Wireless network appliance solution by sirena cheng 20140508Sirena Cheng
This document provides an overview and summary of a wireless network management solution guide from AEWIN. It discusses wireless device and WLAN controller market forecasts, the role of WLAN controllers in core, access, and customer premise networks. It describes features of WLAN controllers for different network layers including centralized/distributed deployment, processor specs, ports, power supplies and remote management capabilities. Key applications are mentioned for each network type.
重要インフラセキュリティ市場展望 By sirena cheng 20140507 aewin technologiesSirena Cheng
The document discusses Sirena Cheng's role as senior marketing manager and provides information about AEWIN, a company that produces embedded systems. It mentions AEWIN's focus industries including public safety, energy, finance, transport systems, water supply, public health, and telecommunications. It also briefly describes AEWIN's R&D, facilities, and one of its products - the EM-6336 and SEM-6336 fanless embedded systems that can operate at wide temperatures from -40 to 75 degrees Celsius.
The document discusses the benefits of exercise for mental health. Regular physical activity can help reduce anxiety and depression and improve mood and cognitive functioning. Exercise causes chemical changes in the brain that may help protect against mental illness and improve symptoms.
Aewin fanless system sem6333 intel atom d2550_n2600Sirena Cheng
This document summarizes a fanless embedded computing system with an Intel Atom processor. It has HDMI and VGA video outputs, supports up to 4GB of RAM, has space for one 2.5" hard drive and one mSATA SSD. It has multiple network and USB ports as well as audio I/O. The system comes in a compact aluminum case and has a wide input voltage range, making it suitable for industrial applications. It ships with power and mounting accessories.
This document summarizes a PC/104+ CPU module featuring an Intel Atom D2550 or N2600 processor. It includes onboard VGA and LVDS display interfaces, 2 Gigabit Ethernet ports, SATA, CompactFlash socket, 2 COM ports, 4 USB ports, and a DC 5V power input. The module measures 96mm x 116mm and supports operating temperatures from 0°C to 60°C.
Wireless network appliance solution by sirena cheng 20140508Sirena Cheng
This document provides an overview and summary of a wireless network management solution guide from AEWIN. It discusses wireless device and WLAN controller market forecasts, the role of WLAN controllers in core, access, and customer premise networks. It describes features of WLAN controllers for different network layers including centralized/distributed deployment, processor specs, ports, power supplies and remote management capabilities. Key applications are mentioned for each network type.
重要インフラセキュリティ市場展望 By sirena cheng 20140507 aewin technologiesSirena Cheng
The document discusses Sirena Cheng's role as senior marketing manager and provides information about AEWIN, a company that produces embedded systems. It mentions AEWIN's focus industries including public safety, energy, finance, transport systems, water supply, public health, and telecommunications. It also briefly describes AEWIN's R&D, facilities, and one of its products - the EM-6336 and SEM-6336 fanless embedded systems that can operate at wide temperatures from -40 to 75 degrees Celsius.
The document discusses the benefits of exercise for mental health. Regular physical activity can help reduce anxiety and depression and improve mood and cognitive functioning. Exercise causes chemical changes in the brain that may help protect against mental illness and improve symptoms.
Aewin fanless system sem6333 intel atom d2550_n2600Sirena Cheng
This document summarizes a fanless embedded computing system with an Intel Atom processor. It has HDMI and VGA video outputs, supports up to 4GB of RAM, has space for one 2.5" hard drive and one mSATA SSD. It has multiple network and USB ports as well as audio I/O. The system comes in a compact aluminum case and has a wide input voltage range, making it suitable for industrial applications. It ships with power and mounting accessories.
This document summarizes a PC/104+ CPU module featuring an Intel Atom D2550 or N2600 processor. It includes onboard VGA and LVDS display interfaces, 2 Gigabit Ethernet ports, SATA, CompactFlash socket, 2 COM ports, 4 USB ports, and a DC 5V power input. The module measures 96mm x 116mm and supports operating temperatures from 0°C to 60°C.
This document summarizes the specifications of a PC/104+ embedded computer module with an Intel Atom processor. The module features an Intel Atom D525 or D425 processor, Intel ICH8M chipset, up to 4GB DDR3 RAM, VGA and LVDS video outputs, SATA, CompactFlash socket, 2 Gigabit Ethernet ports, USB, serial ports, and 5V DC power input. It is available in standard and pin-down mounting type variants and has optional HD audio and storage expansion. Dimensions are 96mm x 116mm and it operates from 0-60°C.
Aewin embedded pm7110 intel atom z510_z530_pc_104Sirena Cheng
This document provides specifications for a PC/104+ module with an Intel Atom processor. It features an Intel Atom Z530 or Z510 CPU, integrated VGA and LVDS display outputs, 2 Ethernet ports, SATA, COM ports, USB, and a CompactFlash socket. The module requires 5V DC power input and measures 96mm x 116mm. It is available in standard and pin-down versions to interface with other PC/104+ modules for embedded applications.
Aewin embedded pm6101 amd g series_pc_104Sirena Cheng
This document summarizes a PC/104+ module featuring an AMD G-series APU, AMD A55E chipset, VGA and LVDS dual display outputs, 2 Gigabit Ethernet ports, SATA, 2 serial ports, 4 USB ports, and a CompactFlash socket. The module is powered by DC 5V and measures 96mm x 116mm. It supports up to 4GB of DDR3 memory and has options for an HD audio module.
This document provides specifications for a PC/104+ CPU module with an AMD LX800 processor. It includes the following key details:
- The module has an AMD LX800 single core 500MHz processor, up to 1GB of DDR RAM, 2 Ethernet ports, 2 serial ports, USB, IDE, and CF card socket connections.
- Input power is 5V DC. Interface is via PC/104+ connector. Operating temperature is 0-60°C.
- The module has onboard VGA and LVDS video outputs. Audio and additional I/O is available via optional modules.
- Ordering information and optional accessories like cables are listed for models with different AMD processors and
Aewin embedded mb8390 amd r series_mini_itxSirena Cheng
This document provides specifications for the MB-8390A Mini-ITX motherboard from Aewin. The board supports AMD Embedded R-Series APUs with integrated Radeon HD graphics, up to 8GB of DDR3 memory, and features three HDMI ports, one DisplayPort, two Gigabit Ethernet ports, two COM ports, four USB 3.0 ports, two SATA ports, an optional TPM, intrusion detection, a PCIe x16 slot, and a Mini-PCIe slot. The board requires a DC power input between 8-32V and has dimensions of 170mm x 170mm.
This document summarizes the specifications of the MB-8302 Mini-ITX motherboard. It supports an Intel 4th generation Core LGA 1150 processor and Intel H81 Express chipset with up to 16GB of DDR3 RAM. It has various I/O including HDMI, VGA, DVI, USB, Ethernet, and serial ports. Expansion slots include one PCIe x16 and one PCIe x1 slot.
This document summarizes an embedded computing motherboard with a Mini-ITX form factor. It features an onboard 4th generation Intel Core mobile processor, Intel QM87 chipset, up to 16GB of DDR3 memory, HDMI/DVI/VGA and LVDS display outputs, 2 Gigabit Ethernet ports, 4 SATA ports, USB 3.0, and a wide input voltage range of 8V to 32V. The motherboard supports expansion via PCIe and Mini-PCIe slots. It also includes multiple serial and USB ports, audio I/O, and power/storage connectivity options. Various configuration options and accessory items are listed for ordering.
This document summarizes the features and specifications of the MB-8300 series of Mini-ITX motherboards that support 3rd generation Intel Core Mobile processors. The boards support up to 16GB of DDR3 RAM, HDMI/DVI/VGA display outputs, dual Gigabit LAN, multiple COM and USB ports, and mini PCIe slots. Models are available with different display and expansion port configurations and optional video/audio inputs. The boards operate from 8V to 32V DC input and have a Mini-ITX form factor.
This document summarizes the specifications of two Mini-ITX motherboards with AMD processors and chipsets. The boards feature AMD G-series or T40R APUs, an AMD A55E chipset, DDR3 memory support, VGA and DVI video outputs, PCI and PCIe slots, SATA ports, multiple serial and USB ports, and audio. One board supports the AMD T56N dual-core processor while the other is optimized for the AMD T40R single-core processor.
The FS-9500 is a new PICMG 1.3 single board computer featuring a 4th Gen Intel Core i7/i5/i3 mobile processor with Intel QM87 chipset. It has up to 32GB of DDR3 memory, dual Gigabit Ethernet ports, 4 SATA3 ports, 6 serial COM ports, and display outputs of DVI, VGA, and optional DisplayPort. Measuring 338mm x 126mm, it is designed for operating temperatures between 0-60 degrees Celsius.
This document summarizes the specifications of the EM-6336A single board computer. It can operate from -40°C to 85°C without a fan and uses a DC power input from 8V to 32V. It features an Intel Atom BayTrail-I processor with optional single, dual, or quad core configurations. It has ports for HDMI, VGA, LVDS display output, dual Gigabit Ethernet, USB 3.0, USB 2.0, SATA, audio, and two Mini-PCIe expansion slots. The board size is 146mm x 101mm and has optional models with AMD processors.
Aewin embedded em6335 sj1-amd g series socSirena Cheng
This document summarizes the specifications of the EM-6335-SJ1 single board computer. It features an AMD Embedded G-Series quad-core processor, up to 8GB of DDR3 memory, HDMI video output, Gigabit Ethernet, 4 serial ports, and USB ports. It has a Mini-PCIe slot and takes a DC power input between 8-32V. Measuring 146mm x 101mm, it is designed for operating temperatures between 0-60 degrees Celsius.
Aewin embedded em6335 amd g series socSirena Cheng
This document summarizes an AMD Embedded G-Series single board computer. It features an AMD Embedded G-Series SOC processor, HDMI, VGA, and LVDS video outputs, Gigabit Ethernet, 2 Mini-PCIe slots, 4 COM ports, USB, SATA, and audio. It has a DC input voltage range of 8V to 32V and dimensions of 146mm x 101mm. Various ordering options are provided with different AMD Embedded G-Series SOC processors ranging from 1.0GHz to 2.0GHz clock speeds.
This document summarizes a 3.5" single board computer (SBC) that features an Intel Atom D2550 or N2600 processor, Intel NM10 chipset, up to 4GB DDR3 memory, HDMI/VGA/LVDS display outputs, 6 USB ports, SATA interface, 2 Mini-PCIe slots, and DC 8-32V power input. Key specifications of the SBC include its processor, memory support, I/O interfaces, display options, and operating temperature range. Two product options - models EM-6333A-D16 and EM-6333B-D18 - are listed along with optional accessories.
This document summarizes the specifications of a 3.5" single board computer (SBC) with an AMD Geode LX800 processor. It includes features like 2 LAN ports, 4 COM ports, 4 USB ports, a compactflash socket, mini-PCI and PCI-104 expansion interfaces, and a DC 5V power input. It provides details on the CPU, chipset, memory support, I/O interfaces, display support, packaging, and ordering information for two models with different Ethernet chipsets.
This document summarizes the specifications of a 3.5" single board computer (SBC) with an Intel Atom N450, D410, or D510 processor. The SBC features include dual display output via VGA and LVDS, dual gigabit Ethernet, SATA, USB, serial and mini-PCI ports. It has a compact form factor of 146mm x 101mm and is powered by 12V DC input. Optional accessories include an HD audio module and cable. Three models are listed with different onboard Atom processors.
The document describes a COM Express compact module with an onboard Intel Atom Z510 or Z530 processor. It has key features like up to 1GB of DDR2 memory, an Intel SCH US15W chipset, Gigabit Ethernet, LVDS and SDVO display interfaces, and two PCI Express x1 slots. The module has a COM Express compact form factor and pin-out type 2. It operates from 0-60°C and has various I/O including SATA, USB, and audio interfaces. Optional accessories include an evaluation baseboard and display modules.
This document provides specifications for an Intel Core 2 Duo/Core Duo COM Express basic module with an Intel 945GME chipset. It includes key features such as support for Core 2 Duo/Core Duo CPUs, up to 2GB of DDR2 memory, Gigabit Ethernet, PCIe and PCI expansion, and various I/O including USB, audio, SATA, and VGA output. It also lists the module form factor and dimensions, operating temperature range, and an optional heatsink and accessories that can be ordered.
This document summarizes the specifications of an ETX CPU module that supports the Intel Core 2 Duo processor. The module features the Intel GME965 and ICH8M chipset, up to 2GB of DDR2 memory, VGA and LVDS display outputs, fast Ethernet, SATA, USB, serial, and audio connectivity. It has a compact form factor of 114mm x 95mm and supports operating temperatures from 0 to 60 degrees Celsius.
This document provides information about an ETX CPU module that features an onboard AMD LX800 processor and AMD Geode CS5536 chipset. It can support up to 1GB of DDR RAM, has interfaces for VGA, LVDS, LAN, SATA, COM, USB, and expansion via PCI and ISA. Storage options include 2 SATA, 2 PATA, and a CompactFlash socket. Audio and 2 serial ports are included, and it operates from a 5V DC power source on a small 114x95mm board.
Northern Engraving | Nameplate Manufacturing Process - 2024Northern Engraving
Manufacturing custom quality metal nameplates and badges involves several standard operations. Processes include sheet prep, lithography, screening, coating, punch press and inspection. All decoration is completed in the flat sheet with adhesive and tooling operations following. The possibilities for creating unique durable nameplates are endless. How will you create your brand identity? We can help!
This document summarizes the specifications of a PC/104+ embedded computer module with an Intel Atom processor. The module features an Intel Atom D525 or D425 processor, Intel ICH8M chipset, up to 4GB DDR3 RAM, VGA and LVDS video outputs, SATA, CompactFlash socket, 2 Gigabit Ethernet ports, USB, serial ports, and 5V DC power input. It is available in standard and pin-down mounting type variants and has optional HD audio and storage expansion. Dimensions are 96mm x 116mm and it operates from 0-60°C.
Aewin embedded pm7110 intel atom z510_z530_pc_104Sirena Cheng
This document provides specifications for a PC/104+ module with an Intel Atom processor. It features an Intel Atom Z530 or Z510 CPU, integrated VGA and LVDS display outputs, 2 Ethernet ports, SATA, COM ports, USB, and a CompactFlash socket. The module requires 5V DC power input and measures 96mm x 116mm. It is available in standard and pin-down versions to interface with other PC/104+ modules for embedded applications.
Aewin embedded pm6101 amd g series_pc_104Sirena Cheng
This document summarizes a PC/104+ module featuring an AMD G-series APU, AMD A55E chipset, VGA and LVDS dual display outputs, 2 Gigabit Ethernet ports, SATA, 2 serial ports, 4 USB ports, and a CompactFlash socket. The module is powered by DC 5V and measures 96mm x 116mm. It supports up to 4GB of DDR3 memory and has options for an HD audio module.
This document provides specifications for a PC/104+ CPU module with an AMD LX800 processor. It includes the following key details:
- The module has an AMD LX800 single core 500MHz processor, up to 1GB of DDR RAM, 2 Ethernet ports, 2 serial ports, USB, IDE, and CF card socket connections.
- Input power is 5V DC. Interface is via PC/104+ connector. Operating temperature is 0-60°C.
- The module has onboard VGA and LVDS video outputs. Audio and additional I/O is available via optional modules.
- Ordering information and optional accessories like cables are listed for models with different AMD processors and
Aewin embedded mb8390 amd r series_mini_itxSirena Cheng
This document provides specifications for the MB-8390A Mini-ITX motherboard from Aewin. The board supports AMD Embedded R-Series APUs with integrated Radeon HD graphics, up to 8GB of DDR3 memory, and features three HDMI ports, one DisplayPort, two Gigabit Ethernet ports, two COM ports, four USB 3.0 ports, two SATA ports, an optional TPM, intrusion detection, a PCIe x16 slot, and a Mini-PCIe slot. The board requires a DC power input between 8-32V and has dimensions of 170mm x 170mm.
This document summarizes the specifications of the MB-8302 Mini-ITX motherboard. It supports an Intel 4th generation Core LGA 1150 processor and Intel H81 Express chipset with up to 16GB of DDR3 RAM. It has various I/O including HDMI, VGA, DVI, USB, Ethernet, and serial ports. Expansion slots include one PCIe x16 and one PCIe x1 slot.
This document summarizes an embedded computing motherboard with a Mini-ITX form factor. It features an onboard 4th generation Intel Core mobile processor, Intel QM87 chipset, up to 16GB of DDR3 memory, HDMI/DVI/VGA and LVDS display outputs, 2 Gigabit Ethernet ports, 4 SATA ports, USB 3.0, and a wide input voltage range of 8V to 32V. The motherboard supports expansion via PCIe and Mini-PCIe slots. It also includes multiple serial and USB ports, audio I/O, and power/storage connectivity options. Various configuration options and accessory items are listed for ordering.
This document summarizes the features and specifications of the MB-8300 series of Mini-ITX motherboards that support 3rd generation Intel Core Mobile processors. The boards support up to 16GB of DDR3 RAM, HDMI/DVI/VGA display outputs, dual Gigabit LAN, multiple COM and USB ports, and mini PCIe slots. Models are available with different display and expansion port configurations and optional video/audio inputs. The boards operate from 8V to 32V DC input and have a Mini-ITX form factor.
This document summarizes the specifications of two Mini-ITX motherboards with AMD processors and chipsets. The boards feature AMD G-series or T40R APUs, an AMD A55E chipset, DDR3 memory support, VGA and DVI video outputs, PCI and PCIe slots, SATA ports, multiple serial and USB ports, and audio. One board supports the AMD T56N dual-core processor while the other is optimized for the AMD T40R single-core processor.
The FS-9500 is a new PICMG 1.3 single board computer featuring a 4th Gen Intel Core i7/i5/i3 mobile processor with Intel QM87 chipset. It has up to 32GB of DDR3 memory, dual Gigabit Ethernet ports, 4 SATA3 ports, 6 serial COM ports, and display outputs of DVI, VGA, and optional DisplayPort. Measuring 338mm x 126mm, it is designed for operating temperatures between 0-60 degrees Celsius.
This document summarizes the specifications of the EM-6336A single board computer. It can operate from -40°C to 85°C without a fan and uses a DC power input from 8V to 32V. It features an Intel Atom BayTrail-I processor with optional single, dual, or quad core configurations. It has ports for HDMI, VGA, LVDS display output, dual Gigabit Ethernet, USB 3.0, USB 2.0, SATA, audio, and two Mini-PCIe expansion slots. The board size is 146mm x 101mm and has optional models with AMD processors.
Aewin embedded em6335 sj1-amd g series socSirena Cheng
This document summarizes the specifications of the EM-6335-SJ1 single board computer. It features an AMD Embedded G-Series quad-core processor, up to 8GB of DDR3 memory, HDMI video output, Gigabit Ethernet, 4 serial ports, and USB ports. It has a Mini-PCIe slot and takes a DC power input between 8-32V. Measuring 146mm x 101mm, it is designed for operating temperatures between 0-60 degrees Celsius.
Aewin embedded em6335 amd g series socSirena Cheng
This document summarizes an AMD Embedded G-Series single board computer. It features an AMD Embedded G-Series SOC processor, HDMI, VGA, and LVDS video outputs, Gigabit Ethernet, 2 Mini-PCIe slots, 4 COM ports, USB, SATA, and audio. It has a DC input voltage range of 8V to 32V and dimensions of 146mm x 101mm. Various ordering options are provided with different AMD Embedded G-Series SOC processors ranging from 1.0GHz to 2.0GHz clock speeds.
This document summarizes a 3.5" single board computer (SBC) that features an Intel Atom D2550 or N2600 processor, Intel NM10 chipset, up to 4GB DDR3 memory, HDMI/VGA/LVDS display outputs, 6 USB ports, SATA interface, 2 Mini-PCIe slots, and DC 8-32V power input. Key specifications of the SBC include its processor, memory support, I/O interfaces, display options, and operating temperature range. Two product options - models EM-6333A-D16 and EM-6333B-D18 - are listed along with optional accessories.
This document summarizes the specifications of a 3.5" single board computer (SBC) with an AMD Geode LX800 processor. It includes features like 2 LAN ports, 4 COM ports, 4 USB ports, a compactflash socket, mini-PCI and PCI-104 expansion interfaces, and a DC 5V power input. It provides details on the CPU, chipset, memory support, I/O interfaces, display support, packaging, and ordering information for two models with different Ethernet chipsets.
This document summarizes the specifications of a 3.5" single board computer (SBC) with an Intel Atom N450, D410, or D510 processor. The SBC features include dual display output via VGA and LVDS, dual gigabit Ethernet, SATA, USB, serial and mini-PCI ports. It has a compact form factor of 146mm x 101mm and is powered by 12V DC input. Optional accessories include an HD audio module and cable. Three models are listed with different onboard Atom processors.
The document describes a COM Express compact module with an onboard Intel Atom Z510 or Z530 processor. It has key features like up to 1GB of DDR2 memory, an Intel SCH US15W chipset, Gigabit Ethernet, LVDS and SDVO display interfaces, and two PCI Express x1 slots. The module has a COM Express compact form factor and pin-out type 2. It operates from 0-60°C and has various I/O including SATA, USB, and audio interfaces. Optional accessories include an evaluation baseboard and display modules.
This document provides specifications for an Intel Core 2 Duo/Core Duo COM Express basic module with an Intel 945GME chipset. It includes key features such as support for Core 2 Duo/Core Duo CPUs, up to 2GB of DDR2 memory, Gigabit Ethernet, PCIe and PCI expansion, and various I/O including USB, audio, SATA, and VGA output. It also lists the module form factor and dimensions, operating temperature range, and an optional heatsink and accessories that can be ordered.
This document summarizes the specifications of an ETX CPU module that supports the Intel Core 2 Duo processor. The module features the Intel GME965 and ICH8M chipset, up to 2GB of DDR2 memory, VGA and LVDS display outputs, fast Ethernet, SATA, USB, serial, and audio connectivity. It has a compact form factor of 114mm x 95mm and supports operating temperatures from 0 to 60 degrees Celsius.
This document provides information about an ETX CPU module that features an onboard AMD LX800 processor and AMD Geode CS5536 chipset. It can support up to 1GB of DDR RAM, has interfaces for VGA, LVDS, LAN, SATA, COM, USB, and expansion via PCI and ISA. Storage options include 2 SATA, 2 PATA, and a CompactFlash socket. Audio and 2 serial ports are included, and it operates from a 5V DC power source on a small 114x95mm board.
Northern Engraving | Nameplate Manufacturing Process - 2024Northern Engraving
Manufacturing custom quality metal nameplates and badges involves several standard operations. Processes include sheet prep, lithography, screening, coating, punch press and inspection. All decoration is completed in the flat sheet with adhesive and tooling operations following. The possibilities for creating unique durable nameplates are endless. How will you create your brand identity? We can help!
Getting the Most Out of ScyllaDB Monitoring: ShareChat's TipsScyllaDB
ScyllaDB monitoring provides a lot of useful information. But sometimes it’s not easy to find the root of the problem if something is wrong or even estimate the remaining capacity by the load on the cluster. This talk shares our team's practical tips on: 1) How to find the root of the problem by metrics if ScyllaDB is slow 2) How to interpret the load and plan capacity for the future 3) Compaction strategies and how to choose the right one 4) Important metrics which aren’t available in the default monitoring setup.
What is an RPA CoE? Session 1 – CoE VisionDianaGray10
In the first session, we will review the organization's vision and how this has an impact on the COE Structure.
Topics covered:
• The role of a steering committee
• How do the organization’s priorities determine CoE Structure?
Speaker:
Chris Bolin, Senior Intelligent Automation Architect Anika Systems
LF Energy Webinar: Carbon Data Specifications: Mechanisms to Improve Data Acc...DanBrown980551
This LF Energy webinar took place June 20, 2024. It featured:
-Alex Thornton, LF Energy
-Hallie Cramer, Google
-Daniel Roesler, UtilityAPI
-Henry Richardson, WattTime
In response to the urgency and scale required to effectively address climate change, open source solutions offer significant potential for driving innovation and progress. Currently, there is a growing demand for standardization and interoperability in energy data and modeling. Open source standards and specifications within the energy sector can also alleviate challenges associated with data fragmentation, transparency, and accessibility. At the same time, it is crucial to consider privacy and security concerns throughout the development of open source platforms.
This webinar will delve into the motivations behind establishing LF Energy’s Carbon Data Specification Consortium. It will provide an overview of the draft specifications and the ongoing progress made by the respective working groups.
Three primary specifications will be discussed:
-Discovery and client registration, emphasizing transparent processes and secure and private access
-Customer data, centering around customer tariffs, bills, energy usage, and full consumption disclosure
-Power systems data, focusing on grid data, inclusive of transmission and distribution networks, generation, intergrid power flows, and market settlement data
Connector Corner: Seamlessly power UiPath Apps, GenAI with prebuilt connectorsDianaGray10
Join us to learn how UiPath Apps can directly and easily interact with prebuilt connectors via Integration Service--including Salesforce, ServiceNow, Open GenAI, and more.
The best part is you can achieve this without building a custom workflow! Say goodbye to the hassle of using separate automations to call APIs. By seamlessly integrating within App Studio, you can now easily streamline your workflow, while gaining direct access to our Connector Catalog of popular applications.
We’ll discuss and demo the benefits of UiPath Apps and connectors including:
Creating a compelling user experience for any software, without the limitations of APIs.
Accelerating the app creation process, saving time and effort
Enjoying high-performance CRUD (create, read, update, delete) operations, for
seamless data management.
Speakers:
Russell Alfeche, Technology Leader, RPA at qBotic and UiPath MVP
Charlie Greenberg, host
Northern Engraving | Modern Metal Trim, Nameplates and Appliance PanelsNorthern Engraving
What began over 115 years ago as a supplier of precision gauges to the automotive industry has evolved into being an industry leader in the manufacture of product branding, automotive cockpit trim and decorative appliance trim. Value-added services include in-house Design, Engineering, Program Management, Test Lab and Tool Shops.
AppSec PNW: Android and iOS Application Security with MobSFAjin Abraham
Mobile Security Framework - MobSF is a free and open source automated mobile application security testing environment designed to help security engineers, researchers, developers, and penetration testers to identify security vulnerabilities, malicious behaviours and privacy concerns in mobile applications using static and dynamic analysis. It supports all the popular mobile application binaries and source code formats built for Android and iOS devices. In addition to automated security assessment, it also offers an interactive testing environment to build and execute scenario based test/fuzz cases against the application.
This talk covers:
Using MobSF for static analysis of mobile applications.
Interactive dynamic security assessment of Android and iOS applications.
Solving Mobile app CTF challenges.
Reverse engineering and runtime analysis of Mobile malware.
How to shift left and integrate MobSF/mobsfscan SAST and DAST in your build pipeline.
Introducing BoxLang : A new JVM language for productivity and modularity!Ortus Solutions, Corp
Just like life, our code must adapt to the ever changing world we live in. From one day coding for the web, to the next for our tablets or APIs or for running serverless applications. Multi-runtime development is the future of coding, the future is to be dynamic. Let us introduce you to BoxLang.
Dynamic. Modular. Productive.
BoxLang redefines development with its dynamic nature, empowering developers to craft expressive and functional code effortlessly. Its modular architecture prioritizes flexibility, allowing for seamless integration into existing ecosystems.
Interoperability at its Core
With 100% interoperability with Java, BoxLang seamlessly bridges the gap between traditional and modern development paradigms, unlocking new possibilities for innovation and collaboration.
Multi-Runtime
From the tiny 2m operating system binary to running on our pure Java web server, CommandBox, Jakarta EE, AWS Lambda, Microsoft Functions, Web Assembly, Android and more. BoxLang has been designed to enhance and adapt according to it's runnable runtime.
The Fusion of Modernity and Tradition
Experience the fusion of modern features inspired by CFML, Node, Ruby, Kotlin, Java, and Clojure, combined with the familiarity of Java bytecode compilation, making BoxLang a language of choice for forward-thinking developers.
Empowering Transition with Transpiler Support
Transitioning from CFML to BoxLang is seamless with our JIT transpiler, facilitating smooth migration and preserving existing code investments.
Unlocking Creativity with IDE Tools
Unleash your creativity with powerful IDE tools tailored for BoxLang, providing an intuitive development experience and streamlining your workflow. Join us as we embark on a journey to redefine JVM development. Welcome to the era of BoxLang.
In our second session, we shall learn all about the main features and fundamentals of UiPath Studio that enable us to use the building blocks for any automation project.
📕 Detailed agenda:
Variables and Datatypes
Workflow Layouts
Arguments
Control Flows and Loops
Conditional Statements
💻 Extra training through UiPath Academy:
Variables, Constants, and Arguments in Studio
Control Flow in Studio
MySQL InnoDB Storage Engine: Deep Dive - MydbopsMydbops
This presentation, titled "MySQL - InnoDB" and delivered by Mayank Prasad at the Mydbops Open Source Database Meetup 16 on June 8th, 2024, covers dynamic configuration of REDO logs and instant ADD/DROP columns in InnoDB.
This presentation dives deep into the world of InnoDB, exploring two ground-breaking features introduced in MySQL 8.0:
• Dynamic Configuration of REDO Logs: Enhance your database's performance and flexibility with on-the-fly adjustments to REDO log capacity. Unleash the power of the snake metaphor to visualize how InnoDB manages REDO log files.
• Instant ADD/DROP Columns: Say goodbye to costly table rebuilds! This presentation unveils how InnoDB now enables seamless addition and removal of columns without compromising data integrity or incurring downtime.
Key Learnings:
• Grasp the concept of REDO logs and their significance in InnoDB's transaction management.
• Discover the advantages of dynamic REDO log configuration and how to leverage it for optimal performance.
• Understand the inner workings of instant ADD/DROP columns and their impact on database operations.
• Gain valuable insights into the row versioning mechanism that empowers instant column modifications.
How information systems are built or acquired puts information, which is what they should be about, in a secondary place. Our language adapted accordingly, and we no longer talk about information systems but applications. Applications evolved in a way to break data into diverse fragments, tightly coupled with applications and expensive to integrate. The result is technical debt, which is re-paid by taking even bigger "loans", resulting in an ever-increasing technical debt. Software engineering and procurement practices work in sync with market forces to maintain this trend. This talk demonstrates how natural this situation is. The question is: can something be done to reverse the trend?
"Choosing proper type of scaling", Olena SyrotaFwdays
Imagine an IoT processing system that is already quite mature and production-ready and for which client coverage is growing and scaling and performance aspects are life and death questions. The system has Redis, MongoDB, and stream processing based on ksqldb. In this talk, firstly, we will analyze scaling approaches and then select the proper ones for our system.
This talk will cover ScyllaDB Architecture from the cluster-level view and zoom in on data distribution and internal node architecture. In the process, we will learn the secret sauce used to get ScyllaDB's high availability and superior performance. We will also touch on the upcoming changes to ScyllaDB architecture, moving to strongly consistent metadata and tablets.
QA or the Highway - Component Testing: Bridging the gap between frontend appl...zjhamm304
These are the slides for the presentation, "Component Testing: Bridging the gap between frontend applications" that was presented at QA or the Highway 2024 in Columbus, OH by Zachary Hamm.