Work as UPS Die Bond process in Infineon Technology (M) Sdn. Bhd.

1. RESUME
Name : CHO WEI KIAN
Contact Number : 012-6146869
Home Address : 217, Jalan Kenanga, 3/31,
Taman Kenanga Seksyen 3,
Jalan Gajah Berang, 75200 Melaka.
Email address : cho_roger@hotmail.com /
WeiKian.Cho@infineon.com
Background of myself:
Univerity : University of Malaya, Year of 2011
Degree :Bachelor of Engineering Degree (B.Sc.) (Hons.) Majoring in Manufacturing
EducationBackground:
Secondary Education SPM
Field of study Sciences
School Sekolah Menengah Katholik, Melaka
Grade 5A’s
Secondary Higher Education STPM
Field of study Sciences
School Sekolah Menengah Gajah Berang, Melaka
CGPA 3.50/4.00
Muet Band 3
Tertiary Education Bachelor of Engineering Degree
Field of study Bachelor of Engineering Degree (B.Sc.) (Hons.) Majoring in Manufacturing
University University of Malaya
Current CGPA 3.19/4.00
Personal Strength:
 Fast Learner.
 Willing to learn and accept the challenge for the purpose of company.
 Have good responsibility and attitude.
 Independence. Self-motivated, initiative, enthusiastic to learn and willing to take challenges.
 Have team work management.
 Ready to meet people, accept new ideas and adapt to new environment.

2. Skills:
Engineering Design software Auto CAD 2004, Catia, Pro-E, Master CAM, Matlab R2006
IT skill Microsoft Office (Word, Excel, and Power Point), Microsoft Visual C++
Languages Malay Chinese English
Written - Rating 7 9 8
Spoken - Rating 8 9 8
(Rating 1-10; Proficiency: 1 = poor, 10 = excellent)
Internship Experience:
I have been undergone my internship at NYLEX Company (MALAYSIA) SDN BHD for the period for 10 weeks.
(3/5/2010 – 9/7/2010)
 Observe the process at production line. (For Calendering Process)
 Know the experience of working at Quality Assurance (QA) Department.
 Have been given a task to study howto maximize the productivity by learning the STATISTICAL
PROCESS CONTROL (SPC)
 Know the safety and precaution during working at Production line.
Working Experience:
INFINEON Malacca (POWER Segment M2)
1. Overall Achievement 2013-2014 In Infineon POWER Segment (Module 2):
 Gold Medal Award on MPC (Southen Regional Convension on Team Excellent 2014)
 Malaysia National Competition MPC ICC 2014, Electronic Sector
 TO252- 5PFC DVSD Yield Improvement - 80%
 TO252- 3SR DVSD Yield Improvement - 42%
 Top Chip Variance Yield Improvement - 53%
 Insufficient Solder Improvement 90%
 SMT (Self Management Team) Mentor for DPAK STS DB TEAM (6 teams) => 6/6 teams are
awarded on Level 1.3 certifiticate on SMT performance.
 Crack Die solved on Thin wafer device (70um)
 Revise the vespel collet design for efficiency while running production
2. Competancy:
 CAMSTAR System(Automation)
 WORKSTREAM
 SPACE
 Deviation & Decision Management (DDM)
 IPC
 SAP
 Cerberus
 Total Fab Monitoring (TFM)
 Boxi Yield Compilation
 TBD
 Assembly Spec Approval
 FMEA
 FE Basic Process

3. 3. Equipment handle:
a. Die bond => ESEC2007 SSI plus
b. Die bond => ESEC2008 HS PLUS
c. Die bond => ESEC2009 SSI e
d. Die bond => Tosok Machine
e. BLUE M OVEN
Co-Curriculum Activities:
1. Persembahan Gubahan Lagu University Malaya-DAYAO(08)
Position: Logistic leader
2. St. John Ambulans Sekolah Menengah Katholik
Position: AJK
3. Participants of (MONEY TREE IDEA EXCHANGE) MIX programme, organized by Sunway group, 2011.
4. Participants of 30 hour Famine, 2009
References:
Yap Hwa Jen
Lecturer of Department of Engineering Design & Manufacture,
Faculty of Engineering, University of Malaya,
50603 Kuala Lumpur, Malaysia.
Tel : +603 7967 5240 (direct) or +603 7967 5383/5369 (Office)
Fax : +603 7967 5330
Email : hjyap737@um.edu.my or hjyap737@yahoo.com