The key market players in the global radiation-hardened electronics for space applications market include 3D Plus (HEICO Corporation), Analog Device, Anaren Inc (TTM Technologies), BAE Systems, Cobham PLC, Data Device Corporation, Exxelia, General Dynamics, GSI Technology, Microchip Technology, Micropac Industries, Renesas Electronics Corporation, Solid State Devices Inc, STMicroelectronics, and Teledyne Technologies Incorporated among others. The radiation-hardened electronics for space applications market is segregated into four major regions, namely North America, Europe, Asia-Pacific, and Rest-of-the-World. Data for each of these regions, along with country-level analyses, is provided in the market study. View the full report of radiation-hardened electronics for space applications market made by Bis Research: https://bisresearch.com/industry-report/radiation-hardened-electronics-space-applications-market.html Download the sample report on radiation-hardened electronics for space applications market, exclusively made by Bis Research: https://bisresearch.com/requestsample?id=1266&type=toc

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https://pxhere.com/en/photo/893729
Focus on Platform, Manufacturing
Technique, Material Type, and
Component Analysis and Forecast
2022-2032
April 2022
Radiation Hardened
Electronics for Space
Applications Market –
A Global Market
Analysis
Table of Content

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BIS Research is a leading market intelligence and technology research company. BIS Research publishes in-
depth market intelligence reports focusing on the market estimations, technology analysis, emerging high-
growth applications, deeply segmented granular country-level market data and other important market
parameters useful in the strategic decision making for senior management. BIS Research provides multi-client
reports, company profiles, databases, and custom research services.
Copyright © 2022 BIS Research Inc.
All Rights Reserved. This document contains highly confidential information and is the sole property of BIS
Research. Disclosing, copying, circulating, quoting or otherwise reproducing any or all contents of this
document is strictly prohibited. Access to this information is provided exclusively for the benefit of the people
or organization concerned. It may not be accessed by or offered whether for sale or otherwise to any third
party.

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Table of Content
Executive Summary
1. Markets
1.1 Industry Outlook
1.1.1 Radiation Hardened Market: Overview
1.1.1.1 New Space: An emerging business opportunity for LEO-focused small
satellites and Deep Space Missions
1.1.2 Comparison of Radiation-Hardened Products Standard
Requirements and Regulations (by End User)
1.1.3 Ongoing radiation hardening efforts in the space industry
1.1.4 Current and Futuristic Trends
1.1.5 Radiation-Hardened Electronics Manufacturers and Certifications
1.1.6 Value Chain Analysis
1.2 Business Dynamics
1.2.1 Business Drivers
1.2.2 Business Challenges
1.2.3 Business Strategies
1.2.3.1 Business Strategies
1.2.3.2 Corporate Strategies
1.2.4 Business Opportunities
2. Application
2.1 Global Radiation-Hardened Electronics for Space Applications
Market– by Platform
2.1.1 Market Overview
2.1.2 Demand Analysis of Radiation Hardened Electronics for Space
Applications Market by Platform
2.1.3 Satellite
2.1.3.1 Small Satellites (0-500 kg)
2.1.3.2 Medium Satellites (501-1,000 kg)
2.1.3.3 Large Satellites (1,001 kg and Above)

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2.1.4 Launch Vehicle
2.1.4.1 Small and Medium Lift Launch Vehicle
2.1.4.2 Heavy Lift Launch Vehicle
2.1.5 Deep Space Probes
2.1.5.1 Lander
2.1.5.2 Rover
2.1.5.3 Orbiter
2.1.5.4 Space Station
3. Products
3.1 Global Radiation-Hardened Electronics for Space Applications Market –
by Manufacturing Technique
3.1.1 Demand Analysis of Radiation-Hardened Electronics for Space
Applications Market by Manufacturing Technique
3.1.2 Rad-Hard by Design (RHBD)
3.1.3 Rad-Hard by Process (RHBP)
3.1.4 Rad-Hard by Software (RHBS)
3.2 Global Radiation-Hardened Electronics for Space Applications Market-
By Material Type
3.2.1 Demand Analysis of Radiation-Hardened Electronics for Space
Applications Market by Material Type
3.2.2 Silicon
3.2.3 Gallium Nitride
3.2.4 Silicon Carbide
3.2.5 Others
3.3 Global Radiation-Hardened Electronics for Space Applications Market-
by Component
3.3.1 Microprocessors and Controllers
3.3.2 Discrete Semiconductors
3.3.3 Power Sources
3.3.4 Memory
3.3.5 Field-Programmable Gate Array

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3.3.6 Analog and Mixed Signals
3.3.7 Application-Specific Integrated Circuit
3.3.8 Sensors
3.3.9 Others
4. Region
4.1 Global Radiation-Hardened Electronics for Space Applications Market
(by Region)
4.2 North America
4.2.1 Markets
4.2.1.1 Key Manufacturers and Suppliers in North America
4.2.1.2 Business Drivers
4.2.1.3 Business Challenges
4.2.2 Application
4.2.2.1 North America Radiation-Hardened Electronics for Space Applications
Market (by Platform)
4.2.3 North America (by Country)
4.2.3.1 U.S.
4.2.3.1.1 Markets
4.2.3.1.1.1 Key Manufacturers in the U.S.
4.2.3.1.2 Application
4.2.3.1.2.1 U.S. Radiation-Hardened Electronics for Space Applications Market (by
Platform)
4.2.4.2 Canada
4.2.4.2.1 Markets
4.2.3.1.1.1 Key Manufacturers in Canada
4.2.4.2.2 Application
4.2.4.2.2.1 Canada Radiation-Hardened Electronics for Space Applications Market
(by Platform)
4.3 Europe
4.3.1 Markets
4.3.1.1 Key Manufacturers and Suppliers in Europe

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4.3.1.2 Business Drivers
4.3.1.3 Business Challenges
4.3.2 Application
4.3.2.1 Europe Radiation-Hardened Electronics for Space Applications Market
(by Platform)
4.3.4 Europe (by Country)
4.3.4.1 France
4.3.4.1.1 Markets
4.3.4.1.1.1 Key Manufacturers in France
4.3.4.1.2 Application
4.3.4.1.2.1 France Radiation-Hardened Electronics for Space Applications Market
(by Platform)
4.3.4.2 Germany
4.3.4.2.2 Markets
4.3.4.2.2.1 Key Manufacturers in Germany
4.3.4.2.3 Application
4.3.4.2.3.1 Germany Radiation-Hardened Electronics for Space Applications Market
(by Platform)
4.3.4.3 Russia
4.3.4.3.1 Markets
4.3.4.3.1.1 Key Manufacturers in Russia
4.3.4.3.2 Application
4.3.4.3.2.1 Russia Radiation-Hardened Electronics for Space Applications Market
(by Platform)
4.3.4.4 U.K.
4.3.4.4.1 Markets
4.3.4.4.1.1 Key Manufacturers in the U.K.
4.3.4.4.2 Application
4.3.4.4.2.1 U.K. Radiation-Hardened Electronics for Space Applications Market (by
Platform)
4.3.4.5 Rest-of-Europe

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4.3.4.5.1 Markets
4.3.4.5.1.1 Key Manufacturers in Rest-of-Europe
4.3.4.5.2 Application
4.3.4.5.2.1 Rest-of-Europe Radiation-Hardened Electronics for Space Applications
Market (by Platform)
4.4 Asia-Pacific
4.4.1 Markets
4.4.1.1 Key Manufacturers and Suppliers in Asia-Pacific
4.4.1.2 Business Drivers
4.4.1.3 Business Challenges
4.4.2 Application
4.4.2.1 Asia-Pacific Radiation-Hardened Electronics for Space Applications
Market (by Platform)
4.4.3 Asia-Pacific (by Country)
4.4.3.1 China
4.4.3.1.1 Markets
4.4.3.1.1.1 Key Manufacturers in China
4.4.3.1.2 Application
4.4.3.1.2.1 China Radiation-Hardened Electronics for Space Applications Market
(by Platform)
4.4.3.2 India
4.4.3.2.1 Markets
4.4.3.2.1.1 Key Manufacturers in China
4.4.3.2.2 Application
4.4.3.2.2.1 India Radiation-Hardened Electronics for Space Applications Market (by
Platform)
4.4.3.3 Japan
4.4.3.3.1 Markets
4.4.3.3.1.1 Key Manufacturers in Japan
4.4.3.3.2 Application

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4.4.3.3.2.1 Japan Radiation-Hardened Electronics for Space Applications Market
(by Platform)
4.4.3.4 Rest-of-Asia-Pacific
4.4.3.4.1 Markets
4.4.3.4.1.1 Key Manufacturers in Rest-of-Asia-Pacific
4.4.3.4.2 Application
4.4.3.4.2.1 Rest-of-Asia-Pacific Radiation-Hardened Electronics for Space
Applications Market (by Platform)
4.5 Rest-of-the-World
4.5.1 Markets
4.5.1.1 Business Drivers
4.5.1.2 Business Challenges
4.5.2 Application
4.5.2.1 Rest-of-the-World Radiation-Hardened Electronics for Space Applications
Market (by Application)
4.5.3 By Country
4.5.3.1 The Middle East and Africa
4.5.3.1.1 Key Manufacturers in the Middle East and Africa
4.5.3.1.2 Application
4.5.3.1.2.1 Middle East and Africa Radiation-Hardened Electronics for Space Applications
Market (by Platform)
4.5.3.2 South America
4.5.3.2.1 Key Manufacturers in South America
4.5.3.2.2 Application
4.5.3.2.2.1 South America Radiation-Hardened Electronics for Space Applications Market (by
Platform)
5. Markets - Competitive Benchmarking & Company Profiles
5.1 Market Share Analysis
5.2 Company Profiles
5.2.1 3D Plus (HEICO Corporation)

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5.2.2 Analog Devices Inc.
5.2.3 Anaren Inc. (TTM Technologies).
5.2.4 BAE Systems
5.2.5 Cobham plc
5.2.6 Data Device Corporation
5.2.7 Exxelia
5.2.8 General Dynamics
5.2.9 GSI Technology
5.2.10 Microchip Technology Inc
5.2.11 Micropac Industries Inc.
5.2.12 Renesas Electronics Corporation
5.2.13 Solid State Devices Inc.
5.2.14 STMicroelectronics N.V
5.2.15 Teledyne Technologies Incorporated
5.2.16 Other Key Players
5.2.16.1 Texas Instruments Inc.
5.2.16.2 Maxim Integrated
5.2.16.3 Xilinx Inc.
5.2.16.4 Digikey
5.2.16.5 Vishay Intertechnology Inc.
5.2.16.6 Vorago Technologies
5.2.16.7 EPC Space LLC
5.2.16.8 VPT Inc.
6. Growth Opportunities & Recommendations
7. Research Methodology

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