Manufacturer and Exporter of a wide array of optimum quality soldering and brazing fluxes, PCB chemicals and Solder Alloys such as Flux- 15C, Flux-615, Flux-638, Flux- RN40, Flux- RN40, Flux- 708, Flux-709, Flux- 915 (voc- Free), Flux Paste S18-MA (Rosin Activated), Flux Paste S7-MA (Rosin Mildly Activated), Flux Paste-9226, Flux Paste-982, Solder Conditioner - 1410, Solder Brightner 2727, Copper Cleaner 3033, Flux 506 (RT).

2. PRODUCTSFORPCBASSEMBLY
ROSINACTIVATED FLUXES (RATYPE) NO CLEAN- LOWSOLIDSFLUXES
These Fluxesare clear,homogenous solutions ofWW The no-clean fluxes are halogen-free with low solids.They
grade rosin in special alcohol solvent systemswith effective leave very little residues that require no-cieaning.The
activating agents.They can be applied by foaming, dipping non-corrosive and non-conductive characteristicsof the
or spraying. residues usually yield higher surface insulation resistance
than the residuesof typical organic water soluble flux.
FLUX- 15C They can be applied by foaming, dipping, spraying.
It is a liquid solution with approximately 15%solids
containing water white rosin blended solvent system FLUX- 707
with activators.The chlorides are approximately 0.1%. It is a halogen-free, modified rosin, low solids solvent
The surfactants incorporated into the flux yield relatively designed for wave soldering conventional and surface
tackfree residues. mount circuit board assemblies.
FLUX-615 FLUX- 708
It is a liquid solution with approximately 15%solids contain- It is a halogen-free, non-rosin, low solids solvent system
ing water white rosin blended solvent system into which a designed for similar application as Flux-707.lt contains
small amount of effective activating agent is incorporated. synthetic resin.
The chlorides are approximately 0.25%.
FLUX- 709
FLUX-638 . It is a halogen-free, rosin-resin free,with lower solids
It is a qquid solution with approximately 38% solids contain- percentage solvent system designed for similar application
ing ww-rosin with activators and surfactants.The chlorides as Flux-707.However,it has lessfoaming action than
are approximately 0.2%. Flux - 707.
ROSINMILDLYACTIVATED FLUXES (RMATYPE) FLUX- 915 (VOC- Free)
These Fluxescontain WW-rosin and solvent systemssimilar It is a VOC-free,halogen-free foamable flux with low solids
to RAfluxes,however,the activation is so incorporated that water based system.Although it is a No Clean Fluxthe flux
the chlorides are within 0.075%.They can be applied by residues are water soluble and can be cleaned with
foaming, dipping or spraying. deionised water.
FLUX- 7A TINNINGOIL
It is a liquid solution with approximately 8% solids contain- A refined synthetic oil for useas a blanket on top of molten
ing water white rosin blended solvent systemwith which solder to minimize dross.
effective activators are so incorporated that the chlorides
are maximum 0.055%. SOLDER BARS
High purity ofTin and Lead uniformly alloyed in 63/37 or
FLUX-415 60/40 proportion for optimum performance and process
It is a liquid solution with approximately 15%solids contain- consistency.
ing water white rosin blended solvent system and activators.
The chlorides are maximum 0.075%. FLUXPASTE HAND SOLDERING
For applications where a liquid flux is inconvenient to
ROSINNONACTIVATEDLUX(RTYPE)
F use these paste formulations are available.
These Fluxescontain WW-rosin and solvent systemswithout
any activating agents.They can be applied by foaming, FLUXPASTE S18-MA(ROSIN ACTIVATED)
dipping or spraying. It is a blend of water white rosin,surfactants and activators
especially formulated for assembling printed circuits.
FLUX- RN40 It can be applied to the areasto be soldered by any
It is a liquid solution with approximately 40% solids convenient method.
containing WW rosin in solvents system without any
activating agent. FLUXPASTE S7-MA(ROSINMILDLYACTIVATED)
It is a blend of water white rosin with surfactants similar
ORGANIC WATER SOLUBLE FLUXES to Flux PasteS-18-A.However it is mildly activated per
Organic fluxes provide greater fluxing action than rosin but MIL-14256D.
the ionizable nature of the water-soluble residues necessitate
their adequate removal, generally with deionised water. FLUXPASTE NC-25(NO CLEAN)
It is a non-rosin halogen-free paste with surfactant and
FLUX- 103 activator especially formulated for assembling printed
It is a water soluble organic activated flux. It is especially circuits. It is lessactive than Flux PastesS-18Aand S7-MA.
adaptable for foam fluxing, however, it can also be applied
by dipping or brushing. It is used where inorganic fluxes are
too corrosive to useand rosin fluxes are too inactive for the
application. It is essentialthat the flux residues be
completely and adequately removed.

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SOLDER STRIPPERS (NON PEROXIDE) 2529
- FLUX-1202
It is an acid basechemical solution formulated to effectively remove It is a high activity, organic based chloride free aluminium soldering
tin/lead and tin plated surfacesfrom copper substrate.It does not fluxthat can be used for soldering aluminium to aluminium,
contain peroxide or fluorides. Type Z is non foaming and can be aluminium to copper/brass and aluminium to plated terminals and it
usedeither by spraying or dipping. Type N is a foaming type and is also performs well in hot dip coating of aluminium cable connectors.
used by dipping only. The flux has a specific gravity of 1.14.
SOLDER CONDITIONER 1410
- FLUX-OP64
It is an acid basechemical cleaner for cleaning and conditioning It is a solvent based, acidic solution used prior to soldering the
tin/lead plated surfaces.It removes ammonia salt residuesformed stainless steel surface. It is primarily used to clean the stainless steel
during alkaline etching. It can also be used as a presoldering cleaner surface by removing organic contaminants and oxides.It has a
to improve solderability by removing oxides formed during storage. specific gravity of 1.55.
SOLDER BRIGHTNER2727- FLUX-ZC40
It is a non-halogen, acid chemical cleaner for cleaning It is an acidic solution used prior to soldering the brass or copper
and conditioning tin/lead plated surfaces.It contains additives surfaces. It is primarily used to clean the brass and copper surfaceby
to enhance reflow charact~risticswhen used asa precleaner prior removing organic contaminants and oxides. The fluxhas a specific
to infrared or hot oil fusing. It will remove ammonia salt residues gravity of 1.10.
formed in alkaline etching system and oxides formed during
storage. FLUXPASTE ACL-15
It is a zinc free blend of polyols,surfactants and activators. It is
COPPER
CLEANER 3033
- especially used for assembling by soldering and brazing the copper
It is an acidic,organic,water soluble, sprayablecleaner to remove and brass parts used in plumbing applications. The Flux-Pasteand its
organic and inorganic soils such asfinger prints, light oil and tarnish residues are completely water soluable.
from copper surfacesprior to application of protective coatings,
solder mask,dryfilm photoresist or ink. FLUX-468
It is a low-foaming, zinc free acidic solution to primarily clean the
-
FLUX 1539 (HAL.) brass and copper surface by removing organic contaminants and
It is a low viscosity organic liquid formulation developed for Solder oxides. It can be used in assembling operations like core-baking,
Coating of printed circuit boards by hot air levelling equipment.The tube-header (end-dipping),tube-milling and other soldering process
residueof flux is water soluble. for automotive radiators and heater cores. The flux hasa specific
gravity of 1.22.
FLUX 506 (RT)
-
It is an organic liquid formulation developed for solder coating of FLUX-119
printed circuit boards by roller coating equipment. The residue of It is a water based acidic solution used for soldering copper, brass
flux iswater soluble.(The process is also known as RollTinning). and certain hard to solder stainless steel alloys. It has a specific
gravity of 1.80.
QUENCH- P50E
It is an organic liquid formulation developed to cool the printed
circuitpanels after solder coating (hot air leveling)process. The
steadyrate of cooling reduces the thermal shock and preserves a
brightand even solder appearance: The panels are then rinsed in
warm water. The residues of Quench-P50E are completely water
soluble.
FLUX- 205 (I.R.)
Itisan organic liquidformulation developed for use in reflowof
solder plated printed circuit boards by infra-redfusing equipment.
-
TheresidueofICM 205 is completely solublein water.
RT-861 (ROLL TINNINGSALT)
Itisa whitishgranular powder. It contains halogens and J
it acts as a flux and a dross reducer and enhances solder spread
during roll tinning of printed circuits.
PROTECOT (PROTEGIVE COATING)
It isa rosin based coating developed to preserve the solderability
of printed circuit boards by protecting clean metallic surfaces ~ ~
from atmospheric oxidation and other contamination. It can be ~
applied by spraying, dipping or brushing to a circuit board which
has been cleaned and water rinsed.
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