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Advanced packaging assembly solution

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Provide market needs, technically advanced, through hole component Auto Insertion solutions for PCB assembly challenges in LED, Power Supply,Audio amplifier,LCD TV.

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Advanced packaging assembly solution

  1. 1. www.smthelp.com ✦ Advanced Packaging Assembly Solution
  2. 2. www.smthelp.com Solutions for Advanced Packaging Assembly Flip Chip die PCB Flux High Accuracy Placement: Embedded Device WLCSP Power QFN Flip Chip Die Attach SIP/MCM Assembly: Die Attach Flip Chip & Component Placement Chip
  3. 3. www.smthelp.com Growth In Advanced Packaging

  4. 4. www.smthelp.com The closest Package format 
 to a Flip Chip or WLCSP Package
 
 
 What’s new?
 QFN (Quad Flatpack No Lead) Flip Chip die PCB Flux
  5. 5. www.smthelp.com QFN Market Assessment
 APAS Opportunity TotalQFN&PQFNPackages 0 12.5 25 37.5 50 Year 2009 2010 2011 2012 2013 2014 2015 12.4 10.3 8.6 7.2 5.4 43.6 41.4 34.5 28.7 24 21.8 19.8 18 QFN Units PQFN Units Market in Transition Price of Gold Thermal Performance Electrical Performance
  6. 6. www.smthelp.com PQFN Market Assessment
 Packaging Units, Lines and Capacity Needs Incremental Capacity(m/c's&$M) 0 32.5 65 97.5 130 TotalPQFNPackages(B) 0 3.25 6.5 9.75 13 Year 2009 2010 2011 2012 2013 2014 2015 PQFN Units Incremental PQFN m/c's Incr CAPEX $ M 90.97 75.81 63.17 129.96 108.3 90.25 12.4 10.3 8.6 7.2 5.4 4 3.6 63.17 75.81 90.9790.25 108.3 129.96 Incremental CAPEX $ Incremental Lines needed
  7. 7. www.smthelp.com Annual Savings from no Taping = $300,000 / Year 
 
 PER COMPONENT! Wafer Re-constitution - WLCSP
  8. 8. www.smthelp.com
  9. 9. www.smthelp.com OSAT’s Strategic Value
  10. 10. www.smthelp.com

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