LED Lighting Module Technology, Industry and Market Trends 2015 Report by Yole Developpement

From Technologies to Market
LED Lighting Module
Technology, Industry
and Market Trends
Sample
Market & Technology Report

2
o Authors of the Report P6
o Objectives of the Report P7
o Acronym P8
o Executive Summary P9
o Definitions and Uses of LED Modules P33
• Definitions
• LED Module in the Global LED Value Chain
• Luminaire Design Approach with a LED Module
• Benefits of LED Module for Integrator
• Overview
• Focus on Time and Cost Savings
o International Standards for LED Modules P41
• Introduction
• Overview of Main Standards
• International vs. Local Standards - Deviations & Trends
o LED Module Integration into Lighting Systems (1/2) P45
• System Integration
• Engineering
• Thermal Integration
• Electrical Insulation Rules
• Overview
• Details on Driver Classes
• Zhaga
• Guideline for Interchangeability of Light Sources
• Consortium Members
• The Dilemma
o LED Module Integration into Lighting Systems (2/2) P45
• The Different Types of LED Modules
• Taxonomy
• Middle Power vs. High Power vs. COB vs. AC vs. Custom
• Positioning
• Geometry and Size
• Electrical Interfaces
• LED Module vs. LEDi Module
• The Case of Flexible LED Strips
o Analysis of Main Functions in LED Modules (1/2) P62
• Introduction
• System Structure
• Parameter Interdependence
• Thermal Management
• Why Thermal Management is Required for LED Systems?
• Substrates/PCB
• Heatsink and Thermal Interface Materials
• Analysis of Different Thermal Interface Materials
• Heatsink technologies
• Heatsink Design vs. LED Module Technology
• Major Trends in Thermal Management
• Importance of Thermal Management for LED Module Reliability
• Optical Design
• A Large Panel of Optical Solutions
• Optical Generic Architecture in Lighting
• Collimators, Lenses and Refractors - Materials & Process
• Focus on Reflectors
• Focus on Diffusers
• Mixing Chamber
• Optical Architecture vs. LED Module Technology
• Overview
• Analysis per Application
TABLE OF CONTENT OFTHE REPORT (1/4)
©2015 | www.yole.fr | LED Lighting Module Technology, Industry and Market Trends

3
o Analysis of Main Functions in LED Modules (2/2) P62
• Power Supply and Drivers
• Overview of Drivers
• The Different Driver Topologies
• Driver Topology vs. LED Module Technology
• AC Drivers
• Low Voltage DC Minigrids
• Driver Reliability
• Trends
o Analysis of Middle Power LED Modules P94
• Drivers for Integration
• Why Middle Power LEDs for LED Modules?
• Overview of Standard Design
• Type of LEDs
• Performance Aspects
• Substrate/PCB
• Thermal Management and Reliability
• Power and Voltage
• Drivers
• Optics
• Focus on AC Middle Power LED Module
• Introduction
• Impact on Design
• Efficacy
• Cost Aspects
• Performance Standards for Luminaire
o Analysis of High Power LED Modules (1/2) P112
• Introduction
• High Power LEDs vs. Middle Power LEDs
• High Power LED Modules vs. Middle Power LED Modules
o Analysis of High Power LED Modules (2/2) P112
• The Different Type of High Power LED Modules
• High Brightness and Large (HBL) Module
• Overview
• Substrate/PCB
• Drivers and Electrical Connections
• Thermal Management
• Optics
• High Quality of Light (HQL) Module
• Overview
• Beating CDM Lamp Evolution
• Multichannel Technology
• Phosphor Technology
• High Brightness and Compact (HBC) Module
o Analysis of COB LED Modules (1/2) P126
• Introduction
• COB Technology - A Compromise Solution
• Main COB Design Choices
• Substrate/PCB
• Chip Layout
• Trends
• High Lumen Density in COB
• Positioning of High Density COB
• Market Segmentation and Uses
• New COB Devices
• COB Evolution and Roadmap
• Ecosystem
• Interconnection
• Options for COB
• Comparison of Technology

4
o Analysis of COB LED Modules (2/2) P126
• Holder Reliability
• Diversity and Compatibility
• Standardization
• Zhaga Influence
• Optics
• Overview
• Integration
• Management of System Performance
• Drivers
• Thermal Behavior
• Performance Standards for Luminaires
o Analysis of Flexible LED Strips P152
• Flexible LED Strips at a Glance
• Flexible LED Strips vs. Rigid LED Strips
• Status of the Industry
• Differentiation Factors
• Overview
• Focus on “Large Variety of Flexible LED Strip Types”
• Focus on “Quality Criteria”
• Focus on “Specific Products and Innovative Solutions”
• Focus on “Price”
• Voltage
• Connectors
• Dust/Water Protection
• Adhesive
o LED Lighting Module Industry and Market Trends (1/2) P167
• Introduction - Packaged LED Industry and Market Trends
• Introduction to LEDs
• History of LED Industry
• Overview
• Recent Trends
• Market Trends
• LED Adoption Rate (Comparison 2014 vs. 2020)
• Focus on Display Applications
• Focus on General Lighting Applications
• LED Industry in 2015 - Main Challenges
• LED Lighting Module Market Trends
• Application vs. Module Technology
• Market Volume and Revenue
• Introduction
• Total Market (Excluding Flexible LED Strips)
• Split by Module Technology (Excluding Flexible LED Strips)
• The Case of Flexible LED Strips
• Market Volume and Revenue
• Trends in ASP
• Conclusion
• LED Lighting Module Industry Trends
• History of the LED Lighting Module Industry
• The SSL Chasm
• Main LED Module Suppliers (Excluding COB and Flexible LED Strips)
• Main COB LED Suppliers
• Main Flexible LED Strip Suppliers
• Non-COB LED Module Supplier vs. COB LED Module Supplier
• Origin of Players
• Overview
• Positioning of some LED Module Suppliers
• Example of Vossloh Schwabe

5
o LED Lighting Module Industry and Market Trends (2/2) P167
• LED Lighting Module Industry Trends
• Focus on Packaged LED Manufacturers
• Focus on Driver Manufacturers
• Focus on Optic, Luminaire and Connector Manufacturers
o Conclusion P203
o Appendix - International Standards for LED Modules P209
o Appendix - Presentation of Yole Développement P216
o Appendix - Presentation of PISEO P231

6
TO PROVIDE A COMPREHENSIVE OVERVIEW OF ALL ASPECTS OF LED LIGHTING MODULES!
- Technologies. - Markets and applications.
- Main functions. - Integration into lighting systems (…).
TO ANALYZE POSITIONING OF EACH LED LIGHTING MODULETYPE!
- Middle power LED module. - High power LED module.
- COB LED module. - Flexible LED strips.
TO ANALYZE MAINTECHNOLOGY IN USE FOR EACH LED LIGHTING MODULETYPE!
- Thermal management (PCB/substrate,TIM, heatsink). - Optical design.
- Power supply and driver.
TO ANALYZE LED LIGHTING MODULE INDUSTRY STRUCTURE AND FUTURETRENDS!
TO PROVIDE VOLUME AND MARKET SIZE FOR LED LIGHTING MODULE!
OBJECTIVES OFTHE REPORT

7
• From LED chip to LED lighting system, several steps of value drive the lighting industry. LED modules represent a bridge
between the packaged LED offer and the luminaire shaped product.
• A significantly integrated LED package reduces the level of know-how necessary for lighting manufacturers, thereby enabling
conventional lighting system manufacturers to have easier access to the technology.
• Basically, we can consider an LED module as a unit containing one or more LEDs with mechanical and optical components.
• It may contain additional components (e.g., connectors, resistors, ESD protection devices, lenses…).
• Generally, LED module is considered a replaceable item for use in a luminaire.
• An LED module represents a component/sub-system optimized for a given application scope.
LED Module in the Global LEDValue Chain
DEFINITIONS AND USES OF LED MODULES
LED MODULES
LED
Die/Chip
Packaged
LED
Light/LED
Module
Light Source
(Module + Driver)
Luminaire
Light
System/
Solution
Philips
Lighting
Lumileds

8
Modular
approach enable
an easier
integration of
LED modules.
System Integration
LED MODULE INTEGRATION INTO LIGHTING SYSTEMS
• System integration is based on standardized interfaces and building blocks: LED module, driver, optic, electronic (…).
• The design effort of the integrator is mainly focused on:
• The interfaces between these building blocks.
• The system performance qualification.
PCB /
Connector
Packaged
LED
Optic
Thermal
System
Driver
Mechanical
Assembly
• Please note that lower efforts can be done on the
LED module qualification which is under the
responsibility of the LED module manufacturer /
supplier.
• Modular architecture can be developed to easier
upgrade of the building blocks (→ allowing for
short and efficient product development /
evolution).
• With this strategy, companies benefit from:
• Improvement of LED performance (lm/W).
• LED cost decrease ($/lm).
• Work also for other components, such as
driver (…).
• Technology leverage → Same LED module for
different applications.
• Thermal redesign.
• Optics redesign (and improvements). ©2015 | www.yole.fr | LED Lighting Module Technology, Industry and Market Trends

9
• The Zhaga Consortium is an organization enabling the
interchangeability of LED light sources made by different
manufacturers.
• Zhaga establishes interface specifications for different form factors.
For each form factor, Zhaga’s specifications enable interchange of
components from different suppliers.
• Zhaga define following interfaces:
• Mechanical interface.
• Photometric interface.
• Thermal interface.
• Electrical interface.
Zhaga - Guideline for Interchangeability of Light Sources (1/2)
Example of compatible spot modules from Zhaga book 3
Source: Zhaga
Overview of Zhaga books
Source: Zhaga
* Books in
development as
of October
2015

10
System Structure (1/2)
MAIN FUNCTIONS IN LED MODULES
Power Supply & Driver
To realize AC to DC
conversion
Optical Design
To shape the light emitted
from LED
Thermal Management
To dissipate heat produced
by LEDs
• Substrate / PCB
• Thermal Interface Management / Material
• Heatsink
• External Driver
• Integrated Driver
• Collimator
• Reflector
• Lens Plates
• Diffusers
Function Associated Components / MaterialsLED Lighting Module

11
• Although the heatsink contributes to
the design of the luminaire, it remains a
part dedicated to cooling the whole
system. Shape, size, weight are directly
the consequence of the total embedded
thermal power and the thermal power
density.
• Middle Power modules have low
cooling needs due to their large
surfaces and low embedded power.
Some lighting products like T5 tubes
don’t need a heatsink.
• COB modules concentrate the light
output on a small area, requiring good
design of the thermal cooling system
for performance and reliability
management.
• High Power modules in general require
large and efficient heatsinks. Active
cooling is an option to reduce the size
while getting the required thermal
performance.
Heatsink Design vs. LED Module Technology
THERMAL MANAGEMENT IN LED MODULES
High heatsink performance
Active cooling
Moderate heatsink performance
Passive cooling
No heatsink needed or
low heatsink performance
Maximum heatsink required performance

12
• In practice, creativity of solutions covers almost all configurations.
Optical Architecture vs. LED Module Technology - Analysis per Application
OPTICAL DESIGN FOR LED MODULES
Middle Power LED Module High Power LED Module COB Module
High Bay Can be used but not mainstream • Lens plate or collimators • Technology XX
Low Bay
• Technology XX
• Technology XX
Can be used but not mainstream • Technology XX
Spot Lighting • Lens plates and collimators • Technology XX • Technology XX
Troffer
• Technology XX
• Diffusers
Can be used but not mainstream Can be used but not mainstream
Downlight
• Technology XX
• Technology XX
Can be used but not mainstream • Technology XX
Linear
• Lens plates or collimators
• Technology XX
• Technology XX
Can be used but not mainstream Can be used but not mainstream
Outdoor Can be used but not mainstream • Technology XX • Reflectors
Task • Technology XX • Diffusers Can be used but not mainstream
Wall Pack
• Technology XX
• Reflectors
• Technology XX
• Technology XX
Can be used but not mainstream

13
Middle Power LED Module:
• The middle power LED is a solution offering
low power consumption and high flux.
High Power LED Module:
• The high power LED is a solution offering
small lighting emitting surface and high flux.
COB LED Module:
• The COB module architecture is a solution
offering good compromise between size of
the light emitting surface, flux power and
power consumption.
The choice of the right LED module
solution depends on requirements at
application level, cost level (…).
The DifferentTypes of LED Modules - Positioning
High flux
Low consumption Small light
emitting surface
LOW POWER
LED / MODULE
COB
MODULE

14
• Photometric performances are similar between modules.
• Differences can be observed on the diversity (flux, CRI…), the choice of the LEDs, the pattern, the connections (…).
• The table below highlight key characteristics of middle power LED modules and associated general trends:
Performance Aspects
MIDDLE POWER LED MODULE
Characteristics General trend
Efficacy (lm/W)
• In relation with LED performances.
• Efficacy stays in a range of XXlm/W to XXlm/W.
Flux Range (lm)
• Driven by the application.
• Flux range is in average between XX lm to XX lm.
CCT (K) • 3000K, 3500K, 4000K or 5000K.
CRI
• Mostly CRI 80.
• CRI 90 in specific cases.
Color Consistency
(SDCM)
• X SDCM at initial time.
• Can increase up to X–X SDCM after aging.
Lifetime (hours) • Not systematically specified.
Analysis “flux vs. efficacy” of different middle power LED modules
Source: Piseo

15
MCPCB is the
solution of
choice for
middle power
LEDs
Substrate/PCB
MIDDLE POWER LED MODULE
• MCPCB offers valuable thermal and mechanical properties compared to glass epoxy PCBs.
• Various thicknesses of substrates are available. Most common thicknesses are 1.1mm and 1.6mm.
• Dielectric thickness varies between 70µm to 200µm. This parameter has an influence on the thermal performances and
the breakdown voltage.
• Usual copper thickness is 35µm (1oz).
• The amount of power to dissipate requires a good enough thermal
dissipation/management through the PCB.
Technology
Thermal
Conductivity1
(W/m.K)
Voltage
Breakdown
(kV)
Cost
($/m²)
Pros Cons
Standard
Glass Epoxy
0.25-0.65
(Rth: XX K/W)
XX–XX
Low
(< $XX)
• Low cost.
• Multiple suppliers.
• XX.
FR4 +
ThermalVias
In between
Depend on
number of vias
Non Available Medium
• XX.
• Multiple suppliers.
• XX.
MCPCB
1-XX typically
Rth: XX K/W
XX–XX
High
($XX–$XX)
• Better performance than
standard glass epoxy PCB.
• Cheaper than ceramic PCB.
• XX.
• XX.
MCPCB
architecture
Source:The
Bergquist Company
(now part of
Henkel)

16
• Strategy of middle power
LED module manufacturers
is driven by cost aspect and
based on mass production
of middle power LEDs (i.e.,
economy of scale), resulting
in a standard offer with
limited diversity and flux
range.
• High power modules
address applications having
different needs (or
combinations of needs):
• Need XX.
• Need XX.
• Need XX.
• The market is characterized
by less volumes, but higher
value and selling price.
Introduction - High Power LED Modules vs. Middle Power LED Modules
HIGH POWER LED MODULES
Type of
Application
Key Requirements LED Module Used High Power ModuleType
Application XX
• High flux
• XX
• XX
• XX
• XX
• XX
• XX
Spot Lighting
• XX
• XX
• Artistic touch
• XX
• XX
• XX
• XX
• XX
Troffer &
Linear Lighting
• High efficacy
For 300lux
• Middle Power NA
Application XX • XX
• Middle Power
• COB
NA
Application XX
• XX
• XX
• Optical control
• XX
• XX
• XX
Task Lighting
• High brightness
• XX
• High Power NA
Wall Lighting • Architectural light control • XX NA

17
High power
LED modules
integrate both
primary and
secondary
optics (and can
also integrate
tertiary optics).
HBL Module - Optics
HIGH POWER LED MODULES
• High power LEDs already integrate a Silicone dome shape (encapsulant/primary
optic) which is used to extract the light of the (individual) LEDs and increase
the light efficacy.
• In general, a secondary optic is added on the module. This optic consists of a
plate supporting a lens array with each lens being located in front of an LED and
providing an individual light beam.
• Key features for a lens plate:
• Feature XX.
• Feature XX.
• Feature XX.
• Lens design, shape and material choices are managed by optical manufacturers,
but the lens plate geometry is generally made under the supervision of the LED
module manufacturer.
• LED module manufacturers’ offer also integrates modules combining the LED
board with the optical plate.
• Zhaga participates in the standardization of interfaces between LED modules
and optics.
Lens plate for LED array
Integrate module white optic

18
• Chips are spread into series and parallel chains. The rules
are similar to mid-power modules (minimum of 3 pcs for a
string).
• There is a wide variety of LED quantity and arrangement.
The smallest COB has 12 chips, the biggest can have 650
chips or more.
• There is no real limitation in terms of number of chips.
However, the chip to chip placement lowers the re-
absorption of light, leading to a flux penalty.
Main COB Design Choices - Chip Layout
COB LED MODULE
CLU-56 (Citizen) CXA1304 (CREE)
Chip number 648 12
Targeted flux 20,000 lm 400 lm
LES diameter 32.8 mm 6 mm
Power 170W 0.4W
COB size 38 x 38 x 1.4mm 13.35 x 13.35 x 1.7mm
Analysis of COB products
available on the market (data from
CREE, LG Innotek and Lumileds)
Source: Piseo

19
• Offering specific products might be a strong differentiation factor however products have to respond to a customer demand
and might represent only niche markets.
Differentiation Factors - Focus on “Specific Products and Innovative Solutions” (1/3)
FLEXIBLE LED STRIPS
Parameter TypicalValue (s) DifferentiatingValue(s)
Example of Product /
Manufacturer
Light Output • 100–900 lm/m (depends on color)
• XX lm/m for white light
• XX lm/W for white light
• XX
XX • XX • XX • XX
XX NA • XX
• XX
• XX
LED Density
• XX / XX / 60 / XX / 120 / XX (unit
per meter)
NA • Most manufacturers
Voltage • 12VDC or 24VDC • XXV DC • Most Chinese manufacturers
White ColorType
• 2—3 types of white (cold white, warm
white, natural white)
NA • Most manufacturers
XX • Blue, Red, Green,Yellow (…) • XX NA
White Color Choice NA • XX • XX
XX • XX • XX • XX
CRI • No specification or superior to 80 • > XX
• XX
• XX
High Medium LowDIFFERENTIATION STRENGTH: ©2015 | www.yole.fr | LED Lighting Module Technology, Industry and Market Trends

20
Most of the
LED module
manufacturers
are coming
from the XX
field.
Origin of Players - Overview (2/2)
LED LIGHTING MODULE INDUSTRY TRENDS
• As detailed previously, LED module manufacturers are coming from
different horizons in terms of activities.
• However the majority of them is coming from the XX industry and the
XX industry (see analysis on the right).
• Detailed explanations about drivers for such players to manufacture LED
modules are given in the next slides.
• It is also important to understand that the LED module industry is
strongly disparate, with:
• Small companies and large companies.
• Companies having a unique offer and companies developing large
product portfolio.
• (…).
 As a very young industry, the LED module industry is not really
structured at the moment!
Analysis of origin of LED module manufacturers per
activity
The analysis is based on the identification of main players
involved in LED module manufacturing and sale (sample
of more than 40 LED lighting module manufacturers

21
Main LED Module Suppliers (Excluding COB and Flexible LED Strips)
LED LIGHTING MODULE INDUSTRY TRENDS
US:
Cree, Bridgelux, XX, XX,
XX, XX, XX, XX, XX,
Lumileds
England:
XX, XX, Carclo
Finland:
XX, XX
Russia:
XX
South Korea:
Seoul Semi., XX,
XX
Taiwan:
XX, Lextar
China:
XX
Italy:
TCI
Slovakia:
XX
Germany:
Osram, BJB,
XX, XX, XX,
XX
The Netherlands:
Philips
Austria:
Vossloh-Schwabe

22
In 2014, total
LED lighting
module market
represented a
size of ~$XXB.
It should grow
to a size of
~$XX by 2020.
LED LIGHTING MODULE MARKET TRENDS

© 2015
Yole Développement
FromTechnologies to Market

24
MEMS &
Sensors
LED/OLED
Compound
Semi.
Imaging Photonics
MedTech
Manufacturing
Advanced
Packaging
PV
Power
Electronics
FIELDS OF EXPERTISE
Yole Développement’s 30 analysts operate in the following areas

25
4 BUSINESS MODELS
o Consulting and Analysis
• Market data & research, marketing analysis
• Technology analysis
• Strategy consulting
• Reverse engineering & costing
• Patent analysis
www.yole.fr
o Reports
• Market &Technology reports
• Patent Investigation and patent infringement risk
analysis
• Teardowns & Reverse Costing Analysis
• Cost SimulationTool
www.i-Micronews.com/reports
o Financial services
• M&A (buying and selling)
• Due diligence
• Fundraising
• Maturation of companies
• IP portfolio management & optimization
www.yolefinance.com
Blu Morpho
o Media
• i-Micronews.com website
• @Micronews e-newsletter
• Technology magazines
• Communication & webcast services
• Events
www.i-Micronews.com

26
A GROUP OF COMPANIES
Market,
technology and
strategy
consulting
www.yole.fr
M&A operations
Due diligences
www.yolefinance.com
Fundraising
Maturation of companies
IP portfolio management & optimization
TBA
Manufacturing costs analysis
Teardown and reverse engineering
Cost simulation tools
www.systemplus.fr
IP analysis
Patent assessment
www.knowmade.fr
Blu Morpho

27
OUR GLOBAL ACTIVITY
Yole Japan
Yole Inc.
Yole
Korea
40% of our business is in
EU countries
North America
Asia
Blu Morpho

28
SERVING THE ENTIRE SUPPLY CHAIN
Our analysts
provide
market
analysis,
technology
evaluation,
and business
plan along
the entire
supply chain
Integrators and
end-users
Device
makers
Suppliers: material,
equipment, OSAT,
foundries…
Financial investors,
R&D centers

29
REPORTS COLLECTION
• Yole Développement publishes a comprehensive collection of market & technology reports and patent analysis
in:
• MEMS & Sensors
• Imaging
• Medical technologies (MedTech)
• Advanced packaging
• Power electronics
• Compound semiconductors
• OLED, LED & Laser diode
• Semiconductor Manufacturing
• Photovoltaics
• Batteries
• Our reports are unmatched in quality and technology depth and typically include:
• Technology trends and evolution: costs, barriers, roadmaps, etc.
• Supply & value chain analysis: business models, relationships, value flows, etc.
• In-depth analysis of applications and market drivers: challenges, inflection points, etc.
• Market data ($, units, wafer starts, etc.)
• Every year, Yole Développement, System Plus Consulting and KnowMade publish +60 reports.
• Take the full benefit from our Bundle and Annual Subscription offers.
www.i-Micronews.com

30
OUR 2015 PUBLISHED REPORTS LIST
o MEMS & SENSORS
− Sensors and Data Management for Autonomous Vehicles
− Sensors for Wearable Electronics And Mobile Healthcare
− Status of the MEMS Industry
− Uncooled Infrared Imaging Technology & Market Trends
− IR Detector and Small Size Imagers
− High End Gyro, Accelerometers and IMU
− Non Volatile Memory Markets and Technology Trends
o IMAGING & OPTOELECTRONICS
− Camera Module Packaging (Vol 1: Market & Technology Trends / Vol 2 Teardowns &
Reverse Engineering)
− Uncooled Infrared Imaging Technology & Market Trends
− Status of the CMOS Image Sensors
o MEDTECH
− Microfluidic for Sample Preparation
− Microfluidic Applications
− Sensors for Wearable Electronics And Mobile Healthcare
o COMPOUND SEMICONDUCTORS
− Sapphire Applications & Market 2015: from LED to Consumer Electronics
− Status of Wide Band Gap Material: GaN, SiC (and also AlN, Ga2O3, Diamond as a trend)
− GaN and SiC Devices for Power Electronics Applications
o LED
− LED Module Technologies
− UV LED - Technology, Manufacturing and Application Trends
− Phosphors & Quantum Dots 2015: LED Downconverters for Lighting & Displays
− Sapphire Applications & Market 2015: from LED to Consumer Electronics
o POWER ELECTRONICS
− Power Packaging Technology Trends and Market Expectations
− Thermal Managment for LED and Power
− Power Electronics for Renewable Energy
− Energy Management for Smart Grid, Cities and Buildings: Opportunities for battery
electricity storage solutions
− Status of Chinese Power Electronics Industry
− New Technologies and Architectures for Efficient Data Center
− IGBT Market and Technology Trends
− Status of Power Electronics Industry
− Status of Wide Band Gap Material: GaN, SiC (and also AlN, Ga2O3, Diamond as a trend)
− GaN and SiC Devices for Power Electronics Applications
o ADVANCED PACKAGING
− Advanced Packaging in Emerging Markets in China*
− Status of the Advanced Packaging Industry
− Supply Chain Readiness for Panel Manufacturing in Packaging
− Fan-in Wafer Level Packaging: Market and Technology Trends
− Flip Chip Business Update
− 2.5D & 3DIC Business Update*
− Fan-Out and Embedded Die: Technologies & Market Trends
o MANUFACTURING
− Photolithography Equipment and Materials for Advanced Packaging, MEMS and LED
Applications
− Thinning & Dicing Equipment for Advanced Packaging, MEMS, Photovoltaics, LED, CMOS
Image Sensors
− Non Volatile Memory Markets and Technology Trends
• Reports to be decided within 2015

31
CONTACT INFORMATION
o Consulting and Specific Analysis
• North America: Steve LaFerriere, Director of Northern America Business Development,Yole Inc.
Email: laferriere@yole.fr
• Japan:Yutaka Katano, General Manager,Yole Japan & President,Yole K.K.
Email: katano@yole.fr
• RoW: Jean-Christophe Eloy, President & CEO,Yole Développement
Email: eloy@yole.fr
o Report business
• North America: Steve LaFerriere, Director of Northern America Business Development,Yole Inc.
Email: laferriere@yole.fr
• Europe: Fayçal El Khamassi, Headquarter Sales Coordination & Customer Service
Email: khamassi@yole.fr
• Japan & Asia:Takashi Onozawa, Sales Asia & General Manager,Yole K.K.
Email: onozawa@yole.fr
• Korea: HaileyYang, Business Development Manager, Korean Office
Email: yang@yole.fr
o Financial services
• Jean-Christophe Eloy, CEO & President
Email: eloy@yole.fr
o General
• Email: info@yole.fr
Follow us on

33
• Initiated in spring 2010 by CEA-LETI & Cluster Lumière members
• Selected as NationalTechnological Platform and granted for public funding by the French Ministry of Industry on
September 23rd, 2011
• Created as an independant private company on November, 30th 2011, € 1 169 827 capital, owned by 30
shareholders
• € 4 millions investment over 2012 – 2013 – 2014
• € 1,6 millions support from French State and local Authorities
• Located in Lyon, France
MISSION  We help our clients to Create and Deploy Innovative and Performing Lighting Systems
National Lighting Innovation Platform and Testing Lab
HISTORIC & MISSION

34
Manufacturers
 Materials
 LED packages
 LED Modules
 Luminaires (LED & conv.)
 Lamps (LED & conv.)
 Displays
 Other LED Systems (automotive, medical, …)
Specifiers & Users
 Property developpers : buildings, shops, roads, …
 Specifiers : architects, lighting designers,
engineering offices,…
 Retailers
 Installers, contractors
 Tenants
OUR CLIENTS

35
OUR SERVICE OFFER
TESTING
Photometrical
Electriqal
Thermal
Reliability
Safety
TRAINING
LEDTechnology
System design
Reliability
Regulations
Standards
Applications
CONSULTING
R&D
Reliabibility
Safety
Regulations
Standards
Applications

36
Photometric & electrical characterizations
 Luminous flux
 Spectral analysis & colorimetry (colour point, CCT, CRI)
 Light distribution
 Consummed power
 Luminous efficacy
 Power factor
 Harmonic distorsion
 2D Luminance Mapping
Thermal measurments
 Hot point with thermal camera
 LED junction temperature in operating conditions
 Thermal interface analysis
Tests on demand (half, full lab day)
TESTING

37
Performance & Reliability
 Critical analysis of the design and manufacturing of electronics parts
 Endurance and sturdiness tests
 X-rays
 Microscopy
Regulation and standards compliancy
 CE Compliancy of lamps, modules and LED luminaires (244/2009/CE, 874/2012/CE, 1194/2012/CE)
 Photobiological risk (EN 62471, IEC/TR 62778, EN 60598, EN 60031)
 Emergency lighting (EN 60598-2-22)
Product Certification
 ENEC+ testing
TESTING

38
R&D
CONSULTING
Financing Research & Innovation
- Opportunity study
- Idea generation
- Demonstrators
- Proof of concept
- Technology maturity
grids
Concept
Creation
- Functional
requirements
- Modelization &
dimensionning
- Optical design
- Product and system
designPrototyping
- Sourcing strategy
- Risk management
- Testing and
qualification
Function / Product
Development
• Marketing of
technology
• Strategic Roadmapping
• State of the art analysis
• Application research
• Market research
• Technology scouting
• IP scouting
• LED, modules &
electronics analysis
Prospective & Research
- Offer valorization
- Certification
- Labellization
Market introduction

39
Specific Programs
 Benchmarking of LED packages, lamps and luminaires
 Failure analysis
 Reliability improvement
 FMEA
 Supplier assesment
 Quality control
 Support for regional homologation (CE, UL, …)
 Lighting design & DIALUX simulations
CONSULTING
Ts (°C) =
Set
Anode
I (mA) =
Set
Tp Vf (V)
Flux
Lumineux
(lm)
Flux
Radiométrique
(W)
IRC CCT (K) x y
1,7 100 -7,2 24,19 210,1 0,78 97,5 2985,4 0,4392 0,4070
25 100 14,7 23,81 204,0 0,76 97,7 2958,7 0,4397 0,4046
35 100 30,6 23,59 199,5 0,74 97,8 2942,5 0,4399 0,4030
55 100 50,1 23,32 193,1 0,72 97,8 2925,5 0,4399 0,4010
65 100 61,4 23,25 189,8 0,71 97,7 2918,7 0,4398 0,4001
75 100 71,4 23,10 186,2 0,70 97,6 2912,4 0,4398 0,3991
85 100 79,5 22,99 182,0 0,69 97,4 2906,7 0,4396 0,3982
RESULTATS DES MESURES – 100 mA

40
 Regulation & standards
 Implementation of LED technology for SSL lighting
 Reliability of LED lighting systems
 Basics of photometry
 Basics of optics
 Understanding LED package datasheets
 IP for LED Systems
 Lighting simulation with DIALUX
 « A la carte » programs
TRAINING

41
Unique concentration of photometrical, electrical & thermal imaging equipment
EQUIPMENT
Photo-Goniometer LMT GO DS
2000 type C equipped with CAS 140
spectrometer
Gonio-photometer MAJANTYS
for retrofit lamps
2 m Integrating sphere
INSTRUMENT SYSTEMS
equipped with CAS 120
spectrometer
Thermal camera INFRATEC 50 cm integrating sphere
MAJANTYS (or 5cm for LED
sources) equipped B&WTEK
spectrometer
Photobiological test bench
OST-300 EVERFINE
(200nm-3000nm)
Video-luminancemeter
LUMETRIX
Non exhaustive pictures

42
• High precision equipments calibrated in accredited labs
• Quality management system according to ISO 17025 – accreditation pending
• Photometrical and electrical tests according to international standards (EN 13032-1, EN 13032-4, LM-79)
• Regular Participation in inter-laboratory comparaison programs (eg: participation in IEA SSL inter-comparison program)
Quality as our foundation
QUALITY

43
• Highly specialized team with large experience in the lighting industry (technology, system design and integration, metrology, applications)
• Independant Testing Lab with cutting edge equipment
• Comprehensive offer (from Research to full System Qualification)
• Strong Partnerships :
• LCIE BureauVERITAS, electrical test lab and certification body
• SERMATechnologie, reliability of electronic systems test and consulting
• YOLE Développement, strategic analysis of semi-conductor markets and consulting
• Institut d’optique Graduate School, optical engineering graduate school
• Strong involvment in the development of the lighting sector
• Participation in light sources and luminaires standardization committees of AFNOR, CENELEC and IEC
• 3 professional lighting associations as shareholders (Cluster Lumière, GIL, Syndicat de l’éclairage)
KEY ELEMENTS

LED Lighting Module Technology, Industry and Market Trends 2015 Report by Yole Developpement

Recommended

Recommended

More Related Content

More from Yole Developpement

More from Yole Developpement (20)

Recently uploaded

Recently uploaded (20)

LED Lighting Module Technology, Industry and Market Trends 2015 Report by Yole Developpement