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© 2010 IBM Corporation
IBM Power Systems
IBM Power Systems
Surabaya Indonesia
15 April 2011
by Saiful Bahri (saiful@my.ibm.com)
Power Systems – ASEAN Techline
techline@my.ibm.com
© 2011 IBM Corporation
IBM Power Systems
2
Agenda
OBJECTIVE
POWER Technology Update
• Intro to POWER Technology
• POWER7 Product Offerings and Features
Virtualization and High Availability
• PowerVM
• PowerHA clustering
Operating Systems
• AIX and IBM I and Linux
© 2011 IBM Corporation
IBM Power Systems
3
Objective
 Information on how techline can be utilized by BPs
 Understand the current Power System product portfolio
 Understand the PowerVM offering for virtualization
 Configuration of Power server with eConfig tool
 Available tool/material available for Power server - tvdemo
 Product Certification target for Power server pre-sales and sellers
© 2011 IBM Corporation
IBM Power Systems
4
Introduction to POWER
Systems(previously known as RS/6000,
pSeries and System p)
© 2011 IBM Corporation
IBM Power Systems
5
5
20 Years of IBM RISC Technology Leadership
POWER6
POWER5
POWER4
RS64
POWER3
PowerPC
RISC
POWER
1990 2010
Performance Leadership
Reliability / Availability / Serviceability
Commercial & Technical Workloads
Virtualization Technologies
POWER7
© 2011 IBM Corporation
IBM Power Systems
6
Processor Technology Roadmap
2001
 Dual Core
 Chip Multi Processing
 Distributed Switch
 Shared L2
 Dynamic LPARs (32)
2004
 Dual Core
 Enhanced Scaling
 SMT
 Distributed Switch +
 Core Parallelism +
 FP Performance +
 Memory bandwidth +
 Virtualization
2007
 Dual Core
 High Frequencies
 Virtualization +
 Memory Subsystem +
 Altivec
 Instruction Retry
 Dyn Energy Mgmt
 SMT +
 Protection Keys
2010
 Multi Core
 On-Chip eDRAM
 Power Optimized Cores
 Mem Subsystem ++
 SMT++
 Reliability +
 VSM & VSX (AltiVec)
 Protection Keys+
POWER8
 Concept Phase
POWER4
180 nm
POWER5
130 nm
POWER6
65 nm
POWER7
45 nm
© 2011 IBM Corporation
IBM Power Systems
7
Watson
 IBM Research built a computer system able to compete with humans at the game of Jeopardy:
Human vs. Machine contest.
 Code-named “Watson,” Computer is designed to rival the human mind
 Answering questions in the Jeopardy! format poses a grand challenge in computer science:
– Broad range of topics , such as history, literature, politics, popular culture and science
– Nature of the clues, requires analyzing subtle meaning, irony, riddles and other complexities
 Based on the science of Question Answering (QA), differs from conventional search
 Critical for implementing useful business applications such as:
– Customer relationship management
– Regulatory compliance
– Help desk support
 Watson and Workload Optimized Systems
 Watson’s success in the Jeopardy! challenge is inspiring a new era of optimized systems design. Based on commercially
available IBM Power® 750 servers, Watson’s advances in deep analytics and its ability to process unstructured data and
interpret natural language will now be tailored to fit the requirements of new solutions in science, healthcare, financial services
and other industries. Download the white paper and read more about Watson and workload optimized system design.
© 2011 IBM Corporation
IBM Power Systems
8
✓4, 6 or 8 cores per socket
✓3.0 to 4.14 GHz
✓Up to 4 threads per core
✓Integrated eDRAM L3 Cache
✓Dynamic Energy Optimization
© 2011 IBM Corporation
IBM Power Systems
9
POWER6
Memory+
GX+
Bridge
Memory+
GX Bus Cntrl
Memory
Cntrl
Memory
Cntrl
Fabric Bus
Controller
Core
Alti
Vec
L3
Ctrl L3
L3
Ctrl
L3
Core
Alti
Vec
4 MB
L2
4 MB
L2
Core
L2
Core
L2
Memory Interface
Core
L2
Core
L2
Core
L2
Core
L2
Core
L2
Core
L2
G
X
S
M
P
F
A
B
R
I
C
P
O
W
E
R
B
U
S
POWER7
Memory++
L3 Cache
© 2011 IBM Corporation
IBM Power Systems
10
POWER7 Core
64-bit PowerPC architecture v2.07
Execution Units
• 2 Fixed Point Units
• 2 Load Store Units
• 4 Double Precision Floating Point Units
• 1 Branch
• 1 Condition Register
• 1 Vector Unit
• 1 Decimal Floating Point Unit
• 6 Wide Dispatch
• Units include distributed Recovery Function
Out of Order Execution
Modes: POWER6, POWER6+ and POWER7
L2 Cache
IFU
CRU/BRU
ISU
DFU
FXU
VSX
FPU
LSU
 POWER7 continues to support VMX / Extends SIMD support with VSX
– 2 VSX units that can each handle 2 Double-Precision FP instructions
– 8 FLOPS per cycles
– VSX units can also handle 4 Single Precision instructions per cycle
– VSX instruction set support for vector and scalar instructions
© 2011 IBM Corporation
IBM Power Systems
11
11
Performance per Core Moves Up with POWER7
…up to 1.6X improvement over POWER6
…up to 2X improvement over POWER5+
rPerf performance estimate for fully configured 64-way systems divided by number of cores
© 2011 IBM Corporation
IBM Power Systems
12
More TPC-C performance per core than any system in the industry
POWER5 POWER6 POWER7
HP Itanium2
Sun/Oracle T2+
Best results listed for IBM POWER, HP, and Sun/Oracle systems over 1M tpmC.
Source: http://www.tpc.org as of 4/1/08. See Power 780 benchmark details for specific results.
K tpmC
per core
2X
3X
4.6X
4.6 to 7.5 times more
performance per core
than HP Itanium and Sun Enterprise T5440 cluster
respectively
Power 780
with DB2
© 2011 IBM Corporation
IBM Power Systems
13
More SAP performance than any system in the industry
20% more performance … one-fourth the number of cores vs. Sun M9000
SAP
Users
Sun T5440
SPARC
4/32/256
Power 750
POWER
4/32/128
Sun X4640
Opteron
4/48/48
Fujitsu 1800E
Nehalem-EX
8/64/128
Power 780
POWER
8/64/256
Sun M9000
SPARC
32/128/256
Sun M9000
SPARC
64/256/512
4 sockets 8 sockets 32 sockets 64 sockets
37,000
SAP users on SAP SD 2 Tier
Power 780
Overall
4-socket
© 2011 IBM Corporation
IBM Power Systems
14
Operating Systems
Power Systems Portfolio
Major Features:
 Modular systems with linear scalability
 PowerVM™ Virtualization
 Physical and Virtual Management
 Roadmap to Continuous Availability
 Binary Compatibility
 Energy / Thermal Management
Power 755
Power 750
Power 710,
720, 730,
740
Power
795
520
Power 770
Power 780
BladeCenter
PS700 / PS701 / PS702
575
550
570
JS23,
JS43
595
© 2011 IBM Corporation
IBM Power Systems
15
POWER7 Systems Technology Value…
 Technology
–Roadmap
–Processor Instruction Retry
–Green Technology built in
–Common architecture from Blades to High-end
 Performance
–Power Systems scalability from blades to high end systems
–Performance leadership in a variety of workloads
–Best Performance per core
–Memory and IO bandwidth
 Virtualization
–Consolidate to higher levels
–Virtualize Processors, Memory, and I/O
–Dynamic movement of Partitions and Applications
–Reduce infrastructure costs
 RAS
–Power Systems mainframe inspired RAS features
–Hot Add support / Concurrent Maintenance
–Alternate Process Recovery
–Operating Systems Availability Leadership
Hypervisor
Virt I/O Server
Shared I/O
Single SMP Hardware System
0
100
200
300
400
500
600
700
PS700 PS701 PS702 520 750 570/16 570/32 770 780 595
© 2011 IBM Corporation
IBM Power Systems
16
IBM AIX 5.3, 6.1, 7.1
AIX 6 Editions for entry to enterprise servers &
workload consolidation
AIX 7 able to exploit 1024 POWER7 threads, and
support AIX 5.2 WPARs
IBM i for Business
Linux on Power
POWER7 support for RHEL 5.5 & 6, SLES 10 & 11
plus PowerVM Lx86 performance optimized for x86 server
consolidation
All 3 operating environments available with POWER7
IBM i 7.1 features XML in DB2, automatic workload
optimization with SSDs, Rational Open Access: RPG
Edition and much more
*All statements regarding IBM's future direction and intent are subject to change or withdrawal without notice, and
represent goals and objectives only. Some features require the purchase of additional software components.
© 2011 IBM Corporation
IBM Power Systems
17
AIX
Release/TL
Max Cores
& Threads Supported
POWER6
Mode
POWER7
Mode
AIX 5.3
(TL9,10,11
Supported
64 / 128 N/A
AIX 6.1 TL2,
TL3
64 / 128 N/A
AIX 6.1 TL4 64 / 128 64 / 256
AIX 6.1 TL5 64 / 128 64 / 256
AIX 7.1 64 / 128 256 / 1024
POWER7 Modes: IBM i and AIX®
IBM i
Release
Max Cores
& Threads Supported
POWER6
Mode
POWER7
Mode
IBM i 6.1 32 / 64 32 / 128
Special
Support
64/128 32 / 128
IBM i 7.1 32 / 64 32 / 128
Special
Support
64/128 64 / 256
© 2011 IBM Corporation
IBM Power Systems
18
Linux
Max Processors
& Threads Supported
POWER6 Mode POWER7 Mode
RHEL 5.5 and newer 64 / 128 N/A
SLES 10 SP#3 and newer 64 / 128 N/A
SLES 11 ( All Service Packs) 64 / 128 256 / 1024
RHEL 6 (Next major RHEL version) 64 / 128 256 / 1024
POWER7 Modes: Linux®
© 2011 IBM Corporation
IBM Power Systems
19
Core
L2
Core
L2
Memory Interface
Core
L2
Core
L2
Core
L2
Core
L2
Core
L2
Core
L2
G
X
S
M
P
F
A
B
R
I
C
P
O
W
E
R
B
U
S
32 MB
L3 Cache
POWER7 TurboCore™ Mode
 TurboCore Chips: 4 available cores
 Aggregation of L3 Caches of unused cores.
 TurboCore chips have a 2X the L3 Cache per
Chip available
–4 TurboCore Chips L3 = 32 MB
 Performance gain over POWER6.
–Provides up to 1.5X per core to core
 Chips run at higher frequency:
–Power reduction of unused cores.
 With “Reboot”, System can be reconfigured to 8
core mode.
–ASM Menus
Unused
Core
TurboCores
POWER7 Chip
Power 780/795 TurboCore
Chip
© 2011 IBM Corporation
IBM Power Systems
20
POWER7 Offerings…
Power 710, 720, 730, 740
Power 750 Express
Power 755
PS700 Express
PS701 Express
PS702 Express Power 770
Power 780
Power 795
© 2011 IBM Corporation
IBM Power Systems
21
POWER7
Model 750
BladeCenter
PS700 Express
© 2011 IBM Corporation
IBM Power Systems
22
POWER7 PS700 Blade 4 Cores
Fiber Support Yes (via BladeCenter chassis)
Media Bays 1 BladeCenter chassis
Redundant Power Yes BladeCenter chassis
Redundant Cooling Yes BladeCenter chassis
Service Processor Yes
Power & Thermal POWER Save / Power Cap
Architecture 4 Core Single Socket
L2 & L3 Cache On Chip
DDR3 Memory Up to 64 GB
DASD / Bays 0 - 2 SAS (300/600GB)
Daughter Card
Options
CIOv & CFFh
( PCIe Adapters )
Integrated
Options
Dual Port Gbt Ethernet
Ethernet, USB
© 2011 IBM Corporation
IBM Power Systems
23
PS700 Layout
POWER7
4 Cores @ 3.0 GHz
Buffer
Chip
Buffer
Chip
4 DIMMs
4 DIMMs
IO Hub
FSP
CFFh
SAS SFF HDD
300 / 600 GB
SAS SFF HDD
300 / 600 GB
VPD
CIOv
SAS
Cntrl
Power
IO / Network
Power
IO / Network
© 2011 IBM Corporation
IBM Power Systems
24
Functional Differences
POWER6 Blade PS700 Blades
Up to 4 Cores (Dual Socket) 4 Cores (Single Socket)
Up to 64 GB Memory
8 DIMM slots
Up to 64 GB Memory
8 / 16 DIMM slots
DDR2 Memory DDR3 Memory
0 - 1 SFF SAS DASD / SSD 0-2 SFF SAS DASD
2 PCIe slots 2 PCIe slots
IVE: Dual Gbt
Optional: Quad Gbt, ot 10 Gbt
IVE: Dual Gbt
Optional: Dual 10 Gbt
TPMD Enhanced TPMD
Guiding Light Light Path
© 2011 IBM Corporation
IBM Power Systems
25
POWER7
Model 750
BladeCenter
PS701 Express
© 2011 IBM Corporation
IBM Power Systems
26
POWER7 PS701 Blade 8 Cores
Fiber Support Yes (via BladeCenter chassis)
Media Bays 1 BladeCenter chassis
Redundant Power Yes BladeCenter chassis
Redundant Cooling Yes BladeCenter chassis
Service Processor Yes
Power & Thermal POWER Save / Power Cap
Architecture 8 Core Single Socket
L2 & L3 Cache On Chip
DDR3 Memory Up to 128 GB
DASD / Bays 0 - 1 SAS (300/600GB)
Daughter Card
Options
CIOv & CFFh
( PCIe Adapters )
Integrated
Options
Dual Port Gbt Ethernet
Ethernet, USB
© 2011 IBM Corporation
IBM Power Systems
27
PS701 Layout SAS
Cntrl
POWER7
8 Cores @ 3.0 GHz
Buffer
Chip
Buffer
Chip
8 DIMMs
Buffer
Chip
Buffer
Chip
8 DIMMs
IO Hub
SMP
Interconnect
CFFh
SAS SFF HDD
300 / 600 GB
Power
IO / Network
CIOv
Power
IO / Network
VPD
FSP
© 2011 IBM Corporation
IBM Power Systems
28
Functional Differences
POWER6 Blade PS701 Blades
Up to 4 Cores (Dual Socket) 8 Cores (Single Socket)
Up to 64 GB Memory
8 DIMM slots
Up to 128 GB Memory
8 / 16 DIMM slots
DDR2 Memory DDR3 Memory
0 - 1 SFF SAS DASD / SSD 0-1 SFF SAS DASD
2 PCIe slots 2 PCIe slots
IVE: Dual Gbt
Optional: Quad Gbt, ot 10 Gbt
IVE: Dual Gbt
Optional: Dual 10 Gbt
TPMD Enhanced TPMD
Guiding Light Light Path
© 2011 IBM Corporation
IBM Power Systems
29
POWER7
Model 750
BladeCenter
PS702 Express
© 2011 IBM Corporation
IBM Power Systems
30
POWER7 PS702 Blade 16 Cores
Fiber Support Yes (via BladeCenter chassis)
Media Bays 1 BladeCenter chassis
Redundant Power Yes BladeCenter chassis
Redundant
Cooling
Yes BladeCenter chassis
Service Processor Yes
Power & Thermal POWER Save / Power Cap
Architecture 8 Cores/Socket Two Socket
L2 & L3 Cache On Chip
DDR3 Memory Up to 256 GB
DASD / Bays 0 - 2 SAS (300/600GB)
Daughter Card
Options
CIOv & CFFh
( PCIe Adapters )
Integrated
Options
Quad Port Gbt Ethernet
Ethernet, USB
© 2011 IBM Corporation
IBM Power Systems
31
PS702 Layout
POWER7
8 Cores @ 3.0 GHz
Buffer
Chip
Buffer
Chip
8 DIMMs
Buffer
Chip
Buffer
Chip
8 DIMMs
IO Hub
SMP
Interconnect
CFFh
SAS SFF HDD
300 / 600 GB
Power
IO / Network
CIOv
Power
IO / Network
© 2011 IBM Corporation
IBM Power Systems
32
Functional Differences
POWER6 Blade PS702 Blades
Up to 8 Cores (Dual Socket) 16 Cores (Dual Socket)
Up to 128 GB Memory
8 DIMM slots
Up to 256 GB Memory
32 DIMM slots
DDR2 Memory DDR3 Memory
0 - 2 SFF SAS DASD / SSD 0- 2 SFF SAS DASD
4 PCIe slots 4 PCIe slots
IVE: Dual Gbt
Optional: Quad Gbt, ot 10 Gbt
IVE: Quad Gbt
Optional: Dual 10 Gbt
TPMD Enhanced TPMD
Guiding Light Light Path
© 2011 IBM Corporation
IBM Power Systems
33
Operating System Support
Installing the AIX operating system (one of these):
–AIX V5.3 with the 5300-12 Technology Level, or later
AIX V6.1 with the 6100-05 Technology Level, or later
Installing the IBM i operating system:
–IBM i 6.1 with i 6.1.1 machine code, or later
–IBM i 7.1, or later
Installing VIOS:
–VIOS 2.1.3.0, or later
–VIOS is required with the IBM i operating system
Installing the Linux operating system (one of these):
–SUSE Linux Enterprise Server 10 Service Pack 3 for POWER , or later with current
maintenance updates available from Novell to enable all planned functionality
Red Hat Enterprise Linux 5.5 for POWER, or later
IBM Systems Director 6.2
© 2011 IBM Corporation
IBM Power Systems
34
PS700 PS701 PS702
Architecture
POWER7
4-Core (1 Socket x 4 Cores / Blade)
Single Wide
POWER7
8-core (1 Socket x 8 Cores / Blade)
Single Wide
POWER7
16-core (1 Socket x 8 Cores / Blade)
Double Wide
Memory
4GB to 64GB DDR3 (Chipkill)
4GB@1066MHz, 8GB@800MHz
4GB to 128GB DDR3 (Chipkill)
4GB@1066MHz, 8GB@800MHz
4GB to 256GB DDR3 (Chipkill)
4GB@1066MHz, 8GB@800MHz
DASD / Bays 0-2 SAS disk 0-1 SAS disk 0-2 SAS disk
Expansion Card Slots
1 PCI-E CIOv Expansion Card
1 PCI-E CFFh ExpansionCard
1 PCI-E CIOv Expansion Card
1 PCI-E CFFh ExpansionCard
2 PCI-E CIOv Expansion Card
2 PCI-E CFFh ExpansionCard
Integrated Features
Keyboard, Video and Mouse
Dual Port 1Gb Ethernet
SAS Controller
USB
Keyboard, Video and Mouse
Dual Port 1Gb Ethernet
SAS Controller
USB
Keyboard, Video and Mouse
Quad Port 1Gb Ethernet
SAS Controller
USB
Scalability Support No Yes – Factory or Customer Upgrade Yes – Factory or Customer Upgrade
Fiber Support Yes (via BladeCenter) Yes (via BladeCenter) Yes (via BladeCenter)
Redundant Power Yes (via BladeCenter) Yes (via BladeCenter) Yes (via BladeCenter)
Redundant Cooling Yes (via BladeCenter) Yes (via BladeCenter) Yes (via BladeCenter)
Service Processor FSP1 (IPMI, SOL) FSP1 (IPMI, SOL) FSP1 (IPMI, SOL)
Virtualization IBM PowerVM IBM PowerVM IBM PowerVM
Systems Management
IBM Director 6.2 and CSM
IBM EnergyScale Technology
IBM Director 6..2 and CSM
IBM EnergyScale Technology
IBM Director 6.2 and CSM
IBM EnergyScale Technology
OS Support AIX, i, Linux AIX, i, Linux AIX, i, Linux
BladeCenter Chassis
Support BCE, BCH*, BCHT, BCS* BCH*, BCHT, BCS* BCH*, BCHT, BCS*
BladeCenter PS Blades
© 2011 IBM Corporation
IBM Power Systems
35
Performance Comparisons
0
20
40
60
80
100
120
140
160
POWER6 POWER7
4 Core 8 Core 16 Core
JS23 JS43 PS700 PS701 PS702
© 2011 IBM Corporation
IBM Power Systems
36
Performance Comparisons
0
20
40
60
80
100
120
140
160
Single Wide Double Wide
JS23 JS43
PS700
PS701 PS702
© 2011 IBM Corporation
IBM Power Systems
37
Power 720 / 740
© 2011 IBM Corporation
IBM Power Systems
38
POWER7 720 / 740 4U Server
Size: 4U
Power 720 Power 740
Architecture
4 / 6 / 8 Cores
Up to 8 Core
Single Socket
4 / 6 / 8 Cores
Up to 16 Core
Single or Dual Socket
(Upgradeable)
Upgrade
Memory
Dual SAS Cntrl / RAID
PCIe Slots
Cores & Memory
Dual SAS Cntrl / RAID
PCIe Slots
DDR3 Memory
4GB or 8GB DIMMs
8GB to 128GB
4GB or 8GB DIMMs
8GB to 256GB
DASD / Bays
Up to 6 or 8 SFF or SSD
Optional RAID
Expansion
PCIe: 4 Full slots
Opt. 4 Low Profile Slots
GX Bus: 2 Slots
PCIe Gen2 Yes
Integrated SAS/SATA Yes / Dual SAS Split Bkpl or RAID (Optional)
Integrated Ports 3 USB, 2 Serial, 2 HMC
Integrated Virtual
Ethernet
Quad 10/100/1000
Optional: Dual 10Gbt
Media Bays 1 Slim-line & 1 Half Height
Remote IO Drawers Yes / T19 = 4 / 2 Max
Virt Management IVM & HMC
Redundant Power and
Cooling
Yes ( Power Optional )
EnergyScale TPMD
© 2011 IBM Corporation
IBM Power Systems
39
Power 720 / 740 Processor Options
 Power 720
 4-core 3.0 GHz POWER7 Module
 6-core 3.0 GHz POWER7 Module
 8 core 3.0 GHz POWER7 Module
 Power 740
 1 or 2 x 4-core 3.3 GHz POWER7 Module
 1 or 2 x 4-core 3.7 GHz POWER7 Module
 1 or 2 x 6-core 3.7 GHz POWER7 Module
 2 x 8-core 3.55 GHz POWER7 Module
© 2011 IBM Corporation
IBM Power Systems
40
Power 740 Expansion Options
Processor Expansion:
– Add 2nd POWER7 Module
Memory Expansion:
– Add up to 3 additional memory cards
IO Controller Expansion
– Second SAS Controller
IO Expansion
– Internal PCIe expansion: Four additional PCIe slots
Remote IO Expansion
– Up to four PCIe Express drawers
– Up to eight PCI-X drawers
© 2011 IBM Corporation
IBM Power Systems
41
Front view Dual Socket System
Memory
Cards
6/ 8 SFF Bays & DVD
Fans
1 / 2
P7 Sockets
Fans
Tape
© 2011 IBM Corporation
IBM Power Systems
42
Rear view Dual Socket System
Dual
Power
Supplies
4 PCIe
Slots
IVE
Slot
Fans
Memory
Cards
GX Bus
GX Bus
Opt PCIe
Expansion
P7
Sockets
P7
Sockets
© 2011 IBM Corporation
IBM Power Systems
43
Power 720 / 740 Physical Specifications
 Dimensions:
– Width: 440 mm (19.0 in)
– Depth: 610 mm (24.0 in)
– Height: 177 mm (6.81 in)
– Weight: 48.7 kg (107.4 lb)
 Operating voltage:
– Power 720:100 to 127 or 200 to 240 V AC
– Power 740:200 to 240 V AC
 Maximum measured power consumption (Maximum):
– Power 720:750 watts
– Power 740:1400 watts
 Maximum measured BTU (Maximum):
– Power 720:2560
– Power 740:4778
 Power-source loading ( Maximum )
– Power 720:0.765kVa
– Power 740:1.428 kVa
– To obtain a heat output estimate based on a specific configuration:
http://www-912.ibm.com/see/EnergyEstimator
© 2011 IBM Corporation
IBM Power Systems
44
Power 740 (720) rear View
IVE
HMC
Ports
Serial
Ports
GX
Bus
GX
Bus
Power
Supplies
PCIe
Slots
POWER7
Socket
Memory
Cards
USB
© 2011 IBM Corporation
IBM Power Systems
45
Power 720 / 740 Rear View
PCIe Adapters
Power Supplies
Optional:
PCIe Adapters
HMC
Ports
IVE
Ports
Serial
Ports
S
l
o
t
5
S
l
o
t
6
S
l
o
t
7
S
l
o
t
8
S
l
o
t
1
S
l
o
t
2
S
l
o
t
3
S
l
o
t
4
GX
Bus
#2
GX Bus #1 or
PCIe Expan Riser
USB
Port
© 2011 IBM Corporation
IBM Power Systems
46
Power 720 / 740 PCIe Expansion Option
GX++
Connection
Slot #1
Located above the
Power Supplies
PCIe Expansion Option
Four Low Profile Slots
 Two options:
– 1. PCIe Gen1
– 2. PCIe Gen2 (Future)
© 2011 IBM Corporation
IBM Power Systems
47
POWER6 : POWER7 720 / 740
Performance
0
20
40
60
80
100
120
140
160
180
520 - 720/740 520 - 740
POWER6 POWER7
Single Socket Dual Socket
© 2011 IBM Corporation
IBM Power Systems
48
Power 710 / 730
© 2011 IBM Corporation
IBM Power Systems
49
Power 710 and 730
Size: 2U
Power 710 Power 730
Architecture
4 / 6 / 8 Cores
Up to 8 Core
Single Socket
4 / 6 / 8 Cores
Up to 16 Core
Dual Socket
Upgrade
RAID
Memory
RAID
Memory
DDR3 Memory
4GB or 8GB DIMMs
8GB to 64GB
4GB or 8GB DIMMs
8GB to 128GB
DASD / Bays
Up to 6 SFF or SSD
Optional RAID
Expansion
PCIe: 4 Low Profile slots
GX Bus: 2 Slots
Integrated
SAS/SATA Cntrl
Yes / RAID (Optional)
Integrated Ports 3 USB, 2 Serial, 2 HMC
Integrated Virtual
Ethernet
Quad 10/100/1000
Optional: Dual 10Gbt
Media Bays 1 Slim-line & 1 Half Height ( Optional )
Remote IO Drawers N / A
Virt Management IVM & HMC
Redundant Power
and Cooling
Yes ( Power Optional )
EnergyScale
TPMD
© 2011 IBM Corporation
IBM Power Systems
50
Power 730 / 710 Packaging Options
Six SFF bays
with Media
Three SFF bays
with Tape and Media
© 2011 IBM Corporation
IBM Power Systems
51
Power 710 / 730 Processor Options
 Power 710 ( Single Module ):
– 4-core 3.0 GHz POWER7 processor module
– 6-core 3.7 GHz POWER7 processor module
– 8-core 3.55 GHz POWER7 processor module
Power 730 ( Dual Modules ):
– 4-core 3.0 GHz POWER7 processor module
– 4-core 3.7 GHz POWER7 processor module
– 6-core 3.7 GHz POWER7 processor module
– 8-core 3.55 GHz POWER7 processor module
© 2011 IBM Corporation
IBM Power Systems
52
Power 710 / 730 Physical Specifications
 Dimensions:
– Width: 440 mm (19.0 in)
– Depth: 706 mm (27.8 in)
– Height: 89 mm (3.5 in)
– Weight Power 710: 28.2 kg (62 Ibs) Power 730: 29.5 kg (65 lbs)
 Operating voltage:
– Power 710:100 to 127 or 200 to 240 V AC
– Power 730:200 to 240 V AC
 Maximum measured power consumption (Maximum):
– Power 710:650 watts
– Power 730:1100 watts
 Maximum measured BTU (Maximum):
– Power 710:2218
– Power 730:3754
 Power-source loading ( Maximum )
– Power 710:0.663 kVa
– Power 730:1.122 kVa
– To obtain a heat output estimate based on a specific configuration.
http://www-912.ibm.com/see/EnergyEstimator
© 2011 IBM Corporation
IBM Power Systems
53
POWER7 730 / 710 System Layout
POWER7
Socket
Memory
Cards
Power
Supplies
Fans
Storage
Bays
PCIe
PCIe
PCIe
PCIe
GX Bus
Fans
GX Bus
HMC
IVE
Power 710
© 2011 IBM Corporation
IBM Power Systems
54
Power 710 (730) rear View
IVE
HMC
Ports
Serial
Ports
GX
Bus
GX
Bus
Power
Supplies
PCIe
Slots
POWER7
Socket
Memory
Cards
USB
Power 730
POWER7
Socket
Power 730
Memory
Cards
GX Buses do not support remote IO Drawers
© 2011 IBM Corporation
IBM Power Systems
55
POWER7
Model 750
Power 750
Express
© 2011 IBM Corporation
IBM Power Systems
56
Power 750 Express Product Features
Features of the Power 750: 8233-E8B…
–POWER7 processor with multiple cores
• 32-ways (8 cores/processor card x 4 processor cards)
–Industry Standard RDIMM, DDR3 1066 Mbps with enhanced memory RAS features including 64-
byte marking ECC code, and ChipKill detection and correction.
• 512 GB maximum (16GB/DIMM x 8 DIMMs/processor card x 4 processor cards)
–8 hot plug and front access SFF SAS DASD.
–1 slim media bay for DVD.
–1 half high bay for tape drive.
–Hot plug 3 PCIe slots and two PCIX slots with Enhanced Error Handling.
–One GX+ slot and one GX++ slot (not hot pluggable)
–Hot plug and redundant power.
–Hot plug and redundant cooling.
–Support for Logical Partitioning (LPAR) and Dynamic LPAR (DLPAR).
–Embedded SAS and SATA
–Embedded four 1 Gigabit Ethernet devices or two 10 Gigabit Ethernet devices
–Embedded USB
–Service Processor FSP-1 for enhanced reliability and remote system management
–Rack mountable drawer
56
© 2011 IBM Corporation
IBM Power Systems
57
Power 750 System 8233-E8B
POWER7 Architecture
6 Cores @ 3.3 GHz
8 Cores @ 3. 0, 3.3, 3.55 GHz
Max: 4 Sockets
DDR3 Memory Up to 512 GB
System Unit SAS SFF Bays
Up to 8 Drives (HDD or SSD)
73 / 146 / 300GB @ 15k (2.4 TB)
(Opt: cache & RAID-5/6)
System Unit
IO Expansion Slots
PCIe x8: 3 Slots (2 shared)
PCI-X DDR: 2 Slots
1 GX+ & Opt 1 GX++ 12X cards
Integrated SAS / SATA Yes
System Unit
Integrated Ports
3 USB, 2 Serial, 2 HMC
Integrated Virtual Ethernet
Quad 10/100/1000
Optional: Dual 10 Gb
System Unit Media Bays 1 Slim-line DVD & 1 Half Height
IO Drawers w/ PCI slots PCIe = 4 Max: PCI-X = 8 MAX
Cluster 12X SDR / DDR (IB technology)
Redundant Power and
Cooling
Yes (AC or DC Power)
Single phase 240 VAC or -48 VDC
Certification (SoD) NEBS / ETSI for harsh environments
Active Thermal Power Management
4U
Depth: 28.8”
© 2011 IBM Corporation
IBM Power Systems
58
Power 750 System Overview
8 SFF Bays
(Disk or SSD)
 Dual Power
 Supplies
Half-High Bay
(tape or removable disk  Up to 4
 Processor / Memory
Cards
 3 PCIe & 2 PCI-X
 Slots
 Fan
s
 TP
MD
DVD
© 2011 IBM Corporation
IBM Power Systems
59
59
Power
Supplies
Tape Drive
Remove DASD Bay
DVD Drive
Operator Panel
8 SFF DASD / SSD
Power 750 Front View
© 2011 IBM Corporation
IBM Power Systems
60
60
SAS Port
System
Port 1
System
Port 2
USB
Ports
HMC
Ports
IVE
Ethernet
PCIe
Slot 1
or
GX++ Slot
PCIe
Slot 2
or
GX+ Slot
PCIe
Slot 3
PCIX
Slot 5
PCIX
Slot 4
Power 750 Rear View
SPCN
© 2011 IBM Corporation
IBM Power Systems
61
Power 750 Internal USB Removable Disk Drive
Alternative to DLT, VXA, DAT72 or 8mm tape drives
–Faster than tape / 20MB/s Sustained Transfer Rate
–Lower total cost of ownership
• USB drives have longer life than tape cartridges
• No cleaning cartridges
• Inexpensive docking stations
AIX and Linux support
Capacities: 160GB and 500GB
USB 2.0
Designed for BACKUP and RESTORE type processes ONLY.
NOT designed to be used as a regular disk drive.
No compression, Data can be compressed by operating system and passed
to the USB RDD
61
© 2011 IBM Corporation
IBM Power Systems
62
Power 750 Information….
Physical Specifications:
–Width: 440 mm (17.3 in)
–Depth: 730.8 mm (28.8 in)
–Height: 173 mm (6.81 in)
–Weight: 48.63 kg (107 lb)
Operating voltage:
–200 to 240 V
Operating Frequency: 50/60 Hz
Power Consumption: 1950 watts (maximum)
Power Factor: 0.98
Thermal Output: 6655 Btu/hour (maximum)
Power-source Loading
–2.0 KVA (maximum configuration)
Noise Level and Sound
–Rack-mount drawer: 7.1 Bels operating
© 2011 IBM Corporation
IBM Power Systems
64
Power 750 vs Power 550 / 560
0
20
40
60
80
100
120
140
160
180
Power 750 Power 550 Power 560
0
10
20
30
40
50
60
70
Power 750 Power 550 Power 560
Performance* / KW Performance* / K BTU
* Calculated on rPerf, CPW results siimilar
© 2011 IBM Corporation
IBM Power Systems
65
Power 755
© 2011 IBM Corporation
IBM Power Systems
66
Power 755 HPC: 8236-E8C
 Power 755 / Power 750 Differences:
1. Only an 8-core 3.3GHz will be offered
2. Valid configuration is 32-core 3.3GHz (i.e. 4 processor cards).
3. No 16GB DIMM - Maximum memory is 256GB.
4. No IBM i O/S support
5. No PowerVM features (i.e. no LPAR or DLPAR)
6. No RAID feature
7. No Split Disk feature
8. No tape drive
9. No external I/O Drawers (e.g. PCIe 19 Drawers)
10. No IB 12x SDR adapter
66
© 2011 IBM Corporation
IBM Power Systems
67
5.3 / 6.1 RHEL / SLES
Power 755 4-Socket HPC System
8236-E8C
POWER7 Architecture
4 Processor Sockets = 32 Cores
8 Core @ 3.3 GHz
DDR3 Memory 128 GB / 256 GB, 32 DIMM Slots
System Unit
SAS SFF Bays
Up to 8 disk or SSD
73 / 146 / 300GB @ 15K (up to 2.4TB)
System Unit
Expansion
PCIe x8: 3 Slots (1 shared)
PCI-X DDR: 2 Slots
GX++ Bus
Integrated Ports 3 USB, 2 Serial, 2 HMC
Integrated Ethernet
Quad 1Gb Copper
(Opt: Dual 10Gb Copper or Fiber)
System Unit Media Bay 1 DVD-RAM ( No supported tape bay )
Cluster
Up to 64 nodes
Ethernet or IB-DDR
Redundant Power
Yes (AC or DC Power)
Single phase 240vac or -48 VDC
Certifications (SoD) NEBS / ETSI for harsh environments
EnergyScale
Active Thermal Power Management
Dynamic Energy Save & Capping
Up to 8.4 TFlops per Rack
( 10 nodes per Rack )
4U x 28.8” depth
© 2011 IBM Corporation
IBM Power Systems
68
1H / 2010
Scaling
64 nodes (32 Cores/node) 54
TFlops
Operating Systems
AIX 6.1 TL 04 / 05
Linux
HPC Stack Levels
xCAT v2.3.x
GPFS v3.3.x
PESSL v3.3.x
LL v4.1.x
PE v5.2.x
ESSL
Beta (GA 06/2010)
ESSL v5.1
Compilers
GA Levels
XLF v13.1
VAC/C++ v11.1
Power 755 HPC Cluster Node
IB-DDR
Interconnect
Data Center in a Rack
Up to 10 Nodes per Rack
© 2011 IBM Corporation
IBM Power Systems
69
Feature 755 750
Processors 32-core @ 3.3 GHz
32-core @ 3.55 GHz
6 / 12 / 18 / 24-core @ 3.3 GHz
8 / 16 / 24 / 32-core @ 3.0 GHz
Memory 128GB OR 256GB
4GB & 8GB DIMMS
512GB Max.
4GB, 8GB, 16GB DIMMS
GX slot support Yes – IB clustering Yes
I/O Drawer support No Yes
DASD Backplane No Split Backplane Split Backplane support
Integrated Ethernet Quad GbE or Dual 10GbE Quad GbE or Dual 10GbE
Virtualization No PowerVM support PowerVM Std and Ent
DASD / Bays
8 SFF SAS HDD / SDD
10k and 15K SFF drives
8 SFF SAS HDD / SDD
10k and 15K SFF drives
Optional RAID
Internal Tape No Yes
Performance Metric TFLOPS rPerf
Misc.
No IBM i Support
No H/W Raid Cards
IBM i Support
H/W Raid Cards
Power 755 vs. 750 Offering Structures
© 2011 IBM Corporation
IBM Power Systems
70
Power 770
Power 780
© 2011 IBM Corporation
IBM Power Systems
71
Power 770
Power 770
Processor Technology
6 Cores @ 3.55 GHz
8 Cores @ 3.1 GHz
L3 Cache On Chip
Redundant Power & Cooling Yes
Redundant Server Processor Yes / Two Enclosure minimum
Redundant Clock Yes / Two Enclosure minimum
Hot Add Support Yes
Hot Service Yes
System Unit Single Enclosure 4 Enclosures
Processors Up to 2 Sockets 8 Sockets
DDR3 Memory (Buffered) Up to 512 GB Up to 2 TB
SAS/SSD SFF Bays 6 24
DVD-RAM Media Bays 1 Slim-line 4 Slim-line
SAS / SATA Controller 2 / 1 8 / 4
PCIe bays 6 PCIe 24 PCIe
GX++ Slots (12X DDR) 2 8
Integrated Ethernet
Std: Quad 1Gb
Opt: Dual 10Gb + Dual 1
Gb
Std: Four Quad 1Gb
Opt: Four x Dual 10Gb + Dual 1
Gb
USB 3 12
12X I/O Drawers w/ PCI slots Max: 4 PCIe, 8 PCI-X Max: 16 PCIe, 32 PCI-X
Maint Coverage: 9 x 5
4U x 32 inches Depth
© 2011 IBM Corporation
IBM Power Systems
72
Power 780
Power 780
Processor Technology
4 Cores @ 4.1 GHz TurboCore
8 Cores @ 3.8 GHz
L3 Cache On Chip
Redundant Power & Cooling Yes
Redundant Server Processor Yes / Two Enclosure minimum
Redundant Clock Yes / Two Enclosure minimum
Hot Add Support Yes
Hot Service Yes
System Unit Single Enclosure 4 Enclosures
Processors 2 Sockets 8 Sockets
DDR3 Memory (Buffered) Up to 512 GB Up to 2 TB
SAS/SSD SFF Bays (CEC) 6 24
DVD-RAM Media Bays 1 Slim-line 4 Slim-line
SAS / SATA Controller 2 / 1 8 / 4
PCIe (CEC) 6 PCIe 24 PCIe
GX++ Slots (12X DDR) 2 8
Integrated Ethernet
Std: Quad 1Gb
Opt: Dual 10Gb + Dual 1
Gb
Std: Four Quad 1Gb
Opt: Four x Dual 10Gb + Dual 1
Gb
USB 3 12
12X I/O Drawers w/ PCI slots Max: 4 PCIe, 8 PCI-X Max: 16 PCIe, 32 PCI-X
Maint Coverage
24 X 7
PowerCare Support
© 2011 IBM Corporation
IBM Power Systems
73
POWER7
Processor
Chip
16 DIMM slots
PCIe
Slots
FSP
GX
Slots
6 SFF
Bays
POWER7
Processor
Chip
Interconnect
TPMD
POWER7 Modular Layout
© 2011 IBM Corporation
IBM Power Systems
74
POWER7 Modular Front View
Fabric
Interconnects
6 SFF Bays
DVD
Fans
Op Panel
© 2011 IBM Corporation
IBM Power Systems
75
POWER7 Modular Rear View
Two GX++ Bays
IVE
Ports
Two Power
Supplies
FSP
Connectors
HMC
Ports
P
C
I
e
P
C
I
e
P
C
I
e
P
C
I
e
P
C
I
e
P
C
I
e
SPCN
Ports
HMC
Ports
Serial
Port
USB
Ports
© 2011 IBM Corporation
IBM Power Systems
76
POWER7 Modular System View
Socket
Socket
Fan
Fan
Fan
Fan
Fan
PCIe Slot
PCIe Slot
PCIe Slot
PCIe Slot
PCIe Slot
PCIe Slot
FSP & Clock
Regulator
Memory DIMMs
Qty: 8
Memory DIMMs
Qty: 4
Memory DIMMs
Qty: 4
TPMD
Power
GX++ (12X)
SFF
16 DIMM cards
© 2011 IBM Corporation
IBM Power Systems
77
Serial Port
–Power 770 & Power 780 support one serial port in the rear of the system.
–Connector is a standard 9-pin male D-shell & it supports RS232 interface.
–Power 770 & Power 780 is a HMC managed system, this serial port is always OS
controlled and therefore available in any system configuration.
–It is support any serial device that has an OS Device Driver.
–The FSP virtual console will be on the HMC
–AIX and Linux use only, No IBM i
USB Controller
–USB controller is used to provide 3 USB ports.
• One on the operator panel in front and two in the rear.
–A stacked USB connector is used.
–There is no sharing of these USB ports with the FSP.
–The FSP has its own USB port located on the FSP card itself.
–AIX and Linux use only,
CEC I/O Ports
© 2011 IBM Corporation
IBM Power Systems
78
Power 770 / 780 Four CEC Configuration
© 2011 IBM Corporation
IBM Power Systems
79
CEC Enclosure 1
FSP/ Clock
CEC Enclosure 2
FSP/ Clock
CEC Enclosure 3
Drw to Drw
Connection
CEC Enclosure 4
Drw to Drw
Connection
Drw to Drw
Connection
Point to Point Cabling
 Three cables
Hot Drawer Add Support
Add cables to live systems
No disruptions
Hot Failover support
FSP
Clock
Concurrent Service Support
FSP Cabling Configuration ( Logical View )
Front
Rear
Drw to Drw
Connection
© 2011 IBM Corporation
IBM Power Systems
80
FSP 4 Enclosure Configuration
Enclosure 1
Enclosure 2
Enclosure 3
Enclosure 4
Cable 2
Cable 1
Cable 3
© 2011 IBM Corporation
IBM Power Systems
81
19-inch Rack Considerations
2
1
Cables wider than CEC
Multi-enclosure configurations
supported in IBM “Enterprise”
racks:
 IBM 7014-T00, -T42, #0551, #0553
 No problems with a front door
(regular or acoustic), but if use
rack trim, need new #6247 trim kit
© 2011 IBM Corporation
IBM Power Systems
82
SSD / DASD Support
Dual Split Backplane Mode
–SSDs supported
–No mixing of SSDs and HDDs with a split domain
–No mirroring between SSD drives and HDD drives
Triple Split Backplane Mode
–SSDs supported
–No mixing of SSDs and HDDs with a split domain
–No mirroring between SSD drives and HDD drives
RAID Internal Drives
–SSDs supported
–Can install both SSD and HDD in internal bays
• No mixing within a RAID array.
RAID Internal & #5886 EXP12S Disk Drawer
–Support only for HDD in this mode / No SSD support
–No support for RAID of external SSD drives using FC 1819 to connect to the
external DASD drawer.
© 2011 IBM Corporation
IBM Power Systems
83
POWER7 Modular Information….
 Physical Specifications (4 EIA units)
–Width: 483 mm (19.0 in.)
–Depth: 863 mm (32.0 in.)
–Height: 174 mm (6.85 in)
–Weight: 70.3 kg (155 lb)
 Operating voltage:
–200 to 240 V
 Operating Frequency: 50/60 Hz
 Power Consumption: 1600 watts (maximum)
–Per enclosure with 16 cores active
 Power Factor: 0.97
 Thermal Output: 5461 Btu/hour (maximum)
– Per enclosure with 16 cores active
 Power-source Loading
– 1.649 kva (maximum configuration)
 Noise Level and Sound
–One enclosure with 16 active cores:
• 6.8 bels / 6.3 bels with acoustic rack doors (operating/idle)
–Four enclosures with 64 active cores:
• 7.4 bels / 6.9 Bels with acoustic rack doors (operating/idle)
© 2011 IBM Corporation
IBM Power Systems
84
0
20
40
60
80
100
120
Power 780 Power 770 Power 570/32
0
5
10
15
20
25
30
35
Power 780 Power 770 Power 570/32
rPerf / KW rPerf / KBTU
Power 780/770 vs Power 570/32
© 2011 IBM Corporation
IBM Power Systems
85
rPerf Performance
0
100
200
300
400
500
600
700
Power 570/32 Power 595 Power 770 Power 780
© 2011 IBM Corporation
IBM Power Systems
86
Power 780 CPW Performance
0
20
40
60
80
100
120
140
160
180
8 Core 16 Core 32 Core
Power 570/32 Power 780
Estimated CPW values, not final. Final numbers will be available with announcement.
© 2011 IBM Corporation
IBM Power Systems
87
Power 795
© 2011 IBM Corporation
IBM Power Systems
88
POWER7 795
Power 795
Architecture
Up to 32 Sockets ( Max 256 Cores)
4 TurboCore / 8 Max Core & 6 Core
L2 & L3 Cache On Chip
DDR3 Memory Up to 8 TB
DASD / Bays
Remote I/O Drawer
( SAS / SSD )
Book Interconnect Point to Point
GX++ Bus
4 per System Book
Max: 32 ( 8 Nodes )
Media Bays Media drawer
Remote IO Drawers 1 – 32 drawers
LPARs Up to 254
Redundant
Power & Cooling
Yes
Hot Maintenance Yes
Cooling Air
Redundant Clock Yes
Power / Thermal (TPMD)
Advanced Energy Scale
Optional DC power
© 2011 IBM Corporation
IBM Power Systems
89
32
32
32
32
32
32
32
32
24
24
24
24
24
24
24
24
16
16
16
16
16
16
16
16
Power 795 Processor Core Options
 256 Cores / 32 Core Books
 MaxCore Chips ( 8 Cores)
 @ 4.0 GHz
 192 Cores / 24 Core Books
 6 Core Chips
 @ 3.72 GHz
 128 Cores / 16 Core Books
 TurboCore Chips ( 4 Cores )
 @ 4.256 GHz
© 2011 IBM Corporation
IBM Power Systems
90
POWER4™
p690
POWER4+™
p690
POWER5™
p5-595
POWER6™
Power 595
POWER7™
Power 795
Performance per Watt
High-end Energy Efficiency
© 2011 IBM Corporation
IBM Power Systems
91
Power 795 Layout
Bulk
Power
Supply
Processor/Memory
Book Nodes
Midplane
I/O Drawers (3X)
Media Drawer Light Panel
Node
Controller (2X)
System
Controller(2X)
Clock (2X)
I/O Hub
Up to 4 per node
Network Hub
© 2011 IBM Corporation
IBM Power Systems
92
4 POWER7 Chips / Up to 1TB Memory
4 GX Ports / 2 Node Controllers
32 DIMM Slots per Node
2 TPMD / Node
Power 795 Processor / Memory Book Node
GX Bus
DCA Bulk Power
DCA Bulk Power
DIMMs
DIMMs
P7
P7
P7
P7
TPMD (2)
Node Cntrl
GX Bus
GX Bus
Node Cntrl
GX Bus
© 2011 IBM Corporation
IBM Power Systems
93
Power 795 Physical Specifications:
 Width:
- 74.9 cm (29.5 in) rack only
- 77.5 cm (30.5 in) rack with side door
- 77.5 cm (30.5 in) rack with slimline or acoustic door and side doors, one frame
- 156.7 cm (61.7 in) rack with slimline or acoustic door and side doors, two frames
- 77.5 cm (30.5 in) rack with slimline front door and rear door heat exchange (RDHX)
 Depth:
- 127.3 cm (50.1 in) rack only
- 148.6 cm (58.5 in) rack with slimline and side doors, one or two frames
- 180.6 cm (71.1 in) rack with acoustic and side doors, one or two frames
- 152.1 cm (61.3 in) rack with slimline front door and RDHX, CEC frame only
 Height: 201.4 cm (79.3 in)
 Weight:
Max stand-alone weight of a fully populated Power 795 CEC rack with eight processor
books, with I/O drawers and without covers:
- 1,102 kg (2,430 lb) three I/O drawers and without IBB
- 1,193 kg (2,630 lb) two I/O drawers and with IBB
Max stand-alone weight of a powered Expansion Rack without covers:
- 1,200 kg (2,645 lb) eight I/O drawers and without IBB
- 1,291 kg (2,845 lb) seven I/O drawers and with IBB
© 2011 IBM Corporation
IBM Power Systems
94
Power 795 Physical Specifications:
 OPERATING ENVIRONMENT:
 Temperature (air cooled):
System operating temperature range at sea level:
– Min of 10 deg. C to a max of 32 deg. C (50 to 90 degrees F), (Varies by altitude)
 Nominal Ambient Input Air Temperature of 22.5 deg. C (72.5 deg. F) to
- Ambient Input Air Temperature Range of 10 deg. C to 27 deg. C (50 deg. F to 80.6 deg F)
- Max operating temperature 32 deg. C (90 degrees F), (Varies by altitude)
 Max altitude: 3,048 m (10,000 ft)
 Relative humidity: 20% to 80%
 Acoustics:
Slimline door set (#6868):
-- Declared A-Weighted Sound Power Level, = 8.4 typical (8.7 max) bells
-- Declared A-Weighted Sound Pressure Level, = 66 typical (69 max) decibels
Acoustical door set (#6867):
-- Declared A-Weighted Sound Power Level, = 7.5 typical (7.8 max) bels
-- Declared A-Weighted Sound Pressure Level, = 57 typical (60 max) decibels
Acoustical heat exchanger door set ( #6887)
-- Declared A-Weighted Sound Power Level, = 8.0 typical (8.3 max) bels
-- Declared A-Weighted Sound Pressure Level, = 62 typical (65 max) decibels
 Note: Noise levels are stated below for nominal operation with each door set offering under the
following two conditions:
– Typical configuration: 4 processor books and 3 I/O drawers;
– Max configuration: 8 processor books and 3 I/O drawers
© 2011 IBM Corporation
IBM Power Systems
95
Power is Dynamic Energy
Optimization
95
61%
less
Max Utility Power * (kW)
* Statement of Direction
* System operating at nominal frequency
under normal operating environment
35%
less
 Power 795 is designed to deliver large-scale
performance at new levels of energy efficiency
 Unique innovations can help enterprises reduce costs
by simplifying facilities needed for power and cooling
– High-voltage AC inputs
– Integrated Battery Feature
– New high-voltage DC inputs
 Power 795 Advanced EnergyScale technology
delivers new levels of monitoring and control
– Redundant Thermal, Power Management
Devices (TPMD) per node
– Power Capping
– Partition level energy policies* will enable more
granular specifying of energy management
options
© 2011 IBM Corporation
IBM Power Systems
96
Power Flex
Multi-system infrastructure providing a highly
available and flexible IT environment to support
clients’ most demanding business resiliency
objectives
At least two systems enables active-active availability
Allocate and rebalance processor and memory
Live Partition Mobility for flexible workload movement
Seamless growth with Capacity on Demand
On/Off Processor days for extra capacity
Serious flexibility.
© 2011 IBM Corporation
IBM Power Systems
97
Planned Maintenance
Resource Re-balancing
64
Active
64
Inactive
System A
64
Active
64
Inactive
System B
Maint
Actions
System A
64
Active
System B
64
Active
Temporary
64
Active
64
Inactive
System B
32
Active
64
Active
32
Inactive
System A
16
Active
64
Active
48
Inactive
System A
16
Active
64
Active
48
Inactive
System B
64
Active
64
Inactive
System A
64
Active
64
Inactive
System B
Power Flex Examples….
© 2011 IBM Corporation
IBM Power Systems
98
40% more performance,
35% less energy
when upgrading from POWER6 to POWER7.
Power 595
•POWER6 technology
•64 cores @ 5.0 GHz
•rPerf 553
Power 795
•POWER7 technology
•64 cores @ 4.25 GHz
•rPerf 777
upgrade
© 2011 IBM Corporation
IBM Power Systems
99
PowerVM Virtualization
© 2011 IBM Corporation
IBM Power Systems
100
Virtualization – a substitution process
Creates virtual resources from real resources.
Primarily accomplished with software and/or firmware.
Resources
Components with architected interfaces/functions.
Usually physical. May be centralized or distributed.
Examples: memory, disk drives, networks, servers.
Virtual Resources
 Substitutes for real resources: same interfaces/functions, different attributes.
 Often of part of the underlying resource, but may span multiple resources.
 Separates presentation of resources to users from actual resources
 Aggregates pools of resources for allocation to users as virtual resources
Virtualization Concept
© 2011 IBM Corporation
IBM Power Systems
101
Aggregation
Virtual
Resources
Resources
Examples: Virtual disks, IP routing to clones
Benefits: Management simplification,
investment protection, scalability
Insulation
Add, Replace,
or Change
Virtual
Resources
Resources
Examples: Spare CPU subst., CUoD
Benefits: Continuous availability, flexibility,
investment protection
Sharing
Virtual
Resources
Resources
Examples: LPARs, VMs, virtual disks, VLANs
Benefits: Resource utilization, workload
manageability, flexibility, isolation
Virtualization Functions and Benefits
Emulation
Virtual
Resources
Resources
Examples: Arch. emulators, iSCSI, virtual tape
Benefits: Compatibility, investment protection,
interoperability, flexibility
Resource
Type Y
Resource
Type X
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Server Virtualization
Virtual Servers
Physical
Server
Virtualization
Roles:
Consolidations
Dynamic provisioning/hosting
Workload management
Workload isolation
Software release migration
Mixed production and test
Mixed OS types/releases
Reconfigurable clusters
Low-cost backup servers
Benefits:
Higher resource utilization
Greater usage flexibility
Improved workload QoS
Higher availability / security
Lower cost of availability
Lower management costs
Improved interoperability
Legacy compatibility
Investment protection
In the final analysis, the virtualization benefits take three forms:
• Reduced hardware costs
Higher physical resource utilization
Smaller footprints
• Improved flexibility and responsiveness
Virtual resources can be adjusted dynamically to meet new or changing needs
and to optimize service level achievement
Virtualization is a key enabler of on demand operating environments
• Reduced management costs
Fewer physical servers to manage
Many common management tasks become much easier
 However, server
virtualization
introduces some
complexity
and requires skills
 This partially offsets the
benefits, but the net gains
are generally substantial
© 2011 IBM Corporation
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Many small dedicated servers
Servers managed individually
Low resource utilization
Rigid physical configurations
Server, storage, network silos
Wasted energy and floor space
HW changes impact SW assets
Extensive do-it-yourself
Complex, fragile IT architecture
Build-to-order by IT department
Much more powerful shared servers
Pools manageable as single
systems
High resource utilization
Flexible virtual configurations
Unified service management
Energy and space efficiency
SW assets insulated from HW
Ready-to-use integrated solutions
Modular, fault tolerant IT
architecture
Cloud utility model and self-service
IT Today – Complex Sprawl
End Users
Web Servers
App Servers
App Servers
App/DB
Servers
App/DB Server
App Servers
Fully Virtualized IT In The Future
Pool
Pool
Pool
Virtual
Appliances
Service
Mgmt.
Cloud
Integrated
Solutions
Cloud
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IBM
develops
hypervisor
that would
become VM
on the
mainframe
IBM
announces
first
machines to
do physical
partitioning
IBM
announces
LPAR on
the
mainframe
IBM
announces
LPAR on
POWER™
1967 1973 1987
IBM intro’s
POWER
Hypervisor™
for System p™
and System i™
IBM
announces
PowerVM
2007
2004
1999 2008
IBM announces
POWER6™, the
first UNIX®
servers with
Live Partition
Mobility
PowerVM Builds on IBM’s History of Virtualization
Leadership
A 40-year track record in virtualization innovation continues with PowerVM™
© 2011 IBM Corporation
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Hypervisor software/firmware
runs directly on server
Hypervisor software runs on
a host operating system
VMware GSX
Microsoft Virtual Server
HP Integrity VM
User Mode Linux
Linux KVM
S/370 SI->PP & PP->SI,
Sun Dynamic Domains, HP nPartitions
Logical partitioning
Physical partitioning
Original POWER4 LPAR
HP vPartitions
Sun Logical Domains
Adjustable
partitions
Partition
Controller
...
SMP Server
OS
Apps
OS
Apps
Hypervisor
SMP Server
...
OS
Apps
OS
Apps
Host OS
SMP Server
Hypervisor
...
OS
Apps
OS
Apps
Hardware Partitioning Bare Metal Hypervisor Hosted Hypervisor
Server Virtualization Approaches
Outlook:
• Bare metal hypervisors with high efficiency and availability will become dominant for servers
• Hosted hypervisors will be mainly for clients where host OS integration is important
• Hardware partitioning will die out as an approach
Server is subdivided into fractions
each of which can run an OS
Hypervisor provides fine-grained
timesharing of all resources
Hypervisor uses OS services to
do timesharing of all resources
System z PR/SM and z/VM
PowerVM Hypervisor
VMware ESX Server, vSphere
Xen Hypervisor
Microsoft Hyper-V
© 2011 IBM Corporation
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OS
Apps
Hypervisor
Logical Partition
(LPAR)
OS
Apps
OS
Apps
OS
Apps
PowerVM Virtualization Technology
© 2011 IBM Corporation
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AIX Linux AIX
AIX AIX AIX
5.3 6.1 6.1
TL8 TL1 TL2
Logical Partitions (LPARs)
© 2011 IBM Corporation
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LPAR LPAR
LPAR LPAR
0.3 0.7
Shared processor
pool
Micro-partitioning and Shared Processors
© 2011 IBM Corporation
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PowerVM
 Processors
– Dedicated or shared processors
– Fine-grained resource allocation
– Shared processor controls*
• # of virtual processors
• Entitlements
• Capped and uncapped
• Weights
– Adjustable via DLPAR
 Memory
– From 128MB to all physical memory
– Dedicated physical memory
– Active Memory Sharing (>POWER6)
– Active Memory Expansion (POWER7)
– Adjustable via DLPAR
 IO – dedicated or shared (VIO)
 Capacity On-Demand
 Live Partition Mobility (>POWER6)
 Group Capping (>POWER6)
Dedicated
Physical CPUs
Shared Pool of
Physical CPUs
CPU
CPU
CPU
CPU
CPU CPU
CPU
CPU
IBM
AIX 5.3
2 CPU
AIX 6.1
2.8 CPU
Weight: 50
i OS
.65 CPU
Weight: 20
Linux
.75 CPU
Capped
CoD
CPUs
Virtual CPU
Virtual CPU
Virtual CPU
Virtual CPU
Virtual CPU
Virtual CPU
Virtual CPU Virtual CPU
Virtual CPU
CoD CPU
CoD CPU
CoD CPU
CoD CPU
Dynamic Spares and
Capacity on Demand
 Scaling
– Up to 254 (1000) partitions
– Partitions up to 64w (256w) SMP
Enterprise-Grade Virtualization for Power Systems
CPU
0.1
CPU
Weight:
210
VIO
Server
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Allocate CPU, RAM and adapters dynamically
Available from POWER5 onwards
Dynamic Logical Partitioning (DLPAR)
© 2011 IBM Corporation
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Progressive Phases of IT Transformation
Virtualization and integration will be used to reduce IT complexity
and cost and to improve IT qualities (agility, resilience, security, …)
IT In The Future
IT Today
Workload optimized
systems and solutions
Lower IT Costs, Higher IT Quality
Consolidations
• Better hardware utilization
• Improved IT agility
• Lower power consumption
Pools
• Manageable like single systems
• Reduced scale-out complexity
• Lower operational expense
• Improved resilience / security
Clouds
• Utility model; self-service
• Lower cost; massive scalability
• Public, private, and hybrid
© 2011 IBM Corporation
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REDUCE COST by consolidating with Power Systems
 Resource sharing
 Sharing system resources through virtualized
consolidation reduces unused system overhead
 Virtualized consolidated systems are evidenced by
high utilization rates
 High utilization means less hardware
 Environmentally friendly
 Less power and cooling is required
 Less floor space is required
 Fiscally responsible
 Fewer processor cores drives less software costs
 Newer systems are more reliable and less costly to
maintain than older systems
 Fewer systems translates to reduced people costs
© 2011 IBM Corporation
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Why is scalability important?
 The #1 reason IT managers deploy virtualization solutions is workload
consolidation
– Put simply, the more workloads that can be encapsulated within VMs and combined
onto a single server, the higher the consolidation ratio and greater the cost
reduction
– The integrated combination of the POWER architecture and PowerVM makes
possible to achieve far higher consolidation ratios than scale-out scenarios
© 2011 IBM Corporation
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Reduce cost with Active Memory Sharing (and/or Active
Memory Expansion)
 Dynamically adjusts memory available on a
physical system for multiple virtual images
based on their workload activity levels:
– Different workload peaks due to time zones
– Mixed workloads with different time of day
peaks (e.g. CRM by day, batch at night)
– Ideal for highly-consolidated workloads with
low or sporadic memory requirements
 Available with PowerVM Enterprise Edition
– Supports AIX®, IBM i and Linux workloads
 Blends Power Systems hardware, firmware
and software enhancements to optimize
resources
– Supports over-commitment of logical memory
 Systems built on the POWER7 processor can
use Active Memory Expansion to achieve
apparent memory of as much as 2X true
0
5
10
15
Asia
Americas
Europe
Memory
Usage
(GB)
0
5
10
15
Night
Day
Time
Memory
Usage
(GB)
Time
PowerVM dynamically optimizes shared memory
© 2011 IBM Corporation
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External Network
External Network
Virtual LAN
Reduce cost and complexity with Virtual LAN
 Virtual networking for server-to-server communication can sustain
performance while reducing network utilization and physical points-of-failure
 Removes the need for network adapters and switches for communication
between LPARs
 Can drastically improve network recovery in the event of a disaster – no
physical cables to re-connect or diagnose
Reduce network latency
Increase server network
throughput up to 3X!
© 2011 IBM Corporation
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Reduce Cost with Virtual I/O Server
VLAN
LPAR1 LPAR2 LPAR3 LPAR4 LPAR5 LPAR6 LPAR7 LPAR8
VLAN
LPAR9 LPAR10 LPAR11 LPAR12 LPAR13 LPAR14 LPAR15 LPAR16
VIOS
External Network
 VIOS can dramatically reduce physical resources and
associated costs through more effective resource sharing
Reduce I/O adapters & cabling with VIOS !
Redundant VIOS enhances reliability
Network
© 2011 IBM Corporation
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Reduce cost by eliminating hardware and points-of-
failure
Single Application Server (2 CPUs)
0%
10%
20%
30%
40%
50%
60%
70%
80%
Single Application Server (2 CPUs)
0%
10%
20%
30%
40%
50%
60%
70%
80%
Single Application Server (2 CPUs)
0%
10%
20%
30%
40%
50%
60%
70%
80%
Single Application Server (2 CPUs)
0%
10%
20%
30%
40%
50%
60%
70%
80%
Single Application Server (2 CPUs)
0%
10%
20%
30%
40%
50%
60%
70%
80%
Single Application Server (2 CPUs)
0%
10%
20%
30%
40%
50%
60%
70%
80%
Single Application Server (2 CPUs)
0%
10%
20%
30%
40%
50%
60%
70%
80%
Single Application Server (2 CPUs)
0%
10%
20%
30%
40%
50%
60%
70%
80%
Single Application Server (2 CPUs)
0%
10%
20%
30%
40%
50%
60%
70%
80%
Single Application Server (2 CPUs)
0%
10%
20%
30%
40%
50%
60%
70%
80%
Single Application Server (2 CPUs)
0%
10%
20%
30%
40%
50%
60%
70%
80%
Single Application Server (2 CPUs)
0%
10%
20%
30%
40%
50%
60%
70%
80%
Single Application Server (2 CPUs)
0%
10%
20%
30%
40%
50%
60%
70%
80%
Single Application Server (2 CPUs)
0%
10%
20%
30%
40%
50%
60%
70%
80%
Single Application Server (2 CPUs)
0%
10%
20%
30%
40%
50%
60%
70%
80%
Single Application Server (2 CPUs)
0%
10%
20%
30%
40%
50%
60%
70%
80%
0%
10%
20%
30%
40%
50%
60%
70%
80%
 Reduce 32 disk drives to 8!
 Reduce 32 fibre adapters to 4!
 Reduce 32 LAN adapters to 4!
 Reduce 128 cables to 16!
Virtualize & Consolidate
 Eliminate underutilized adapters
 Reduce switches and cost of network operations and maintenance
© 2011 IBM Corporation
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Reduce cost of software licensing
0%
10%
20%
30%
40%
50%
60%
70%
80%
 Reduce software costs by up to 80%!
 Reduce software support costs
 Reduce software subscription costs
 Employ virtual shared processor pools
Single Application Server
(4 CPUs)
0%
10%
20%
30%
40%
50%
60%
70%
80%
Single Application Server
(4 CPUs)
0%
10%
20%
30%
40%
50%
60%
70%
80%
Single Application Server
(4 CPUs)
0%
10%
20%
30%
40%
50%
60%
70%
80%
Single Application Server
(4 CPUs)
0%
10%
20%
30%
40%
50%
60%
70%
80%
Single Application Server
(4 CPUs)
0%
10%
20%
30%
40%
50%
60%
70%
80%
Single Application Server
(4 CPUs)
0%
10%
20%
30%
40%
50%
60%
70%
80%
Single Application Server
(4 CPUs)
0%
10%
20%
30%
40%
50%
60%
70%
80%
Single Application Server
(4 CPUs)
0%
10%
20%
30%
40%
50%
60%
70%
80%
Single Application Server
(4 CPUs)
0%
10%
20%
30%
40%
50%
60%
70%
80%
Single Application Server
(4 CPUs)
0%
10%
20%
30%
40%
50%
60%
70%
80%
Single Application Server
(4 CPUs)
0%
10%
20%
30%
40%
50%
60%
70%
80%
Single Application Server
(4 CPUs)
0%
10%
20%
30%
40%
50%
60%
70%
80%
Single Application Server
(4 CPUs)
0%
10%
20%
30%
40%
50%
60%
70%
80%
Single Application Server
(4 CPUs)
0%
10%
20%
30%
40%
50%
60%
70%
80%
Single Application Server
(4 CPUs)
0%
10%
20%
30%
40%
50%
60%
70%
80%
Single Application Server
(4 CPUs)
0%
10%
20%
30%
40%
50%
60%
70%
80%
Based on previous example of consolidating sixteen 4 core servers to one 12 core server
Assumes 2.65 consolidation factor and 2.0 performance ratio
Virtualization can generate significant software savings
Database software
$40k per core!
© 2011 IBM Corporation
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Partition Mobility
POWER6
POWER6+
POWER7
Binary Compatibility between POWER6 and POWER7
Leverage POWER6 / POWER6+™ Compatibility Mode
Migrate partitions between POWER6 and POWER7 Servers
 Forward and Backward
© 2011 IBM Corporation
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122
Virtualize, Consolidate, Save
Still on POWER5?
You can dramatically reduce your energy usage, floor space, software license
costs, maintenance costs AND increase your performance and capacity
Two POWER5 590 systems
• 64 cores @ 2.1 GHz
• 30% utilization
Power 780
• POWER7 technology
• 64 cores @ 3.8 GHz
• 6,400 watts
• 80 virtualization
• 40% more performance
• Payback ~ 12-15 months
Four POWER5 570 systems
• 64 cores @ 1.9 GHz
• 30% utilization
POWER7 770
• 24 cores @ 3.5 GHz
• 60% utilization
30% effective capacity increase
Reduce energy usage by 90%
Save ~$600k over 3 years in maint.
Save >$1M in database license
POWER7 770
• 24 cores @ 3.5 GHz
• 60% utilization
50% effective capacity increase
Reduce energy usage by 84%
Save ~$250k over 3 years in maint.
Save >$1M in database license
* Based on US list price at announce
And still have room to
consolidate x86 workloads!
© 2011 IBM Corporation
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123
Capacity on Demand (CoD)
CPU / Memory Required
Now Future
Activate resources as they are required
© 2011 IBM Corporation
IBM Power Systems
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Capacity Upgrade on Demand
On/Off Capacity
Utility Capacity
Capacity On Demand
© 2011 IBM Corporation
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PowerHA SystemMirror
Power Systems High Availability Solution
For mission critical application availability through planned and
unplanned outage events
Editions Targeted at data center or multi-site deployments
Shared Storage Clustering Technology Designed for
automation and minimal IT operations.
125
© 2011 IBM Corporation
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126
PowerHA SystemMirror for AIX Standard Edition
 Cluster management for the data center
– Monitors, detects and reacts to events
– Establishes a heartbeat between the systems
– Enables automatic switch-over
 IBM shared storage clustering
– Can enable near-continuous application service
– Minimize impact of planned & unplanned outages
– Ease of use for HA operations
PowerHA SystemMirror for AIX Enterprise Edition
 Cluster management for the Enterprise
– Multi-site cluster management
– Includes the Standard Edition function
PowerHA SystemMirror Editions
© 2011 IBM Corporation
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PowerHA SystemMirror 7.1 Standard Edition
Simpler to deploy and easier to manage with IBM Systems Director,
intuitive interfaces, cluster and resource group wizards, management
dashboards and Smart Assists for SAP and other popular applications
Minimize IT operations with cluster aware AIX; cluster wide AIX
commands, kernel based event management, device naming, central
repository and multi-channel communications
Robust cluster integrity with disk fencing and multi-channel heart beat
which automatically uses available I/O including SAN.
Complete end to end failover automation with policy driven resource
group relationship sequencing
© 2011 IBM Corporation
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Operating System
© 2011 IBM Corporation
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Network Centric
Computing
AIX V2 & V3
Establishment in
the market:
- RISC Support
- UNIX credibility
- Open Sys. Stds..
- Dynamic Kernel
- JFS and LVM
- SMIT
AIX V3.2.5
Maturity:
- Stability
- Quality
AIX V4.1/4.2
SMP Scalability:
- POWERPC spt.
- 4-8 way SMP
- Kernel Threads
- Client/Server pkg
- NFS V3
- CDE
- UNIX95 branded
- NIM
- > 2GB filesystems
-HACMP Clustering
- POSIX 1003.1,
1003.2, XPG4
- Runtime Linking
- Java 1.1.2
AIX V4.3
Higher levels of
scalability:
- 24-way SMP
- 64-bit HW support
- 96 GB memory
- UNIX98 branded
- TCP/IP V6
- IPsec
- Web Sys. Mgr.
- LDAP Dir. Server.
- Workload Mgr
- Java JDT/JIT
- Direct I/O
- Alt. Disk Install
- Exp/Bonus CDs
Distributed
Client-Server
1986-1992 1994-1996 1997-1999
Flexible Resource
Management:
- POWER4+ spt.
- Dynamic LPAR
- Dynamic CUoD
- New 64bit kernel
- 512GB mem
- JFS2
- 16 TB filesystems
- UNIX03 branded
- Concurrent I/O
- MultiPath I/O
- Flex LDAP Client
- XSSO PAM spt
e-Business
Computing
Open Systems
Workstations
AIX Evolution – Over Twenty years of Progress
AIX/6000
Uni-processor 4-8 way SMP 24-way SMP 32-way SMP
AIX 7
Future of UNIX:
-256 core/1024 tread
scalability
-POWER7
Exploitation
-Domain based
RBAC
- AIX Profile
Manager
-WPAR
enhancements
-AIX 5.2 in a WPAR
-PowerVM
virtualized storage
-LVM SSD support
-Terabyte segment
2010
On Demand
Business
2001-2002
64/256-way SMT
AIX 5L V5.3
Advanced
Virtualization:
- POWER5 support
- 64-way SMP
- SMT
- MicroPartitions™
- Virt I/O Server
- Partition Load Mgr
- NFS Version 4
- Adv. Accounting
- Scaleable VG
- JFS2 Shrink
- SUMA
- SW RAS features
- POSIX Realtime
2004-2005
AIX 5L V5.1/5.2
Smarter
Planet
2007
AIX 6
Enterprise RAS:
-POWER6 support
-Workload Partitions
-Application Mobility
-Continuous Avail.
-Storage Keys
-Dynamic tracing
-Software FFDC
-Recovery Rtns
-Concurrent MX
-Trusted AIX
-RBAC
-Encrypting JFS2
-AIX Security Expert
-Director Console
New Enterprise
Data Center
1024-way SMT4
© 2011 IBM Corporation
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 Workload-Optimizing Systems
– Vertical scalability for massive workloads with up to 256 cores/1024 threads
in a single AIX partition
 Virtualization without limits
– Run AIX 5.2 in a WPAR to simplify consolidation of legacy environments on POWER7
 Resiliency without downtime
– Built in clustering to simplify configuration and management of scale-out
workloads and high availability solutions
 Management with Automation
– Profile based configuration management eases the management
of pools of AIX systems
AIX 7 -- The Future of UNIX
*All statements regarding IBM's future direction and intent are subject
to change or withdrawal without notice, and represent goals and objectives only.
Some features require the purchase of additional software components.
© 2011 IBM Corporation
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AIX Workload Partitions (WPAR)
 WPARs are designed to save
administrator work by reducing
the number of AIX instances to
patch
 WPARs have much lower
memory resource requirements:
68 MB vs 1GB for an LPAR
 WPAR takes seconds to create
and LPARs minutes
 Application mobility much simpler
to organize than LPM
 Lots of WPARs on one AIX is
simpler to monitor and control
than monitoring across many
LPARs.
 Rapid cloning is easy and lets
you use "disposable images" -
simple to create, experiment and
throw away
Virtualized AIX operating system
environments within a single AIX
image
Each WPAR shares the single
AIX operating system
AIX 7 added the capability to run
AIX 5.2 in a WPAR*
Applications and users inside a
WPAR cannot affect resources
outside the WPAR*
Each WPAR can have a
regulated share of processor,
memory and other resources
Two types of WPAR
- System WPARs have separate
security and appear like a
completely separate OS
- Application WPARs are
manageability wrappers around
a single application
Top reasons to use WPARs
What is it?
* Requires purchase of the AIX 5.2 WPARs for AIX 7
product
Networks
Disk or NFS storage Networks
Disk or NFS storage
© 2011 IBM Corporation
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AIX 7 WPAR Enhancements
 Export of Fibre channel adapters to WPARs
– NPIV-like, but can work on any Fibre Channel adapter
– Adds support for Fibre Channel tape
 Kernel Extensions for WPARs
– Trusted kernel extensions may be loaded by the WPAR administrator
– Extensions can be only for one WPAR or for entire system
 Support for VIOS disks in WPARs
– VSCSI disks can be exported to a WPAR
– This feature also available in AIX 6 Technology Level 6
 Run AIX 5.2 inside of a Workload Partition
– Consolidate older environments on POWER7 processor-based systems
– Requires AIX 5.2 WPARs for AIX 7 – available separately from AIX 7
© 2011 IBM Corporation
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Cluster Aware AIX
 Easily create clusters of AIX instances for scale-out computing or high availability
 Designed to:
– Significantly simplify cluster configuration, construction, and maintenance
– Designed to improve availability by reducing the time to discover failures
– Capabilities such as common device naming help simplify administration
– Built in event management and monitoring
 A foundation for future AIX capabilities and the next generation of PowerHA SystemMirror
and PowerVM
Designed to simplify construction and management of clusters of AIX
systems for scale-out computing and high availability
© 2011 IBM Corporation
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Virtualization Enhancements for IBM i
1. IBM i 6.1 partition can host
 IBM i 7.1 and 6.1 partitions
 AIX 5.2, 5.3, 6.1 and SLES and Red Hat Linux partitions
 iSCSI attached System x and BladeCenter
2. IBM i 7.1 partition can host
 IBM i 7.1 and 6.1 partitions
 AIX 5.2, 5.3, 6.1 and SLES and Red Hat Linux partitions
 iSCSI attached System x and BladeCenter
3. PowerVM VIOS can host
 IBM i 7.1 and 6.1 partitions
 AIX and Linux partitions
 VIOS supports advanced virtualization technologies
including Active Memory Sharing and NPIV
POWER6 & POWER7
VIOS
IBM i 6.1
POWER6 & POWER7
VIOS
IBM i 7.1
POWER6 & POWER7
VIOS
IBM i 7.1 IBM i 6.1
VIOS
VIOS
IBM i 7.1 IBM i 6.1
VIOS
IBM i 7.1 IBM i 6.1
Storage Virtualization can reduce costs while
improving IT infrastructure flexibility
© 2011 IBM Corporation
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IBM Partner World and eConfig Access
 https://www-304.ibm.com/partnerworld/wps/servlet/ContentHandler/pw_home_pub_index
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© 2011 IBM Corporation
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© 2011 IBM Corporation
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© 2011 IBM Corporation
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© 2011 IBM Corporation
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Tools/Web for Power Systems
 Landing page for Power Systems - http://www-
03.ibm.com/systems/power/index.html?ca=power_productlink
 Power Systems benchmarks -
http://public.dhe.ibm.com/common/ssi/ecm/en/poo03017usen/POO03017USEN.P
DF
 PartnerWorld website contains links to lots of product information
 System Planning Tool – help in configuring Power Systems with LPARs
– http://www-947.ibm.com/systems/support/tools/systemplanningtool/
 Web Lectures - http://www-
304.ibm.com/services/weblectures/smartzone/powersales/ or https://www-
304.ibm.com/services/weblectures/dlv/Gate.wss?handler=Login&sequence=9&ac
tion=index&customer=partnerworld&offering=caps&category=&itemCode=&curric
ulum=
© 2011 IBM Corporation
IBM Power Systems
141
Product Certifications – Power Systems
 http://www-03.ibm.com/certify/certs/ps_index.shtml - product certifications for
Power systems
© 2011 IBM Corporation
IBM Power Systems
142
© 2011 IBM Corporation
IBM Power Systems
143
143
IBM Power Systems
Smarter systems for a Smarter Planet.

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IBM Power Systems Technology Update and Virtualization Overview

  • 1. © 2010 IBM Corporation IBM Power Systems IBM Power Systems Surabaya Indonesia 15 April 2011 by Saiful Bahri (saiful@my.ibm.com) Power Systems – ASEAN Techline techline@my.ibm.com
  • 2. © 2011 IBM Corporation IBM Power Systems 2 Agenda OBJECTIVE POWER Technology Update • Intro to POWER Technology • POWER7 Product Offerings and Features Virtualization and High Availability • PowerVM • PowerHA clustering Operating Systems • AIX and IBM I and Linux
  • 3. © 2011 IBM Corporation IBM Power Systems 3 Objective  Information on how techline can be utilized by BPs  Understand the current Power System product portfolio  Understand the PowerVM offering for virtualization  Configuration of Power server with eConfig tool  Available tool/material available for Power server - tvdemo  Product Certification target for Power server pre-sales and sellers
  • 4. © 2011 IBM Corporation IBM Power Systems 4 Introduction to POWER Systems(previously known as RS/6000, pSeries and System p)
  • 5. © 2011 IBM Corporation IBM Power Systems 5 5 20 Years of IBM RISC Technology Leadership POWER6 POWER5 POWER4 RS64 POWER3 PowerPC RISC POWER 1990 2010 Performance Leadership Reliability / Availability / Serviceability Commercial & Technical Workloads Virtualization Technologies POWER7
  • 6. © 2011 IBM Corporation IBM Power Systems 6 Processor Technology Roadmap 2001  Dual Core  Chip Multi Processing  Distributed Switch  Shared L2  Dynamic LPARs (32) 2004  Dual Core  Enhanced Scaling  SMT  Distributed Switch +  Core Parallelism +  FP Performance +  Memory bandwidth +  Virtualization 2007  Dual Core  High Frequencies  Virtualization +  Memory Subsystem +  Altivec  Instruction Retry  Dyn Energy Mgmt  SMT +  Protection Keys 2010  Multi Core  On-Chip eDRAM  Power Optimized Cores  Mem Subsystem ++  SMT++  Reliability +  VSM & VSX (AltiVec)  Protection Keys+ POWER8  Concept Phase POWER4 180 nm POWER5 130 nm POWER6 65 nm POWER7 45 nm
  • 7. © 2011 IBM Corporation IBM Power Systems 7 Watson  IBM Research built a computer system able to compete with humans at the game of Jeopardy: Human vs. Machine contest.  Code-named “Watson,” Computer is designed to rival the human mind  Answering questions in the Jeopardy! format poses a grand challenge in computer science: – Broad range of topics , such as history, literature, politics, popular culture and science – Nature of the clues, requires analyzing subtle meaning, irony, riddles and other complexities  Based on the science of Question Answering (QA), differs from conventional search  Critical for implementing useful business applications such as: – Customer relationship management – Regulatory compliance – Help desk support  Watson and Workload Optimized Systems  Watson’s success in the Jeopardy! challenge is inspiring a new era of optimized systems design. Based on commercially available IBM Power® 750 servers, Watson’s advances in deep analytics and its ability to process unstructured data and interpret natural language will now be tailored to fit the requirements of new solutions in science, healthcare, financial services and other industries. Download the white paper and read more about Watson and workload optimized system design.
  • 8. © 2011 IBM Corporation IBM Power Systems 8 ✓4, 6 or 8 cores per socket ✓3.0 to 4.14 GHz ✓Up to 4 threads per core ✓Integrated eDRAM L3 Cache ✓Dynamic Energy Optimization
  • 9. © 2011 IBM Corporation IBM Power Systems 9 POWER6 Memory+ GX+ Bridge Memory+ GX Bus Cntrl Memory Cntrl Memory Cntrl Fabric Bus Controller Core Alti Vec L3 Ctrl L3 L3 Ctrl L3 Core Alti Vec 4 MB L2 4 MB L2 Core L2 Core L2 Memory Interface Core L2 Core L2 Core L2 Core L2 Core L2 Core L2 G X S M P F A B R I C P O W E R B U S POWER7 Memory++ L3 Cache
  • 10. © 2011 IBM Corporation IBM Power Systems 10 POWER7 Core 64-bit PowerPC architecture v2.07 Execution Units • 2 Fixed Point Units • 2 Load Store Units • 4 Double Precision Floating Point Units • 1 Branch • 1 Condition Register • 1 Vector Unit • 1 Decimal Floating Point Unit • 6 Wide Dispatch • Units include distributed Recovery Function Out of Order Execution Modes: POWER6, POWER6+ and POWER7 L2 Cache IFU CRU/BRU ISU DFU FXU VSX FPU LSU  POWER7 continues to support VMX / Extends SIMD support with VSX – 2 VSX units that can each handle 2 Double-Precision FP instructions – 8 FLOPS per cycles – VSX units can also handle 4 Single Precision instructions per cycle – VSX instruction set support for vector and scalar instructions
  • 11. © 2011 IBM Corporation IBM Power Systems 11 11 Performance per Core Moves Up with POWER7 …up to 1.6X improvement over POWER6 …up to 2X improvement over POWER5+ rPerf performance estimate for fully configured 64-way systems divided by number of cores
  • 12. © 2011 IBM Corporation IBM Power Systems 12 More TPC-C performance per core than any system in the industry POWER5 POWER6 POWER7 HP Itanium2 Sun/Oracle T2+ Best results listed for IBM POWER, HP, and Sun/Oracle systems over 1M tpmC. Source: http://www.tpc.org as of 4/1/08. See Power 780 benchmark details for specific results. K tpmC per core 2X 3X 4.6X 4.6 to 7.5 times more performance per core than HP Itanium and Sun Enterprise T5440 cluster respectively Power 780 with DB2
  • 13. © 2011 IBM Corporation IBM Power Systems 13 More SAP performance than any system in the industry 20% more performance … one-fourth the number of cores vs. Sun M9000 SAP Users Sun T5440 SPARC 4/32/256 Power 750 POWER 4/32/128 Sun X4640 Opteron 4/48/48 Fujitsu 1800E Nehalem-EX 8/64/128 Power 780 POWER 8/64/256 Sun M9000 SPARC 32/128/256 Sun M9000 SPARC 64/256/512 4 sockets 8 sockets 32 sockets 64 sockets 37,000 SAP users on SAP SD 2 Tier Power 780 Overall 4-socket
  • 14. © 2011 IBM Corporation IBM Power Systems 14 Operating Systems Power Systems Portfolio Major Features:  Modular systems with linear scalability  PowerVM™ Virtualization  Physical and Virtual Management  Roadmap to Continuous Availability  Binary Compatibility  Energy / Thermal Management Power 755 Power 750 Power 710, 720, 730, 740 Power 795 520 Power 770 Power 780 BladeCenter PS700 / PS701 / PS702 575 550 570 JS23, JS43 595
  • 15. © 2011 IBM Corporation IBM Power Systems 15 POWER7 Systems Technology Value…  Technology –Roadmap –Processor Instruction Retry –Green Technology built in –Common architecture from Blades to High-end  Performance –Power Systems scalability from blades to high end systems –Performance leadership in a variety of workloads –Best Performance per core –Memory and IO bandwidth  Virtualization –Consolidate to higher levels –Virtualize Processors, Memory, and I/O –Dynamic movement of Partitions and Applications –Reduce infrastructure costs  RAS –Power Systems mainframe inspired RAS features –Hot Add support / Concurrent Maintenance –Alternate Process Recovery –Operating Systems Availability Leadership Hypervisor Virt I/O Server Shared I/O Single SMP Hardware System 0 100 200 300 400 500 600 700 PS700 PS701 PS702 520 750 570/16 570/32 770 780 595
  • 16. © 2011 IBM Corporation IBM Power Systems 16 IBM AIX 5.3, 6.1, 7.1 AIX 6 Editions for entry to enterprise servers & workload consolidation AIX 7 able to exploit 1024 POWER7 threads, and support AIX 5.2 WPARs IBM i for Business Linux on Power POWER7 support for RHEL 5.5 & 6, SLES 10 & 11 plus PowerVM Lx86 performance optimized for x86 server consolidation All 3 operating environments available with POWER7 IBM i 7.1 features XML in DB2, automatic workload optimization with SSDs, Rational Open Access: RPG Edition and much more *All statements regarding IBM's future direction and intent are subject to change or withdrawal without notice, and represent goals and objectives only. Some features require the purchase of additional software components.
  • 17. © 2011 IBM Corporation IBM Power Systems 17 AIX Release/TL Max Cores & Threads Supported POWER6 Mode POWER7 Mode AIX 5.3 (TL9,10,11 Supported 64 / 128 N/A AIX 6.1 TL2, TL3 64 / 128 N/A AIX 6.1 TL4 64 / 128 64 / 256 AIX 6.1 TL5 64 / 128 64 / 256 AIX 7.1 64 / 128 256 / 1024 POWER7 Modes: IBM i and AIX® IBM i Release Max Cores & Threads Supported POWER6 Mode POWER7 Mode IBM i 6.1 32 / 64 32 / 128 Special Support 64/128 32 / 128 IBM i 7.1 32 / 64 32 / 128 Special Support 64/128 64 / 256
  • 18. © 2011 IBM Corporation IBM Power Systems 18 Linux Max Processors & Threads Supported POWER6 Mode POWER7 Mode RHEL 5.5 and newer 64 / 128 N/A SLES 10 SP#3 and newer 64 / 128 N/A SLES 11 ( All Service Packs) 64 / 128 256 / 1024 RHEL 6 (Next major RHEL version) 64 / 128 256 / 1024 POWER7 Modes: Linux®
  • 19. © 2011 IBM Corporation IBM Power Systems 19 Core L2 Core L2 Memory Interface Core L2 Core L2 Core L2 Core L2 Core L2 Core L2 G X S M P F A B R I C P O W E R B U S 32 MB L3 Cache POWER7 TurboCore™ Mode  TurboCore Chips: 4 available cores  Aggregation of L3 Caches of unused cores.  TurboCore chips have a 2X the L3 Cache per Chip available –4 TurboCore Chips L3 = 32 MB  Performance gain over POWER6. –Provides up to 1.5X per core to core  Chips run at higher frequency: –Power reduction of unused cores.  With “Reboot”, System can be reconfigured to 8 core mode. –ASM Menus Unused Core TurboCores POWER7 Chip Power 780/795 TurboCore Chip
  • 20. © 2011 IBM Corporation IBM Power Systems 20 POWER7 Offerings… Power 710, 720, 730, 740 Power 750 Express Power 755 PS700 Express PS701 Express PS702 Express Power 770 Power 780 Power 795
  • 21. © 2011 IBM Corporation IBM Power Systems 21 POWER7 Model 750 BladeCenter PS700 Express
  • 22. © 2011 IBM Corporation IBM Power Systems 22 POWER7 PS700 Blade 4 Cores Fiber Support Yes (via BladeCenter chassis) Media Bays 1 BladeCenter chassis Redundant Power Yes BladeCenter chassis Redundant Cooling Yes BladeCenter chassis Service Processor Yes Power & Thermal POWER Save / Power Cap Architecture 4 Core Single Socket L2 & L3 Cache On Chip DDR3 Memory Up to 64 GB DASD / Bays 0 - 2 SAS (300/600GB) Daughter Card Options CIOv & CFFh ( PCIe Adapters ) Integrated Options Dual Port Gbt Ethernet Ethernet, USB
  • 23. © 2011 IBM Corporation IBM Power Systems 23 PS700 Layout POWER7 4 Cores @ 3.0 GHz Buffer Chip Buffer Chip 4 DIMMs 4 DIMMs IO Hub FSP CFFh SAS SFF HDD 300 / 600 GB SAS SFF HDD 300 / 600 GB VPD CIOv SAS Cntrl Power IO / Network Power IO / Network
  • 24. © 2011 IBM Corporation IBM Power Systems 24 Functional Differences POWER6 Blade PS700 Blades Up to 4 Cores (Dual Socket) 4 Cores (Single Socket) Up to 64 GB Memory 8 DIMM slots Up to 64 GB Memory 8 / 16 DIMM slots DDR2 Memory DDR3 Memory 0 - 1 SFF SAS DASD / SSD 0-2 SFF SAS DASD 2 PCIe slots 2 PCIe slots IVE: Dual Gbt Optional: Quad Gbt, ot 10 Gbt IVE: Dual Gbt Optional: Dual 10 Gbt TPMD Enhanced TPMD Guiding Light Light Path
  • 25. © 2011 IBM Corporation IBM Power Systems 25 POWER7 Model 750 BladeCenter PS701 Express
  • 26. © 2011 IBM Corporation IBM Power Systems 26 POWER7 PS701 Blade 8 Cores Fiber Support Yes (via BladeCenter chassis) Media Bays 1 BladeCenter chassis Redundant Power Yes BladeCenter chassis Redundant Cooling Yes BladeCenter chassis Service Processor Yes Power & Thermal POWER Save / Power Cap Architecture 8 Core Single Socket L2 & L3 Cache On Chip DDR3 Memory Up to 128 GB DASD / Bays 0 - 1 SAS (300/600GB) Daughter Card Options CIOv & CFFh ( PCIe Adapters ) Integrated Options Dual Port Gbt Ethernet Ethernet, USB
  • 27. © 2011 IBM Corporation IBM Power Systems 27 PS701 Layout SAS Cntrl POWER7 8 Cores @ 3.0 GHz Buffer Chip Buffer Chip 8 DIMMs Buffer Chip Buffer Chip 8 DIMMs IO Hub SMP Interconnect CFFh SAS SFF HDD 300 / 600 GB Power IO / Network CIOv Power IO / Network VPD FSP
  • 28. © 2011 IBM Corporation IBM Power Systems 28 Functional Differences POWER6 Blade PS701 Blades Up to 4 Cores (Dual Socket) 8 Cores (Single Socket) Up to 64 GB Memory 8 DIMM slots Up to 128 GB Memory 8 / 16 DIMM slots DDR2 Memory DDR3 Memory 0 - 1 SFF SAS DASD / SSD 0-1 SFF SAS DASD 2 PCIe slots 2 PCIe slots IVE: Dual Gbt Optional: Quad Gbt, ot 10 Gbt IVE: Dual Gbt Optional: Dual 10 Gbt TPMD Enhanced TPMD Guiding Light Light Path
  • 29. © 2011 IBM Corporation IBM Power Systems 29 POWER7 Model 750 BladeCenter PS702 Express
  • 30. © 2011 IBM Corporation IBM Power Systems 30 POWER7 PS702 Blade 16 Cores Fiber Support Yes (via BladeCenter chassis) Media Bays 1 BladeCenter chassis Redundant Power Yes BladeCenter chassis Redundant Cooling Yes BladeCenter chassis Service Processor Yes Power & Thermal POWER Save / Power Cap Architecture 8 Cores/Socket Two Socket L2 & L3 Cache On Chip DDR3 Memory Up to 256 GB DASD / Bays 0 - 2 SAS (300/600GB) Daughter Card Options CIOv & CFFh ( PCIe Adapters ) Integrated Options Quad Port Gbt Ethernet Ethernet, USB
  • 31. © 2011 IBM Corporation IBM Power Systems 31 PS702 Layout POWER7 8 Cores @ 3.0 GHz Buffer Chip Buffer Chip 8 DIMMs Buffer Chip Buffer Chip 8 DIMMs IO Hub SMP Interconnect CFFh SAS SFF HDD 300 / 600 GB Power IO / Network CIOv Power IO / Network
  • 32. © 2011 IBM Corporation IBM Power Systems 32 Functional Differences POWER6 Blade PS702 Blades Up to 8 Cores (Dual Socket) 16 Cores (Dual Socket) Up to 128 GB Memory 8 DIMM slots Up to 256 GB Memory 32 DIMM slots DDR2 Memory DDR3 Memory 0 - 2 SFF SAS DASD / SSD 0- 2 SFF SAS DASD 4 PCIe slots 4 PCIe slots IVE: Dual Gbt Optional: Quad Gbt, ot 10 Gbt IVE: Quad Gbt Optional: Dual 10 Gbt TPMD Enhanced TPMD Guiding Light Light Path
  • 33. © 2011 IBM Corporation IBM Power Systems 33 Operating System Support Installing the AIX operating system (one of these): –AIX V5.3 with the 5300-12 Technology Level, or later AIX V6.1 with the 6100-05 Technology Level, or later Installing the IBM i operating system: –IBM i 6.1 with i 6.1.1 machine code, or later –IBM i 7.1, or later Installing VIOS: –VIOS 2.1.3.0, or later –VIOS is required with the IBM i operating system Installing the Linux operating system (one of these): –SUSE Linux Enterprise Server 10 Service Pack 3 for POWER , or later with current maintenance updates available from Novell to enable all planned functionality Red Hat Enterprise Linux 5.5 for POWER, or later IBM Systems Director 6.2
  • 34. © 2011 IBM Corporation IBM Power Systems 34 PS700 PS701 PS702 Architecture POWER7 4-Core (1 Socket x 4 Cores / Blade) Single Wide POWER7 8-core (1 Socket x 8 Cores / Blade) Single Wide POWER7 16-core (1 Socket x 8 Cores / Blade) Double Wide Memory 4GB to 64GB DDR3 (Chipkill) 4GB@1066MHz, 8GB@800MHz 4GB to 128GB DDR3 (Chipkill) 4GB@1066MHz, 8GB@800MHz 4GB to 256GB DDR3 (Chipkill) 4GB@1066MHz, 8GB@800MHz DASD / Bays 0-2 SAS disk 0-1 SAS disk 0-2 SAS disk Expansion Card Slots 1 PCI-E CIOv Expansion Card 1 PCI-E CFFh ExpansionCard 1 PCI-E CIOv Expansion Card 1 PCI-E CFFh ExpansionCard 2 PCI-E CIOv Expansion Card 2 PCI-E CFFh ExpansionCard Integrated Features Keyboard, Video and Mouse Dual Port 1Gb Ethernet SAS Controller USB Keyboard, Video and Mouse Dual Port 1Gb Ethernet SAS Controller USB Keyboard, Video and Mouse Quad Port 1Gb Ethernet SAS Controller USB Scalability Support No Yes – Factory or Customer Upgrade Yes – Factory or Customer Upgrade Fiber Support Yes (via BladeCenter) Yes (via BladeCenter) Yes (via BladeCenter) Redundant Power Yes (via BladeCenter) Yes (via BladeCenter) Yes (via BladeCenter) Redundant Cooling Yes (via BladeCenter) Yes (via BladeCenter) Yes (via BladeCenter) Service Processor FSP1 (IPMI, SOL) FSP1 (IPMI, SOL) FSP1 (IPMI, SOL) Virtualization IBM PowerVM IBM PowerVM IBM PowerVM Systems Management IBM Director 6.2 and CSM IBM EnergyScale Technology IBM Director 6..2 and CSM IBM EnergyScale Technology IBM Director 6.2 and CSM IBM EnergyScale Technology OS Support AIX, i, Linux AIX, i, Linux AIX, i, Linux BladeCenter Chassis Support BCE, BCH*, BCHT, BCS* BCH*, BCHT, BCS* BCH*, BCHT, BCS* BladeCenter PS Blades
  • 35. © 2011 IBM Corporation IBM Power Systems 35 Performance Comparisons 0 20 40 60 80 100 120 140 160 POWER6 POWER7 4 Core 8 Core 16 Core JS23 JS43 PS700 PS701 PS702
  • 36. © 2011 IBM Corporation IBM Power Systems 36 Performance Comparisons 0 20 40 60 80 100 120 140 160 Single Wide Double Wide JS23 JS43 PS700 PS701 PS702
  • 37. © 2011 IBM Corporation IBM Power Systems 37 Power 720 / 740
  • 38. © 2011 IBM Corporation IBM Power Systems 38 POWER7 720 / 740 4U Server Size: 4U Power 720 Power 740 Architecture 4 / 6 / 8 Cores Up to 8 Core Single Socket 4 / 6 / 8 Cores Up to 16 Core Single or Dual Socket (Upgradeable) Upgrade Memory Dual SAS Cntrl / RAID PCIe Slots Cores & Memory Dual SAS Cntrl / RAID PCIe Slots DDR3 Memory 4GB or 8GB DIMMs 8GB to 128GB 4GB or 8GB DIMMs 8GB to 256GB DASD / Bays Up to 6 or 8 SFF or SSD Optional RAID Expansion PCIe: 4 Full slots Opt. 4 Low Profile Slots GX Bus: 2 Slots PCIe Gen2 Yes Integrated SAS/SATA Yes / Dual SAS Split Bkpl or RAID (Optional) Integrated Ports 3 USB, 2 Serial, 2 HMC Integrated Virtual Ethernet Quad 10/100/1000 Optional: Dual 10Gbt Media Bays 1 Slim-line & 1 Half Height Remote IO Drawers Yes / T19 = 4 / 2 Max Virt Management IVM & HMC Redundant Power and Cooling Yes ( Power Optional ) EnergyScale TPMD
  • 39. © 2011 IBM Corporation IBM Power Systems 39 Power 720 / 740 Processor Options  Power 720  4-core 3.0 GHz POWER7 Module  6-core 3.0 GHz POWER7 Module  8 core 3.0 GHz POWER7 Module  Power 740  1 or 2 x 4-core 3.3 GHz POWER7 Module  1 or 2 x 4-core 3.7 GHz POWER7 Module  1 or 2 x 6-core 3.7 GHz POWER7 Module  2 x 8-core 3.55 GHz POWER7 Module
  • 40. © 2011 IBM Corporation IBM Power Systems 40 Power 740 Expansion Options Processor Expansion: – Add 2nd POWER7 Module Memory Expansion: – Add up to 3 additional memory cards IO Controller Expansion – Second SAS Controller IO Expansion – Internal PCIe expansion: Four additional PCIe slots Remote IO Expansion – Up to four PCIe Express drawers – Up to eight PCI-X drawers
  • 41. © 2011 IBM Corporation IBM Power Systems 41 Front view Dual Socket System Memory Cards 6/ 8 SFF Bays & DVD Fans 1 / 2 P7 Sockets Fans Tape
  • 42. © 2011 IBM Corporation IBM Power Systems 42 Rear view Dual Socket System Dual Power Supplies 4 PCIe Slots IVE Slot Fans Memory Cards GX Bus GX Bus Opt PCIe Expansion P7 Sockets P7 Sockets
  • 43. © 2011 IBM Corporation IBM Power Systems 43 Power 720 / 740 Physical Specifications  Dimensions: – Width: 440 mm (19.0 in) – Depth: 610 mm (24.0 in) – Height: 177 mm (6.81 in) – Weight: 48.7 kg (107.4 lb)  Operating voltage: – Power 720:100 to 127 or 200 to 240 V AC – Power 740:200 to 240 V AC  Maximum measured power consumption (Maximum): – Power 720:750 watts – Power 740:1400 watts  Maximum measured BTU (Maximum): – Power 720:2560 – Power 740:4778  Power-source loading ( Maximum ) – Power 720:0.765kVa – Power 740:1.428 kVa – To obtain a heat output estimate based on a specific configuration: http://www-912.ibm.com/see/EnergyEstimator
  • 44. © 2011 IBM Corporation IBM Power Systems 44 Power 740 (720) rear View IVE HMC Ports Serial Ports GX Bus GX Bus Power Supplies PCIe Slots POWER7 Socket Memory Cards USB
  • 45. © 2011 IBM Corporation IBM Power Systems 45 Power 720 / 740 Rear View PCIe Adapters Power Supplies Optional: PCIe Adapters HMC Ports IVE Ports Serial Ports S l o t 5 S l o t 6 S l o t 7 S l o t 8 S l o t 1 S l o t 2 S l o t 3 S l o t 4 GX Bus #2 GX Bus #1 or PCIe Expan Riser USB Port
  • 46. © 2011 IBM Corporation IBM Power Systems 46 Power 720 / 740 PCIe Expansion Option GX++ Connection Slot #1 Located above the Power Supplies PCIe Expansion Option Four Low Profile Slots  Two options: – 1. PCIe Gen1 – 2. PCIe Gen2 (Future)
  • 47. © 2011 IBM Corporation IBM Power Systems 47 POWER6 : POWER7 720 / 740 Performance 0 20 40 60 80 100 120 140 160 180 520 - 720/740 520 - 740 POWER6 POWER7 Single Socket Dual Socket
  • 48. © 2011 IBM Corporation IBM Power Systems 48 Power 710 / 730
  • 49. © 2011 IBM Corporation IBM Power Systems 49 Power 710 and 730 Size: 2U Power 710 Power 730 Architecture 4 / 6 / 8 Cores Up to 8 Core Single Socket 4 / 6 / 8 Cores Up to 16 Core Dual Socket Upgrade RAID Memory RAID Memory DDR3 Memory 4GB or 8GB DIMMs 8GB to 64GB 4GB or 8GB DIMMs 8GB to 128GB DASD / Bays Up to 6 SFF or SSD Optional RAID Expansion PCIe: 4 Low Profile slots GX Bus: 2 Slots Integrated SAS/SATA Cntrl Yes / RAID (Optional) Integrated Ports 3 USB, 2 Serial, 2 HMC Integrated Virtual Ethernet Quad 10/100/1000 Optional: Dual 10Gbt Media Bays 1 Slim-line & 1 Half Height ( Optional ) Remote IO Drawers N / A Virt Management IVM & HMC Redundant Power and Cooling Yes ( Power Optional ) EnergyScale TPMD
  • 50. © 2011 IBM Corporation IBM Power Systems 50 Power 730 / 710 Packaging Options Six SFF bays with Media Three SFF bays with Tape and Media
  • 51. © 2011 IBM Corporation IBM Power Systems 51 Power 710 / 730 Processor Options  Power 710 ( Single Module ): – 4-core 3.0 GHz POWER7 processor module – 6-core 3.7 GHz POWER7 processor module – 8-core 3.55 GHz POWER7 processor module Power 730 ( Dual Modules ): – 4-core 3.0 GHz POWER7 processor module – 4-core 3.7 GHz POWER7 processor module – 6-core 3.7 GHz POWER7 processor module – 8-core 3.55 GHz POWER7 processor module
  • 52. © 2011 IBM Corporation IBM Power Systems 52 Power 710 / 730 Physical Specifications  Dimensions: – Width: 440 mm (19.0 in) – Depth: 706 mm (27.8 in) – Height: 89 mm (3.5 in) – Weight Power 710: 28.2 kg (62 Ibs) Power 730: 29.5 kg (65 lbs)  Operating voltage: – Power 710:100 to 127 or 200 to 240 V AC – Power 730:200 to 240 V AC  Maximum measured power consumption (Maximum): – Power 710:650 watts – Power 730:1100 watts  Maximum measured BTU (Maximum): – Power 710:2218 – Power 730:3754  Power-source loading ( Maximum ) – Power 710:0.663 kVa – Power 730:1.122 kVa – To obtain a heat output estimate based on a specific configuration. http://www-912.ibm.com/see/EnergyEstimator
  • 53. © 2011 IBM Corporation IBM Power Systems 53 POWER7 730 / 710 System Layout POWER7 Socket Memory Cards Power Supplies Fans Storage Bays PCIe PCIe PCIe PCIe GX Bus Fans GX Bus HMC IVE Power 710
  • 54. © 2011 IBM Corporation IBM Power Systems 54 Power 710 (730) rear View IVE HMC Ports Serial Ports GX Bus GX Bus Power Supplies PCIe Slots POWER7 Socket Memory Cards USB Power 730 POWER7 Socket Power 730 Memory Cards GX Buses do not support remote IO Drawers
  • 55. © 2011 IBM Corporation IBM Power Systems 55 POWER7 Model 750 Power 750 Express
  • 56. © 2011 IBM Corporation IBM Power Systems 56 Power 750 Express Product Features Features of the Power 750: 8233-E8B… –POWER7 processor with multiple cores • 32-ways (8 cores/processor card x 4 processor cards) –Industry Standard RDIMM, DDR3 1066 Mbps with enhanced memory RAS features including 64- byte marking ECC code, and ChipKill detection and correction. • 512 GB maximum (16GB/DIMM x 8 DIMMs/processor card x 4 processor cards) –8 hot plug and front access SFF SAS DASD. –1 slim media bay for DVD. –1 half high bay for tape drive. –Hot plug 3 PCIe slots and two PCIX slots with Enhanced Error Handling. –One GX+ slot and one GX++ slot (not hot pluggable) –Hot plug and redundant power. –Hot plug and redundant cooling. –Support for Logical Partitioning (LPAR) and Dynamic LPAR (DLPAR). –Embedded SAS and SATA –Embedded four 1 Gigabit Ethernet devices or two 10 Gigabit Ethernet devices –Embedded USB –Service Processor FSP-1 for enhanced reliability and remote system management –Rack mountable drawer 56
  • 57. © 2011 IBM Corporation IBM Power Systems 57 Power 750 System 8233-E8B POWER7 Architecture 6 Cores @ 3.3 GHz 8 Cores @ 3. 0, 3.3, 3.55 GHz Max: 4 Sockets DDR3 Memory Up to 512 GB System Unit SAS SFF Bays Up to 8 Drives (HDD or SSD) 73 / 146 / 300GB @ 15k (2.4 TB) (Opt: cache & RAID-5/6) System Unit IO Expansion Slots PCIe x8: 3 Slots (2 shared) PCI-X DDR: 2 Slots 1 GX+ & Opt 1 GX++ 12X cards Integrated SAS / SATA Yes System Unit Integrated Ports 3 USB, 2 Serial, 2 HMC Integrated Virtual Ethernet Quad 10/100/1000 Optional: Dual 10 Gb System Unit Media Bays 1 Slim-line DVD & 1 Half Height IO Drawers w/ PCI slots PCIe = 4 Max: PCI-X = 8 MAX Cluster 12X SDR / DDR (IB technology) Redundant Power and Cooling Yes (AC or DC Power) Single phase 240 VAC or -48 VDC Certification (SoD) NEBS / ETSI for harsh environments Active Thermal Power Management 4U Depth: 28.8”
  • 58. © 2011 IBM Corporation IBM Power Systems 58 Power 750 System Overview 8 SFF Bays (Disk or SSD)  Dual Power  Supplies Half-High Bay (tape or removable disk  Up to 4  Processor / Memory Cards  3 PCIe & 2 PCI-X  Slots  Fan s  TP MD DVD
  • 59. © 2011 IBM Corporation IBM Power Systems 59 59 Power Supplies Tape Drive Remove DASD Bay DVD Drive Operator Panel 8 SFF DASD / SSD Power 750 Front View
  • 60. © 2011 IBM Corporation IBM Power Systems 60 60 SAS Port System Port 1 System Port 2 USB Ports HMC Ports IVE Ethernet PCIe Slot 1 or GX++ Slot PCIe Slot 2 or GX+ Slot PCIe Slot 3 PCIX Slot 5 PCIX Slot 4 Power 750 Rear View SPCN
  • 61. © 2011 IBM Corporation IBM Power Systems 61 Power 750 Internal USB Removable Disk Drive Alternative to DLT, VXA, DAT72 or 8mm tape drives –Faster than tape / 20MB/s Sustained Transfer Rate –Lower total cost of ownership • USB drives have longer life than tape cartridges • No cleaning cartridges • Inexpensive docking stations AIX and Linux support Capacities: 160GB and 500GB USB 2.0 Designed for BACKUP and RESTORE type processes ONLY. NOT designed to be used as a regular disk drive. No compression, Data can be compressed by operating system and passed to the USB RDD 61
  • 62. © 2011 IBM Corporation IBM Power Systems 62 Power 750 Information…. Physical Specifications: –Width: 440 mm (17.3 in) –Depth: 730.8 mm (28.8 in) –Height: 173 mm (6.81 in) –Weight: 48.63 kg (107 lb) Operating voltage: –200 to 240 V Operating Frequency: 50/60 Hz Power Consumption: 1950 watts (maximum) Power Factor: 0.98 Thermal Output: 6655 Btu/hour (maximum) Power-source Loading –2.0 KVA (maximum configuration) Noise Level and Sound –Rack-mount drawer: 7.1 Bels operating
  • 63. © 2011 IBM Corporation IBM Power Systems 64 Power 750 vs Power 550 / 560 0 20 40 60 80 100 120 140 160 180 Power 750 Power 550 Power 560 0 10 20 30 40 50 60 70 Power 750 Power 550 Power 560 Performance* / KW Performance* / K BTU * Calculated on rPerf, CPW results siimilar
  • 64. © 2011 IBM Corporation IBM Power Systems 65 Power 755
  • 65. © 2011 IBM Corporation IBM Power Systems 66 Power 755 HPC: 8236-E8C  Power 755 / Power 750 Differences: 1. Only an 8-core 3.3GHz will be offered 2. Valid configuration is 32-core 3.3GHz (i.e. 4 processor cards). 3. No 16GB DIMM - Maximum memory is 256GB. 4. No IBM i O/S support 5. No PowerVM features (i.e. no LPAR or DLPAR) 6. No RAID feature 7. No Split Disk feature 8. No tape drive 9. No external I/O Drawers (e.g. PCIe 19 Drawers) 10. No IB 12x SDR adapter 66
  • 66. © 2011 IBM Corporation IBM Power Systems 67 5.3 / 6.1 RHEL / SLES Power 755 4-Socket HPC System 8236-E8C POWER7 Architecture 4 Processor Sockets = 32 Cores 8 Core @ 3.3 GHz DDR3 Memory 128 GB / 256 GB, 32 DIMM Slots System Unit SAS SFF Bays Up to 8 disk or SSD 73 / 146 / 300GB @ 15K (up to 2.4TB) System Unit Expansion PCIe x8: 3 Slots (1 shared) PCI-X DDR: 2 Slots GX++ Bus Integrated Ports 3 USB, 2 Serial, 2 HMC Integrated Ethernet Quad 1Gb Copper (Opt: Dual 10Gb Copper or Fiber) System Unit Media Bay 1 DVD-RAM ( No supported tape bay ) Cluster Up to 64 nodes Ethernet or IB-DDR Redundant Power Yes (AC or DC Power) Single phase 240vac or -48 VDC Certifications (SoD) NEBS / ETSI for harsh environments EnergyScale Active Thermal Power Management Dynamic Energy Save & Capping Up to 8.4 TFlops per Rack ( 10 nodes per Rack ) 4U x 28.8” depth
  • 67. © 2011 IBM Corporation IBM Power Systems 68 1H / 2010 Scaling 64 nodes (32 Cores/node) 54 TFlops Operating Systems AIX 6.1 TL 04 / 05 Linux HPC Stack Levels xCAT v2.3.x GPFS v3.3.x PESSL v3.3.x LL v4.1.x PE v5.2.x ESSL Beta (GA 06/2010) ESSL v5.1 Compilers GA Levels XLF v13.1 VAC/C++ v11.1 Power 755 HPC Cluster Node IB-DDR Interconnect Data Center in a Rack Up to 10 Nodes per Rack
  • 68. © 2011 IBM Corporation IBM Power Systems 69 Feature 755 750 Processors 32-core @ 3.3 GHz 32-core @ 3.55 GHz 6 / 12 / 18 / 24-core @ 3.3 GHz 8 / 16 / 24 / 32-core @ 3.0 GHz Memory 128GB OR 256GB 4GB & 8GB DIMMS 512GB Max. 4GB, 8GB, 16GB DIMMS GX slot support Yes – IB clustering Yes I/O Drawer support No Yes DASD Backplane No Split Backplane Split Backplane support Integrated Ethernet Quad GbE or Dual 10GbE Quad GbE or Dual 10GbE Virtualization No PowerVM support PowerVM Std and Ent DASD / Bays 8 SFF SAS HDD / SDD 10k and 15K SFF drives 8 SFF SAS HDD / SDD 10k and 15K SFF drives Optional RAID Internal Tape No Yes Performance Metric TFLOPS rPerf Misc. No IBM i Support No H/W Raid Cards IBM i Support H/W Raid Cards Power 755 vs. 750 Offering Structures
  • 69. © 2011 IBM Corporation IBM Power Systems 70 Power 770 Power 780
  • 70. © 2011 IBM Corporation IBM Power Systems 71 Power 770 Power 770 Processor Technology 6 Cores @ 3.55 GHz 8 Cores @ 3.1 GHz L3 Cache On Chip Redundant Power & Cooling Yes Redundant Server Processor Yes / Two Enclosure minimum Redundant Clock Yes / Two Enclosure minimum Hot Add Support Yes Hot Service Yes System Unit Single Enclosure 4 Enclosures Processors Up to 2 Sockets 8 Sockets DDR3 Memory (Buffered) Up to 512 GB Up to 2 TB SAS/SSD SFF Bays 6 24 DVD-RAM Media Bays 1 Slim-line 4 Slim-line SAS / SATA Controller 2 / 1 8 / 4 PCIe bays 6 PCIe 24 PCIe GX++ Slots (12X DDR) 2 8 Integrated Ethernet Std: Quad 1Gb Opt: Dual 10Gb + Dual 1 Gb Std: Four Quad 1Gb Opt: Four x Dual 10Gb + Dual 1 Gb USB 3 12 12X I/O Drawers w/ PCI slots Max: 4 PCIe, 8 PCI-X Max: 16 PCIe, 32 PCI-X Maint Coverage: 9 x 5 4U x 32 inches Depth
  • 71. © 2011 IBM Corporation IBM Power Systems 72 Power 780 Power 780 Processor Technology 4 Cores @ 4.1 GHz TurboCore 8 Cores @ 3.8 GHz L3 Cache On Chip Redundant Power & Cooling Yes Redundant Server Processor Yes / Two Enclosure minimum Redundant Clock Yes / Two Enclosure minimum Hot Add Support Yes Hot Service Yes System Unit Single Enclosure 4 Enclosures Processors 2 Sockets 8 Sockets DDR3 Memory (Buffered) Up to 512 GB Up to 2 TB SAS/SSD SFF Bays (CEC) 6 24 DVD-RAM Media Bays 1 Slim-line 4 Slim-line SAS / SATA Controller 2 / 1 8 / 4 PCIe (CEC) 6 PCIe 24 PCIe GX++ Slots (12X DDR) 2 8 Integrated Ethernet Std: Quad 1Gb Opt: Dual 10Gb + Dual 1 Gb Std: Four Quad 1Gb Opt: Four x Dual 10Gb + Dual 1 Gb USB 3 12 12X I/O Drawers w/ PCI slots Max: 4 PCIe, 8 PCI-X Max: 16 PCIe, 32 PCI-X Maint Coverage 24 X 7 PowerCare Support
  • 72. © 2011 IBM Corporation IBM Power Systems 73 POWER7 Processor Chip 16 DIMM slots PCIe Slots FSP GX Slots 6 SFF Bays POWER7 Processor Chip Interconnect TPMD POWER7 Modular Layout
  • 73. © 2011 IBM Corporation IBM Power Systems 74 POWER7 Modular Front View Fabric Interconnects 6 SFF Bays DVD Fans Op Panel
  • 74. © 2011 IBM Corporation IBM Power Systems 75 POWER7 Modular Rear View Two GX++ Bays IVE Ports Two Power Supplies FSP Connectors HMC Ports P C I e P C I e P C I e P C I e P C I e P C I e SPCN Ports HMC Ports Serial Port USB Ports
  • 75. © 2011 IBM Corporation IBM Power Systems 76 POWER7 Modular System View Socket Socket Fan Fan Fan Fan Fan PCIe Slot PCIe Slot PCIe Slot PCIe Slot PCIe Slot PCIe Slot FSP & Clock Regulator Memory DIMMs Qty: 8 Memory DIMMs Qty: 4 Memory DIMMs Qty: 4 TPMD Power GX++ (12X) SFF 16 DIMM cards
  • 76. © 2011 IBM Corporation IBM Power Systems 77 Serial Port –Power 770 & Power 780 support one serial port in the rear of the system. –Connector is a standard 9-pin male D-shell & it supports RS232 interface. –Power 770 & Power 780 is a HMC managed system, this serial port is always OS controlled and therefore available in any system configuration. –It is support any serial device that has an OS Device Driver. –The FSP virtual console will be on the HMC –AIX and Linux use only, No IBM i USB Controller –USB controller is used to provide 3 USB ports. • One on the operator panel in front and two in the rear. –A stacked USB connector is used. –There is no sharing of these USB ports with the FSP. –The FSP has its own USB port located on the FSP card itself. –AIX and Linux use only, CEC I/O Ports
  • 77. © 2011 IBM Corporation IBM Power Systems 78 Power 770 / 780 Four CEC Configuration
  • 78. © 2011 IBM Corporation IBM Power Systems 79 CEC Enclosure 1 FSP/ Clock CEC Enclosure 2 FSP/ Clock CEC Enclosure 3 Drw to Drw Connection CEC Enclosure 4 Drw to Drw Connection Drw to Drw Connection Point to Point Cabling  Three cables Hot Drawer Add Support Add cables to live systems No disruptions Hot Failover support FSP Clock Concurrent Service Support FSP Cabling Configuration ( Logical View ) Front Rear Drw to Drw Connection
  • 79. © 2011 IBM Corporation IBM Power Systems 80 FSP 4 Enclosure Configuration Enclosure 1 Enclosure 2 Enclosure 3 Enclosure 4 Cable 2 Cable 1 Cable 3
  • 80. © 2011 IBM Corporation IBM Power Systems 81 19-inch Rack Considerations 2 1 Cables wider than CEC Multi-enclosure configurations supported in IBM “Enterprise” racks:  IBM 7014-T00, -T42, #0551, #0553  No problems with a front door (regular or acoustic), but if use rack trim, need new #6247 trim kit
  • 81. © 2011 IBM Corporation IBM Power Systems 82 SSD / DASD Support Dual Split Backplane Mode –SSDs supported –No mixing of SSDs and HDDs with a split domain –No mirroring between SSD drives and HDD drives Triple Split Backplane Mode –SSDs supported –No mixing of SSDs and HDDs with a split domain –No mirroring between SSD drives and HDD drives RAID Internal Drives –SSDs supported –Can install both SSD and HDD in internal bays • No mixing within a RAID array. RAID Internal & #5886 EXP12S Disk Drawer –Support only for HDD in this mode / No SSD support –No support for RAID of external SSD drives using FC 1819 to connect to the external DASD drawer.
  • 82. © 2011 IBM Corporation IBM Power Systems 83 POWER7 Modular Information….  Physical Specifications (4 EIA units) –Width: 483 mm (19.0 in.) –Depth: 863 mm (32.0 in.) –Height: 174 mm (6.85 in) –Weight: 70.3 kg (155 lb)  Operating voltage: –200 to 240 V  Operating Frequency: 50/60 Hz  Power Consumption: 1600 watts (maximum) –Per enclosure with 16 cores active  Power Factor: 0.97  Thermal Output: 5461 Btu/hour (maximum) – Per enclosure with 16 cores active  Power-source Loading – 1.649 kva (maximum configuration)  Noise Level and Sound –One enclosure with 16 active cores: • 6.8 bels / 6.3 bels with acoustic rack doors (operating/idle) –Four enclosures with 64 active cores: • 7.4 bels / 6.9 Bels with acoustic rack doors (operating/idle)
  • 83. © 2011 IBM Corporation IBM Power Systems 84 0 20 40 60 80 100 120 Power 780 Power 770 Power 570/32 0 5 10 15 20 25 30 35 Power 780 Power 770 Power 570/32 rPerf / KW rPerf / KBTU Power 780/770 vs Power 570/32
  • 84. © 2011 IBM Corporation IBM Power Systems 85 rPerf Performance 0 100 200 300 400 500 600 700 Power 570/32 Power 595 Power 770 Power 780
  • 85. © 2011 IBM Corporation IBM Power Systems 86 Power 780 CPW Performance 0 20 40 60 80 100 120 140 160 180 8 Core 16 Core 32 Core Power 570/32 Power 780 Estimated CPW values, not final. Final numbers will be available with announcement.
  • 86. © 2011 IBM Corporation IBM Power Systems 87 Power 795
  • 87. © 2011 IBM Corporation IBM Power Systems 88 POWER7 795 Power 795 Architecture Up to 32 Sockets ( Max 256 Cores) 4 TurboCore / 8 Max Core & 6 Core L2 & L3 Cache On Chip DDR3 Memory Up to 8 TB DASD / Bays Remote I/O Drawer ( SAS / SSD ) Book Interconnect Point to Point GX++ Bus 4 per System Book Max: 32 ( 8 Nodes ) Media Bays Media drawer Remote IO Drawers 1 – 32 drawers LPARs Up to 254 Redundant Power & Cooling Yes Hot Maintenance Yes Cooling Air Redundant Clock Yes Power / Thermal (TPMD) Advanced Energy Scale Optional DC power
  • 88. © 2011 IBM Corporation IBM Power Systems 89 32 32 32 32 32 32 32 32 24 24 24 24 24 24 24 24 16 16 16 16 16 16 16 16 Power 795 Processor Core Options  256 Cores / 32 Core Books  MaxCore Chips ( 8 Cores)  @ 4.0 GHz  192 Cores / 24 Core Books  6 Core Chips  @ 3.72 GHz  128 Cores / 16 Core Books  TurboCore Chips ( 4 Cores )  @ 4.256 GHz
  • 89. © 2011 IBM Corporation IBM Power Systems 90 POWER4™ p690 POWER4+™ p690 POWER5™ p5-595 POWER6™ Power 595 POWER7™ Power 795 Performance per Watt High-end Energy Efficiency
  • 90. © 2011 IBM Corporation IBM Power Systems 91 Power 795 Layout Bulk Power Supply Processor/Memory Book Nodes Midplane I/O Drawers (3X) Media Drawer Light Panel Node Controller (2X) System Controller(2X) Clock (2X) I/O Hub Up to 4 per node Network Hub
  • 91. © 2011 IBM Corporation IBM Power Systems 92 4 POWER7 Chips / Up to 1TB Memory 4 GX Ports / 2 Node Controllers 32 DIMM Slots per Node 2 TPMD / Node Power 795 Processor / Memory Book Node GX Bus DCA Bulk Power DCA Bulk Power DIMMs DIMMs P7 P7 P7 P7 TPMD (2) Node Cntrl GX Bus GX Bus Node Cntrl GX Bus
  • 92. © 2011 IBM Corporation IBM Power Systems 93 Power 795 Physical Specifications:  Width: - 74.9 cm (29.5 in) rack only - 77.5 cm (30.5 in) rack with side door - 77.5 cm (30.5 in) rack with slimline or acoustic door and side doors, one frame - 156.7 cm (61.7 in) rack with slimline or acoustic door and side doors, two frames - 77.5 cm (30.5 in) rack with slimline front door and rear door heat exchange (RDHX)  Depth: - 127.3 cm (50.1 in) rack only - 148.6 cm (58.5 in) rack with slimline and side doors, one or two frames - 180.6 cm (71.1 in) rack with acoustic and side doors, one or two frames - 152.1 cm (61.3 in) rack with slimline front door and RDHX, CEC frame only  Height: 201.4 cm (79.3 in)  Weight: Max stand-alone weight of a fully populated Power 795 CEC rack with eight processor books, with I/O drawers and without covers: - 1,102 kg (2,430 lb) three I/O drawers and without IBB - 1,193 kg (2,630 lb) two I/O drawers and with IBB Max stand-alone weight of a powered Expansion Rack without covers: - 1,200 kg (2,645 lb) eight I/O drawers and without IBB - 1,291 kg (2,845 lb) seven I/O drawers and with IBB
  • 93. © 2011 IBM Corporation IBM Power Systems 94 Power 795 Physical Specifications:  OPERATING ENVIRONMENT:  Temperature (air cooled): System operating temperature range at sea level: – Min of 10 deg. C to a max of 32 deg. C (50 to 90 degrees F), (Varies by altitude)  Nominal Ambient Input Air Temperature of 22.5 deg. C (72.5 deg. F) to - Ambient Input Air Temperature Range of 10 deg. C to 27 deg. C (50 deg. F to 80.6 deg F) - Max operating temperature 32 deg. C (90 degrees F), (Varies by altitude)  Max altitude: 3,048 m (10,000 ft)  Relative humidity: 20% to 80%  Acoustics: Slimline door set (#6868): -- Declared A-Weighted Sound Power Level, = 8.4 typical (8.7 max) bells -- Declared A-Weighted Sound Pressure Level, = 66 typical (69 max) decibels Acoustical door set (#6867): -- Declared A-Weighted Sound Power Level, = 7.5 typical (7.8 max) bels -- Declared A-Weighted Sound Pressure Level, = 57 typical (60 max) decibels Acoustical heat exchanger door set ( #6887) -- Declared A-Weighted Sound Power Level, = 8.0 typical (8.3 max) bels -- Declared A-Weighted Sound Pressure Level, = 62 typical (65 max) decibels  Note: Noise levels are stated below for nominal operation with each door set offering under the following two conditions: – Typical configuration: 4 processor books and 3 I/O drawers; – Max configuration: 8 processor books and 3 I/O drawers
  • 94. © 2011 IBM Corporation IBM Power Systems 95 Power is Dynamic Energy Optimization 95 61% less Max Utility Power * (kW) * Statement of Direction * System operating at nominal frequency under normal operating environment 35% less  Power 795 is designed to deliver large-scale performance at new levels of energy efficiency  Unique innovations can help enterprises reduce costs by simplifying facilities needed for power and cooling – High-voltage AC inputs – Integrated Battery Feature – New high-voltage DC inputs  Power 795 Advanced EnergyScale technology delivers new levels of monitoring and control – Redundant Thermal, Power Management Devices (TPMD) per node – Power Capping – Partition level energy policies* will enable more granular specifying of energy management options
  • 95. © 2011 IBM Corporation IBM Power Systems 96 Power Flex Multi-system infrastructure providing a highly available and flexible IT environment to support clients’ most demanding business resiliency objectives At least two systems enables active-active availability Allocate and rebalance processor and memory Live Partition Mobility for flexible workload movement Seamless growth with Capacity on Demand On/Off Processor days for extra capacity Serious flexibility.
  • 96. © 2011 IBM Corporation IBM Power Systems 97 Planned Maintenance Resource Re-balancing 64 Active 64 Inactive System A 64 Active 64 Inactive System B Maint Actions System A 64 Active System B 64 Active Temporary 64 Active 64 Inactive System B 32 Active 64 Active 32 Inactive System A 16 Active 64 Active 48 Inactive System A 16 Active 64 Active 48 Inactive System B 64 Active 64 Inactive System A 64 Active 64 Inactive System B Power Flex Examples….
  • 97. © 2011 IBM Corporation IBM Power Systems 98 40% more performance, 35% less energy when upgrading from POWER6 to POWER7. Power 595 •POWER6 technology •64 cores @ 5.0 GHz •rPerf 553 Power 795 •POWER7 technology •64 cores @ 4.25 GHz •rPerf 777 upgrade
  • 98. © 2011 IBM Corporation IBM Power Systems 99 PowerVM Virtualization
  • 99. © 2011 IBM Corporation IBM Power Systems 100 Virtualization – a substitution process Creates virtual resources from real resources. Primarily accomplished with software and/or firmware. Resources Components with architected interfaces/functions. Usually physical. May be centralized or distributed. Examples: memory, disk drives, networks, servers. Virtual Resources  Substitutes for real resources: same interfaces/functions, different attributes.  Often of part of the underlying resource, but may span multiple resources.  Separates presentation of resources to users from actual resources  Aggregates pools of resources for allocation to users as virtual resources Virtualization Concept
  • 100. © 2011 IBM Corporation IBM Power Systems 101 Aggregation Virtual Resources Resources Examples: Virtual disks, IP routing to clones Benefits: Management simplification, investment protection, scalability Insulation Add, Replace, or Change Virtual Resources Resources Examples: Spare CPU subst., CUoD Benefits: Continuous availability, flexibility, investment protection Sharing Virtual Resources Resources Examples: LPARs, VMs, virtual disks, VLANs Benefits: Resource utilization, workload manageability, flexibility, isolation Virtualization Functions and Benefits Emulation Virtual Resources Resources Examples: Arch. emulators, iSCSI, virtual tape Benefits: Compatibility, investment protection, interoperability, flexibility Resource Type Y Resource Type X
  • 101. © 2011 IBM Corporation IBM Power Systems 102 Server Virtualization Virtual Servers Physical Server Virtualization Roles: Consolidations Dynamic provisioning/hosting Workload management Workload isolation Software release migration Mixed production and test Mixed OS types/releases Reconfigurable clusters Low-cost backup servers Benefits: Higher resource utilization Greater usage flexibility Improved workload QoS Higher availability / security Lower cost of availability Lower management costs Improved interoperability Legacy compatibility Investment protection In the final analysis, the virtualization benefits take three forms: • Reduced hardware costs Higher physical resource utilization Smaller footprints • Improved flexibility and responsiveness Virtual resources can be adjusted dynamically to meet new or changing needs and to optimize service level achievement Virtualization is a key enabler of on demand operating environments • Reduced management costs Fewer physical servers to manage Many common management tasks become much easier  However, server virtualization introduces some complexity and requires skills  This partially offsets the benefits, but the net gains are generally substantial
  • 102. © 2011 IBM Corporation IBM Power Systems 103 Many small dedicated servers Servers managed individually Low resource utilization Rigid physical configurations Server, storage, network silos Wasted energy and floor space HW changes impact SW assets Extensive do-it-yourself Complex, fragile IT architecture Build-to-order by IT department Much more powerful shared servers Pools manageable as single systems High resource utilization Flexible virtual configurations Unified service management Energy and space efficiency SW assets insulated from HW Ready-to-use integrated solutions Modular, fault tolerant IT architecture Cloud utility model and self-service IT Today – Complex Sprawl End Users Web Servers App Servers App Servers App/DB Servers App/DB Server App Servers Fully Virtualized IT In The Future Pool Pool Pool Virtual Appliances Service Mgmt. Cloud Integrated Solutions Cloud
  • 103. © 2011 IBM Corporation IBM Power Systems 104 IBM develops hypervisor that would become VM on the mainframe IBM announces first machines to do physical partitioning IBM announces LPAR on the mainframe IBM announces LPAR on POWER™ 1967 1973 1987 IBM intro’s POWER Hypervisor™ for System p™ and System i™ IBM announces PowerVM 2007 2004 1999 2008 IBM announces POWER6™, the first UNIX® servers with Live Partition Mobility PowerVM Builds on IBM’s History of Virtualization Leadership A 40-year track record in virtualization innovation continues with PowerVM™
  • 104. © 2011 IBM Corporation IBM Power Systems 105 Hypervisor software/firmware runs directly on server Hypervisor software runs on a host operating system VMware GSX Microsoft Virtual Server HP Integrity VM User Mode Linux Linux KVM S/370 SI->PP & PP->SI, Sun Dynamic Domains, HP nPartitions Logical partitioning Physical partitioning Original POWER4 LPAR HP vPartitions Sun Logical Domains Adjustable partitions Partition Controller ... SMP Server OS Apps OS Apps Hypervisor SMP Server ... OS Apps OS Apps Host OS SMP Server Hypervisor ... OS Apps OS Apps Hardware Partitioning Bare Metal Hypervisor Hosted Hypervisor Server Virtualization Approaches Outlook: • Bare metal hypervisors with high efficiency and availability will become dominant for servers • Hosted hypervisors will be mainly for clients where host OS integration is important • Hardware partitioning will die out as an approach Server is subdivided into fractions each of which can run an OS Hypervisor provides fine-grained timesharing of all resources Hypervisor uses OS services to do timesharing of all resources System z PR/SM and z/VM PowerVM Hypervisor VMware ESX Server, vSphere Xen Hypervisor Microsoft Hyper-V
  • 105. © 2011 IBM Corporation IBM Power Systems 107 OS Apps Hypervisor Logical Partition (LPAR) OS Apps OS Apps OS Apps PowerVM Virtualization Technology
  • 106. © 2011 IBM Corporation IBM Power Systems 108 AIX Linux AIX AIX AIX AIX 5.3 6.1 6.1 TL8 TL1 TL2 Logical Partitions (LPARs)
  • 107. © 2011 IBM Corporation IBM Power Systems 109 LPAR LPAR LPAR LPAR 0.3 0.7 Shared processor pool Micro-partitioning and Shared Processors
  • 108. © 2011 IBM Corporation IBM Power Systems 110 PowerVM  Processors – Dedicated or shared processors – Fine-grained resource allocation – Shared processor controls* • # of virtual processors • Entitlements • Capped and uncapped • Weights – Adjustable via DLPAR  Memory – From 128MB to all physical memory – Dedicated physical memory – Active Memory Sharing (>POWER6) – Active Memory Expansion (POWER7) – Adjustable via DLPAR  IO – dedicated or shared (VIO)  Capacity On-Demand  Live Partition Mobility (>POWER6)  Group Capping (>POWER6) Dedicated Physical CPUs Shared Pool of Physical CPUs CPU CPU CPU CPU CPU CPU CPU CPU IBM AIX 5.3 2 CPU AIX 6.1 2.8 CPU Weight: 50 i OS .65 CPU Weight: 20 Linux .75 CPU Capped CoD CPUs Virtual CPU Virtual CPU Virtual CPU Virtual CPU Virtual CPU Virtual CPU Virtual CPU Virtual CPU Virtual CPU CoD CPU CoD CPU CoD CPU CoD CPU Dynamic Spares and Capacity on Demand  Scaling – Up to 254 (1000) partitions – Partitions up to 64w (256w) SMP Enterprise-Grade Virtualization for Power Systems CPU 0.1 CPU Weight: 210 VIO Server
  • 109. © 2011 IBM Corporation IBM Power Systems 111 Allocate CPU, RAM and adapters dynamically Available from POWER5 onwards Dynamic Logical Partitioning (DLPAR)
  • 110. © 2011 IBM Corporation IBM Power Systems 112 Progressive Phases of IT Transformation Virtualization and integration will be used to reduce IT complexity and cost and to improve IT qualities (agility, resilience, security, …) IT In The Future IT Today Workload optimized systems and solutions Lower IT Costs, Higher IT Quality Consolidations • Better hardware utilization • Improved IT agility • Lower power consumption Pools • Manageable like single systems • Reduced scale-out complexity • Lower operational expense • Improved resilience / security Clouds • Utility model; self-service • Lower cost; massive scalability • Public, private, and hybrid
  • 111. © 2011 IBM Corporation IBM Power Systems 113 REDUCE COST by consolidating with Power Systems  Resource sharing  Sharing system resources through virtualized consolidation reduces unused system overhead  Virtualized consolidated systems are evidenced by high utilization rates  High utilization means less hardware  Environmentally friendly  Less power and cooling is required  Less floor space is required  Fiscally responsible  Fewer processor cores drives less software costs  Newer systems are more reliable and less costly to maintain than older systems  Fewer systems translates to reduced people costs
  • 112. © 2011 IBM Corporation IBM Power Systems 114 Why is scalability important?  The #1 reason IT managers deploy virtualization solutions is workload consolidation – Put simply, the more workloads that can be encapsulated within VMs and combined onto a single server, the higher the consolidation ratio and greater the cost reduction – The integrated combination of the POWER architecture and PowerVM makes possible to achieve far higher consolidation ratios than scale-out scenarios
  • 113. © 2011 IBM Corporation IBM Power Systems 116 Reduce cost with Active Memory Sharing (and/or Active Memory Expansion)  Dynamically adjusts memory available on a physical system for multiple virtual images based on their workload activity levels: – Different workload peaks due to time zones – Mixed workloads with different time of day peaks (e.g. CRM by day, batch at night) – Ideal for highly-consolidated workloads with low or sporadic memory requirements  Available with PowerVM Enterprise Edition – Supports AIX®, IBM i and Linux workloads  Blends Power Systems hardware, firmware and software enhancements to optimize resources – Supports over-commitment of logical memory  Systems built on the POWER7 processor can use Active Memory Expansion to achieve apparent memory of as much as 2X true 0 5 10 15 Asia Americas Europe Memory Usage (GB) 0 5 10 15 Night Day Time Memory Usage (GB) Time PowerVM dynamically optimizes shared memory
  • 114. © 2011 IBM Corporation IBM Power Systems 117 External Network External Network Virtual LAN Reduce cost and complexity with Virtual LAN  Virtual networking for server-to-server communication can sustain performance while reducing network utilization and physical points-of-failure  Removes the need for network adapters and switches for communication between LPARs  Can drastically improve network recovery in the event of a disaster – no physical cables to re-connect or diagnose Reduce network latency Increase server network throughput up to 3X!
  • 115. © 2011 IBM Corporation IBM Power Systems 118 Reduce Cost with Virtual I/O Server VLAN LPAR1 LPAR2 LPAR3 LPAR4 LPAR5 LPAR6 LPAR7 LPAR8 VLAN LPAR9 LPAR10 LPAR11 LPAR12 LPAR13 LPAR14 LPAR15 LPAR16 VIOS External Network  VIOS can dramatically reduce physical resources and associated costs through more effective resource sharing Reduce I/O adapters & cabling with VIOS ! Redundant VIOS enhances reliability Network
  • 116. © 2011 IBM Corporation IBM Power Systems 119 Reduce cost by eliminating hardware and points-of- failure Single Application Server (2 CPUs) 0% 10% 20% 30% 40% 50% 60% 70% 80% Single Application Server (2 CPUs) 0% 10% 20% 30% 40% 50% 60% 70% 80% Single Application Server (2 CPUs) 0% 10% 20% 30% 40% 50% 60% 70% 80% Single Application Server (2 CPUs) 0% 10% 20% 30% 40% 50% 60% 70% 80% Single Application Server (2 CPUs) 0% 10% 20% 30% 40% 50% 60% 70% 80% Single Application Server (2 CPUs) 0% 10% 20% 30% 40% 50% 60% 70% 80% Single Application Server (2 CPUs) 0% 10% 20% 30% 40% 50% 60% 70% 80% Single Application Server (2 CPUs) 0% 10% 20% 30% 40% 50% 60% 70% 80% Single Application Server (2 CPUs) 0% 10% 20% 30% 40% 50% 60% 70% 80% Single Application Server (2 CPUs) 0% 10% 20% 30% 40% 50% 60% 70% 80% Single Application Server (2 CPUs) 0% 10% 20% 30% 40% 50% 60% 70% 80% Single Application Server (2 CPUs) 0% 10% 20% 30% 40% 50% 60% 70% 80% Single Application Server (2 CPUs) 0% 10% 20% 30% 40% 50% 60% 70% 80% Single Application Server (2 CPUs) 0% 10% 20% 30% 40% 50% 60% 70% 80% Single Application Server (2 CPUs) 0% 10% 20% 30% 40% 50% 60% 70% 80% Single Application Server (2 CPUs) 0% 10% 20% 30% 40% 50% 60% 70% 80% 0% 10% 20% 30% 40% 50% 60% 70% 80%  Reduce 32 disk drives to 8!  Reduce 32 fibre adapters to 4!  Reduce 32 LAN adapters to 4!  Reduce 128 cables to 16! Virtualize & Consolidate  Eliminate underutilized adapters  Reduce switches and cost of network operations and maintenance
  • 117. © 2011 IBM Corporation IBM Power Systems 120 Reduce cost of software licensing 0% 10% 20% 30% 40% 50% 60% 70% 80%  Reduce software costs by up to 80%!  Reduce software support costs  Reduce software subscription costs  Employ virtual shared processor pools Single Application Server (4 CPUs) 0% 10% 20% 30% 40% 50% 60% 70% 80% Single Application Server (4 CPUs) 0% 10% 20% 30% 40% 50% 60% 70% 80% Single Application Server (4 CPUs) 0% 10% 20% 30% 40% 50% 60% 70% 80% Single Application Server (4 CPUs) 0% 10% 20% 30% 40% 50% 60% 70% 80% Single Application Server (4 CPUs) 0% 10% 20% 30% 40% 50% 60% 70% 80% Single Application Server (4 CPUs) 0% 10% 20% 30% 40% 50% 60% 70% 80% Single Application Server (4 CPUs) 0% 10% 20% 30% 40% 50% 60% 70% 80% Single Application Server (4 CPUs) 0% 10% 20% 30% 40% 50% 60% 70% 80% Single Application Server (4 CPUs) 0% 10% 20% 30% 40% 50% 60% 70% 80% Single Application Server (4 CPUs) 0% 10% 20% 30% 40% 50% 60% 70% 80% Single Application Server (4 CPUs) 0% 10% 20% 30% 40% 50% 60% 70% 80% Single Application Server (4 CPUs) 0% 10% 20% 30% 40% 50% 60% 70% 80% Single Application Server (4 CPUs) 0% 10% 20% 30% 40% 50% 60% 70% 80% Single Application Server (4 CPUs) 0% 10% 20% 30% 40% 50% 60% 70% 80% Single Application Server (4 CPUs) 0% 10% 20% 30% 40% 50% 60% 70% 80% Single Application Server (4 CPUs) 0% 10% 20% 30% 40% 50% 60% 70% 80% Based on previous example of consolidating sixteen 4 core servers to one 12 core server Assumes 2.65 consolidation factor and 2.0 performance ratio Virtualization can generate significant software savings Database software $40k per core!
  • 118. © 2011 IBM Corporation IBM Power Systems 121 Partition Mobility POWER6 POWER6+ POWER7 Binary Compatibility between POWER6 and POWER7 Leverage POWER6 / POWER6+™ Compatibility Mode Migrate partitions between POWER6 and POWER7 Servers  Forward and Backward
  • 119. © 2011 IBM Corporation IBM Power Systems 122 Virtualize, Consolidate, Save Still on POWER5? You can dramatically reduce your energy usage, floor space, software license costs, maintenance costs AND increase your performance and capacity Two POWER5 590 systems • 64 cores @ 2.1 GHz • 30% utilization Power 780 • POWER7 technology • 64 cores @ 3.8 GHz • 6,400 watts • 80 virtualization • 40% more performance • Payback ~ 12-15 months Four POWER5 570 systems • 64 cores @ 1.9 GHz • 30% utilization POWER7 770 • 24 cores @ 3.5 GHz • 60% utilization 30% effective capacity increase Reduce energy usage by 90% Save ~$600k over 3 years in maint. Save >$1M in database license POWER7 770 • 24 cores @ 3.5 GHz • 60% utilization 50% effective capacity increase Reduce energy usage by 84% Save ~$250k over 3 years in maint. Save >$1M in database license * Based on US list price at announce And still have room to consolidate x86 workloads!
  • 120. © 2011 IBM Corporation IBM Power Systems 123 Capacity on Demand (CoD) CPU / Memory Required Now Future Activate resources as they are required
  • 121. © 2011 IBM Corporation IBM Power Systems 124 Capacity Upgrade on Demand On/Off Capacity Utility Capacity Capacity On Demand
  • 122. © 2011 IBM Corporation IBM Power Systems 125 PowerHA SystemMirror Power Systems High Availability Solution For mission critical application availability through planned and unplanned outage events Editions Targeted at data center or multi-site deployments Shared Storage Clustering Technology Designed for automation and minimal IT operations. 125
  • 123. © 2011 IBM Corporation IBM Power Systems 126 PowerHA SystemMirror for AIX Standard Edition  Cluster management for the data center – Monitors, detects and reacts to events – Establishes a heartbeat between the systems – Enables automatic switch-over  IBM shared storage clustering – Can enable near-continuous application service – Minimize impact of planned & unplanned outages – Ease of use for HA operations PowerHA SystemMirror for AIX Enterprise Edition  Cluster management for the Enterprise – Multi-site cluster management – Includes the Standard Edition function PowerHA SystemMirror Editions
  • 124. © 2011 IBM Corporation IBM Power Systems 127 PowerHA SystemMirror 7.1 Standard Edition Simpler to deploy and easier to manage with IBM Systems Director, intuitive interfaces, cluster and resource group wizards, management dashboards and Smart Assists for SAP and other popular applications Minimize IT operations with cluster aware AIX; cluster wide AIX commands, kernel based event management, device naming, central repository and multi-channel communications Robust cluster integrity with disk fencing and multi-channel heart beat which automatically uses available I/O including SAN. Complete end to end failover automation with policy driven resource group relationship sequencing
  • 125. © 2011 IBM Corporation IBM Power Systems 128 Operating System
  • 126. © 2011 IBM Corporation IBM Power Systems 129 Network Centric Computing AIX V2 & V3 Establishment in the market: - RISC Support - UNIX credibility - Open Sys. Stds.. - Dynamic Kernel - JFS and LVM - SMIT AIX V3.2.5 Maturity: - Stability - Quality AIX V4.1/4.2 SMP Scalability: - POWERPC spt. - 4-8 way SMP - Kernel Threads - Client/Server pkg - NFS V3 - CDE - UNIX95 branded - NIM - > 2GB filesystems -HACMP Clustering - POSIX 1003.1, 1003.2, XPG4 - Runtime Linking - Java 1.1.2 AIX V4.3 Higher levels of scalability: - 24-way SMP - 64-bit HW support - 96 GB memory - UNIX98 branded - TCP/IP V6 - IPsec - Web Sys. Mgr. - LDAP Dir. Server. - Workload Mgr - Java JDT/JIT - Direct I/O - Alt. Disk Install - Exp/Bonus CDs Distributed Client-Server 1986-1992 1994-1996 1997-1999 Flexible Resource Management: - POWER4+ spt. - Dynamic LPAR - Dynamic CUoD - New 64bit kernel - 512GB mem - JFS2 - 16 TB filesystems - UNIX03 branded - Concurrent I/O - MultiPath I/O - Flex LDAP Client - XSSO PAM spt e-Business Computing Open Systems Workstations AIX Evolution – Over Twenty years of Progress AIX/6000 Uni-processor 4-8 way SMP 24-way SMP 32-way SMP AIX 7 Future of UNIX: -256 core/1024 tread scalability -POWER7 Exploitation -Domain based RBAC - AIX Profile Manager -WPAR enhancements -AIX 5.2 in a WPAR -PowerVM virtualized storage -LVM SSD support -Terabyte segment 2010 On Demand Business 2001-2002 64/256-way SMT AIX 5L V5.3 Advanced Virtualization: - POWER5 support - 64-way SMP - SMT - MicroPartitions™ - Virt I/O Server - Partition Load Mgr - NFS Version 4 - Adv. Accounting - Scaleable VG - JFS2 Shrink - SUMA - SW RAS features - POSIX Realtime 2004-2005 AIX 5L V5.1/5.2 Smarter Planet 2007 AIX 6 Enterprise RAS: -POWER6 support -Workload Partitions -Application Mobility -Continuous Avail. -Storage Keys -Dynamic tracing -Software FFDC -Recovery Rtns -Concurrent MX -Trusted AIX -RBAC -Encrypting JFS2 -AIX Security Expert -Director Console New Enterprise Data Center 1024-way SMT4
  • 127. © 2011 IBM Corporation IBM Power Systems 130  Workload-Optimizing Systems – Vertical scalability for massive workloads with up to 256 cores/1024 threads in a single AIX partition  Virtualization without limits – Run AIX 5.2 in a WPAR to simplify consolidation of legacy environments on POWER7  Resiliency without downtime – Built in clustering to simplify configuration and management of scale-out workloads and high availability solutions  Management with Automation – Profile based configuration management eases the management of pools of AIX systems AIX 7 -- The Future of UNIX *All statements regarding IBM's future direction and intent are subject to change or withdrawal without notice, and represent goals and objectives only. Some features require the purchase of additional software components.
  • 128. © 2011 IBM Corporation IBM Power Systems 131 AIX Workload Partitions (WPAR)  WPARs are designed to save administrator work by reducing the number of AIX instances to patch  WPARs have much lower memory resource requirements: 68 MB vs 1GB for an LPAR  WPAR takes seconds to create and LPARs minutes  Application mobility much simpler to organize than LPM  Lots of WPARs on one AIX is simpler to monitor and control than monitoring across many LPARs.  Rapid cloning is easy and lets you use "disposable images" - simple to create, experiment and throw away Virtualized AIX operating system environments within a single AIX image Each WPAR shares the single AIX operating system AIX 7 added the capability to run AIX 5.2 in a WPAR* Applications and users inside a WPAR cannot affect resources outside the WPAR* Each WPAR can have a regulated share of processor, memory and other resources Two types of WPAR - System WPARs have separate security and appear like a completely separate OS - Application WPARs are manageability wrappers around a single application Top reasons to use WPARs What is it? * Requires purchase of the AIX 5.2 WPARs for AIX 7 product Networks Disk or NFS storage Networks Disk or NFS storage
  • 129. © 2011 IBM Corporation IBM Power Systems 132 AIX 7 WPAR Enhancements  Export of Fibre channel adapters to WPARs – NPIV-like, but can work on any Fibre Channel adapter – Adds support for Fibre Channel tape  Kernel Extensions for WPARs – Trusted kernel extensions may be loaded by the WPAR administrator – Extensions can be only for one WPAR or for entire system  Support for VIOS disks in WPARs – VSCSI disks can be exported to a WPAR – This feature also available in AIX 6 Technology Level 6  Run AIX 5.2 inside of a Workload Partition – Consolidate older environments on POWER7 processor-based systems – Requires AIX 5.2 WPARs for AIX 7 – available separately from AIX 7
  • 130. © 2011 IBM Corporation IBM Power Systems 133 Cluster Aware AIX  Easily create clusters of AIX instances for scale-out computing or high availability  Designed to: – Significantly simplify cluster configuration, construction, and maintenance – Designed to improve availability by reducing the time to discover failures – Capabilities such as common device naming help simplify administration – Built in event management and monitoring  A foundation for future AIX capabilities and the next generation of PowerHA SystemMirror and PowerVM Designed to simplify construction and management of clusters of AIX systems for scale-out computing and high availability
  • 131. © 2011 IBM Corporation IBM Power Systems 134 Virtualization Enhancements for IBM i 1. IBM i 6.1 partition can host  IBM i 7.1 and 6.1 partitions  AIX 5.2, 5.3, 6.1 and SLES and Red Hat Linux partitions  iSCSI attached System x and BladeCenter 2. IBM i 7.1 partition can host  IBM i 7.1 and 6.1 partitions  AIX 5.2, 5.3, 6.1 and SLES and Red Hat Linux partitions  iSCSI attached System x and BladeCenter 3. PowerVM VIOS can host  IBM i 7.1 and 6.1 partitions  AIX and Linux partitions  VIOS supports advanced virtualization technologies including Active Memory Sharing and NPIV POWER6 & POWER7 VIOS IBM i 6.1 POWER6 & POWER7 VIOS IBM i 7.1 POWER6 & POWER7 VIOS IBM i 7.1 IBM i 6.1 VIOS VIOS IBM i 7.1 IBM i 6.1 VIOS IBM i 7.1 IBM i 6.1 Storage Virtualization can reduce costs while improving IT infrastructure flexibility
  • 132. © 2011 IBM Corporation IBM Power Systems 135 IBM Partner World and eConfig Access  https://www-304.ibm.com/partnerworld/wps/servlet/ContentHandler/pw_home_pub_index
  • 133. © 2011 IBM Corporation IBM Power Systems 136
  • 134. © 2011 IBM Corporation IBM Power Systems 137
  • 135. © 2011 IBM Corporation IBM Power Systems 138
  • 136. © 2011 IBM Corporation IBM Power Systems 139
  • 137. © 2011 IBM Corporation IBM Power Systems 140 Tools/Web for Power Systems  Landing page for Power Systems - http://www- 03.ibm.com/systems/power/index.html?ca=power_productlink  Power Systems benchmarks - http://public.dhe.ibm.com/common/ssi/ecm/en/poo03017usen/POO03017USEN.P DF  PartnerWorld website contains links to lots of product information  System Planning Tool – help in configuring Power Systems with LPARs – http://www-947.ibm.com/systems/support/tools/systemplanningtool/  Web Lectures - http://www- 304.ibm.com/services/weblectures/smartzone/powersales/ or https://www- 304.ibm.com/services/weblectures/dlv/Gate.wss?handler=Login&sequence=9&ac tion=index&customer=partnerworld&offering=caps&category=&itemCode=&curric ulum=
  • 138. © 2011 IBM Corporation IBM Power Systems 141 Product Certifications – Power Systems  http://www-03.ibm.com/certify/certs/ps_index.shtml - product certifications for Power systems
  • 139. © 2011 IBM Corporation IBM Power Systems 142
  • 140. © 2011 IBM Corporation IBM Power Systems 143 143 IBM Power Systems Smarter systems for a Smarter Planet.