<Presentation>
For illustration purposes, we defined a realistic base case scenario as a reference point. However, it should be noted that market development and future industry dynamics depend on a broad range of critical factors. Hence, we calculated different scenarios in our market model, which range from very optimistic to very pessimistic.
***Service***
Auto buyers will come to regard the car as a bundle of services, rather than a package of hardware.
Many consumers will still want to own their own cars, but they will increasingly favor convenience, digital services, and ability to upgrade over performance and perhaps over durability.
Product Life Cycle
Together, they will not only have an effect on the car itself, but also transform the organizations that design, engineer, assemble, and sell it and the way value is delivered to the customer (see text box 3).
Whereas OEMs traditionally tend to follow a 5- to 7-year development cycle, major software releases are usually delivered every one to two years, with many cloud-based services updated on a continuous basis. While cars go through lengthy technical and regulatory approval processes, software services in the cloud are often tested on the fly, sometimes with multiple versions online at once. We expect the automotive industry to move towards this trend, which will have major implications for processes and governance across functions, from R&D and production via the supply chain t
採用標準化的產品，標準的硬體、標準的作業系統等做法；此 外，一般「3C」電子產品的開發週期為 3-6 個月，產品生命週期為 6-12 個月， 這與汽車的開發週期通常長達 2-3 年，產品使用期通常超過 5 年，甚至更長達 10 年以上，零組件從認證到裝車上市，至少要經過 1-2 年時間，有著很大差別o sales, marketing, and after-sales services.
<Presentation>
The automotive industry is moving to a new era with the driving force of the Internet of Things.
The Internet of Vehicles (IoV) defines the increasing importance of not only solid connectivity but also abundant data processing amongst vehicles at various stages. Over the years these stages have been evolving from passive safety, active safety, connected vehicle (V2X) and future-trending autonomous vehicle; the level of automation involved is increasing accordingly. Simultaneously, the core of development stages highlights the demands of effective and accurate information transmission and data processing in the network of relevant objects.
Passive Safety : e.g. airbag
Active Safety: sensors fusion technology ->
Connected Vehicle
Autonomous Vehicle
Autonomous Car: A car which is capable of fulfilling the operational functions of a traditional car without a human operator
Connected Car: A car which has technology enabling it to connect to devices within the car, as well as external networks such as the internet
IPO model (Input-Process-Output)
In pursuit of real-time responsiveness, data accuracy and consistency, data integrity is primarily required through the entire operation process – input, process and output; the need of high performance and high capacity storage devices is becoming inevitable.
for OEM manufacturers the autonomous car will be seen as a bundle of driver-assistance features — from “passive” features such as the parking assistance systems available today, to semi-autonomous systems that allow drivers to take control at any time.
*********************************************************************************************************************************
The role of NAND Flash Storage in Emerging Connected Automotive Applications
Reference
對於各種不同功能特性(Features)的汽車電子產品(包括U行動通/資訊 U(Telematics)、U多媒體視訊及娛樂U(Infotainments)、U防護及保全U(Protect & Security)、 U安全駕駛輔助U(Safe-driving Assist)、U乘適及便利U(Comfort & Easy)、U潔能及省電 U(Clean & Lean)等六大功能走向)，及其相關技術(Technology)整合應用的發展需求 (未來汽車電子之技術應用範疇至少涵蓋了U電控、U U感測、U U數位影音、U U光電、U U通訊 U及U行動資訊U等六大領域技術應用)，以及OEM、AM市場的走向(Trends)，皆應持 續不斷的深入鑽研。
採用標準化的產品，標準的硬體、標準的作業系統等做法；此 外，一般「3C」電子產品的開發週期為 3-6 個月，產品生命週期為 6-12 個月， 這與汽車的開發週期通常長達 2-3 年，產品使用期通常超過 5 年，甚至更長達 10 年以上，零組件從認證到裝車上市，至少要經過 1-2 年時間，有著很大差別。
就市場行銷面而言，汽車電子產品主要有兩大市場，一個是直接由車廠採 購，進行原廠內裝（Original Equipment，OE），另一個則是消費者自行添購的後 裝市場（After Market，AM）。基本上，車輛動力、底盤系統及安全類相關的產 品，主導權通常掌控在車廠或一階系統供應商，因此多半由車廠與零組件或 ICT 業者共同開發；而駕駛資訊系統、車用影音或導航系統等產品，因較不影響車 輛主要控制系統，則多半由消費者主導，透過後裝市場取得。整體而言，國內 投入汽車電子產業的廠商，目前仍以經營ＡＭ市場為主，外銷到歐、美等市場， 但就長久來看，要讓產品更具競爭力，就必須切入原廠 OEM/ODM 系統，加深 與汽車供應鏈的結合。
Durable customer relationship
DEALERS STILL PART OF EQUATION
Multiple channels and formats will coexist to satisfy different market segments
<Presentation>
The automotive industry is moving to a new era with the driving force of the Internet of Things.
The Internet of Vehicles (IoV) defines the increasing importance of not only solid connectivity but also abundant data processing amongst vehicles at various stages. Over the years these stages have been evolving from passive safety, active safety, connected vehicle (V2X) and future-trending autonomous vehicle; the level of automation involved is increasing accordingly. Simultaneously, the core of development stages highlights the demands of effective and accurate information transmission and data processing in the network of relevant objects.
Passive Safety : e.g. airbag
Active Safety: sensors fusion technology ->
Connected Vehicle
Autonomous Vehicle
Autonomous Car: A car which is capable of fulfilling the operational functions of a traditional car without a human operator
Connected Car: A car which has technology enabling it to connect to devices within the car, as well as external networks such as the internet
IPO model (Input-Process-Output)
In pursuit of real-time responsiveness, data accuracy and consistency, data integrity is primarily required through the entire operation process – input, process and output; the need of high performance and high capacity storage devices is becoming inevitable.
for OEM manufacturers the autonomous car will be seen as a bundle of driver-assistance features — from “passive” features such as the parking assistance systems available today, to semi-autonomous systems that allow drivers to take control at any time.
*********************************************************************************************************************************
The role of NAND Flash Storage in Emerging Connected Automotive Applications
Reference
對於各種不同功能特性(Features)的汽車電子產品(包括U行動通/資訊 U(Telematics)、U多媒體視訊及娛樂U(Infotainments)、U防護及保全U(Protect & Security)、 U安全駕駛輔助U(Safe-driving Assist)、U乘適及便利U(Comfort & Easy)、U潔能及省電 U(Clean & Lean)等六大功能走向)，及其相關技術(Technology)整合應用的發展需求 (未來汽車電子之技術應用範疇至少涵蓋了U電控、U U感測、U U數位影音、U U光電、U U通訊 U及U行動資訊U等六大領域技術應用)，以及OEM、AM市場的走向(Trends)，皆應持 續不斷的深入鑽研。
採用標準化的產品，標準的硬體、標準的作業系統等做法；此 外，一般「3C」電子產品的開發週期為 3-6 個月，產品生命週期為 6-12 個月， 這與汽車的開發週期通常長達 2-3 年，產品使用期通常超過 5 年，甚至更長達 10 年以上，零組件從認證到裝車上市，至少要經過 1-2 年時間，有著很大差別。
就市場行銷面而言，汽車電子產品主要有兩大市場，一個是直接由車廠採 購，進行原廠內裝（Original Equipment，OE），另一個則是消費者自行添購的後 裝市場（After Market，AM）。基本上，車輛動力、底盤系統及安全類相關的產 品，主導權通常掌控在車廠或一階系統供應商，因此多半由車廠與零組件或 ICT 業者共同開發；而駕駛資訊系統、車用影音或導航系統等產品，因較不影響車 輛主要控制系統，則多半由消費者主導，透過後裝市場取得。整體而言，國內 投入汽車電子產業的廠商，目前仍以經營ＡＭ市場為主，外銷到歐、美等市場， 但就長久來看，要讓產品更具競爭力，就必須切入原廠 OEM/ODM 系統，加深 與汽車供應鏈的結合。
Durable customer relationship
DEALERS STILL PART OF EQUATION
Multiple channels and formats will coexist to satisfy different market segments
<Presentation>
For illustration purposes, we defined a realistic base case scenario as a reference point. However, it should be noted that market development and future industry dynamics depend on a broad range of critical factors. Hence, we calculated different scenarios in our market model, which range from very optimistic to very pessimistic.
***Service***
Auto buyers will come to regard the car as a bundle of services, rather than a package of hardware.
Many consumers will still want to own their own cars, but they will increasingly favor convenience, digital services, and ability to upgrade over performance and perhaps over durability.
Environmental constraints
Application Specific demand
- Red intensive: GPS/IVI
- Write intensive: Drive Recorder/EDR
- Mixed: Telematics/ADAS/DMS
<Presentation>
The act of shrinking a die is to create a somewhat identical circuitry using a more advanced fabrication process, usually involving an advance of lithographic node. This reduces overall costs of a chip company, as the absence of major architectural changes to the processor lowers research and development costs, while at the same time allowing more processor dies to be manufactured on the same piece of silicon wafer, resulting in less cost per product sold.
Die shrinks are beneficial to end-users as shrinking a die reduces the current used by each transistor switching on or off in semiconductor devices while maintaining the same clock frequency of a chip, making a product with less power consumption (and thus less heat production), increased clock rate headroom, and lower prices. Since the cost to fabricate a 200-mm or 300-mm silicon wafer is proportional to the number of fabrication steps, and not proportional to the number of chips on the wafer, die shrinks cram more chips onto each wafer, resulting in lowered manufacturing costs per chip.
- NAND Quality – Shrinking lithography - Uneven manufacturing quality of ICs/NAND flash per module - Data reliability, Data retention and endurance are heavily impacted RBER (Raw Bit Error Rate), ELFR (Early Life Failure Rate, Fewer electrons stored per cell
- Temperature Influence - NAND flash reliability heavily influenced by the variations in temperature The changes of the charge distribution in NAND flash might cause ill-effects like data retention decreases or data loss.
隨著NAND半導體製程微縮使得成本下降的同時，品質和可靠的寬容度也大幅下降，因為在僅存非常微小的設計和操作空間之下，NAND的使用限制日漸複雜
