1. YUNJIAN CUI
Piscataway, NJ 08854 732-319-2777 yc773@scarletmail.rutgers.edu
EDUCATION RUTGERS UNIVERSITY New Brunswick, NJ
ME, Mechanical Engineering May 2017
GPA: 3.25
HUAQIAO UNIVERSITY Xiamen, China
BE, Mechanical Engineering and Automation July 2015
GPA: 3.4
EXPERIENCE MAZZEO RESEARCH GROUP New Brunswick, NJ
DEPARTMENT OF MECHANICAL September 2015-
AND AEROSPACE ENGINEERING
RUTGERS UNIVERSITY
 Involved in invention of low cost electrical conductive paper, paper-based
embedded EEG (ECG) electrodes, paper-based sweat sensors 
 Research of paper-based embedded soft sensors 
MOE ENGINEERING RESEARCH CENTER Xiamen, China
FOR BRITTLE MATERIALS MACHINING October 2014- June 2015
 Involved in fabrication and evaluation of brazed micro powder diamond
mill-grinding tool
 Studied the performance of the brazed diamond mill-grinding tool
mill-grinding Al2O3 ceramic and artificial sapphire with ultrasonic assisted
PUBLICATION Jianyun Shen, Jiangquan Wang, Yunjian Cui, and Xipeng Xu. Fabrication and
Evaluation of Brazed Micro Powder Diamond Mill-Grinding Tool
[R]. INTERTECH 2015 (An International Technical Conference on Diamond,
Cubic Boron Nitride and Their Application), Paper #1549, Indianapolis, Indiana
USA, May 19-20, 2015
SKILL Language: English (Working Proficiency), Chinese (Native)
Proficient using: AutoCAD, Inventor, PTC Creo, SolidWorks, Ansys, Matlab,
MS Office
Programming skills: C++, Python
Good team-working skill