Wafer Inspection Reclassification (WIR) is a monotonous and repetitive task of manually checking semiconductor chips with an optical inspection system. An appropriate user interface was needed to minimise physical and mental strain for operators and help them to make the right decisions, faster.

1. A user interface for Wafer Inspection Reclassification timeQ4 2005 durationtwomonths

2. About KLA Tencor KLA Tencor is a leading supplier of process control and yield management solutions for the semiconductor and microelectronics industries. This project was conducted for ICOS Vision Systems, a specialist in visual tools and inspection solutions, part of KLA Tencor since 2008. business to business

3. Design challenge Wafer Inspection Reclassification (WIR) is a monotonous and repetitive task of manually checking semiconductor chips with an optical inspection system. An appropriate user interface was needed to minimise physical and mental strain for operators and help them to make the right decisions, faster. discipline interaction design

5. Requirements analysis

6. Scenarios of use

7. Conceptual design

9. Field study at KLA Tencor labs understandexplore define Field Study After an examination of user requirements (documentation review, interviews with product experts and a field study of ICOS operations), we came up with six scenarios of use.

10. explore

11. understand explore define Scenarios of use We composed realistic stories to describe in detail how different user groups could use the future tool in a variety of contexts depending on the type of wafer, whether working offline/online, or in different locations around the world. Samples from the Scenarios of use for the future WIF system

12. Sample screen of the WIR tool prototype understandexploredefine Prototyping Working closely with KLA Tencor R&D, we designed the user interface architecture with the dies overview and the re-classification wizard as the main features.

13. Outcome Our design for the user interface helped KLA Tencor to reduce the physical and mental strain for operators performing the Wafer Inspection Reclassification and allow them to make the right decisions, faster.

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