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To whom itmay concern:
I am a new graduateof Boise State University.My leadership experiences
throughout my education have prepared me well for your position.
I most recently interned with HP Inc.on the ASIC design team for LE printers in
Boise, Id.During my internship I designed an adapter board,using Cadence, which
is designed to interfacewith a testing tool used throughout the Boisesite. My
intern work experience has presented me with the great opportunity of working
with many diversegroups such as the ASIC, formatter, layout,mechanical
engineering, and procurement teams. Interactingwith them towards a common
goal was a joy.
Additionally,as projectmanager,I led my sponsored,senior design,team through
the project's successes as well as thecommunication and personality challenges
that occurred. My project heavily used embedded systems with wireless sensors to
control customized vent dampers that efficiently manages a home owners HVAC
system. Technical failureanalysisplayed a vital partin understandingchallenges
and learningfrom the team’s mistakes.
In addition to workingat HP my classes haveprepared me for a broad spectrum of
possibleEEinterests rangingfrom embedded systems,ASIC design,power system
analysis,and semiconductor devices.I have successfully designed and debugged
two audio amplifier PCBboards duringmy senior year of college. This experience
was challengingbecauseof the amount of testing and debugging, but the
experience allowed me to grow in my capabilities of learning,researching,and
being detail oriented to my projects.
I valueintegrity and determination on teams and in the workplace.I believe that
members of your team and I will havean amazingworkingrelationship. I amready
to keep learningand to add to the innovation that makes the company so unique.
I respectfully ask for your consideration for employment. I also look forward to
discussingthis opportunity in detail.
Pleasecontactme at 208-284-4620.
Thank you for your time.
Sincerely,
Donny Lloyd
Donny Lloyd
> Electrical Engineering
Graduate
> Boise State University
11457 W Hickory Loop Dr
Boise, ID 83713
208-284-4620
richardlloyd@u.boisestate.edu

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Lloyd_cover_gen

  • 1. To whom itmay concern: I am a new graduateof Boise State University.My leadership experiences throughout my education have prepared me well for your position. I most recently interned with HP Inc.on the ASIC design team for LE printers in Boise, Id.During my internship I designed an adapter board,using Cadence, which is designed to interfacewith a testing tool used throughout the Boisesite. My intern work experience has presented me with the great opportunity of working with many diversegroups such as the ASIC, formatter, layout,mechanical engineering, and procurement teams. Interactingwith them towards a common goal was a joy. Additionally,as projectmanager,I led my sponsored,senior design,team through the project's successes as well as thecommunication and personality challenges that occurred. My project heavily used embedded systems with wireless sensors to control customized vent dampers that efficiently manages a home owners HVAC system. Technical failureanalysisplayed a vital partin understandingchallenges and learningfrom the team’s mistakes. In addition to workingat HP my classes haveprepared me for a broad spectrum of possibleEEinterests rangingfrom embedded systems,ASIC design,power system analysis,and semiconductor devices.I have successfully designed and debugged two audio amplifier PCBboards duringmy senior year of college. This experience was challengingbecauseof the amount of testing and debugging, but the experience allowed me to grow in my capabilities of learning,researching,and being detail oriented to my projects. I valueintegrity and determination on teams and in the workplace.I believe that members of your team and I will havean amazingworkingrelationship. I amready to keep learningand to add to the innovation that makes the company so unique. I respectfully ask for your consideration for employment. I also look forward to discussingthis opportunity in detail. Pleasecontactme at 208-284-4620. Thank you for your time. Sincerely, Donny Lloyd Donny Lloyd > Electrical Engineering Graduate > Boise State University 11457 W Hickory Loop Dr Boise, ID 83713 208-284-4620 richardlloyd@u.boisestate.edu