This document provides specifications for a notebook speaker, including:
1. Dimensions of 25x15x4.6mm and operating temperature range of -20°C to +65°C.
2. Electrical characteristics such as impedance of 8±15% at 2000Hz and maximum input power of 2.0W.
3. Performance specifications like resonance frequency of 750±20%Hz and sound output of 87±3dB/0.1m at 0.8-1.5kHz.
Electrical and Acoustic Characteristics.
Dimensions 28x4mm
AC Impedance 8±15%Ωat 2000Hz
Rated Input Power 1W
Max. input power 1.5W
Resonance Frequency 580±20%Hz
Output Sound Pressure Level 93±3dB/0.1W 0.1m at 0.6,0.8,1.0,1.2KHz Average
Frequency Response Fo~6KHz
Operating Temperature -20~+65℃
Storage Temperature -30~+70℃
Electrical and Acoustic Characteristics.
Dimensions 28x5.5mm
AC Impedance 8±15%Ωat 2000Hz
Rated Input Power 1.0W
Max. input power 1.5W
Resonance Frequency 650±20%Hz
Output Sound Pressure Level 94±3dB/0.1M 0.1W at 0.8,1.0,1.2,1.5KHz Average
Frequency Response Fo~6KHz
Operating Temperature -20~+65℃
Storage Temperature -30~+70℃
Electrical and Acoustic Characteristics.
Dimensions 28x4mm
AC Impedance 8±15%Ωat 2000Hz
Rated Input Power 1W
Max. input power 1.5W
Resonance Frequency 580±20%Hz
Output Sound Pressure Level 93±3dB/0.1W 0.1m at 0.6,0.8,1.0,1.2KHz Average
Frequency Response Fo~6KHz
Operating Temperature -20~+65℃
Storage Temperature -30~+70℃
Electrical and Acoustic Characteristics.
Dimensions 28x5.5mm
AC Impedance 8±15%Ωat 2000Hz
Rated Input Power 1.0W
Max. input power 1.5W
Resonance Frequency 650±20%Hz
Output Sound Pressure Level 94±3dB/0.1M 0.1W at 0.8,1.0,1.2,1.5KHz Average
Frequency Response Fo~6KHz
Operating Temperature -20~+65℃
Storage Temperature -30~+70℃
Electrical and Acoustic Characteristics.
Dimensions 20x3.0mm
AC Impedance 8±15%Ωat 2000Hz
Rated Input Power 0.5W
Max. input power 1.0W
Resonance Frequency 800±20%Hz
Output Sound Pressure Level 92±3dB/0.1M 0.1W at 0.8,1.0,1.2,1.5KHz Average
Frequency Response Fo~20KHz
Operating Temperature -20~+65℃
Storage Temperature -30~+70℃
Electrical and Acoustic Characteristics.
Dimensions 30x3.5mm
AC Impedance 8±15%Ωat 2000Hz
Rated Input Power 0.5W
Max. input power 1.0W
Resonance Frequency 600±20%Hz
Output Sound Pressure Level 93±3dB/0.1M 0.1W at 0.8,1.0,1.2,1.5KHz Average
Frequency Response Fo~6KHz
Operating Temperature -20~+65℃
Storage Temperature -30~+70℃
Electrical and Acoustic Characteristics.
Dimensions 26x5mm
AC Impedance 8±15%Ωat 2000Hz
Rated Input Power 1.2W
Max. input power 1.5W
Resonance Frequency 600±20%Hz
Output Sound Pressure Level 92±3dB/0.1W 0.1m at 0.6,0.8,1.0,1.2KHz Average
Frequency Response Fo~20KHz
Operating Temperature -20~+65℃
Storage Temperature -30~+70℃
Dimensions 23x6mm
AC Impedance 8±15%Ωat 2000Hz
Rated Input Power 0.5W
Max. input power 1.0W
Resonance Frequency 600±20%Hz
Output Sound Pressure Level 92±3dB/0.1M 0.1W at 0.8,1.0,1.2,1.5KHz Average
Frequency Response Fo~20KHz
Operating Temperature -20~+65℃
Storage Temperature -30~+70℃
Electrical and Acoustic Characteristics.
Dimensions 30x5.5mm
AC Impedance 8±15%Ωat 2000Hz
Rated Input Power 1.0W
Max. input power 1.5W
Resonance Frequency 550±20%Hz
Output Sound Pressure Level 90±3dB/0.1M 0.1W at 0.8,1.0,1.2,1.5KHz Average
Frequency Response Fo~6KHz
Operating Temperature -20~+65℃
Storage Temperature -30~+70℃
Electrical and Acoustic Characteristics.
Dimensions 27x5mm
AC Impedance 8±15%Ωat 2000Hz
Rated Input Power 0.5W
Max. input power 1.0W
Resonance Frequency 550±20%Hz
Output Sound Pressure Level 93±3dB/0.1W 0.1m at 0.6,0.8,1.0,1.2KHz Average
Frequency Response Fo~20KHz
Operating Temperature -20~+65℃
Storage Temperature -30~+70℃
Electrical and Acoustic Characteristics.
Dimensions 23x6mm
AC Impedance 8±15%Ωat 2000Hz
Rated Input Power 0.5W
Max. input power 1.0W
Resonance Frequency 600±20%Hz
Output Sound Pressure Level 93±3dB/0.1M 0.1W at 0.8,1.0,1.2,1.5KHz Average
Frequency Response Fo~20KHz
Operating Temperature -20~+65℃
Storage Temperature -30~+70℃
Electrical and Acoustic Characteristics.
Dimensions 40x5.5mm
AC Impedance 8±15%Ωat 2000Hz
Rated Input Power 1.0W
Max. input power 1.5W
Resonance Frequency 600±20%Hz
Output Sound Pressure Level 93±3dB/0.1M 0.1W at 0.8,1.0,1.2,1.5KHz Average
Frequency Response Fo~6KHz
Operating Temperature -20~+65℃
Storage Temperature -30~+70℃
Electrical and Acoustic Characteristics.
Dimensions 32x5.5mm
AC Impedance 8±15%Ωat 2000Hz
Rated Input Power 1.0W
Max. input power 1.5W
Resonance Frequency 630±20%Hz
Output Sound Pressure Level 81±3dB/1M 1W at 0.8,1.0,1.2,1.5KHz Average
Frequency Response Fo~10KHz
Operating Temperature -20~+65℃
Storage Temperature -30~+70℃
Electrical and Acoustic Characteristics.
Dimensions 57x8.3mm
AC Impedance 8±15%Ωat 2000Hz
Rated Input Power 2.0W
Max. input power 2.5W
Resonance Frequency 300±20%Hz
Output Sound Pressure Level 96±3dB/0.1M 0.1W at 0.6,0.8,1.0,1.2KHz Average
Frequency Response Fo~20KHz
Operating Temperature -20~+65℃
Storage Temperature -30~+70℃
Electrical and Acoustic Characteristics.
Dimensions 36x5.5mm
AC Impedance 8±15%Ωat 2000Hz
Rated Input Power 1.0W
Max. input power 1.5W
Resonance Frequency 500±20%Hz
Output Sound Pressure Level 81±3dB/0.1M 0.1W at 0.8,1.0,1.2,1.5KHz Average
Frequency Response Fo~20KHz
Operating Temperature -20~+65℃
Storage Temperature -30~+70℃
Electrical and Acoustic Characteristics.
Dimensions 28x4mm
AC Impedance 8±15%Ωat 2000Hz
Rated Input Power 1W
Max. input power 1.5W
Resonance Frequency 580±20%Hz
Output Sound Pressure Level 93±3dB/0.1W 0.1m at 0.6,0.8,1.0,1.2KHz Average
Frequency Response Fo~6KHz
Operating Temperature -20~+65℃
Storage Temperature -30~+70℃
Electrical and Acoustic Characteristics.
Dimensions 40x5.0mm
AC Impedance 8±15%Ωat 2000Hz
Rated Input Power 1.0W
Max. input power 1.2W
Resonance Frequency 430±20%Hz
Output Sound Pressure Level 89±3dB/1M 0.5W at 0.8,1.0,1.2,1.5KHz Average
Frequency Response Fo~6KHz
Operating Temperature -20~+65℃
Storage Temperature -30~+70℃
Electrical and Acoustic Characteristics.
Dimensions 30x5.5mm
AC Impedance 8±15%Ωat 2000Hz
Rated Input Power 1.0W
Max. input power 1.5W
Resonance Frequency 550±20%Hz
Output Sound Pressure Level 92±3dB/0.1M 0.1W at 0.6,0.8,1.0,1.2KHz Average
Frequency Response Fo~20KHz
Operating Temperature -20~+65℃
Storage Temperature -30~+70℃
Electrical and Acoustic Characteristics.
Dimensions 40x5.5mm
AC Impedance 8±15%Ωat 2000Hz
Rated Input Power 1.0W
Max. input power 1.2W
Resonance Frequency 600±20%Hz
Output Sound Pressure Level 97±3dB/0.1M 0.1W at 0.8,1.0,1.2,1.5KHz Average
Frequency Response Fo~6KHz
Operating Temperature -20~+65℃
Storage Temperature -30~+70℃
Electrical and Acoustic Characteristics.
Dimensions 20x3.0mm
AC Impedance 8±15%Ωat 2000Hz
Rated Input Power 0.5W
Max. input power 1.0W
Resonance Frequency 800±20%Hz
Output Sound Pressure Level 92±3dB/0.1M 0.1W at 0.8,1.0,1.2,1.5KHz Average
Frequency Response Fo~20KHz
Operating Temperature -20~+65℃
Storage Temperature -30~+70℃
Electrical and Acoustic Characteristics.
Dimensions 30x3.5mm
AC Impedance 8±15%Ωat 2000Hz
Rated Input Power 0.5W
Max. input power 1.0W
Resonance Frequency 600±20%Hz
Output Sound Pressure Level 93±3dB/0.1M 0.1W at 0.8,1.0,1.2,1.5KHz Average
Frequency Response Fo~6KHz
Operating Temperature -20~+65℃
Storage Temperature -30~+70℃
Electrical and Acoustic Characteristics.
Dimensions 26x5mm
AC Impedance 8±15%Ωat 2000Hz
Rated Input Power 1.2W
Max. input power 1.5W
Resonance Frequency 600±20%Hz
Output Sound Pressure Level 92±3dB/0.1W 0.1m at 0.6,0.8,1.0,1.2KHz Average
Frequency Response Fo~20KHz
Operating Temperature -20~+65℃
Storage Temperature -30~+70℃
Dimensions 23x6mm
AC Impedance 8±15%Ωat 2000Hz
Rated Input Power 0.5W
Max. input power 1.0W
Resonance Frequency 600±20%Hz
Output Sound Pressure Level 92±3dB/0.1M 0.1W at 0.8,1.0,1.2,1.5KHz Average
Frequency Response Fo~20KHz
Operating Temperature -20~+65℃
Storage Temperature -30~+70℃
Electrical and Acoustic Characteristics.
Dimensions 30x5.5mm
AC Impedance 8±15%Ωat 2000Hz
Rated Input Power 1.0W
Max. input power 1.5W
Resonance Frequency 550±20%Hz
Output Sound Pressure Level 90±3dB/0.1M 0.1W at 0.8,1.0,1.2,1.5KHz Average
Frequency Response Fo~6KHz
Operating Temperature -20~+65℃
Storage Temperature -30~+70℃
Electrical and Acoustic Characteristics.
Dimensions 27x5mm
AC Impedance 8±15%Ωat 2000Hz
Rated Input Power 0.5W
Max. input power 1.0W
Resonance Frequency 550±20%Hz
Output Sound Pressure Level 93±3dB/0.1W 0.1m at 0.6,0.8,1.0,1.2KHz Average
Frequency Response Fo~20KHz
Operating Temperature -20~+65℃
Storage Temperature -30~+70℃
Electrical and Acoustic Characteristics.
Dimensions 23x6mm
AC Impedance 8±15%Ωat 2000Hz
Rated Input Power 0.5W
Max. input power 1.0W
Resonance Frequency 600±20%Hz
Output Sound Pressure Level 93±3dB/0.1M 0.1W at 0.8,1.0,1.2,1.5KHz Average
Frequency Response Fo~20KHz
Operating Temperature -20~+65℃
Storage Temperature -30~+70℃
Electrical and Acoustic Characteristics.
Dimensions 40x5.5mm
AC Impedance 8±15%Ωat 2000Hz
Rated Input Power 1.0W
Max. input power 1.5W
Resonance Frequency 600±20%Hz
Output Sound Pressure Level 93±3dB/0.1M 0.1W at 0.8,1.0,1.2,1.5KHz Average
Frequency Response Fo~6KHz
Operating Temperature -20~+65℃
Storage Temperature -30~+70℃
Electrical and Acoustic Characteristics.
Dimensions 32x5.5mm
AC Impedance 8±15%Ωat 2000Hz
Rated Input Power 1.0W
Max. input power 1.5W
Resonance Frequency 630±20%Hz
Output Sound Pressure Level 81±3dB/1M 1W at 0.8,1.0,1.2,1.5KHz Average
Frequency Response Fo~10KHz
Operating Temperature -20~+65℃
Storage Temperature -30~+70℃
Electrical and Acoustic Characteristics.
Dimensions 57x8.3mm
AC Impedance 8±15%Ωat 2000Hz
Rated Input Power 2.0W
Max. input power 2.5W
Resonance Frequency 300±20%Hz
Output Sound Pressure Level 96±3dB/0.1M 0.1W at 0.6,0.8,1.0,1.2KHz Average
Frequency Response Fo~20KHz
Operating Temperature -20~+65℃
Storage Temperature -30~+70℃
Electrical and Acoustic Characteristics.
Dimensions 36x5.5mm
AC Impedance 8±15%Ωat 2000Hz
Rated Input Power 1.0W
Max. input power 1.5W
Resonance Frequency 500±20%Hz
Output Sound Pressure Level 81±3dB/0.1M 0.1W at 0.8,1.0,1.2,1.5KHz Average
Frequency Response Fo~20KHz
Operating Temperature -20~+65℃
Storage Temperature -30~+70℃
Electrical and Acoustic Characteristics.
Dimensions 28x4mm
AC Impedance 8±15%Ωat 2000Hz
Rated Input Power 1W
Max. input power 1.5W
Resonance Frequency 580±20%Hz
Output Sound Pressure Level 93±3dB/0.1W 0.1m at 0.6,0.8,1.0,1.2KHz Average
Frequency Response Fo~6KHz
Operating Temperature -20~+65℃
Storage Temperature -30~+70℃
Electrical and Acoustic Characteristics.
Dimensions 40x5.0mm
AC Impedance 8±15%Ωat 2000Hz
Rated Input Power 1.0W
Max. input power 1.2W
Resonance Frequency 430±20%Hz
Output Sound Pressure Level 89±3dB/1M 0.5W at 0.8,1.0,1.2,1.5KHz Average
Frequency Response Fo~6KHz
Operating Temperature -20~+65℃
Storage Temperature -30~+70℃
Electrical and Acoustic Characteristics.
Dimensions 30x5.5mm
AC Impedance 8±15%Ωat 2000Hz
Rated Input Power 1.0W
Max. input power 1.5W
Resonance Frequency 550±20%Hz
Output Sound Pressure Level 92±3dB/0.1M 0.1W at 0.6,0.8,1.0,1.2KHz Average
Frequency Response Fo~20KHz
Operating Temperature -20~+65℃
Storage Temperature -30~+70℃
Electrical and Acoustic Characteristics.
Dimensions 40x5.5mm
AC Impedance 8±15%Ωat 2000Hz
Rated Input Power 1.0W
Max. input power 1.2W
Resonance Frequency 600±20%Hz
Output Sound Pressure Level 97±3dB/0.1M 0.1W at 0.8,1.0,1.2,1.5KHz Average
Frequency Response Fo~6KHz
Operating Temperature -20~+65℃
Storage Temperature -30~+70℃
Electrical and Acoustic Characteristics.
Dimensions 57x8.3mm
AC Impedance 8±15%Ωat 2000Hz
Rated Input Power 2.0W
Max. input power 2.5W
Resonance Frequency 300±20%Hz
Output Sound Pressure Level 96±3dB/0.1M 0.1W at 0.6,0.8,1.0,1.2KHz Average
Frequency Response Fo~20KHz
Operating Temperature -20~+65℃
Storage Temperature -30~+70℃
Kubernetes & AI - Beauty and the Beast !?! @KCD Istanbul 2024Tobias Schneck
As AI technology is pushing into IT I was wondering myself, as an “infrastructure container kubernetes guy”, how get this fancy AI technology get managed from an infrastructure operational view? Is it possible to apply our lovely cloud native principals as well? What benefit’s both technologies could bring to each other?
Let me take this questions and provide you a short journey through existing deployment models and use cases for AI software. On practical examples, we discuss what cloud/on-premise strategy we may need for applying it to our own infrastructure to get it to work from an enterprise perspective. I want to give an overview about infrastructure requirements and technologies, what could be beneficial or limiting your AI use cases in an enterprise environment. An interactive Demo will give you some insides, what approaches I got already working for real.
Accelerate your Kubernetes clusters with Varnish CachingThijs Feryn
A presentation about the usage and availability of Varnish on Kubernetes. This talk explores the capabilities of Varnish caching and shows how to use the Varnish Helm chart to deploy it to Kubernetes.
This presentation was delivered at K8SUG Singapore. See https://feryn.eu/presentations/accelerate-your-kubernetes-clusters-with-varnish-caching-k8sug-singapore-28-2024 for more details.
GDG Cloud Southlake #33: Boule & Rebala: Effective AppSec in SDLC using Deplo...James Anderson
Effective Application Security in Software Delivery lifecycle using Deployment Firewall and DBOM
The modern software delivery process (or the CI/CD process) includes many tools, distributed teams, open-source code, and cloud platforms. Constant focus on speed to release software to market, along with the traditional slow and manual security checks has caused gaps in continuous security as an important piece in the software supply chain. Today organizations feel more susceptible to external and internal cyber threats due to the vast attack surface in their applications supply chain and the lack of end-to-end governance and risk management.
The software team must secure its software delivery process to avoid vulnerability and security breaches. This needs to be achieved with existing tool chains and without extensive rework of the delivery processes. This talk will present strategies and techniques for providing visibility into the true risk of the existing vulnerabilities, preventing the introduction of security issues in the software, resolving vulnerabilities in production environments quickly, and capturing the deployment bill of materials (DBOM).
Speakers:
Bob Boule
Robert Boule is a technology enthusiast with PASSION for technology and making things work along with a knack for helping others understand how things work. He comes with around 20 years of solution engineering experience in application security, software continuous delivery, and SaaS platforms. He is known for his dynamic presentations in CI/CD and application security integrated in software delivery lifecycle.
Gopinath Rebala
Gopinath Rebala is the CTO of OpsMx, where he has overall responsibility for the machine learning and data processing architectures for Secure Software Delivery. Gopi also has a strong connection with our customers, leading design and architecture for strategic implementations. Gopi is a frequent speaker and well-known leader in continuous delivery and integrating security into software delivery.
Software Delivery At the Speed of AI: Inflectra Invests In AI-Powered QualityInflectra
In this insightful webinar, Inflectra explores how artificial intelligence (AI) is transforming software development and testing. Discover how AI-powered tools are revolutionizing every stage of the software development lifecycle (SDLC), from design and prototyping to testing, deployment, and monitoring.
Learn about:
• The Future of Testing: How AI is shifting testing towards verification, analysis, and higher-level skills, while reducing repetitive tasks.
• Test Automation: How AI-powered test case generation, optimization, and self-healing tests are making testing more efficient and effective.
• Visual Testing: Explore the emerging capabilities of AI in visual testing and how it's set to revolutionize UI verification.
• Inflectra's AI Solutions: See demonstrations of Inflectra's cutting-edge AI tools like the ChatGPT plugin and Azure Open AI platform, designed to streamline your testing process.
Whether you're a developer, tester, or QA professional, this webinar will give you valuable insights into how AI is shaping the future of software delivery.
UiPath Test Automation using UiPath Test Suite series, part 3DianaGray10
Welcome to UiPath Test Automation using UiPath Test Suite series part 3. In this session, we will cover desktop automation along with UI automation.
Topics covered:
UI automation Introduction,
UI automation Sample
Desktop automation flow
Pradeep Chinnala, Senior Consultant Automation Developer @WonderBotz and UiPath MVP
Deepak Rai, Automation Practice Lead, Boundaryless Group and UiPath MVP
The Art of the Pitch: WordPress Relationships and SalesLaura Byrne
Clients don’t know what they don’t know. What web solutions are right for them? How does WordPress come into the picture? How do you make sure you understand scope and timeline? What do you do if sometime changes?
All these questions and more will be explored as we talk about matching clients’ needs with what your agency offers without pulling teeth or pulling your hair out. Practical tips, and strategies for successful relationship building that leads to closing the deal.
State of ICS and IoT Cyber Threat Landscape Report 2024 previewPrayukth K V
The IoT and OT threat landscape report has been prepared by the Threat Research Team at Sectrio using data from Sectrio, cyber threat intelligence farming facilities spread across over 85 cities around the world. In addition, Sectrio also runs AI-based advanced threat and payload engagement facilities that serve as sinks to attract and engage sophisticated threat actors, and newer malware including new variants and latent threats that are at an earlier stage of development.
The latest edition of the OT/ICS and IoT security Threat Landscape Report 2024 also covers:
State of global ICS asset and network exposure
Sectoral targets and attacks as well as the cost of ransom
Global APT activity, AI usage, actor and tactic profiles, and implications
Rise in volumes of AI-powered cyberattacks
Major cyber events in 2024
Malware and malicious payload trends
Cyberattack types and targets
Vulnerability exploit attempts on CVEs
Attacks on counties – USA
Expansion of bot farms – how, where, and why
In-depth analysis of the cyber threat landscape across North America, South America, Europe, APAC, and the Middle East
Why are attacks on smart factories rising?
Cyber risk predictions
Axis of attacks – Europe
Systemic attacks in the Middle East
Download the full report from here:
https://sectrio.com/resources/ot-threat-landscape-reports/sectrio-releases-ot-ics-and-iot-security-threat-landscape-report-2024/
DevOps and Testing slides at DASA ConnectKari Kakkonen
My and Rik Marselis slides at 30.5.2024 DASA Connect conference. We discuss about what is testing, then what is agile testing and finally what is Testing in DevOps. Finally we had lovely workshop with the participants trying to find out different ways to think about quality and testing in different parts of the DevOps infinity loop.
LF Energy Webinar: Electrical Grid Modelling and Simulation Through PowSyBl -...DanBrown980551
Do you want to learn how to model and simulate an electrical network from scratch in under an hour?
Then welcome to this PowSyBl workshop, hosted by Rte, the French Transmission System Operator (TSO)!
During the webinar, you will discover the PowSyBl ecosystem as well as handle and study an electrical network through an interactive Python notebook.
PowSyBl is an open source project hosted by LF Energy, which offers a comprehensive set of features for electrical grid modelling and simulation. Among other advanced features, PowSyBl provides:
- A fully editable and extendable library for grid component modelling;
- Visualization tools to display your network;
- Grid simulation tools, such as power flows, security analyses (with or without remedial actions) and sensitivity analyses;
The framework is mostly written in Java, with a Python binding so that Python developers can access PowSyBl functionalities as well.
What you will learn during the webinar:
- For beginners: discover PowSyBl's functionalities through a quick general presentation and the notebook, without needing any expert coding skills;
- For advanced developers: master the skills to efficiently apply PowSyBl functionalities to your real-world scenarios.
Key Trends Shaping the Future of Infrastructure.pdfCheryl Hung
Keynote at DIGIT West Expo, Glasgow on 29 May 2024.
Cheryl Hung, ochery.com
Sr Director, Infrastructure Ecosystem, Arm.
The key trends across hardware, cloud and open-source; exploring how these areas are likely to mature and develop over the short and long-term, and then considering how organisations can position themselves to adapt and thrive.
Connector Corner: Automate dynamic content and events by pushing a buttonDianaGray10
Here is something new! In our next Connector Corner webinar, we will demonstrate how you can use a single workflow to:
Create a campaign using Mailchimp with merge tags/fields
Send an interactive Slack channel message (using buttons)
Have the message received by managers and peers along with a test email for review
But there’s more:
In a second workflow supporting the same use case, you’ll see:
Your campaign sent to target colleagues for approval
If the “Approve” button is clicked, a Jira/Zendesk ticket is created for the marketing design team
But—if the “Reject” button is pushed, colleagues will be alerted via Slack message
Join us to learn more about this new, human-in-the-loop capability, brought to you by Integration Service connectors.
And...
Speakers:
Akshay Agnihotri, Product Manager
Charlie Greenberg, Host
Slack (or Teams) Automation for Bonterra Impact Management (fka Social Soluti...Jeffrey Haguewood
Sidekick Solutions uses Bonterra Impact Management (fka Social Solutions Apricot) and automation solutions to integrate data for business workflows.
We believe integration and automation are essential to user experience and the promise of efficient work through technology. Automation is the critical ingredient to realizing that full vision. We develop integration products and services for Bonterra Case Management software to support the deployment of automations for a variety of use cases.
This video focuses on the notifications, alerts, and approval requests using Slack for Bonterra Impact Management. The solutions covered in this webinar can also be deployed for Microsoft Teams.
Interested in deploying notification automations for Bonterra Impact Management? Contact us at sales@sidekicksolutionsllc.com to discuss next steps.
Slack (or Teams) Automation for Bonterra Impact Management (fka Social Soluti...
TE-DL1525A-8H4.6
1. 1 2 3 4 5 6 7 8
APPEARANCE
A
SPECIFICATION A
Electrical and Acoustic Characteristics.
Dimensions 25x15x4.6mm
AC Impedance 8±15% at 2000Hz
Rated Input Power 1.5W
B Max. input power 2.0W B
Resonance Frequency 750±20%Hz
Output Sound Pressure Level 87±3dB/0.1M 0.1W at
0.8,1.0,1.2,1.5KHz Average
Frequency Response Fo~20KHz
Operating Temperature -20~+65
C Storage Temperature -30~+70 C
DIMENSIONS FREQUENCY RESPONSE
110
Sound Pressure Level (dB)
100
D dB D
90
80
70
E E
60
100 200 500 1k 2k 5k 10k 20k
Frequency (Hz)
UNLESS OHERWISE SPECIFIED
DIMENSION ARE IN MILIMETER
MATERIAL TIANER TECHNOLOGY CO., LTD.
AND (INCHES) SILICONE RUBBER 60O http://www.itianer.com
DECIMALS ANGLES FINISH TITLE
.XX ±0.50 (0.02)
.XXX±0.025 (0.001) ±1 O BLACK
Notebook Speaker
F F
DO NOT SCALE DRAWING
DWN BY DATE
THIRD ANGLE PROJEC TIO N
CHK BY DATE UNIT DWG NO/ PART NO REV
mm TE-DL1525A-8H4.6 01
DESIGN DATE SHEET
SCALE 5:1 RELEASE DATE 2009/12/27
J.M. ‘09/08/22
1 2 3 4 5 6 7 8
