This document summarizes a study analyzing electronic chip microchannels using ANSYS software. It presents the background on microchannel cooling technology and prior research. It then describes the numerical model setup in ANSYS, including the microchannel geometry, governing equations, and boundary/flow conditions. Results are shown for temperature contours, velocity vectors, pressure drops, and heat transfer coefficients for different materials and pressure drops. The study found that outlet water temperature was highest for a pressure drop of 30 kPa and when the substrate was silicon. Overall, the document analyzes heat transfer in a microchannel heat sink using computational fluid dynamics software.
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Fig(9): Velocity vectors at outlet of channel for p = 30 kPa, 50kPa, q=90 W/cm2
Fig(10): Comparison of temperature difference (silicon, copper) based of micro channel heat sink for
different pressure drop q= 90 W/cm2
11. Fig (11): Average heat transfer coefficient and Average Nusselt number distributions inside the
channel for different pressure drop at q=90 W/cm2