Efpcb.com offers a range of materials essential for integrated circuit packaging, including substrates, bonding wires, and dielectrics. The document also highlights the importance of semiconductor test boards for verifying integrated circuits and emphasizes the maintenance of probe cards in wafer testing to ensure accurate readings. Additionally, it discusses the significance of via on pad technology in high-speed digital circuits to maintain signal integrity.

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2. IC Substrate: The Base for Integrated Circuit Packaging
Laminate substrates, lead frames, bonding wire, encapsulating materials, underfill, die-
attach materials, WLP (Wafer-Level Packaging) dielectrics, and WLP plating chemicals are
among the most common materials used in integrated circuit packaging. These materials are
used to shield and link IC chips to external devices such as printed circuit boards (PCBs), as
well as to provide thermal control and support. Read our full blog CLICK.

3. Get Into the Deep Insights of Semiconductor Test Board
Semiconductor test boards, often called probe cards or test fixtures, are critical equipment in
the semiconductor industry for testing and verifying integrated circuits (ICs) and other
semiconductor devices. These boards allow you to electrically connect the devices under test
(DUTs) to test equipment such as automated test equipment (ATE) and semiconductor test
systems. Check more information about our product CLICK.

4. Probe Card PCB is A Significant Aspect of Semiconductor Wafer Test System
In general, the probe card is considered disposable, and maintenance is essential to ensure
its performance and usefulness. Overload and the deposition of debris from the wafer's
binding material on the probe's tips or probe needles can cause resistance to increase and
hinder correct readings. Read our full blog for more CLICK.

5. The Importance and Standard of Via on PAD Technology for PCB
in high-speed digital circuits, in order to ensure the integrity of the signal, it is necessary to
strictly control the impedance of the signal. Through the design of the Via on PAD, the
grounding via can be introduced at a specific position to realize the reference plane
switching of the signal, so as to adjust the impedance of the signal and meet the
requirements of high-speed signal transmission. Get more information check our blog CLICK.

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