Provide market needs, technically advanced, through hole component Auto Insertion solutions for PCB assembly challenges in LED, Power Supply,Audio amplifier,LCD TV.

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✦ Advanced Packaging Assembly Solution

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Solutions for Advanced Packaging Assembly
Flip Chip die
PCB
Flux
High Accuracy Placement:
Embedded Device
WLCSP
Power QFN
Flip Chip Die
Attach
SIP/MCM Assembly:
Die Attach
Flip Chip
& Component
Placement
Chip

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Growth In Advanced Packaging

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The closest Package format
to a Flip Chip or WLCSP Package
What’s new?
QFN (Quad Flatpack No Lead)
Flip Chip die
PCB
Flux

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QFN Market Assessment
APAS Opportunity
TotalQFN&PQFNPackages
0
12.5
25
37.5
50
Year
2009 2010 2011 2012 2013 2014 2015
12.4
10.3
8.6
7.2
5.4
43.6
41.4
34.5
28.7
24
21.8
19.8
18
QFN Units PQFN Units
Market in Transition
Price of Gold
Thermal Performance
Electrical Performance

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PQFN Market Assessment
Packaging Units, Lines and Capacity Needs
Incremental
Capacity(m/c's&$M)
0
32.5
65
97.5
130
TotalPQFNPackages(B)
0
3.25
6.5
9.75
13
Year
2009 2010 2011 2012 2013 2014 2015
PQFN Units Incremental PQFN m/c's Incr CAPEX $ M
90.97
75.81
63.17
129.96
108.3
90.25
12.4
10.3
8.6
7.2
5.4
4
3.6
63.17
75.81
90.9790.25
108.3
129.96
Incremental CAPEX $
Incremental Lines needed

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Annual Savings from no Taping =
$300,000 / Year
PER COMPONENT!
Wafer Re-constitution - WLCSP

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OSAT’s Strategic Value

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