SlideShare a Scribd company logo
1 of 19
Download to read offline
LAUNCHXL-F28027 C2000 Piccolo LaunchPad
Experimenter Kit
User's Guide
Literature Number: SPRUHH2
July 2012
Contents
1 LAUNCHXL-F28027 Overview ............................................................................................... 4
1.1 Overview .................................................................................................................. 4
1.2 Kit Contents .............................................................................................................. 5
1.3 Revisions ................................................................................................................. 5
2 Installation ......................................................................................................................... 5
2.1 Download the Required Software ..................................................................................... 5
2.2 Install the Software ...................................................................................................... 6
2.3 Install the Hardware ..................................................................................................... 6
3 Getting Started with the LAUNCHXL-F28027 ........................................................................... 6
3.1 Getting Started ........................................................................................................... 6
3.2 Demo Application, Internal Temperature Measurement ............................................................ 6
3.3 Program and Debug the Temperature Measurement Demo Application ........................................ 6
4 Hardware Configuration ....................................................................................................... 6
4.1 Power Domain ........................................................................................................... 7
4.2 Serial Connectivity ...................................................................................................... 7
4.3 Boot Mode Selection .................................................................................................... 7
4.4 Connecting a Crystal .................................................................................................... 7
4.5 Connecting a Satellite Board .......................................................................................... 7
4.6 Device Migration Path .................................................................................................. 8
5 LAUNCHXL-F28027 Hardware ............................................................................................... 8
5.1 Device Pin Out ........................................................................................................... 8
5.2 Schematics ............................................................................................................... 9
5.3 PCB Layout ............................................................................................................. 11
5.4 Bill of Materials (BOM) ................................................................................................ 12
6 Suggested Reading ........................................................................................................... 13
7 Frequently Asked Questions (FAQ) ...................................................................................... 14
2 Table of Contents SPRUHH2–July 2012
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
www.ti.com
List of Figures
1 LAUNCHXL-F28027 Board Overview .................................................................................... 5
2 C2000 LaunchPad Schematic—Sheet 1 of 2 ........................................................................... 9
3 C2000 LaunchPad Schematic—Sheet 2 of 2.......................................................................... 10
4 LAUNCHXL-F28027 PCB Layout—Top Layer ........................................................................ 11
5 LAUNCHXL-F28027 PCB Layout—Bottom Layer .................................................................... 11
6 LAUNCHXL-F28027 PCB Layout—Silkscreen Image................................................................ 11
List of Tables
1 C2000 LaunchPad Pin Out and Pin Mux Options ...................................................................... 8
2 LAUNCHXL-F28027 Bill of Materials ................................................................................... 12
3SPRUHH2–July 2012 List of Figures
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
User's Guide
SPRUHH2–July 2012
LAUNCHXL-F28027 C2000 Piccolo LaunchPad
Experimenter Kit
1 LAUNCHXL-F28027 Overview
1.1 Overview
The C2000™ Piccolo™ LaunchPad™, LAUNCHXL-F28027, is a complete low-cost experimenter board
for the Texas Instruments Piccolo F2802x devices. The LAUNCHXL-F28027 kit features all the hardware
and software necessary to develop applications based on the F2802x microprocessor. The LaunchPad is
based on the superset F28027 device, and easily allows users to migrate to lower cost F2802x devices
once the design needs are known. It offers an on-board JTAG emulation tool allowing direct interface to a
PC for easy programming, debugging, and evaluation. In addition to JTAG emulation, the USB interface
provides a UART serial connection from the F2802x device to the host PC.
Users can download an unrestricted version of Code Composer Studio™ IDE version 5 to write,
download, and debug applications on the LAUNCHXL-F28027 board. The debugger is unobtrusive,
allowing the user to run an application at full speed with hardware breakpoints and single stepping
available while consuming no extra hardware resources.
As shown in Figure 1, the LAUNCHXL-F28027 C2000 LaunchPad features include:
• USB debugging and programming interface via a high-speed galvanically isolated XDS100v2 emulator
featuring a USB/UART connection.
• Superset F28027 device which allows applications to easily migrate to lower cost devices.
• Nibble (4-bit) wide LED display.
• Two push buttons for user feedback and device reset.
• Easily accessible device pins for debugging purposes or as sockets for adding customized extension
boards.
• Boot selection and USB and UART disconnect switches.
C2000, Piccolo, LaunchPad, Code Composer Studio, controlSUITE are trademarks of Texas Instruments.
Windows is a registered trademark of Microsoft Corporation in the United States and/or other countries.
All other trademarks are the property of their respective owners.
4 LAUNCHXL-F28027 C2000 Piccolo LaunchPad Experimenter Kit SPRUHH2–July 2012
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
USB Connection
JTAG
Isolation
Jumpers:
JP1 and JP3
S4 Serial
Connection Switch
S1 Boot
Selection Switch
CPU Reset
Push Button
JTAG Emulator
Circuitry
Four LEDs
Serial
TX/RX
LEDs
Jumper: JP2
20 PCB Pins
(doubled-sided male connectors)
Pre-Programmed C2000
Piccolo TMS320F28027
MCU
Programmable
Push Button:
GPIO12
www.ti.com Installation
Figure 1. LAUNCHXL-F28027 Board Overview
1.2 Kit Contents
The LAUNCHXL-F28027 C2000 LaunchPad experimenter kit includes the following items:
• C2000 LaunchPad Board (LAUNCHXL-F28027)
• Mini USB-B Cable, 0.5m
• Quick Start Guide
1.3 Revisions
The first production revision of the LAUNCHXL-F28027 C2000 Piccolo LaunchPad, version 1.0, was
released in July of 2012 and is currently the only revision available.
2 Installation
The C2000 LaunchPad installation consists of three easy steps:
1. Download Code Composer Studio and controlSUITE™.
2. Install Code Composer Studio and controlSUITE.
3. Connect and install the C2000 LaunchPad to the PC.
Now the LaunchPad is ready to develop applications or run the pre-programmed demo.
2.1 Download the Required Software
Code Composer Studio IDE is available for free without any restriction when used with the XDS100
emulator on the C2000 LaunchPad. The software can be downloaded from the C2000 LaunchPad page at
www.ti.com/c2000-launchpad. At this site, you can also download a copy of controlSUITE that includes
drivers, examples, and other support software needed to get started.
5SPRUHH2–July 2012 LAUNCHXL-F28027 C2000 Piccolo LaunchPad Experimenter Kit
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Getting Started with the LAUNCHXL-F28027 www.ti.com
2.2 Install the Software
Once downloaded, install Code Composer Studio and the controlSUITE package.
2.3 Install the Hardware
After Code Composer Studio is installed, plug the supplied USB cable into the C2000 LaunchPad board
and into an available USB port on your computer.
Windows® will automatically detect the hardware and ask you to install software drivers. Let Windows run
a search for the drivers and automatically install them. After Windows successfully installs the drivers for
the integrated XDS100v2 emulator, your LaunchPad is now ready for use.
3 Getting Started with the LAUNCHXL-F28027
3.1 Getting Started
The first time the LAUNCHXL-F28027 is used, a demo application automatically starts when the board is
powered from a USB host. If your board does not start the demo application, try placing S1 in the following
positions and resetting the board: UP - UP - DOWN. To start the demo, connect the LAUNCHXL-F28027
with the included mini-USB cable to a free USB port. The demo application starts with the LEDs flashing
to show the device is active.
3.2 Demo Application, Internal Temperature Measurement
The LAUNCHXL-F28027 includes a pre-programmed TMS320F28027 device. When the LaunchPad is
connected via USB, the demo starts with an LED flash sequence that points toward S3. Press S3 to start
the temperature measurement mode.
A reference temperature is taken at the beginning of this mode and the LEDs of the LaunchPad are used
to display any difference between the current temperature and the reference temperature. Initially, the
LED connected to GPIO3 is lit to indicate an 8 in binary, which corresponds to the current temperature
being equal to the reference temperature. As the temperature drifts away from the reference, the
difference is displayed as a binary increment or decrement of the nibble wide LED display. For instance, if
the reference temperature was 30ºC and the current temperature is 33ºC, the LEDs would be (from left to
right) ON, OFF, ON, and ON which would be 11 in binary (33-30=3 and 11-8=3). A new reference
temperature may be set at any time by pressing S3 again.
In addition to the LED display, temperature information is also displayed on your PC through the
USB/UART connection. To view the UART information on your PC, first figure out the COM port
associated with the LaunchPad. To do this in Windows, right click on My Computer and click on
Properties. In the dialog box that appears, click on the Hardware tab and open Device Manager. Look for
an entry under Ports (COM & LPT) titled "USB Serial Port (COMX)", where X is a number. Remember this
number for when you open a serial terminal. The demo applications UART data was written and debugged
using PuTTY, and for the best user experience we recommend you use PuTTY to view the UART data.
Open your serial terminal program and open the COM port you found previously in device manager with
the following settings: 115200 Baud, 8 data bits, no parity, 1 stop bit. After opening the serial port in your
serial terminal, reset the Launchpad with the reset push button and observe the serial terminal for a
surprise.
3.3 Program and Debug the Temperature Measurement Demo Application
The project and associated source code for the C2000 Piccolo LaunchPad demo is included in the
controlSUITE software package and should automatically be found by the TI Resource Explorer in Code
Composer Studio v5. In the resource explorer, open the controlSUITE folder and then the kits tab and look
for the C2000 LaunchPad line item. Expand this item and select the LaunchPad Demo Application. Follow
the steps in the main pane of the resource explorer to import, build, debug, and run this application.
4 Hardware Configuration
The C2000 LaunchPad gives users several options as to how to configure the board.
6 LAUNCHXL-F28027 C2000 Piccolo LaunchPad Experimenter Kit SPRUHH2–July 2012
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
www.ti.com Hardware Configuration
4.1 Power Domain
The C2000 LaunchPad has two separate power domains for the purpose of allowing JTAG isolation.
Jumpers JP1, JP2, and JP3 configure whether the USB power is passed to the target device.
Jumper Power Domain
JP1 3.3 V
JP2 Ground
JP3 5 V
4.2 Serial Connectivity
The LAUNCHXL-F28027 has a USB to UART adapter built in. This makes it easy to print debug
information back to the host PC even in isolated environments. However, in some cases the user may
wish to connect the Piccolo SCI peripheral (C2000 UART peripheral) to a BoosterPack or other hardware
via the header pins. If the SCI pins are connected to both the header pins, the XDS100 UART channel
contention would exist and the pins would not be driven to the correct voltage levels. To solve this issue
we have included a switch to allow the user to disconnect the Piccolo serial pins from the XDS100 UART
connection. When S4 is in the up position, the Piccolo device's SCI is connected to the XDS100 and you
are able to receive and send serial information from or to the board. When S4 is in the down position, the
Piccolo device's SCI is disconnected from the XDS100 and BoosterPacks, which use serial
communication, and can communicate with the Piccolo device.
4.3 Boot Mode Selection
The LaunchPad's F28027 device includes a boot ROM that performs some basic start-up checks and
allows for the device to boot in many different ways. Most users will either want to perform an emulation
boot or a boot to flash (if they are running the application standalone). S1 has been provided to allow
users to easily configure the pins that the bootROM checks to make this decision. The switches on S1
correspond to:
Switch Function
1 GPIO34
2 GPIO37
3 TRSTn
Keep in mind that the debugger does not connect if the device is not in the emulation boot mode (TRST
switch in the up position). More information about boot mode selection can be found in the
TMS320x2802x Piccolo Boot ROM Reference Guide (SPRUFN6).
4.4 Connecting a Crystal
Although the Piccolo device present on the LAUNCHXL-F28027 has an internal oscillator — and for most
applications this is sufficient — the LaunchPad offers a footprint for surface mount or through-hole HC-49
crystals for users who require a more precise clock. If you wish to use an external crystal, solder the
crystal to the Q1/Q2 footprint and appropriate load capacitors to the C3 and C4 footprints. You also need
to configure the device to use the external oscillator in software.
4.5 Connecting a Satellite Board
The C2000 LaunchPad is the perfect experimenter board to start hardware development with the F2802x
devices. Connectors J1, J2, J5, and J6 and the power supply at J3 are aligned in a 0.1-in (2.54-mm) grid
to allow an easy and inexpensive development of a breadboard extension module. These satellite boards
can access all of the GPIO and analog signals. The alignment of the connectors and the pin out can be
found in Section 5.
7SPRUHH2–July 2012 LAUNCHXL-F28027 C2000 Piccolo LaunchPad Experimenter Kit
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
LAUNCHXL-F28027 Hardware www.ti.com
4.6 Device Migration Path
Applications developed on the LAUNCHXL-F28027 can easily be migrated to any of these lower cost
devices in the F2802x family:
Part Number Description
TMS320F28027(1)
32-bit Real Time Microcontroller, 60 MHz, 32K Flash, 6K RAM, 4 HRPWM
TMS320F28026 32-bit Real Time Microcontroller, 60 MHz, 16K Flash, 6K RAM, 4 HRPWM
TMS320F28023 32-bit Real Time Microcontroller, 50 MHz, 32K Flash, 6K RAM, 4 HRPWM
TMS320F28022 32-bit Real Time Microcontroller, 50 MHz, 16K Flash, 6K RAM, 4 HRPWM
TMS320F28021 32-bit Real Time Microcontroller, 40 MHz, 32K Flash, 5K RAM
TMS320F28020 32-bit Real Time Microcontroller, 40 MHz, 16K Flash, 3K RAM
TMS320F280200 32-bit Real Time Microcontroller, 40 MHz, 8K Flash, 3K RAM
(1)
This device is present on the LAUNCHXL-F28027.
5 LAUNCHXL-F28027 Hardware
5.1 Device Pin Out
Table 1 lists the pin out and pin mux options for the C2000 LaunchPad.
Table 1. C2000 LaunchPad Pin Out and Pin Mux Options
Mux Value Mux Value
3 2 1 0 J1 Pin J5 Pin 0 1 2 3
+3.3V 1 1 +5V
ADCINA6 2 2 GND
TZ2 SDAA SCIRXDA GPIO28 3 3 ADCINA7
TZ3 SCLA SCITXDA GPIO29 4 4 ADCINA3
Rsvd Rsvd COMP2OUT GPIO34 5 5 ADCINA1
ADCINA4 6 6 ADCINA0
SCITXDA SPICLK GPIO18 7 7 ADCINB1
ADCINA2 8 8 ADCINB3
ADCINB2 9 9 ADCINB7
ADCINB4 10 10 NC
3 2 1 0 J6 Pin J2 Pin 0 1 2 3
Rsvd Rsvd EPWM1A GPIO0 1 1 GND
COMP1OUT Rsvd EPWM1B GPIO1 2 2 GPIO19 SPISTEA SCIRXDA ECAP1
Rsvd Rsvd EPWM2A GPIO2 3 3 GPIO12 TZ1 SCITXDA Rsvd
COMP2OUT Rsvd EPWM2B GPIO3 4 4 NC
Rsvd Rsvd EPWM3A GPIO4 5 5 RESET#
ECAP1 Rsvd EPWM3B GPIO5 6 6 GPIO16/32 SPISIMOA/ Rsvd/ TZ2/
SDAA EPWMSYNCI ADCSOCA
TZ2/ Rsvd/ SPISIMOA/ GPIO16/32 7 7 GPIO17/33 SPISOMIA/ Rsvd/ TZ3/
ADCSOCA EPWMSYNCI SDAA SCLA EPWMSYNCO ADCSOCB
TZ3/ Rsvd/ SPISOMIA/ GPIO17/33 8 8 GPIO6 EPWM4A EPWMSYNCI EPWMSYNCO
ADCSOCB EPWMSYNCO SCLA
NC 9 9 GPIO7 EPWM4B SCIRXDA Rsvd
NC 10 10 ADCINB6
8 LAUNCHXL-F28027 C2000 Piccolo LaunchPad Experimenter Kit SPRUHH2–July 2012
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Emulator - XDS100v2
1.0C2000_LaunchPad.sch
10k
2.2k
3.3u
0.1u
93
0.1u0.1u0.1u
12k
1k
ISO7231
ISO7240
AGND
AGND
AGND
AGND
AGNDAGND
GND
GND
AGND
1u 0.1u
AGND
AGND
1k
AGND
330
330
12M
36p 36p
+3V3
0
0
0
0
0
0
0
0
0
TLV1117-33
100u
AGND
+3V3
AGND
AGND
AGND
AGND
4.7u 4.7u
AGND
AGND
820
AGND
500mA
+5V
R29
R31
C15
C16
62
CLK4
DO 1
DI3
CS5
VCC
GND
U8
VREGINP$50
USBDMP$7
USBDPP$8
REFP$6
RESET#P$14
OSCIP$2
OSCOP$3
EECSP$63
EECLKP$62
EEDATAP$61
TESTP$13
AGNDP$10
GND1P$1
GND2P$5
GND3P$11
GND4P$15
PWREN# P$60
SUSPEND# P$36
BCBUS3 P$54
BCBUS2 P$53
BCBUS1 P$52
BCBUS0 P$48
BDBUS7 P$46
BDBUS6 P$45
BDBUS5 P$44
BDBUS4 P$43
BDBUS3 P$41
BDBUS2 P$40
BDBUS1 P$39
BDBUS0 P$38
ACBUS3 P$29
ACBUS2 P$28
ACBUS1 P$27
ACBUS0 P$26
ADBUS7 P$24
ADBUS6 P$23
ADBUS5 P$22
ADBUS4 P$21
ADBUS3 P$19
ADBUS2 P$18
ADBUS1 P$17
ADBUS0 P$16
VCCIO1P$20
VCORE2P$37
VCORE1P$12
VPHYP$4
U6
FT2232H
ACBUS4 P$30
ACBUS5 P$32
ACBUS6 P$33
ACBUS7 P$34
BCBUS4 P$55
BCBUS5 P$57
BCBUS6 P$58
BCBUS7 P$59
GND5P$25
GND6P$35
GND7P$47
GND8P$51
VREGOUTP$49 VPLLP$9
VCORE3P$64
VCCIO2P$31
VCCIO3P$42
VCCIO4P$56
THTH
C14C13C12
R24
R22
1
2
3
4
5
VCC1 1VCC216
GND1 2
GND1 8
GND215
GND29
INA 3
INB 4
OUTC 5
NC1 6
EN1 7EN210
OUTA14
OUTB13
INC12
NC211
U7
VCC11 VCC2 16
GND12
GND18
GND2 15
GND2 9
INA3
INB4
INC5
IND6
NC7 EN 10
OUTA 14
OUTB 13
OUTC 12
OUTD 11
U5
C7 C9
R23
D7
D8
R26
R27
Q3
C17 C18
R21
R20
R19
R18
R16
R28
R30
R32
R25
VIN3 VOUT1 2
VOUT2 4
ADJ/GND1
U4
C8
1JP1
2
1JP2
2
C10 C11
L2
L1
D6
R17F1
1JP3
2
D-
D-
D+
D+
USBVCC
USBVCC
USBVCC
TCK
TDI
TDO
TMS
FTDI_CS
FTDI_CS
FTDI_CLK
FTDI_CLK
FTDI_DATA
FTDI_DATA
FTDI_DATA
FTDI_1V8
PWREN#
SUSPEND#
SCI_RX
SCI_TX
FTDI_3V3
FTDI_3V3
FTDI_3V3
FTDI_3V3
FTDI_3V3
FTDI_3V3
FTDI_3V3
FTDI_3V3
JTAG_TRST
Array
EEPROM
A
B
C
D
E
A
B
C
D
E
1 2 3 4 5 6
www.ti.com LAUNCHXL-F28027 Hardware
5.2 Schematics
Figure 2 and Figure 3 show the C2000 LaunchPad schematics sheets.
Figure 2. C2000 LaunchPad Schematic—Sheet 1 of 2
9SPRUHH2–July 2012 LAUNCHXL-F28027 C2000 Piccolo LaunchPad Experimenter Kit
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
SCI_RX
SCI_TX
SPI_CLK
SPI_MISO
SPI_MOSI
SPI_MISO
SPI_MOSI
1.0
Piccolo F2802x
C2000_LaunchPad.sch
+3V3
TMS320F28027PT
36p36p
1M
GND
GND
+3V3
GND
2.2k
2.2k
2.2k
820
820
+3V3
+3V3
GND GND
2.2u 2.2u
GND GND
FSMJSMAFSMJSMA
10k
+3V3
GNDGND
SN74LVC2G07
330
330
+3V3
+3V3
+3V3
GND
SN74LVC2G07
330
330
+3V3
+3V3
+3V3
GND
820
+3V3
GND
219-03
2.2k
GND
204-1
2.2u
GND
2.2u
GND
2.2u
GND
GND
+3V3
+3V3
+5V
GND
GND
GPIO29/SCITXDA/SCLA/TX3#1
TRST#2
XRS#3
ADCINA6/AIO64
ADCINA4/COMP2A/AIO45
ADCINA76
ADCINA37
ADCINA18
ADCINA2/COMP1A/AIO29
ADCINA0/VREFHI10
VDDA11
VSSA/VREFLO12
ADCINB113
ADCINB2/COMP1B/AIO1014
ADCINB315
ADCINB4/COMP2B/AIO1216
ADCINB6/AIO1417
ADCINB718
GPIO34/COMP2OUT19
TDI20
TMS21
TDO22
TCK23
GPIO18/SPICLKA/SCITXDA/XCLKOUT24 GPIO19/XCLKIN/SPISTEA#/SCIRXDA/ECAP125
GPIO17/SPISOMIA/TZ3# 26
GPIO16/SPISIMOA/TZ2# 27
GPIO1/EPWM1B/COMP1OUT 28
GPIO0/EPWM1A 29
TEST 30
GPIO32/SDAA/EPWMSYNCI/ADCSOCAO#31
VDD1 32
VSS1 33
VREGENZ# 34
VDDIO 35
GPIO33/SCLA/EPWMSYNCO/ADCSOCBO#36
GPIO2/EPWM2A 37
GPIO3/EPWM2B/COMP2OUT 38
GPIO4/EPWM3A 39
GPIO5/EPWM3B/ECAP1 40
GPIO6/EPWM4A/EPWMSYNCI/EPWMSYNCO41
GPIO7/EPWM4B/SCIRXDA 42
VDD2 43
VSS2 44
X1 45
X2 46
GPIO12/TZ1#/SCITXDA 47
GPIO28/SCIRXDA/SDAA/TZ2# 48
U1
Q1
Q2
C4C3
R7
R6
R8
R9
R4
R5
C5 C6
S3S2
D2
D4
R11
1A1
2A3 2Y 4
1Y 6
VCC5GND2
U2
R12
R13
D3
D5
1A1
2A3 2Y 4
1Y 6
VCC5GND2
U3
R14
R15
D1
R1
4
5
61
2
3
S1
R10
P$2P$1
S4
P$3P$4
L3
L4
C19 C20C21
1
2
3
J3
1
2
3
4
5
6
7
8
9
10
J1
1
2
3
4
5
6
7
8
9
10
J5
1
2
3
4
5
6
7
8
9
10
J6
1
2
3
4
5
6
7
8
9
10
J2
1JP4
2
1JP5
2
1JP6
2
1JP7
2
1
JP8
2
1
JP9
2
1
JP10
2
1
JP11
2
TCK
TDI
TDO
TDO
TMS
SCI_RX
SCI_TX
TRST
TRST
RESET#
RESET#
RESET#
GPIO34
GPIO34
GPIO34
GPIO19
GPIO19GPIO17
GPIO17
GPIO17
GPIO16
GPIO16
GPIO16
GPIO1
GPIO1
GPIO1
GPIO0
GPIO0
GPIO0
GPIO32
GPIO32
GPIO32
GPIO2
GPIO2
GPIO2
GPIO3
GPIO3
GPIO3
GPIO4
GPIO4
GPIO5
GPIO5
GPIO6
GPIO6
GPIO7
GPIO7
GPIO12
GPIO12
GPIO12
GPIO28
GPIO28
GPIO28
GPIO29
GPIO29
GPIO29
ADCINA6
ADCINA6
ADCINA4
ADCINA4
ADCINA1
ADCINA1
ADCINA2
ADCINA2
ADCINB1
ADCINB1
ADCINB2
ADCINB2
ADCINB4
ADCINB4
ADCINB6
ADCINB6
GPIO18
GPIO18
GPIO33
GPIO33
GPIO33
JTAG_TRST
ADCINA7
ADCINA7
ADCINA3
ADCINA3
ADCINA0
ADCINA0
ADCINB3
ADCINB3
ADCINB7
ADCINB7
123
ON
1
ON
A
B
C
D
E
A
B
C
D
E
1 2 3 4 5 6
LAUNCHXL-F28027 Hardware www.ti.com
Figure 3. C2000 LaunchPad Schematic—Sheet 2 of 2
10 LAUNCHXL-F28027 C2000 Piccolo LaunchPad Experimenter Kit SPRUHH2–July 2012
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
www.ti.com LAUNCHXL-F28027 Hardware
5.3 PCB Layout
Figure 4, Figure 5, and Figure 6 show the LAUNCHXL-F28027 PCB layout.
Figure 4. LAUNCHXL-F28027 PCB Layout—Top Layer
Figure 5. LAUNCHXL-F28027 PCB Layout—Bottom Layer
Figure 6. LAUNCHXL-F28027 PCB Layout—Silkscreen Image
11SPRUHH2–July 2012 LAUNCHXL-F28027 C2000 Piccolo LaunchPad Experimenter Kit
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
LAUNCHXL-F28027 Hardware www.ti.com
5.4 Bill of Materials (BOM)
Table 2 lists the LAUNCHXL-F28027 bill of materials.
Table 2. LAUNCHXL-F28027 Bill of Materials
Quantity
per
Reference Board Description
R12, R13, R14, R15, R26, R27 6 RES 330 Ω 1/10W 5% 0402 SMD
R1, R4, R5, R17 4 RES 820 Ω 1/10W 5% 0402 SMD
R22, R23 2 RES 1.0K Ω 1/10W 5% 0402 SMD
R6, R8, R9, R10, R31 5 RES 2.2K Ω 1/10W 5% 0402 SMD
R11, R29 2 RES 10K Ω 1/10W 5% 0402 SMD
R24 1 RES 12K Ω 1/16W .5% 0402 SMD
R7 1 RES 1.0M Ω 1/10W 5% 0402 SMD
R16, R18, R19, R20, R21, R25, R28, R30, 9 RES 0.0 Ω 1/4W 1206 SMD
R32
L1, L2 2 FERRITE BEAD 600 Ω 0402
L3 1 FERRITE BEAD 220 Ω 0402
L4 1 FERRITE CHIP 60 Ω 1.5A 0402
C9, C12, C13, C14, C16 5 CAP .10 µF 16 V CERAMIC Y5V 0402
C7 1 CAP CER 1.0 µF 6.3 V X5R 20% 0402
C5, C6, C19, C20, C21 5 CAP CER 2.2 µF 6.3 V 20% X5R 0402
C15 1 CAP CER 3.3 µF 4.0 V X5R 0402
C10, C11 2 CAP CER 4.7 µF 4 V X5R 0402
C3, C4 2 CAP CER 36PF 50 V C0G 0402
C17, C18 2 CAP CER 36PF 50 V C0G 0402
C8 1 CAP TANTALUM 100 µF 6.3 V 10% SMD
F1 1 PTC RESETTABLE .50A 15 V 1812
S1 1 SWITCH DIP 3POS TOP SLIDE SMT
S4 1 SWITCH DIP DPST 1POS SMT
S2, S3 2 SW TACT SPST-NO MOM 160GF SMD
Q1, Q2 1 Crystal
Q3 1 CRYSTAL 12.0000 MHZ 18PF SMD
D6 1 LED RED HIGH BRIGHT ESS SMD
D1 1 LED GREEN HIGH BRIGHT ESS SMD
D2, D3, D4, D5, D7, D8 6 LED BLUE HIGH BRIGHT ESS SMD
JP1, JP2, JP3 3 BERGSTIK II .100" SR STRAIGHT
J1 and J5, J2 and J6 2 CONN HEADER .100 DUAL STR 20POS
J3 1 CONN HEADER .100 SNGL STR 3POS
CON1 1 CONN RECEPT MINI-USB TYPE B SMT
U4 1 IC LDO REG 800MA 3.3 V SOT223-4
U2, U3 2 IC BUFF/DVR DL NON-INV SOT236
U5 1 ISOLAT DGTL 2.5 KVRMS 4CH 16-SOIC
U7 1 ISOLAT DGTL 3 KVRMS 3CH 16-SOIC
U6 1 IC USB HS DUAL UART and FIFO 64-QFN
U8 1 IC EEPROM 2KBIT 3 MHZ SOT23-6
U1 1 IC MCU 32 BIT 64KB FLASH 48LQFP
12 LAUNCHXL-F28027 C2000 Piccolo LaunchPad Experimenter Kit SPRUHH2–July 2012
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
www.ti.com Suggested Reading
6 Suggested Reading
The following documents describe the C2000 devices. Copies of these documents are available on the
Internet at http://www.ti.com/c2000 and www.ti.com/c2000-launchpad, or click on the links below:
• TMS320F28027/28026/28023/28022/28021/28020/280200 Piccolo Microcontrollers Data Manual
(SPRS523)
• TMS320F28027/28026/28023/28022/28021/28020/2802x0 Piccolo MCU Silicon Errata (SPRZ292)
• TMS320x2802x, 2803x Piccolo Analog-to-Digital Converter (ADC) and Comparator Reference Guide
(SPRUGE5)
• TMS320x2802x, 2803x Piccolo High Resolution Pulse Width Modulator (HRPWM) Reference Guide
(SPRUGE8)
• TMS320x2802x, 2803x Piccolo Inter-Integrated Circuit (I2C) Reference Guide (SPRUFZ9)
• TMS320x2802x, 2803x Piccolo Enhanced Pulse Width Modulator (ePWM) Module Reference Guide
(SPRUGE9)
• TMS320x2802x/TMS320F2802xx Piccolo System Control and Interrupts Reference Guide (SPRUFN3)
• TMS320x2802x Piccolo Boot ROM Reference Guide (SPRUFN6)
• TMS320x2802x, 2803x Piccolo Serial Communications Interface (SCI) Reference Guide (SPRUGH1)
• TMS320x2802x, 2803x Piccolo Enhanced Capture (eCAP) Module Reference Guide (SPRUFZ8)
• TMS320C28x Instruction Set Simulator Technical Overview (SPRU608)
• TMS320C28x Optimizing C/C++ Compiler v6.1 User's Guide (SPRU514)
• TMS320C28x Assembly Language Tools v6.1 User's Guide (SPRU513)
13SPRUHH2–July 2012 LAUNCHXL-F28027 C2000 Piccolo LaunchPad Experimenter Kit
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Frequently Asked Questions (FAQ) www.ti.com
7 Frequently Asked Questions (FAQ)
1. Can other programming and debug tools (such as an XDS510 emulator) be used with the C2000
LaunchPad?
While a user could potentially connect an external emulator to the F28027 device present on the
LaunchPad, it would require some rework of the board. It is recommended that users who want to use
an external emulator purchase a controlCard and docking station that includes an external JTAG
connector.
2. What versions of Code Composer Studio can be used to develop software for the C2000 LaunchPad?
It is highly recommend that novice users develop applications with Code Composer Studio v5. The
drivers, examples, and other associated software are tailored to make the user experience as smooth
as possible in Code Composer Studio v5. However, there is nothing to prevent a user from creating
projects in Code Composer Studio v3 or v4 with the source files available in controlSUITE. Keep in
mind that all the projects for the C2000 LaunchPad are Code Composer Studio v5 projects and will not
import into Code Composer Studio v3 or v4. Only expert users should attempt to use the LaunchPad
with Code Composer Studio v3 or v4.
3. Why can’t I connect to the LaunchPad in Code Composer Studio?
There are a number of things that could cause this and they all have an easy fix.
• Is S1 switch 3 in the down position?
This is the TRST pin which enables and disables JTAG functionality on the chip. This switch must
be in the up position for the emulator to be able to connect.
• Are both power LEDs lit?
The board has two power domains because of the isolated JTAG interface. For low-voltage
application development, JTAG isolation is not needed and the power domains can be combined to
allow for convenience (that is, the board can be powered completely through the USB). Ensure that
jumpers are placed on the posts of JP1, JP2, and JP3.
• Are drivers correctly installed for the XDS100v2 present on the LaunchPad?
Right click on My Computer and select properties. Navigate to the Hardware tab in the dialog box
and open the device manager. Scroll to the bottom of the list and expand the USB Serial Bus
controllers item. Are there two entries for TI XDS100 Channel A/B? If not, try unplugging and
replugging in the board. Does Windows give you any messages in the system tray? In Device
Manger, do either of the entries have a yellow exclamation mark over their icon? If so, try
reinstalling the drivers.
4. Why is the serial connection not working?
There are a few things that could cause this and they are easy to fix.
• Is S4 in the up position?
S4 connects the F28027 device serial peripheral to the XDS100 serial port, so this switch must be
turned on (up) for serial connectivity to function.
• Are you using the correct COM port?
Right click on My Computer and select properties. Navigate to the Hardware tab in the dialog box
and open the device manager. Scroll to Ports (COM & LPT) and expand this entry. Is there a USB
Serial Port listed? If so, read the COM number to the right of the entry; this is the COM number you
should be using.
• Are you using the correct baud rate?
Most, if not all, of the examples are configured for a baud rate of 115200 when the CPU is running
at 60 MHz. If you have changed the PLL settings or written your own application you may have to
recalculate the baud rate for your specific application. For information on how to do this, see the
TMS320x2802x, 2803x Piccolo Serial Communications Interface (SCI) Reference Guide
(SPRUGH1).
14 LAUNCHXL-F28027 C2000 Piccolo LaunchPad Experimenter Kit SPRUHH2–July 2012
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
EVALUATION BOARD/KIT/MODULE (EVM) ADDITIONAL TERMS
Texas Instruments (TI) provides the enclosed Evaluation Board/Kit/Module (EVM) under the following conditions:
The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims
arising from the handling or use of the goods.
Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days from
the date of delivery for a full refund. THE FOREGOING LIMITED WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO
BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF
MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH
ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL
DAMAGES.
Please read the User's Guide and, specifically, the Warnings and Restrictions notice in the User's Guide prior to handling the product. This
notice contains important safety information about temperatures and voltages. For additional information on TI's environmental and/or safety
programs, please visit www.ti.com/esh or contact TI.
No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or
combination in which such TI products or services might be or are used. TI currently deals with a variety of customers for products, and
therefore our arrangement with the user is not exclusive. TI assumes no liability for applications assistance, customer product design,
software performance, or infringement of patents or services described herein.
REGULATORY COMPLIANCE INFORMATION
As noted in the EVM User’s Guide and/or EVM itself, this EVM and/or accompanying hardware may or may not be subject to the Federal
Communications Commission (FCC) and Industry Canada (IC) rules.
For EVMs not subject to the above rules, this evaluation board/kit/module is intended for use for ENGINEERING DEVELOPMENT,
DEMONSTRATION OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end product fit for general consumer
use. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing
devices pursuant to part 15 of FCC or ICES-003 rules, which are designed to provide reasonable protection against radio frequency
interference. Operation of the equipment may cause interference with radio communications, in which case the user at his own expense will
be required to take whatever measures may be required to correct this interference.
General Statement for EVMs including a radio
User Power/Frequency Use Obligations: This radio is intended for development/professional use only in legally allocated frequency and
power limits. Any use of radio frequencies and/or power availability of this EVM and its development application(s) must comply with local
laws governing radio spectrum allocation and power limits for this evaluation module. It is the user’s sole responsibility to only operate this
radio in legally acceptable frequency space and within legally mandated power limitations. Any exceptions to this are strictly prohibited and
unauthorized by Texas Instruments unless user has obtained appropriate experimental/development licenses from local regulatory
authorities, which is responsibility of user including its acceptable authorization.
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant
Caution
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause
harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the
equipment.
FCC Interference Statement for Class A EVM devices
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial
environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the
instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to
cause harmful interference in which case the user will be required to correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment
generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause
harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If
this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and
on, the user is encouraged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
For EVMs annotated as IC – INDUSTRY CANADA Compliant
This Class A or B digital apparatus complies with Canadian ICES-003.
Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the
equipment.
Concerning EVMs including radio transmitters
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this
device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired
operation of the device.
Concerning EVMs including detachable antennas
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain
approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should
be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication.
This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum
permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain
greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.
Cet appareil numérique de la classe A ou B est conforme à la norme NMB-003 du Canada.
Les changements ou les modifications pas expressément approuvés par la partie responsable de la conformité ont pu vider l’autorité de
l'utilisateur pour actionner l'équipement.
Concernant les EVMs avec appareils radio
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est
autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout
brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain
maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à
l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente
(p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante.
Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel
d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans
cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur.
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
【【Important Notice for Users of this Product in Japan】】
This development kit is NOT certified as Confirming to Technical Regulations of Radio Law of Japan
If you use this product in Japan, you are required by Radio Law of Japan to follow the instructions below with respect to this product:
1. Use this product in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and
Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of
Japan,
2. Use this product only after you obtained the license of Test Radio Station as provided in Radio Law of Japan with respect to this
product, or
3. Use of this product only after you obtained the Technical Regulations Conformity Certification as provided in Radio Law of Japan with
respect to this product. Also, please do not transfer this product, unless you give the same notice above to the transferee. Please note
that if you could not follow the instructions above, you will be subject to penalties of Radio Law of Japan.
Texas Instruments Japan Limited
(address) 24-1, Nishi-Shinjuku 6 chome, Shinjuku-ku, Tokyo, Japan
http://www.tij.co.jp
【ご使用にあたっての注】
本開発キットは技術基準適合証明を受けておりません。
本製品のご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。
1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用いただく。
2. 実験局の免許を取得後ご使用いただく。
3. 技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
   上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。
日本テキサス・インスツルメンツ株式会社
東京都新宿区西新宿6丁目24番1号
西新宿三井ビル
http://www.tij.co.jp
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
EVALUATION BOARD/KIT/MODULE (EVM)
WARNINGS, RESTRICTIONS AND DISCLAIMERS
For Feasibility Evaluation Only, in Laboratory/Development Environments. Unless otherwise indicated, this EVM is not a finished
electrical equipment and not intended for consumer use. It is intended solely for use for preliminary feasibility evaluation in
laboratory/development environments by technically qualified electronics experts who are familiar with the dangers and application risks
associated with handling electrical mechanical components, systems and subsystems. It should not be used as all or part of a finished end
product.
Your Sole Responsibility and Risk. You acknowledge, represent and agree that:
1. You have unique knowledge concerning Federal, State and local regulatory requirements (including but not limited to Food and Drug
Administration regulations, if applicable) which relate to your products and which relate to your use (and/or that of your employees,
affiliates, contractors or designees) of the EVM for evaluation, testing and other purposes.
2. You have full and exclusive responsibility to assure the safety and compliance of your products with all such laws and other applicable
regulatory requirements, and also to assure the safety of any activities to be conducted by you and/or your employees, affiliates,
contractors or designees, using the EVM. Further, you are responsible to assure that any interfaces (electronic and/or mechanical)
between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to
minimize the risk of electrical shock hazard.
3. You will employ reasonable safeguards to ensure that your use of the EVM will not result in any property damage, injury or death, even
if the EVM should fail to perform as described or expected.
4. You will take care of proper disposal and recycling of the EVM’s electronic components and packing materials.
Certain Instructions. It is important to operate this EVM within TI’s recommended specifications and environmental considerations per the
user guidelines. Exceeding the specified EVM ratings (including but not limited to input and output voltage, current, power, and
environmental ranges) may cause property damage, personal injury or death. If there are questions concerning these ratings please contact
a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the
specified output range may result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or
interface electronics. Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the
load specification, please contact a TI field representative. During normal operation, some circuit components may have case temperatures
greater than 60°C as long as the input and output are maintained at a normal ambient operating temperature. These components include
but are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors which can be identified using the
EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during normal operation, please
be aware that these devices may be very warm to the touch. As with all electronic evaluation tools, only qualified personnel knowledgeable
in electronic measurement and diagnostics normally found in development environments should use these EVMs.
Agreement to Defend, Indemnify and Hold Harmless. You agree to defend, indemnify and hold TI, its licensors and their representatives
harmless from and against any and all claims, damages, losses, expenses, costs and liabilities (collectively, "Claims") arising out of or in
connection with any use of the EVM that is not in accordance with the terms of the agreement. This obligation shall apply whether Claims
arise under law of tort or contract or any other legal theory, and even if the EVM fails to perform as described or expected.
Safety-Critical or Life-Critical Applications. If you intend to evaluate the components for possible use in safety critical applications (such
as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, such as devices
which are classified as FDA Class III or similar classification, then you must specifically notify TI of such intent and enter into a separate
Assurance and Indemnity Agreement.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated

More Related Content

What's hot

BUD17-416: Benchmark and profiling in OP-TEE
BUD17-416: Benchmark and profiling in OP-TEE BUD17-416: Benchmark and profiling in OP-TEE
BUD17-416: Benchmark and profiling in OP-TEE Linaro
 
Mémoire de fin de cycle présenté en vue de L’Obtention du Diplôme de Master P...
Mémoire de fin de cycle présenté en vue de L’Obtention du Diplôme de Master P...Mémoire de fin de cycle présenté en vue de L’Obtention du Diplôme de Master P...
Mémoire de fin de cycle présenté en vue de L’Obtention du Diplôme de Master P...Abdallah YACOUBA
 
LAS16-111: Easing Access to ARM TrustZone – OP-TEE and Raspberry Pi 3
LAS16-111: Easing Access to ARM TrustZone – OP-TEE and Raspberry Pi 3LAS16-111: Easing Access to ARM TrustZone – OP-TEE and Raspberry Pi 3
LAS16-111: Easing Access to ARM TrustZone – OP-TEE and Raspberry Pi 3Linaro
 
Model Based Testing des applications du protocole MQTT
Model Based Testing des applications du protocole MQTTModel Based Testing des applications du protocole MQTT
Model Based Testing des applications du protocole MQTTymelka
 
Nodemcu - introduction
Nodemcu - introductionNodemcu - introduction
Nodemcu - introductionMichal Sedlak
 
Windows power management basic knowledge
Windows power management basic knowledgeWindows power management basic knowledge
Windows power management basic knowledgeYonghong(Dave) Feng
 
Embedded_Linux_Booting
Embedded_Linux_BootingEmbedded_Linux_Booting
Embedded_Linux_BootingRashila Rr
 
Arduino presentation by_warishusain
Arduino presentation by_warishusainArduino presentation by_warishusain
Arduino presentation by_warishusainstudent
 
Device tree support on arm linux
Device tree support on arm linuxDevice tree support on arm linux
Device tree support on arm linuxChih-Min Chao
 
TEE - kernel support is now upstream. What this means for open source security
TEE - kernel support is now upstream. What this means for open source securityTEE - kernel support is now upstream. What this means for open source security
TEE - kernel support is now upstream. What this means for open source securityLinaro
 
Bootstrap process of u boot (NDS32 RISC CPU)
Bootstrap process of u boot (NDS32 RISC CPU)Bootstrap process of u boot (NDS32 RISC CPU)
Bootstrap process of u boot (NDS32 RISC CPU)Macpaul Lin
 
Alphorm.com Support Formation Hacking & Sécurité Expert Vulnérabilités Web
Alphorm.com Support Formation Hacking & Sécurité Expert Vulnérabilités WebAlphorm.com Support Formation Hacking & Sécurité Expert Vulnérabilités Web
Alphorm.com Support Formation Hacking & Sécurité Expert Vulnérabilités WebAlphorm
 
Lcu14 107- op-tee on ar mv8
Lcu14 107- op-tee on ar mv8Lcu14 107- op-tee on ar mv8
Lcu14 107- op-tee on ar mv8Linaro
 
用Raspberry Pi 學Linux I2C Driver
用Raspberry Pi 學Linux I2C Driver用Raspberry Pi 學Linux I2C Driver
用Raspberry Pi 學Linux I2C Driver艾鍗科技
 
LAS16-402: ARM Trusted Firmware – from Enterprise to Embedded
LAS16-402: ARM Trusted Firmware – from Enterprise to EmbeddedLAS16-402: ARM Trusted Firmware – from Enterprise to Embedded
LAS16-402: ARM Trusted Firmware – from Enterprise to EmbeddedLinaro
 
Rdl esp32 development board trainer kit
Rdl esp32 development board trainer kitRdl esp32 development board trainer kit
Rdl esp32 development board trainer kitResearch Design Lab
 
Etude et mise en place d’un VPN
Etude et mise en place d’un VPNEtude et mise en place d’un VPN
Etude et mise en place d’un VPNCharif Khrichfa
 

What's hot (20)

BUD17-416: Benchmark and profiling in OP-TEE
BUD17-416: Benchmark and profiling in OP-TEE BUD17-416: Benchmark and profiling in OP-TEE
BUD17-416: Benchmark and profiling in OP-TEE
 
Mémoire de fin de cycle présenté en vue de L’Obtention du Diplôme de Master P...
Mémoire de fin de cycle présenté en vue de L’Obtention du Diplôme de Master P...Mémoire de fin de cycle présenté en vue de L’Obtention du Diplôme de Master P...
Mémoire de fin de cycle présenté en vue de L’Obtention du Diplôme de Master P...
 
LAS16-111: Easing Access to ARM TrustZone – OP-TEE and Raspberry Pi 3
LAS16-111: Easing Access to ARM TrustZone – OP-TEE and Raspberry Pi 3LAS16-111: Easing Access to ARM TrustZone – OP-TEE and Raspberry Pi 3
LAS16-111: Easing Access to ARM TrustZone – OP-TEE and Raspberry Pi 3
 
Model Based Testing des applications du protocole MQTT
Model Based Testing des applications du protocole MQTTModel Based Testing des applications du protocole MQTT
Model Based Testing des applications du protocole MQTT
 
Nodemcu - introduction
Nodemcu - introductionNodemcu - introduction
Nodemcu - introduction
 
Windows power management basic knowledge
Windows power management basic knowledgeWindows power management basic knowledge
Windows power management basic knowledge
 
Embedded_Linux_Booting
Embedded_Linux_BootingEmbedded_Linux_Booting
Embedded_Linux_Booting
 
Arduino presentation by_warishusain
Arduino presentation by_warishusainArduino presentation by_warishusain
Arduino presentation by_warishusain
 
Device tree support on arm linux
Device tree support on arm linuxDevice tree support on arm linux
Device tree support on arm linux
 
TEE - kernel support is now upstream. What this means for open source security
TEE - kernel support is now upstream. What this means for open source securityTEE - kernel support is now upstream. What this means for open source security
TEE - kernel support is now upstream. What this means for open source security
 
Bootstrap process of u boot (NDS32 RISC CPU)
Bootstrap process of u boot (NDS32 RISC CPU)Bootstrap process of u boot (NDS32 RISC CPU)
Bootstrap process of u boot (NDS32 RISC CPU)
 
Alphorm.com Support Formation Hacking & Sécurité Expert Vulnérabilités Web
Alphorm.com Support Formation Hacking & Sécurité Expert Vulnérabilités WebAlphorm.com Support Formation Hacking & Sécurité Expert Vulnérabilités Web
Alphorm.com Support Formation Hacking & Sécurité Expert Vulnérabilités Web
 
I2c drivers
I2c driversI2c drivers
I2c drivers
 
Lcu14 107- op-tee on ar mv8
Lcu14 107- op-tee on ar mv8Lcu14 107- op-tee on ar mv8
Lcu14 107- op-tee on ar mv8
 
用Raspberry Pi 學Linux I2C Driver
用Raspberry Pi 學Linux I2C Driver用Raspberry Pi 學Linux I2C Driver
用Raspberry Pi 學Linux I2C Driver
 
LAS16-402: ARM Trusted Firmware – from Enterprise to Embedded
LAS16-402: ARM Trusted Firmware – from Enterprise to EmbeddedLAS16-402: ARM Trusted Firmware – from Enterprise to Embedded
LAS16-402: ARM Trusted Firmware – from Enterprise to Embedded
 
#RIPv1 vs #RIPv2
#RIPv1 vs #RIPv2#RIPv1 vs #RIPv2
#RIPv1 vs #RIPv2
 
Rdl esp32 development board trainer kit
Rdl esp32 development board trainer kitRdl esp32 development board trainer kit
Rdl esp32 development board trainer kit
 
Etude et mise en place d’un VPN
Etude et mise en place d’un VPNEtude et mise en place d’un VPN
Etude et mise en place d’un VPN
 
Rapport projet
Rapport projetRapport projet
Rapport projet
 

Similar to Texas instruments launchxl-f28027-datasheet

Arduino: Starter kit for arduino(manual de usuario)
Arduino: Starter kit for arduino(manual de usuario)Arduino: Starter kit for arduino(manual de usuario)
Arduino: Starter kit for arduino(manual de usuario)SANTIAGO PABLO ALBERTO
 
Ht usb5130-v2
Ht usb5130-v2Ht usb5130-v2
Ht usb5130-v2handson28
 
neoFlash Introduction
neoFlash IntroductionneoFlash Introduction
neoFlash IntroductionYong Hee Nam
 
Industrial Applications of Arduino using Ladder Logic
Industrial Applications of Arduino using Ladder LogicIndustrial Applications of Arduino using Ladder Logic
Industrial Applications of Arduino using Ladder LogicRobocraze
 
Bluetooth remote control... from your mobile phone
Bluetooth remote control... from your mobile phoneBluetooth remote control... from your mobile phone
Bluetooth remote control... from your mobile phoneBebe Bilguun
 
Xhorse Vvdi prog user manual v4.8.0
Xhorse Vvdi prog user manual v4.8.0Xhorse Vvdi prog user manual v4.8.0
Xhorse Vvdi prog user manual v4.8.0OBD365
 
Wecon HMI PI Series Q&A
Wecon HMI PI Series Q&AWecon HMI PI Series Q&A
Wecon HMI PI Series Q&ALily Zheng
 
Electrónica: PROTEUS design suite Visual Designer Help
Electrónica: PROTEUS design suite Visual Designer Help Electrónica: PROTEUS design suite Visual Designer Help
Electrónica: PROTEUS design suite Visual Designer Help SANTIAGO PABLO ALBERTO
 
DIGITAL LOGIC DESIGN (1) PROJECT REPORT.docx
DIGITAL LOGIC DESIGN (1) PROJECT REPORT.docxDIGITAL LOGIC DESIGN (1) PROJECT REPORT.docx
DIGITAL LOGIC DESIGN (1) PROJECT REPORT.docxRafayNaveed4
 
Xhorse Vvdi prog user manual 4.9.3
Xhorse Vvdi prog user manual 4.9.3Xhorse Vvdi prog user manual 4.9.3
Xhorse Vvdi prog user manual 4.9.3OBD365
 
Lt200 drb200 tecnico
Lt200 drb200 tecnicoLt200 drb200 tecnico
Lt200 drb200 tecnicomiguecas
 
Xhorse Vvdi prog user manual v4.8.6
Xhorse Vvdi prog user manual v4.8.6Xhorse Vvdi prog user manual v4.8.6
Xhorse Vvdi prog user manual v4.8.6OBD365
 

Similar to Texas instruments launchxl-f28027-datasheet (20)

lotos-framework
lotos-frameworklotos-framework
lotos-framework
 
Arduino: Starter kit for arduino(manual de usuario)
Arduino: Starter kit for arduino(manual de usuario)Arduino: Starter kit for arduino(manual de usuario)
Arduino: Starter kit for arduino(manual de usuario)
 
Ht usb5130-v2
Ht usb5130-v2Ht usb5130-v2
Ht usb5130-v2
 
neoFlash Introduction
neoFlash IntroductionneoFlash Introduction
neoFlash Introduction
 
Xgt training
Xgt trainingXgt training
Xgt training
 
Industrial Applications of Arduino using Ladder Logic
Industrial Applications of Arduino using Ladder LogicIndustrial Applications of Arduino using Ladder Logic
Industrial Applications of Arduino using Ladder Logic
 
Bluetooth remote control... from your mobile phone
Bluetooth remote control... from your mobile phoneBluetooth remote control... from your mobile phone
Bluetooth remote control... from your mobile phone
 
Jumper t16 manual
Jumper t16 manualJumper t16 manual
Jumper t16 manual
 
Xhorse Vvdi prog user manual v4.8.0
Xhorse Vvdi prog user manual v4.8.0Xhorse Vvdi prog user manual v4.8.0
Xhorse Vvdi prog user manual v4.8.0
 
Wecon HMI PI Series Q&A
Wecon HMI PI Series Q&AWecon HMI PI Series Q&A
Wecon HMI PI Series Q&A
 
Sinamics g120 treinamento (en)
Sinamics g120 treinamento (en)Sinamics g120 treinamento (en)
Sinamics g120 treinamento (en)
 
Tài liệu đào tạo simens sinamic G120
Tài liệu đào tạo simens sinamic G120Tài liệu đào tạo simens sinamic G120
Tài liệu đào tạo simens sinamic G120
 
Lab7 s2
Lab7 s2Lab7 s2
Lab7 s2
 
Electrónica: PROTEUS design suite Visual Designer Help
Electrónica: PROTEUS design suite Visual Designer Help Electrónica: PROTEUS design suite Visual Designer Help
Electrónica: PROTEUS design suite Visual Designer Help
 
DIGITAL LOGIC DESIGN (1) PROJECT REPORT.docx
DIGITAL LOGIC DESIGN (1) PROJECT REPORT.docxDIGITAL LOGIC DESIGN (1) PROJECT REPORT.docx
DIGITAL LOGIC DESIGN (1) PROJECT REPORT.docx
 
Lab7 s1
Lab7 s1Lab7 s1
Lab7 s1
 
Lab7 s1
Lab7 s1Lab7 s1
Lab7 s1
 
Xhorse Vvdi prog user manual 4.9.3
Xhorse Vvdi prog user manual 4.9.3Xhorse Vvdi prog user manual 4.9.3
Xhorse Vvdi prog user manual 4.9.3
 
Lt200 drb200 tecnico
Lt200 drb200 tecnicoLt200 drb200 tecnico
Lt200 drb200 tecnico
 
Xhorse Vvdi prog user manual v4.8.6
Xhorse Vvdi prog user manual v4.8.6Xhorse Vvdi prog user manual v4.8.6
Xhorse Vvdi prog user manual v4.8.6
 

Recently uploaded

TrustArc Webinar - Unlock the Power of AI-Driven Data Discovery
TrustArc Webinar - Unlock the Power of AI-Driven Data DiscoveryTrustArc Webinar - Unlock the Power of AI-Driven Data Discovery
TrustArc Webinar - Unlock the Power of AI-Driven Data DiscoveryTrustArc
 
Elevate Developer Efficiency & build GenAI Application with Amazon Q​
Elevate Developer Efficiency & build GenAI Application with Amazon Q​Elevate Developer Efficiency & build GenAI Application with Amazon Q​
Elevate Developer Efficiency & build GenAI Application with Amazon Q​Bhuvaneswari Subramani
 
CNIC Information System with Pakdata Cf In Pakistan
CNIC Information System with Pakdata Cf In PakistanCNIC Information System with Pakdata Cf In Pakistan
CNIC Information System with Pakdata Cf In Pakistandanishmna97
 
JavaScript Usage Statistics 2024 - The Ultimate Guide
JavaScript Usage Statistics 2024 - The Ultimate GuideJavaScript Usage Statistics 2024 - The Ultimate Guide
JavaScript Usage Statistics 2024 - The Ultimate GuidePixlogix Infotech
 
Decarbonising Commercial Real Estate: The Role of Operational Performance
Decarbonising Commercial Real Estate: The Role of Operational PerformanceDecarbonising Commercial Real Estate: The Role of Operational Performance
Decarbonising Commercial Real Estate: The Role of Operational PerformanceIES VE
 
TEST BANK For Principles of Anatomy and Physiology, 16th Edition by Gerard J....
TEST BANK For Principles of Anatomy and Physiology, 16th Edition by Gerard J....TEST BANK For Principles of Anatomy and Physiology, 16th Edition by Gerard J....
TEST BANK For Principles of Anatomy and Physiology, 16th Edition by Gerard J....rightmanforbloodline
 
JohnPollard-hybrid-app-RailsConf2024.pptx
JohnPollard-hybrid-app-RailsConf2024.pptxJohnPollard-hybrid-app-RailsConf2024.pptx
JohnPollard-hybrid-app-RailsConf2024.pptxJohnPollard37
 
Corporate and higher education May webinar.pptx
Corporate and higher education May webinar.pptxCorporate and higher education May webinar.pptx
Corporate and higher education May webinar.pptxRustici Software
 
Modernizing Legacy Systems Using Ballerina
Modernizing Legacy Systems Using BallerinaModernizing Legacy Systems Using Ballerina
Modernizing Legacy Systems Using BallerinaWSO2
 
AI+A11Y 11MAY2024 HYDERBAD GAAD 2024 - HelloA11Y (11 May 2024)
AI+A11Y 11MAY2024 HYDERBAD GAAD 2024 - HelloA11Y (11 May 2024)AI+A11Y 11MAY2024 HYDERBAD GAAD 2024 - HelloA11Y (11 May 2024)
AI+A11Y 11MAY2024 HYDERBAD GAAD 2024 - HelloA11Y (11 May 2024)Samir Dash
 
Modular Monolith - a Practical Alternative to Microservices @ Devoxx UK 2024
Modular Monolith - a Practical Alternative to Microservices @ Devoxx UK 2024Modular Monolith - a Practical Alternative to Microservices @ Devoxx UK 2024
Modular Monolith - a Practical Alternative to Microservices @ Devoxx UK 2024Victor Rentea
 
Stronger Together: Developing an Organizational Strategy for Accessible Desig...
Stronger Together: Developing an Organizational Strategy for Accessible Desig...Stronger Together: Developing an Organizational Strategy for Accessible Desig...
Stronger Together: Developing an Organizational Strategy for Accessible Desig...caitlingebhard1
 
Design and Development of a Provenance Capture Platform for Data Science
Design and Development of a Provenance Capture Platform for Data ScienceDesign and Development of a Provenance Capture Platform for Data Science
Design and Development of a Provenance Capture Platform for Data SciencePaolo Missier
 
Finding Java's Hidden Performance Traps @ DevoxxUK 2024
Finding Java's Hidden Performance Traps @ DevoxxUK 2024Finding Java's Hidden Performance Traps @ DevoxxUK 2024
Finding Java's Hidden Performance Traps @ DevoxxUK 2024Victor Rentea
 
Rising Above_ Dubai Floods and the Fortitude of Dubai International Airport.pdf
Rising Above_ Dubai Floods and the Fortitude of Dubai International Airport.pdfRising Above_ Dubai Floods and the Fortitude of Dubai International Airport.pdf
Rising Above_ Dubai Floods and the Fortitude of Dubai International Airport.pdfOrbitshub
 
Navigating the Deluge_ Dubai Floods and the Resilience of Dubai International...
Navigating the Deluge_ Dubai Floods and the Resilience of Dubai International...Navigating the Deluge_ Dubai Floods and the Resilience of Dubai International...
Navigating the Deluge_ Dubai Floods and the Resilience of Dubai International...Orbitshub
 
Quantum Leap in Next-Generation Computing
Quantum Leap in Next-Generation ComputingQuantum Leap in Next-Generation Computing
Quantum Leap in Next-Generation ComputingWSO2
 
[BuildWithAI] Introduction to Gemini.pdf
[BuildWithAI] Introduction to Gemini.pdf[BuildWithAI] Introduction to Gemini.pdf
[BuildWithAI] Introduction to Gemini.pdfSandro Moreira
 
Polkadot JAM Slides - Token2049 - By Dr. Gavin Wood
Polkadot JAM Slides - Token2049 - By Dr. Gavin WoodPolkadot JAM Slides - Token2049 - By Dr. Gavin Wood
Polkadot JAM Slides - Token2049 - By Dr. Gavin WoodJuan lago vázquez
 

Recently uploaded (20)

Understanding the FAA Part 107 License ..
Understanding the FAA Part 107 License ..Understanding the FAA Part 107 License ..
Understanding the FAA Part 107 License ..
 
TrustArc Webinar - Unlock the Power of AI-Driven Data Discovery
TrustArc Webinar - Unlock the Power of AI-Driven Data DiscoveryTrustArc Webinar - Unlock the Power of AI-Driven Data Discovery
TrustArc Webinar - Unlock the Power of AI-Driven Data Discovery
 
Elevate Developer Efficiency & build GenAI Application with Amazon Q​
Elevate Developer Efficiency & build GenAI Application with Amazon Q​Elevate Developer Efficiency & build GenAI Application with Amazon Q​
Elevate Developer Efficiency & build GenAI Application with Amazon Q​
 
CNIC Information System with Pakdata Cf In Pakistan
CNIC Information System with Pakdata Cf In PakistanCNIC Information System with Pakdata Cf In Pakistan
CNIC Information System with Pakdata Cf In Pakistan
 
JavaScript Usage Statistics 2024 - The Ultimate Guide
JavaScript Usage Statistics 2024 - The Ultimate GuideJavaScript Usage Statistics 2024 - The Ultimate Guide
JavaScript Usage Statistics 2024 - The Ultimate Guide
 
Decarbonising Commercial Real Estate: The Role of Operational Performance
Decarbonising Commercial Real Estate: The Role of Operational PerformanceDecarbonising Commercial Real Estate: The Role of Operational Performance
Decarbonising Commercial Real Estate: The Role of Operational Performance
 
TEST BANK For Principles of Anatomy and Physiology, 16th Edition by Gerard J....
TEST BANK For Principles of Anatomy and Physiology, 16th Edition by Gerard J....TEST BANK For Principles of Anatomy and Physiology, 16th Edition by Gerard J....
TEST BANK For Principles of Anatomy and Physiology, 16th Edition by Gerard J....
 
JohnPollard-hybrid-app-RailsConf2024.pptx
JohnPollard-hybrid-app-RailsConf2024.pptxJohnPollard-hybrid-app-RailsConf2024.pptx
JohnPollard-hybrid-app-RailsConf2024.pptx
 
Corporate and higher education May webinar.pptx
Corporate and higher education May webinar.pptxCorporate and higher education May webinar.pptx
Corporate and higher education May webinar.pptx
 
Modernizing Legacy Systems Using Ballerina
Modernizing Legacy Systems Using BallerinaModernizing Legacy Systems Using Ballerina
Modernizing Legacy Systems Using Ballerina
 
AI+A11Y 11MAY2024 HYDERBAD GAAD 2024 - HelloA11Y (11 May 2024)
AI+A11Y 11MAY2024 HYDERBAD GAAD 2024 - HelloA11Y (11 May 2024)AI+A11Y 11MAY2024 HYDERBAD GAAD 2024 - HelloA11Y (11 May 2024)
AI+A11Y 11MAY2024 HYDERBAD GAAD 2024 - HelloA11Y (11 May 2024)
 
Modular Monolith - a Practical Alternative to Microservices @ Devoxx UK 2024
Modular Monolith - a Practical Alternative to Microservices @ Devoxx UK 2024Modular Monolith - a Practical Alternative to Microservices @ Devoxx UK 2024
Modular Monolith - a Practical Alternative to Microservices @ Devoxx UK 2024
 
Stronger Together: Developing an Organizational Strategy for Accessible Desig...
Stronger Together: Developing an Organizational Strategy for Accessible Desig...Stronger Together: Developing an Organizational Strategy for Accessible Desig...
Stronger Together: Developing an Organizational Strategy for Accessible Desig...
 
Design and Development of a Provenance Capture Platform for Data Science
Design and Development of a Provenance Capture Platform for Data ScienceDesign and Development of a Provenance Capture Platform for Data Science
Design and Development of a Provenance Capture Platform for Data Science
 
Finding Java's Hidden Performance Traps @ DevoxxUK 2024
Finding Java's Hidden Performance Traps @ DevoxxUK 2024Finding Java's Hidden Performance Traps @ DevoxxUK 2024
Finding Java's Hidden Performance Traps @ DevoxxUK 2024
 
Rising Above_ Dubai Floods and the Fortitude of Dubai International Airport.pdf
Rising Above_ Dubai Floods and the Fortitude of Dubai International Airport.pdfRising Above_ Dubai Floods and the Fortitude of Dubai International Airport.pdf
Rising Above_ Dubai Floods and the Fortitude of Dubai International Airport.pdf
 
Navigating the Deluge_ Dubai Floods and the Resilience of Dubai International...
Navigating the Deluge_ Dubai Floods and the Resilience of Dubai International...Navigating the Deluge_ Dubai Floods and the Resilience of Dubai International...
Navigating the Deluge_ Dubai Floods and the Resilience of Dubai International...
 
Quantum Leap in Next-Generation Computing
Quantum Leap in Next-Generation ComputingQuantum Leap in Next-Generation Computing
Quantum Leap in Next-Generation Computing
 
[BuildWithAI] Introduction to Gemini.pdf
[BuildWithAI] Introduction to Gemini.pdf[BuildWithAI] Introduction to Gemini.pdf
[BuildWithAI] Introduction to Gemini.pdf
 
Polkadot JAM Slides - Token2049 - By Dr. Gavin Wood
Polkadot JAM Slides - Token2049 - By Dr. Gavin WoodPolkadot JAM Slides - Token2049 - By Dr. Gavin Wood
Polkadot JAM Slides - Token2049 - By Dr. Gavin Wood
 

Texas instruments launchxl-f28027-datasheet

  • 1. LAUNCHXL-F28027 C2000 Piccolo LaunchPad Experimenter Kit User's Guide Literature Number: SPRUHH2 July 2012
  • 2. Contents 1 LAUNCHXL-F28027 Overview ............................................................................................... 4 1.1 Overview .................................................................................................................. 4 1.2 Kit Contents .............................................................................................................. 5 1.3 Revisions ................................................................................................................. 5 2 Installation ......................................................................................................................... 5 2.1 Download the Required Software ..................................................................................... 5 2.2 Install the Software ...................................................................................................... 6 2.3 Install the Hardware ..................................................................................................... 6 3 Getting Started with the LAUNCHXL-F28027 ........................................................................... 6 3.1 Getting Started ........................................................................................................... 6 3.2 Demo Application, Internal Temperature Measurement ............................................................ 6 3.3 Program and Debug the Temperature Measurement Demo Application ........................................ 6 4 Hardware Configuration ....................................................................................................... 6 4.1 Power Domain ........................................................................................................... 7 4.2 Serial Connectivity ...................................................................................................... 7 4.3 Boot Mode Selection .................................................................................................... 7 4.4 Connecting a Crystal .................................................................................................... 7 4.5 Connecting a Satellite Board .......................................................................................... 7 4.6 Device Migration Path .................................................................................................. 8 5 LAUNCHXL-F28027 Hardware ............................................................................................... 8 5.1 Device Pin Out ........................................................................................................... 8 5.2 Schematics ............................................................................................................... 9 5.3 PCB Layout ............................................................................................................. 11 5.4 Bill of Materials (BOM) ................................................................................................ 12 6 Suggested Reading ........................................................................................................... 13 7 Frequently Asked Questions (FAQ) ...................................................................................... 14 2 Table of Contents SPRUHH2–July 2012 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated
  • 3. www.ti.com List of Figures 1 LAUNCHXL-F28027 Board Overview .................................................................................... 5 2 C2000 LaunchPad Schematic—Sheet 1 of 2 ........................................................................... 9 3 C2000 LaunchPad Schematic—Sheet 2 of 2.......................................................................... 10 4 LAUNCHXL-F28027 PCB Layout—Top Layer ........................................................................ 11 5 LAUNCHXL-F28027 PCB Layout—Bottom Layer .................................................................... 11 6 LAUNCHXL-F28027 PCB Layout—Silkscreen Image................................................................ 11 List of Tables 1 C2000 LaunchPad Pin Out and Pin Mux Options ...................................................................... 8 2 LAUNCHXL-F28027 Bill of Materials ................................................................................... 12 3SPRUHH2–July 2012 List of Figures Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated
  • 4. User's Guide SPRUHH2–July 2012 LAUNCHXL-F28027 C2000 Piccolo LaunchPad Experimenter Kit 1 LAUNCHXL-F28027 Overview 1.1 Overview The C2000™ Piccolo™ LaunchPad™, LAUNCHXL-F28027, is a complete low-cost experimenter board for the Texas Instruments Piccolo F2802x devices. The LAUNCHXL-F28027 kit features all the hardware and software necessary to develop applications based on the F2802x microprocessor. The LaunchPad is based on the superset F28027 device, and easily allows users to migrate to lower cost F2802x devices once the design needs are known. It offers an on-board JTAG emulation tool allowing direct interface to a PC for easy programming, debugging, and evaluation. In addition to JTAG emulation, the USB interface provides a UART serial connection from the F2802x device to the host PC. Users can download an unrestricted version of Code Composer Studio™ IDE version 5 to write, download, and debug applications on the LAUNCHXL-F28027 board. The debugger is unobtrusive, allowing the user to run an application at full speed with hardware breakpoints and single stepping available while consuming no extra hardware resources. As shown in Figure 1, the LAUNCHXL-F28027 C2000 LaunchPad features include: • USB debugging and programming interface via a high-speed galvanically isolated XDS100v2 emulator featuring a USB/UART connection. • Superset F28027 device which allows applications to easily migrate to lower cost devices. • Nibble (4-bit) wide LED display. • Two push buttons for user feedback and device reset. • Easily accessible device pins for debugging purposes or as sockets for adding customized extension boards. • Boot selection and USB and UART disconnect switches. C2000, Piccolo, LaunchPad, Code Composer Studio, controlSUITE are trademarks of Texas Instruments. Windows is a registered trademark of Microsoft Corporation in the United States and/or other countries. All other trademarks are the property of their respective owners. 4 LAUNCHXL-F28027 C2000 Piccolo LaunchPad Experimenter Kit SPRUHH2–July 2012 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated
  • 5. USB Connection JTAG Isolation Jumpers: JP1 and JP3 S4 Serial Connection Switch S1 Boot Selection Switch CPU Reset Push Button JTAG Emulator Circuitry Four LEDs Serial TX/RX LEDs Jumper: JP2 20 PCB Pins (doubled-sided male connectors) Pre-Programmed C2000 Piccolo TMS320F28027 MCU Programmable Push Button: GPIO12 www.ti.com Installation Figure 1. LAUNCHXL-F28027 Board Overview 1.2 Kit Contents The LAUNCHXL-F28027 C2000 LaunchPad experimenter kit includes the following items: • C2000 LaunchPad Board (LAUNCHXL-F28027) • Mini USB-B Cable, 0.5m • Quick Start Guide 1.3 Revisions The first production revision of the LAUNCHXL-F28027 C2000 Piccolo LaunchPad, version 1.0, was released in July of 2012 and is currently the only revision available. 2 Installation The C2000 LaunchPad installation consists of three easy steps: 1. Download Code Composer Studio and controlSUITE™. 2. Install Code Composer Studio and controlSUITE. 3. Connect and install the C2000 LaunchPad to the PC. Now the LaunchPad is ready to develop applications or run the pre-programmed demo. 2.1 Download the Required Software Code Composer Studio IDE is available for free without any restriction when used with the XDS100 emulator on the C2000 LaunchPad. The software can be downloaded from the C2000 LaunchPad page at www.ti.com/c2000-launchpad. At this site, you can also download a copy of controlSUITE that includes drivers, examples, and other support software needed to get started. 5SPRUHH2–July 2012 LAUNCHXL-F28027 C2000 Piccolo LaunchPad Experimenter Kit Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated
  • 6. Getting Started with the LAUNCHXL-F28027 www.ti.com 2.2 Install the Software Once downloaded, install Code Composer Studio and the controlSUITE package. 2.3 Install the Hardware After Code Composer Studio is installed, plug the supplied USB cable into the C2000 LaunchPad board and into an available USB port on your computer. Windows® will automatically detect the hardware and ask you to install software drivers. Let Windows run a search for the drivers and automatically install them. After Windows successfully installs the drivers for the integrated XDS100v2 emulator, your LaunchPad is now ready for use. 3 Getting Started with the LAUNCHXL-F28027 3.1 Getting Started The first time the LAUNCHXL-F28027 is used, a demo application automatically starts when the board is powered from a USB host. If your board does not start the demo application, try placing S1 in the following positions and resetting the board: UP - UP - DOWN. To start the demo, connect the LAUNCHXL-F28027 with the included mini-USB cable to a free USB port. The demo application starts with the LEDs flashing to show the device is active. 3.2 Demo Application, Internal Temperature Measurement The LAUNCHXL-F28027 includes a pre-programmed TMS320F28027 device. When the LaunchPad is connected via USB, the demo starts with an LED flash sequence that points toward S3. Press S3 to start the temperature measurement mode. A reference temperature is taken at the beginning of this mode and the LEDs of the LaunchPad are used to display any difference between the current temperature and the reference temperature. Initially, the LED connected to GPIO3 is lit to indicate an 8 in binary, which corresponds to the current temperature being equal to the reference temperature. As the temperature drifts away from the reference, the difference is displayed as a binary increment or decrement of the nibble wide LED display. For instance, if the reference temperature was 30ºC and the current temperature is 33ºC, the LEDs would be (from left to right) ON, OFF, ON, and ON which would be 11 in binary (33-30=3 and 11-8=3). A new reference temperature may be set at any time by pressing S3 again. In addition to the LED display, temperature information is also displayed on your PC through the USB/UART connection. To view the UART information on your PC, first figure out the COM port associated with the LaunchPad. To do this in Windows, right click on My Computer and click on Properties. In the dialog box that appears, click on the Hardware tab and open Device Manager. Look for an entry under Ports (COM & LPT) titled "USB Serial Port (COMX)", where X is a number. Remember this number for when you open a serial terminal. The demo applications UART data was written and debugged using PuTTY, and for the best user experience we recommend you use PuTTY to view the UART data. Open your serial terminal program and open the COM port you found previously in device manager with the following settings: 115200 Baud, 8 data bits, no parity, 1 stop bit. After opening the serial port in your serial terminal, reset the Launchpad with the reset push button and observe the serial terminal for a surprise. 3.3 Program and Debug the Temperature Measurement Demo Application The project and associated source code for the C2000 Piccolo LaunchPad demo is included in the controlSUITE software package and should automatically be found by the TI Resource Explorer in Code Composer Studio v5. In the resource explorer, open the controlSUITE folder and then the kits tab and look for the C2000 LaunchPad line item. Expand this item and select the LaunchPad Demo Application. Follow the steps in the main pane of the resource explorer to import, build, debug, and run this application. 4 Hardware Configuration The C2000 LaunchPad gives users several options as to how to configure the board. 6 LAUNCHXL-F28027 C2000 Piccolo LaunchPad Experimenter Kit SPRUHH2–July 2012 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated
  • 7. www.ti.com Hardware Configuration 4.1 Power Domain The C2000 LaunchPad has two separate power domains for the purpose of allowing JTAG isolation. Jumpers JP1, JP2, and JP3 configure whether the USB power is passed to the target device. Jumper Power Domain JP1 3.3 V JP2 Ground JP3 5 V 4.2 Serial Connectivity The LAUNCHXL-F28027 has a USB to UART adapter built in. This makes it easy to print debug information back to the host PC even in isolated environments. However, in some cases the user may wish to connect the Piccolo SCI peripheral (C2000 UART peripheral) to a BoosterPack or other hardware via the header pins. If the SCI pins are connected to both the header pins, the XDS100 UART channel contention would exist and the pins would not be driven to the correct voltage levels. To solve this issue we have included a switch to allow the user to disconnect the Piccolo serial pins from the XDS100 UART connection. When S4 is in the up position, the Piccolo device's SCI is connected to the XDS100 and you are able to receive and send serial information from or to the board. When S4 is in the down position, the Piccolo device's SCI is disconnected from the XDS100 and BoosterPacks, which use serial communication, and can communicate with the Piccolo device. 4.3 Boot Mode Selection The LaunchPad's F28027 device includes a boot ROM that performs some basic start-up checks and allows for the device to boot in many different ways. Most users will either want to perform an emulation boot or a boot to flash (if they are running the application standalone). S1 has been provided to allow users to easily configure the pins that the bootROM checks to make this decision. The switches on S1 correspond to: Switch Function 1 GPIO34 2 GPIO37 3 TRSTn Keep in mind that the debugger does not connect if the device is not in the emulation boot mode (TRST switch in the up position). More information about boot mode selection can be found in the TMS320x2802x Piccolo Boot ROM Reference Guide (SPRUFN6). 4.4 Connecting a Crystal Although the Piccolo device present on the LAUNCHXL-F28027 has an internal oscillator — and for most applications this is sufficient — the LaunchPad offers a footprint for surface mount or through-hole HC-49 crystals for users who require a more precise clock. If you wish to use an external crystal, solder the crystal to the Q1/Q2 footprint and appropriate load capacitors to the C3 and C4 footprints. You also need to configure the device to use the external oscillator in software. 4.5 Connecting a Satellite Board The C2000 LaunchPad is the perfect experimenter board to start hardware development with the F2802x devices. Connectors J1, J2, J5, and J6 and the power supply at J3 are aligned in a 0.1-in (2.54-mm) grid to allow an easy and inexpensive development of a breadboard extension module. These satellite boards can access all of the GPIO and analog signals. The alignment of the connectors and the pin out can be found in Section 5. 7SPRUHH2–July 2012 LAUNCHXL-F28027 C2000 Piccolo LaunchPad Experimenter Kit Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated
  • 8. LAUNCHXL-F28027 Hardware www.ti.com 4.6 Device Migration Path Applications developed on the LAUNCHXL-F28027 can easily be migrated to any of these lower cost devices in the F2802x family: Part Number Description TMS320F28027(1) 32-bit Real Time Microcontroller, 60 MHz, 32K Flash, 6K RAM, 4 HRPWM TMS320F28026 32-bit Real Time Microcontroller, 60 MHz, 16K Flash, 6K RAM, 4 HRPWM TMS320F28023 32-bit Real Time Microcontroller, 50 MHz, 32K Flash, 6K RAM, 4 HRPWM TMS320F28022 32-bit Real Time Microcontroller, 50 MHz, 16K Flash, 6K RAM, 4 HRPWM TMS320F28021 32-bit Real Time Microcontroller, 40 MHz, 32K Flash, 5K RAM TMS320F28020 32-bit Real Time Microcontroller, 40 MHz, 16K Flash, 3K RAM TMS320F280200 32-bit Real Time Microcontroller, 40 MHz, 8K Flash, 3K RAM (1) This device is present on the LAUNCHXL-F28027. 5 LAUNCHXL-F28027 Hardware 5.1 Device Pin Out Table 1 lists the pin out and pin mux options for the C2000 LaunchPad. Table 1. C2000 LaunchPad Pin Out and Pin Mux Options Mux Value Mux Value 3 2 1 0 J1 Pin J5 Pin 0 1 2 3 +3.3V 1 1 +5V ADCINA6 2 2 GND TZ2 SDAA SCIRXDA GPIO28 3 3 ADCINA7 TZ3 SCLA SCITXDA GPIO29 4 4 ADCINA3 Rsvd Rsvd COMP2OUT GPIO34 5 5 ADCINA1 ADCINA4 6 6 ADCINA0 SCITXDA SPICLK GPIO18 7 7 ADCINB1 ADCINA2 8 8 ADCINB3 ADCINB2 9 9 ADCINB7 ADCINB4 10 10 NC 3 2 1 0 J6 Pin J2 Pin 0 1 2 3 Rsvd Rsvd EPWM1A GPIO0 1 1 GND COMP1OUT Rsvd EPWM1B GPIO1 2 2 GPIO19 SPISTEA SCIRXDA ECAP1 Rsvd Rsvd EPWM2A GPIO2 3 3 GPIO12 TZ1 SCITXDA Rsvd COMP2OUT Rsvd EPWM2B GPIO3 4 4 NC Rsvd Rsvd EPWM3A GPIO4 5 5 RESET# ECAP1 Rsvd EPWM3B GPIO5 6 6 GPIO16/32 SPISIMOA/ Rsvd/ TZ2/ SDAA EPWMSYNCI ADCSOCA TZ2/ Rsvd/ SPISIMOA/ GPIO16/32 7 7 GPIO17/33 SPISOMIA/ Rsvd/ TZ3/ ADCSOCA EPWMSYNCI SDAA SCLA EPWMSYNCO ADCSOCB TZ3/ Rsvd/ SPISOMIA/ GPIO17/33 8 8 GPIO6 EPWM4A EPWMSYNCI EPWMSYNCO ADCSOCB EPWMSYNCO SCLA NC 9 9 GPIO7 EPWM4B SCIRXDA Rsvd NC 10 10 ADCINB6 8 LAUNCHXL-F28027 C2000 Piccolo LaunchPad Experimenter Kit SPRUHH2–July 2012 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated
  • 9. Emulator - XDS100v2 1.0C2000_LaunchPad.sch 10k 2.2k 3.3u 0.1u 93 0.1u0.1u0.1u 12k 1k ISO7231 ISO7240 AGND AGND AGND AGND AGNDAGND GND GND AGND 1u 0.1u AGND AGND 1k AGND 330 330 12M 36p 36p +3V3 0 0 0 0 0 0 0 0 0 TLV1117-33 100u AGND +3V3 AGND AGND AGND AGND 4.7u 4.7u AGND AGND 820 AGND 500mA +5V R29 R31 C15 C16 62 CLK4 DO 1 DI3 CS5 VCC GND U8 VREGINP$50 USBDMP$7 USBDPP$8 REFP$6 RESET#P$14 OSCIP$2 OSCOP$3 EECSP$63 EECLKP$62 EEDATAP$61 TESTP$13 AGNDP$10 GND1P$1 GND2P$5 GND3P$11 GND4P$15 PWREN# P$60 SUSPEND# P$36 BCBUS3 P$54 BCBUS2 P$53 BCBUS1 P$52 BCBUS0 P$48 BDBUS7 P$46 BDBUS6 P$45 BDBUS5 P$44 BDBUS4 P$43 BDBUS3 P$41 BDBUS2 P$40 BDBUS1 P$39 BDBUS0 P$38 ACBUS3 P$29 ACBUS2 P$28 ACBUS1 P$27 ACBUS0 P$26 ADBUS7 P$24 ADBUS6 P$23 ADBUS5 P$22 ADBUS4 P$21 ADBUS3 P$19 ADBUS2 P$18 ADBUS1 P$17 ADBUS0 P$16 VCCIO1P$20 VCORE2P$37 VCORE1P$12 VPHYP$4 U6 FT2232H ACBUS4 P$30 ACBUS5 P$32 ACBUS6 P$33 ACBUS7 P$34 BCBUS4 P$55 BCBUS5 P$57 BCBUS6 P$58 BCBUS7 P$59 GND5P$25 GND6P$35 GND7P$47 GND8P$51 VREGOUTP$49 VPLLP$9 VCORE3P$64 VCCIO2P$31 VCCIO3P$42 VCCIO4P$56 THTH C14C13C12 R24 R22 1 2 3 4 5 VCC1 1VCC216 GND1 2 GND1 8 GND215 GND29 INA 3 INB 4 OUTC 5 NC1 6 EN1 7EN210 OUTA14 OUTB13 INC12 NC211 U7 VCC11 VCC2 16 GND12 GND18 GND2 15 GND2 9 INA3 INB4 INC5 IND6 NC7 EN 10 OUTA 14 OUTB 13 OUTC 12 OUTD 11 U5 C7 C9 R23 D7 D8 R26 R27 Q3 C17 C18 R21 R20 R19 R18 R16 R28 R30 R32 R25 VIN3 VOUT1 2 VOUT2 4 ADJ/GND1 U4 C8 1JP1 2 1JP2 2 C10 C11 L2 L1 D6 R17F1 1JP3 2 D- D- D+ D+ USBVCC USBVCC USBVCC TCK TDI TDO TMS FTDI_CS FTDI_CS FTDI_CLK FTDI_CLK FTDI_DATA FTDI_DATA FTDI_DATA FTDI_1V8 PWREN# SUSPEND# SCI_RX SCI_TX FTDI_3V3 FTDI_3V3 FTDI_3V3 FTDI_3V3 FTDI_3V3 FTDI_3V3 FTDI_3V3 FTDI_3V3 JTAG_TRST Array EEPROM A B C D E A B C D E 1 2 3 4 5 6 www.ti.com LAUNCHXL-F28027 Hardware 5.2 Schematics Figure 2 and Figure 3 show the C2000 LaunchPad schematics sheets. Figure 2. C2000 LaunchPad Schematic—Sheet 1 of 2 9SPRUHH2–July 2012 LAUNCHXL-F28027 C2000 Piccolo LaunchPad Experimenter Kit Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated
  • 10. SCI_RX SCI_TX SPI_CLK SPI_MISO SPI_MOSI SPI_MISO SPI_MOSI 1.0 Piccolo F2802x C2000_LaunchPad.sch +3V3 TMS320F28027PT 36p36p 1M GND GND +3V3 GND 2.2k 2.2k 2.2k 820 820 +3V3 +3V3 GND GND 2.2u 2.2u GND GND FSMJSMAFSMJSMA 10k +3V3 GNDGND SN74LVC2G07 330 330 +3V3 +3V3 +3V3 GND SN74LVC2G07 330 330 +3V3 +3V3 +3V3 GND 820 +3V3 GND 219-03 2.2k GND 204-1 2.2u GND 2.2u GND 2.2u GND GND +3V3 +3V3 +5V GND GND GPIO29/SCITXDA/SCLA/TX3#1 TRST#2 XRS#3 ADCINA6/AIO64 ADCINA4/COMP2A/AIO45 ADCINA76 ADCINA37 ADCINA18 ADCINA2/COMP1A/AIO29 ADCINA0/VREFHI10 VDDA11 VSSA/VREFLO12 ADCINB113 ADCINB2/COMP1B/AIO1014 ADCINB315 ADCINB4/COMP2B/AIO1216 ADCINB6/AIO1417 ADCINB718 GPIO34/COMP2OUT19 TDI20 TMS21 TDO22 TCK23 GPIO18/SPICLKA/SCITXDA/XCLKOUT24 GPIO19/XCLKIN/SPISTEA#/SCIRXDA/ECAP125 GPIO17/SPISOMIA/TZ3# 26 GPIO16/SPISIMOA/TZ2# 27 GPIO1/EPWM1B/COMP1OUT 28 GPIO0/EPWM1A 29 TEST 30 GPIO32/SDAA/EPWMSYNCI/ADCSOCAO#31 VDD1 32 VSS1 33 VREGENZ# 34 VDDIO 35 GPIO33/SCLA/EPWMSYNCO/ADCSOCBO#36 GPIO2/EPWM2A 37 GPIO3/EPWM2B/COMP2OUT 38 GPIO4/EPWM3A 39 GPIO5/EPWM3B/ECAP1 40 GPIO6/EPWM4A/EPWMSYNCI/EPWMSYNCO41 GPIO7/EPWM4B/SCIRXDA 42 VDD2 43 VSS2 44 X1 45 X2 46 GPIO12/TZ1#/SCITXDA 47 GPIO28/SCIRXDA/SDAA/TZ2# 48 U1 Q1 Q2 C4C3 R7 R6 R8 R9 R4 R5 C5 C6 S3S2 D2 D4 R11 1A1 2A3 2Y 4 1Y 6 VCC5GND2 U2 R12 R13 D3 D5 1A1 2A3 2Y 4 1Y 6 VCC5GND2 U3 R14 R15 D1 R1 4 5 61 2 3 S1 R10 P$2P$1 S4 P$3P$4 L3 L4 C19 C20C21 1 2 3 J3 1 2 3 4 5 6 7 8 9 10 J1 1 2 3 4 5 6 7 8 9 10 J5 1 2 3 4 5 6 7 8 9 10 J6 1 2 3 4 5 6 7 8 9 10 J2 1JP4 2 1JP5 2 1JP6 2 1JP7 2 1 JP8 2 1 JP9 2 1 JP10 2 1 JP11 2 TCK TDI TDO TDO TMS SCI_RX SCI_TX TRST TRST RESET# RESET# RESET# GPIO34 GPIO34 GPIO34 GPIO19 GPIO19GPIO17 GPIO17 GPIO17 GPIO16 GPIO16 GPIO16 GPIO1 GPIO1 GPIO1 GPIO0 GPIO0 GPIO0 GPIO32 GPIO32 GPIO32 GPIO2 GPIO2 GPIO2 GPIO3 GPIO3 GPIO3 GPIO4 GPIO4 GPIO5 GPIO5 GPIO6 GPIO6 GPIO7 GPIO7 GPIO12 GPIO12 GPIO12 GPIO28 GPIO28 GPIO28 GPIO29 GPIO29 GPIO29 ADCINA6 ADCINA6 ADCINA4 ADCINA4 ADCINA1 ADCINA1 ADCINA2 ADCINA2 ADCINB1 ADCINB1 ADCINB2 ADCINB2 ADCINB4 ADCINB4 ADCINB6 ADCINB6 GPIO18 GPIO18 GPIO33 GPIO33 GPIO33 JTAG_TRST ADCINA7 ADCINA7 ADCINA3 ADCINA3 ADCINA0 ADCINA0 ADCINB3 ADCINB3 ADCINB7 ADCINB7 123 ON 1 ON A B C D E A B C D E 1 2 3 4 5 6 LAUNCHXL-F28027 Hardware www.ti.com Figure 3. C2000 LaunchPad Schematic—Sheet 2 of 2 10 LAUNCHXL-F28027 C2000 Piccolo LaunchPad Experimenter Kit SPRUHH2–July 2012 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated
  • 11. www.ti.com LAUNCHXL-F28027 Hardware 5.3 PCB Layout Figure 4, Figure 5, and Figure 6 show the LAUNCHXL-F28027 PCB layout. Figure 4. LAUNCHXL-F28027 PCB Layout—Top Layer Figure 5. LAUNCHXL-F28027 PCB Layout—Bottom Layer Figure 6. LAUNCHXL-F28027 PCB Layout—Silkscreen Image 11SPRUHH2–July 2012 LAUNCHXL-F28027 C2000 Piccolo LaunchPad Experimenter Kit Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated
  • 12. LAUNCHXL-F28027 Hardware www.ti.com 5.4 Bill of Materials (BOM) Table 2 lists the LAUNCHXL-F28027 bill of materials. Table 2. LAUNCHXL-F28027 Bill of Materials Quantity per Reference Board Description R12, R13, R14, R15, R26, R27 6 RES 330 Ω 1/10W 5% 0402 SMD R1, R4, R5, R17 4 RES 820 Ω 1/10W 5% 0402 SMD R22, R23 2 RES 1.0K Ω 1/10W 5% 0402 SMD R6, R8, R9, R10, R31 5 RES 2.2K Ω 1/10W 5% 0402 SMD R11, R29 2 RES 10K Ω 1/10W 5% 0402 SMD R24 1 RES 12K Ω 1/16W .5% 0402 SMD R7 1 RES 1.0M Ω 1/10W 5% 0402 SMD R16, R18, R19, R20, R21, R25, R28, R30, 9 RES 0.0 Ω 1/4W 1206 SMD R32 L1, L2 2 FERRITE BEAD 600 Ω 0402 L3 1 FERRITE BEAD 220 Ω 0402 L4 1 FERRITE CHIP 60 Ω 1.5A 0402 C9, C12, C13, C14, C16 5 CAP .10 µF 16 V CERAMIC Y5V 0402 C7 1 CAP CER 1.0 µF 6.3 V X5R 20% 0402 C5, C6, C19, C20, C21 5 CAP CER 2.2 µF 6.3 V 20% X5R 0402 C15 1 CAP CER 3.3 µF 4.0 V X5R 0402 C10, C11 2 CAP CER 4.7 µF 4 V X5R 0402 C3, C4 2 CAP CER 36PF 50 V C0G 0402 C17, C18 2 CAP CER 36PF 50 V C0G 0402 C8 1 CAP TANTALUM 100 µF 6.3 V 10% SMD F1 1 PTC RESETTABLE .50A 15 V 1812 S1 1 SWITCH DIP 3POS TOP SLIDE SMT S4 1 SWITCH DIP DPST 1POS SMT S2, S3 2 SW TACT SPST-NO MOM 160GF SMD Q1, Q2 1 Crystal Q3 1 CRYSTAL 12.0000 MHZ 18PF SMD D6 1 LED RED HIGH BRIGHT ESS SMD D1 1 LED GREEN HIGH BRIGHT ESS SMD D2, D3, D4, D5, D7, D8 6 LED BLUE HIGH BRIGHT ESS SMD JP1, JP2, JP3 3 BERGSTIK II .100" SR STRAIGHT J1 and J5, J2 and J6 2 CONN HEADER .100 DUAL STR 20POS J3 1 CONN HEADER .100 SNGL STR 3POS CON1 1 CONN RECEPT MINI-USB TYPE B SMT U4 1 IC LDO REG 800MA 3.3 V SOT223-4 U2, U3 2 IC BUFF/DVR DL NON-INV SOT236 U5 1 ISOLAT DGTL 2.5 KVRMS 4CH 16-SOIC U7 1 ISOLAT DGTL 3 KVRMS 3CH 16-SOIC U6 1 IC USB HS DUAL UART and FIFO 64-QFN U8 1 IC EEPROM 2KBIT 3 MHZ SOT23-6 U1 1 IC MCU 32 BIT 64KB FLASH 48LQFP 12 LAUNCHXL-F28027 C2000 Piccolo LaunchPad Experimenter Kit SPRUHH2–July 2012 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated
  • 13. www.ti.com Suggested Reading 6 Suggested Reading The following documents describe the C2000 devices. Copies of these documents are available on the Internet at http://www.ti.com/c2000 and www.ti.com/c2000-launchpad, or click on the links below: • TMS320F28027/28026/28023/28022/28021/28020/280200 Piccolo Microcontrollers Data Manual (SPRS523) • TMS320F28027/28026/28023/28022/28021/28020/2802x0 Piccolo MCU Silicon Errata (SPRZ292) • TMS320x2802x, 2803x Piccolo Analog-to-Digital Converter (ADC) and Comparator Reference Guide (SPRUGE5) • TMS320x2802x, 2803x Piccolo High Resolution Pulse Width Modulator (HRPWM) Reference Guide (SPRUGE8) • TMS320x2802x, 2803x Piccolo Inter-Integrated Circuit (I2C) Reference Guide (SPRUFZ9) • TMS320x2802x, 2803x Piccolo Enhanced Pulse Width Modulator (ePWM) Module Reference Guide (SPRUGE9) • TMS320x2802x/TMS320F2802xx Piccolo System Control and Interrupts Reference Guide (SPRUFN3) • TMS320x2802x Piccolo Boot ROM Reference Guide (SPRUFN6) • TMS320x2802x, 2803x Piccolo Serial Communications Interface (SCI) Reference Guide (SPRUGH1) • TMS320x2802x, 2803x Piccolo Enhanced Capture (eCAP) Module Reference Guide (SPRUFZ8) • TMS320C28x Instruction Set Simulator Technical Overview (SPRU608) • TMS320C28x Optimizing C/C++ Compiler v6.1 User's Guide (SPRU514) • TMS320C28x Assembly Language Tools v6.1 User's Guide (SPRU513) 13SPRUHH2–July 2012 LAUNCHXL-F28027 C2000 Piccolo LaunchPad Experimenter Kit Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated
  • 14. Frequently Asked Questions (FAQ) www.ti.com 7 Frequently Asked Questions (FAQ) 1. Can other programming and debug tools (such as an XDS510 emulator) be used with the C2000 LaunchPad? While a user could potentially connect an external emulator to the F28027 device present on the LaunchPad, it would require some rework of the board. It is recommended that users who want to use an external emulator purchase a controlCard and docking station that includes an external JTAG connector. 2. What versions of Code Composer Studio can be used to develop software for the C2000 LaunchPad? It is highly recommend that novice users develop applications with Code Composer Studio v5. The drivers, examples, and other associated software are tailored to make the user experience as smooth as possible in Code Composer Studio v5. However, there is nothing to prevent a user from creating projects in Code Composer Studio v3 or v4 with the source files available in controlSUITE. Keep in mind that all the projects for the C2000 LaunchPad are Code Composer Studio v5 projects and will not import into Code Composer Studio v3 or v4. Only expert users should attempt to use the LaunchPad with Code Composer Studio v3 or v4. 3. Why can’t I connect to the LaunchPad in Code Composer Studio? There are a number of things that could cause this and they all have an easy fix. • Is S1 switch 3 in the down position? This is the TRST pin which enables and disables JTAG functionality on the chip. This switch must be in the up position for the emulator to be able to connect. • Are both power LEDs lit? The board has two power domains because of the isolated JTAG interface. For low-voltage application development, JTAG isolation is not needed and the power domains can be combined to allow for convenience (that is, the board can be powered completely through the USB). Ensure that jumpers are placed on the posts of JP1, JP2, and JP3. • Are drivers correctly installed for the XDS100v2 present on the LaunchPad? Right click on My Computer and select properties. Navigate to the Hardware tab in the dialog box and open the device manager. Scroll to the bottom of the list and expand the USB Serial Bus controllers item. Are there two entries for TI XDS100 Channel A/B? If not, try unplugging and replugging in the board. Does Windows give you any messages in the system tray? In Device Manger, do either of the entries have a yellow exclamation mark over their icon? If so, try reinstalling the drivers. 4. Why is the serial connection not working? There are a few things that could cause this and they are easy to fix. • Is S4 in the up position? S4 connects the F28027 device serial peripheral to the XDS100 serial port, so this switch must be turned on (up) for serial connectivity to function. • Are you using the correct COM port? Right click on My Computer and select properties. Navigate to the Hardware tab in the dialog box and open the device manager. Scroll to Ports (COM & LPT) and expand this entry. Is there a USB Serial Port listed? If so, read the COM number to the right of the entry; this is the COM number you should be using. • Are you using the correct baud rate? Most, if not all, of the examples are configured for a baud rate of 115200 when the CPU is running at 60 MHz. If you have changed the PLL settings or written your own application you may have to recalculate the baud rate for your specific application. For information on how to do this, see the TMS320x2802x, 2803x Piccolo Serial Communications Interface (SCI) Reference Guide (SPRUGH1). 14 LAUNCHXL-F28027 C2000 Piccolo LaunchPad Experimenter Kit SPRUHH2–July 2012 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated
  • 15. EVALUATION BOARD/KIT/MODULE (EVM) ADDITIONAL TERMS Texas Instruments (TI) provides the enclosed Evaluation Board/Kit/Module (EVM) under the following conditions: The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims arising from the handling or use of the goods. Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days from the date of delivery for a full refund. THE FOREGOING LIMITED WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES. Please read the User's Guide and, specifically, the Warnings and Restrictions notice in the User's Guide prior to handling the product. This notice contains important safety information about temperatures and voltages. For additional information on TI's environmental and/or safety programs, please visit www.ti.com/esh or contact TI. No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or combination in which such TI products or services might be or are used. TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not exclusive. TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or services described herein. REGULATORY COMPLIANCE INFORMATION As noted in the EVM User’s Guide and/or EVM itself, this EVM and/or accompanying hardware may or may not be subject to the Federal Communications Commission (FCC) and Industry Canada (IC) rules. For EVMs not subject to the above rules, this evaluation board/kit/module is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end product fit for general consumer use. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to part 15 of FCC or ICES-003 rules, which are designed to provide reasonable protection against radio frequency interference. Operation of the equipment may cause interference with radio communications, in which case the user at his own expense will be required to take whatever measures may be required to correct this interference. General Statement for EVMs including a radio User Power/Frequency Use Obligations: This radio is intended for development/professional use only in legally allocated frequency and power limits. Any use of radio frequencies and/or power availability of this EVM and its development application(s) must comply with local laws governing radio spectrum allocation and power limits for this evaluation module. It is the user’s sole responsibility to only operate this radio in legally acceptable frequency space and within legally mandated power limitations. Any exceptions to this are strictly prohibited and unauthorized by Texas Instruments unless user has obtained appropriate experimental/development licenses from local regulatory authorities, which is responsibility of user including its acceptable authorization. For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant Caution This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. FCC Interference Statement for Class A EVM devices This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense.
  • 16. FCC Interference Statement for Class B EVM devices This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna. • Increase the separation between the equipment and receiver. • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. • Consult the dealer or an experienced radio/TV technician for help. For EVMs annotated as IC – INDUSTRY CANADA Compliant This Class A or B digital apparatus complies with Canadian ICES-003. Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. Concerning EVMs including radio transmitters This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Concerning EVMs including detachable antennas Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Cet appareil numérique de la classe A ou B est conforme à la norme NMB-003 du Canada. Les changements ou les modifications pas expressément approuvés par la partie responsable de la conformité ont pu vider l’autorité de l'utilisateur pour actionner l'équipement. Concernant les EVMs avec appareils radio Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Concernant les EVMs avec antennes détachables Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur. SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER
  • 17. 【【Important Notice for Users of this Product in Japan】】 This development kit is NOT certified as Confirming to Technical Regulations of Radio Law of Japan If you use this product in Japan, you are required by Radio Law of Japan to follow the instructions below with respect to this product: 1. Use this product in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of Japan, 2. Use this product only after you obtained the license of Test Radio Station as provided in Radio Law of Japan with respect to this product, or 3. Use of this product only after you obtained the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to this product. Also, please do not transfer this product, unless you give the same notice above to the transferee. Please note that if you could not follow the instructions above, you will be subject to penalties of Radio Law of Japan. Texas Instruments Japan Limited (address) 24-1, Nishi-Shinjuku 6 chome, Shinjuku-ku, Tokyo, Japan http://www.tij.co.jp 【ご使用にあたっての注】 本開発キットは技術基準適合証明を受けておりません。 本製品のご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。 1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用いただく。 2. 実験局の免許を取得後ご使用いただく。 3. 技術基準適合証明を取得後ご使用いただく。 なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。    上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・インスツルメンツ株式会社 東京都新宿区西新宿6丁目24番1号 西新宿三井ビル http://www.tij.co.jp SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER
  • 18. EVALUATION BOARD/KIT/MODULE (EVM) WARNINGS, RESTRICTIONS AND DISCLAIMERS For Feasibility Evaluation Only, in Laboratory/Development Environments. Unless otherwise indicated, this EVM is not a finished electrical equipment and not intended for consumer use. It is intended solely for use for preliminary feasibility evaluation in laboratory/development environments by technically qualified electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems and subsystems. It should not be used as all or part of a finished end product. Your Sole Responsibility and Risk. You acknowledge, represent and agree that: 1. You have unique knowledge concerning Federal, State and local regulatory requirements (including but not limited to Food and Drug Administration regulations, if applicable) which relate to your products and which relate to your use (and/or that of your employees, affiliates, contractors or designees) of the EVM for evaluation, testing and other purposes. 2. You have full and exclusive responsibility to assure the safety and compliance of your products with all such laws and other applicable regulatory requirements, and also to assure the safety of any activities to be conducted by you and/or your employees, affiliates, contractors or designees, using the EVM. Further, you are responsible to assure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. 3. You will employ reasonable safeguards to ensure that your use of the EVM will not result in any property damage, injury or death, even if the EVM should fail to perform as described or expected. 4. You will take care of proper disposal and recycling of the EVM’s electronic components and packing materials. Certain Instructions. It is important to operate this EVM within TI’s recommended specifications and environmental considerations per the user guidelines. Exceeding the specified EVM ratings (including but not limited to input and output voltage, current, power, and environmental ranges) may cause property damage, personal injury or death. If there are questions concerning these ratings please contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, some circuit components may have case temperatures greater than 60°C as long as the input and output are maintained at a normal ambient operating temperature. These components include but are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors which can be identified using the EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during normal operation, please be aware that these devices may be very warm to the touch. As with all electronic evaluation tools, only qualified personnel knowledgeable in electronic measurement and diagnostics normally found in development environments should use these EVMs. Agreement to Defend, Indemnify and Hold Harmless. You agree to defend, indemnify and hold TI, its licensors and their representatives harmless from and against any and all claims, damages, losses, expenses, costs and liabilities (collectively, "Claims") arising out of or in connection with any use of the EVM that is not in accordance with the terms of the agreement. This obligation shall apply whether Claims arise under law of tort or contract or any other legal theory, and even if the EVM fails to perform as described or expected. Safety-Critical or Life-Critical Applications. If you intend to evaluate the components for possible use in safety critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, such as devices which are classified as FDA Class III or similar classification, then you must specifically notify TI of such intent and enter into a separate Assurance and Indemnity Agreement. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2012, Texas Instruments Incorporated
  • 19. IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2012, Texas Instruments Incorporated