧ ARM11™ architecture ‧ 3GPP Rel7 HSPA+ platform supports HSPA category 14 (21 Mbit per second)  in the downlink and category 7 (11.5 Mbit per second) in the uplink. ‧ EDGE multislot class 33 PMB5712 SMARTi UE2 RF Transceiver  Skyworks SKY77604 Power Amplifier SKY13397 RF Switch Murata/SEMCO N/A Broadcom BCM4334 ‧ Dual‐band 2.4 GHz and 5 GHz IEEE 802.11 a/b/g/n Wi‐Fi connectivity  ‧ Single‐stream IEEE 802.11n support for 20 MHz and 40 MHz channels provides PHY  layer rates up to 150 Mbps for typical upper‐layer throughput in excess of 90 Mbps  ‧ Supports the IEEE 802.11n STBC (space‐time block coding) and LDPC (low‐density parity check) options for improved range and power efficiency  ‧ Complies with Bluetooth Core Specification Version 4.0 + HS with provisions for supporting future specifications  ‧ Bluetooth Class 1 transmitter operation▼PMIC MAXIM MAX77686 PMIC for SAMSUNG Exynos AP
  22. 22. Manufacturer Part Number Function▼Audio Wolfson Microelectronics WM1811AE Audio Codec▼Touch Screen Controller Atmel mXT1664S Touch screen controller Wacom W8008 for SAMSUNG S Pen▼MEMs AKM AKM8975 Electronic compass STMicroelectronics LSM330DLC 3D accelerometer and 3D gyroscope▼Video Doestek DTC34LM85AM LVDS transmitter Silicon Image SiI9244BO MHL™ Transmitter  SAMSUNG N/A Front camera, 5.0MP Murata N/A Rear camera, 1.9MP▼Others ABOV MC96FR332A 8‐bit Microcontroller Unknown F0514A Unknown
  23. 23. The metallic spun finish with ultra-slim and light features of the Transformer Primesets a new benchmark in the art of tablet
  24. 24. Broadcom BCM47511 Nuvoton NPCE795LA0BX 32GB/64GB eMMC;  Konix KXTF9 Winbond 25X40BVIG AzureWave AW‐NH615 Hynix/Kinston Invensense MPU‐3050 Fortemedia FM34  Fujitsu Image Processor Voice Processor Texas Instruments  NVIDIA® Tegra® 3 TPS659110 PMICRealtek ALC5631  LVDS Transmitter;  audio codec Elpida 8Gb LPDDR2  TI/THine memory
  25. 25. 10.1",  Super IPS LCD LVDS LVDS  Korea Transmitter MBG043 1280*800 Atmel mXT768E I2C CMOS HDMI 8Gb*1pcs Kionix I2C LPDDR2 Elpida KXTF9 B8132B2MA 32/64GB Invensense I2C eMMC eMMC MPU‐3050 Hynix/Kingston TI I2S/PCM I2C Fortemedia TPS659II02 FM34NE 395  PMIC I2S/PCM SDIORealtek ALC5631 I2C SPI USB UART UART SDIO 0 nuvonTon I2C nuvonTon winbond BROADCOM AzureWave Docking  NPCE795 NPCE795 25X40BVIG BCM4751 AW‐NH615 Station
  26. 26. Manufacturer Device Function▼Processor nVidia NVIDIA® Tegra® 3 1.5GHz, ARM CortexTM‐A9, Quad‐core▼Memory Elpida B8132B2MA‐6D‐F 8Gb LPDDR2 Hynix H26M64002BNR e‐NAND 32/64GB eMMC Kingston KE4BT5D6A 32/64GB eMMC▼Radio Frequency AzureWave AW‐NH615  802.11b/g/n Wi‐Fi + Bluetooth  EDR Broadcom BCM47511 GPS receiver ▼PMIC Texas Instruments TPS659110 PMIC for NVIDIA® Tegra® 3▼Audio Realtek ALC5631 Audio codec Fortemedia FM34NE Voice Processor▼Touch Screen Controller Atmel MXT768E Touch screen controller
  27. 27. Manufacturer Device Function▼MEMs Invensense MPU‐3050 Three‐axis gyroscope Kionix KXTF9 3‐axis accelerometer and inclinometers▼Video Texas Instruments SN75LVDS83B FlatLink 10‐135MHz LVDS Transmitter  THine TH133B LVDS Transmitter Fujitsu MBG048 Image processor▼Others TPS51125A Dual‐Synchronous, Step‐Down Controller  Texas Instruments bq24725  2‐4 Cell Li+ Battery SMBus Charge Controller  FPF2700  AccuPower FPF2700 Integrated Load Switch  Fairchild FDMC4435BZ 30V P‐Channel Power Trench MOSFET  Nuvoton NPCE795LA0BX Embedded controller Winbond 25X40BVIG 4Mb serial flash
  28. 28. Tablet System Display MHL MIPI‐CSI Rear‐facing camera: Wacom Touch Touch Screen Silicon Image Screen Controller MHL Transmitter Controller MIPI‐CSI Front‐facing camera: I2C/UART/ LVDS/eDP SPI HDMI /MIPI 2 I C/SPI Gyro LPDDR2/DDR3L System LPDDR2/DDR3L Memory I2C/SPI accle NAND Flash NF/eMMC I2C/SPI or Compass eMMC I2C/SPI ALS USB/C2C/HSIC Baseband Mobile  Processor DDR Pressure I2C/SPI Sensor SDIO WiFi/BT I2C Soc PMIC UART I2S I2C/UART/ UART USB SDIO SPI voice  I2S Audio  GNSS NFC processor Receiver Codec USB Port
  29. 29. 2013 Tablet Guide Tablet Components, Key Suppliers and Market Share 2012E Source: Nomura
  30. 30. 2013 Tablet Guide Tablet Components, Key Suppliers and Market Share 2012E Source: Nomura
  31. 31. 2013 Tablet Guide Tablet Components, Key Suppliers and Market Share 2012E Source: Nomura
  32. 32. 2013 Tablet Guide Tablet Components, Key Suppliers and Market Share 2012E Source: Nomura
  33. 33. 2013 Tablet Guide Tablet Components, Key Suppliers and Market Share 2012E Source: Nomura
  34. 34. 2013 Tablet Guide Tablet Components, Key Suppliers and Market Share 2012E Source: Nomura
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