Fillunger All Product Booklet 2014

Team Fillunger
H. Fillunger was established in the year 1926 as a Trading
Company by Dr. Harry Fillunger (a German), Mr. Stracatti
(a Czech) and Mr. D. A. Marathe (an Indian), as a partnership
Company and was incorporated as a Private Ltd., in the year
1957. Fillunger has three main business activities namely LPG
Division, Vacuum Division & Agency Division.
Under LPG Division (Formerly known as Chinchwad
Precision Optical Frame Works), initially company
manufacturedprecisionscrewsforcameras&scientificinstru-
ments and precision turned components for LPG regulators &
valves.PresentlyLPGdivisionmanufacturesLPGRegulatorsfor
Domestic Gas Applications, Adaptors / Couplings and Valve
Components. This Division has around 100% Export to
European Countries and also to some South East Asian
Countries.
Our Agency Division represents world renowned
manufacturers / suppliers of various industrial raw materials,
components and equipment. Some of our principles from
their specialized field are:
Raw Material: Coroplast Fritz Mueller GmbH Germany, Tadiran
Batteries Limited, Israel, Goodfellow Cambridge Ltd, UK etc.
Equipment: SVCS Process Innovation s.r.o, Czech
Republic, TPT Wire Bonders, Germany, Disco Hi-tec Pte Ltd.,
Singapore, Roth & Rau AG, Germany etc.
Components: SPT Asia Pte. Ltd., Singapore, Tanaka Kikinzoku
Group, Japan etc.
Mandar A. Marathe
Managing Director
Fillunger’s Vacuum Division (formerly known as The New Poona Industries)
launched its first product in 1959. In 1987, Vacuum Division diversified & started
manufacturing high & ultra-high vacuum components as an import substitution.
The users for these products are scientific community in India and various research
establishments like Department of Atomic Energy, Nuclear Power Corporation of
India Limited, Defense Labs, CSIR Labs, Department of Space, IIT’s and
Universities. Presently Vacuum Division has all the facilities including conventional
machine, CNC, machine tools, Modern Welding Machines, 3D & 2D design
packages in Engineering, a well-equipped test laboratory to ensure flawless quality
product. The manufacturing plant & sales is located in Pune & sales representatives
in Mumbai, Delhi, Chennai, Bangalore & Kolkata.
Fillunger Vacuum Division Manufactures
Standard Vacuum Components
Motion Manipulation
Vacuum Valves
Custom Built High and Ultra High Vacuum Chambers
Helium Mass Spectrometer Leak Detectors
Plasma Cleaning Systems
Reactive Ion Etching Systems
Magnetron Sputter Deposition Systems
Nanoparticle Deposition Systems
Thermal Coating Systems
Vacuum based high temperature substrate heating/annealing systems
Atmospheric Pressure Plasma Jet
H. Fillunger Vacuum Division has several reputed domestic and international clients
involved in research activities in the field of particle accelerator beam lines, Surface
Science Studies, Thin Film Studies, Electron Microscopy Specimen Preparation
as well as production oriented customers in the field of Automotive , Plastics,
Semiconductors, Non-destructive Testing for Petroleum / Petrochemical
Industry, Hermetically Sealed Electronic Components, Heat Exchangers, Vacuum
Interrupters / Switchgears & other applications involving non-destructive testing
using Helium Leak Detectors.
QUALITY POLICY
We satisfy our customer by delivering right product & right service at
right time. We work as a team and improve our products & services
continually.

For removing hydrocarbon contamination from
specimen and holders prior to
electron microscopy analysis
APPLICATIONS:
l Cleaning of Surface (e.g. cleaning of SEM and TEM specimen holders and specimen itself)
l Activation of surfaces (e.g. before printing, varnishing or gluing)
l Plasma Polymerization (e.g. depositing polymer films from liquid/ gaseous monomer)
EM-PC-1000-Basic
PLASMA CLEANER
A Plasma technique is now being implemented in the field of electron microscopy, where specimens can become contaminat-
ed during the preparation process or from other sources. Current analytical instruments use tightly focused, intense beams that
create carbon deposits on the specimen surface due to organic contamination. The EM-PC-1000-Basic plasma cleaner is designed to
simultaneouslycleanthespecimenandspecimenstage,whichminimizes,andinmanycases,eliminatescontaminationofthespecimenbeing
analyzed. The specimen holder and specimen are subjected to reactive gas plasma prior to electron microscopy analysis
(SEM and TEM).
TECHNICAL DATA
CONTROL PANEL
Readouts Readouts Analog display indicates forward power and reflected power in Watts
Forward Power Control 0-100 Watts , Adjustable
Electronics RF Generator (13.56 MHz) with manual 50 Ohm impedance matching network (Automatic
impedance matching optionally available)
Interlocks RF, Gas and Vacuum fully interlocked for users & lab safety
Process Time Process time can be manually set via timer, based on the specimen material properties &
applications
POWER INPUT 230 VAC single phase, 50 Hz, 15 A
VACUUM SYSTEM
Pump 60 Ltr/Sec Turbo Molecular Pump with a 4.8m3
/h Rotary Pump
(Dry Scroll Pump optionally available)
Base Pressure 1 x 10-5
mbar
Operating Pressure User Variable (0.05 torr upto 0.5 torr typical)
System Vacuum vent Independent Solenoid operated Vent Valve
Pressure Control Pressure Control is done using manual Right angle valve with fully closed position sensor
interlocked with system vent
GAS INLETS Manually adjustable gas flow through two Rotameters for two of either Argon/Oxygen/Air
CHAMBER
Size 200 mm x 100 mm High Stainless steel electro-polished cylinder with view port
Electrode Immersed stainless steel
Specimen Interface “No Tools” quick connect for all side and top entry holders
SAMPLE HANDLING Standard Electron Microscopy holder for TEM applications. Special Stainless Steel
trays for accommodating SEM samples or larger samples of 4” dia.
ACCESSORIES Quick connect TEM specimen holder adaptors, Vacuum Storage Chamber for storing SEM and
TEM specimen, Disc Punch TEM-DP-100 for punching TEM Discs
MACHINE FOOTPRINT H 510mm x W 550mm x D 500mm
DISC PUNCH TEM-DP-100
The Disc Punch prepares specimen discs of 3 mm diameter and thickness ranging from 10 micron to above 100 micron for transmission electron
microscopy (TEM). The model TEM-DP-100 Disc Punch is designed to prepare ductile metals and soft materials for TEM without mechanical distortion.
Solid constructions and high tolerance design allows maximum force to be used with difficult materials while maintaining specimen quality.
The construction of the disc punch is such that one can easily select the position to be punched. A small removable tray simplifies collection of
punched discs. The mechanical layout ensures a uniform application of pressure on to the specimen. A strong metal base makes the disc punch rigid
and contributes to the long term use without loss of precision. The precise construction of every unit guarantees sharp edges and easy disc ejection
even after long term use.
FEATURES
l Unique piston-die design
l Strong metal base
l Easy to see and remove punched area/disc
l Prevents overall compression and the cutting forces
from extending into the center region of the specimen
l Guarantees a sharp cut edge and easy removal of the punched disc
l Rigid and long-term use without loss of precision
l Simplifies collection and allows fast, single motion multiple punching.
SPECIFICATIONS
l DIMENSIONS : H 230mm x W 200mm x D 150mm
l DISC SIZE : 3.O mm
l NET WEIGHT : 2.60 Kg
Plasma Chamber
TEM Holder
FEATURES
l Suitable for all side entry and top entry Electron microscopy holders
l Analog display indicates forward power and reflected power in watts and vacuum level is indicated digitally
l System comes with 3 ports which allow simultaneous cleaning of multiple holders or insertion of analytcal tools into the
plasma chamber
l Power level can be optimized for each specimen type and gas species to maximize cleaning rate without risk of etching the
specimen stage or the chamber
l Viewport allows easy monitoring of the process
l Safety interlocked controls simplify operation ideal for multiuser environments

EM-PC-1000-Advanced
PLASMA CLEANER
For Ashing, Etching and cleaning applications using
Argon and Oxygen Plasmas
APPLICATIONS:
l Plasma activation
l Treating PDMS
l Organic contaminant remova
l Predeposition cleaning
l Photo resist stripping
Argon and Oxygen gases are used to generate reactive gas plasmas using High frequency (Radio Frequency) Generators with power
upto 100 W @ 13.56 MHz
Ideally suited for R&D institutes as well as for small pilot scale setups
FEATURES
l Digital LCD display indicates forward and reflected power in Watts, gas flows and Vacuum level
l System comes with 4” diameter substrate holder with easy loading and unloading station
l Power level can be optimized for each substrate type to optimize cleaning rate
l Viewport allows easy monitoring of the process
l Safety interlocked controls simplify operation ideal for multiuser environments
TECHNICAL DATA
CONTROL PANEL
Read Out Digital 20X4 LCD display & parameter entry via 16 keys keypad interface
Forward power control 0-100 watts adjustable
Electronics RF Generator (13.56 MHz) with manual 50 Ohm impedance matching network
(Automatic impedance matching optionally available)
Interlocks RF, gas and vacuum fully interlocked for users and lab safety
Process Time Process parameters such as vacuum level, gas selection and flow, and process time can be set
via keypad interface
POWER INPUT 230 VAC single phase, 50 Hz, 15 A
VACUUM SYSTEM
Pump 12 m3
/hr two stage Rotary vane pump (Optionally Dry Scroll Pump available)
Base Pressure 1 x 10-2
mbar
Operating Pressure User variable (0.05 torr upto 0.5 torr typical)
System Vacuum vent Independent solenoid Vent Valve
GAS INLETS Adjustable gas flow through Two Mass Flow controllers for Argon and Oxygen
CHAMBER
Size 150mm x 200mm Quartz Glass Barrel Reactor with Stainless Steel end flanges
Substrate Interface Substrate holder with clamping mechanism to hold single maximum 4” substrate
ACCESSORIES Set of Viton O-rings
MACHINE FOOTPRINT H 300mm X W 500mm X D 550mm
Silicon Substrate Pre and Post Photo Resist Ashing
Image Courtesy: University of Pune

RIE-0103
REACTIVE
ION ETCHING SYSTEM
For Etching metals, dielectrics, and other thin film materials
requiring Fluorine based chemistries
APPLICATIONS
l Etching silicon based films
l Etching certain metallic films like Gold, Molybdenum, Niobium, etc.
l Removing passivation materials for failure analysis
l Standard photo resist stripping
FEATURES
l Digital display indicates forward and reflected power in Watts, gas flow & vacuum level
l Compatible with Argon, Oxygen and CF4
l System comes with a 125 mm diameter water-cooled RF powered substrate holder
l Grounded 125 mm Shower Head gas distribution with 3 mass flow controllers (MFC)
l Hinged top-flange for easy loading and unloading of substrates
l Power level can be optimized for each substrate type to optimize the etching rate
l View port allows easy monitoring of the process
l Distance between two electrodes can be manually varied between 20 to 80 mm
l Safety interlocked controls simplify operation ideal for multi-user environment
TECHNICAL DATA
CONTROL PANEL
Read Out 20x4 LCD digital display and parameter entry via 16 keys keypad interface
Interlocks RF, Gas and Vacuum fully interlocked for user safety and lab safety
Process Parameters Process parameters such as vacuum level, gas selection, gas flow and process timing can be
set via the keypad interface
POWER INPUT 230VAC single phase, 50Hz, 15 A
VACUUM SYSTEM
Pump 60 Ltr/sec Turbo Pump with 12m3/hr Rotary Backing Pump
(optionally Dry Scroll Pump available)
Base Pressure 1x10-5
mbar
Operating Pressure User Variable (0.05 torr upto 0.5 torr typical)
Pressure Regulation Manual KF40 Right Angle Valve (KF 40 Throttle Butterfly Valve optionally available)
SUBSTRATE HANDLING Substrate holder with clamping mechanism to hold single maximum
4” substrate
GAS SYSTEM Gas flow control (0-100sccm) using three Mass Flow Controllers for Argon, Oxygen, & CF4
CHAMBER
Size 200 mm X 300 mm High Stainless steel electro-polished cylinder with view port
Substrate Interface Parallel plate electrode consisting of grounded gas distribution shower head and water-cooled
(2Lpm) RF powered substrate holder
SPARES & ACCESSORIES Set of O-rings, Set of claw clamps
NOTE: Upon request the model RIE-0103 can be optionally modified to handle SF6/CHF3
gases with modified reactor design using corrosive series pumping, gas lines and
exhaust system
RIE-0103 is an ideal solution for R&D Laboratories and institutes,
for Ion Assisted Etching requirements in a compact Table Top
structure Argon, Oxygen & CF4
gases are used to generate
reactive ion species at High frequencies (Radio frequency) using
RF generator to generate power upto 300W (optionally 600W) @
about 13.56 MHz
Gold etched using CF4
Niobium etched using CF4
+ Ar
Image Courtesy: NISER Bhubaneswar

APPJ-04-200
ATMOSPHERIC
PRESSURE PLASMA JET
(Helium Stabilised)
For sterilization, cleaning and
surface treatment
APPLICATIONS (Intended for research pertaining to but not limited to below applications)
l Analysis (SEM, TEM)
l Archaeology
l Automotive industry
l Elastomer industry
l Medical technology
l Plastics industry
l Semiconductor industry
l Sterilization
l Textile treatment
Non-thermal atmospheric pressure plasmas are finding increasing attention. These discharges have the important advantages over
the widely used low pressure plasmas or arcs that they can be operated without vacuum systems. Furthermore these plasmas can be
applied even over thermally sensitive surfaces. Not only will the freedom from a vacuum system have a positive impact on the cost of
the process it will also reduce operating constraints in comparison with chamber-based processes.
HELIUM PLASMA JET
FEATURES
l Suitable for surface activation and cleaning applications
l Digital display indicates forward power and reflected power in watts
l 300 W RF Generator @ 13.56 MHz Frequency provides homogeneous discharge providing efficient generation of plasma
l Power level can be optimized for each specimen type and gas species to optimize result
l Plasma Jet Source Body water cooled to prevent overheating during process
l No need of expensive vacuum setup and chamber based processes
l Hand held Plasma Jet assists processing large area objects without hassles
TECHNICAL DATA
CONTROL CABINET
Read Out Digital display for forward and reflected power in Watts
Forward Power Control 0-300 Watts , Adjustable at 13.56 MHz
Impedance Matching Network Manual 50 Ohm Impedance Matching Network
POWER INPUT 230 VAC single phase, 50 Hz,15 A
APPJ SOURCE DIMENSIONS
Source Diameter 12 mm
Source Length 200 mm
Source Weight approx 1.5 kg
Plasma Jet Diameter approx 4 mm
Plasma Gas Temperature maximum 300 Deg C at nozzle tip
Gas Types Helium
Gas Input 2 m3
/ hr
Gas Velocity at nozzle exit 25 m/s
CONNECTION
Flexible Tube Cooling Water, Gas and Power Connections through flexible tube with knurled PVC housing for
holding the source
Connection Tube Length 1 meter
Connection Tube Diameter 15mm
PLASMA Capacitively Coupled Plasma with concentric electrodes

MAGNETRON SPUTTER
DEPOSITION SYSTEMS
FEATURES
l Suitable for depositing both conductive materials like Aluminium, Copper, Titanium, Molybdenum, etc. and non conductive thin
films like Aluminium oxide, Titanium oxide, Tantalum Pentoxide, Zinc Oxide, etc.
l Two 2” water cooled Magnetron sources having integrated shutter assembly
l Magnetron sources tiltable from 0 to 30 Deg and manual adjustment of source to substrate distance
l Argon gas can be introduced through the cathode body of the Magnetron source which enhances plasma density closed to target
surface and enabling sputter deposition even at lower pressures
l Incorporates one DC power supply of 1 kW and one RF power supply of 300 W @ 13.56 MHz with automatic impedance matching
l Utilizes 300 Lps Turbo pump backed by Dry scroll pump enabling clean and dry ultimate vacuum of 1 X 10-6
mbar
l Reactive gases such as Oxygen or Nitrogen introduced through gas shower ring located above the substrate surface
l Easy loading and unloading of substrates upto 3” Dia through quick access door with view port
l Integrated quartz crystal film thickness monitor
l Microprocessor based programmable logic interface with all safety interlocks
l Bench top unit with compact footprint of H 950mm X W 560mm X D 750mm, suitable for R & D setups and educational institutes
SYSTEM DESCRIPTION
Stainless Steel Electropolished 304 Cylindrical Chamber Diameter approx. 300 mm, Height 350mm
l Top flange accommodates sources, source tilting thimbles, shutter thimbles, etc. and bottom flange accommodates
substrate holder. Sealing of flanges done using Viton O-Rings with clamps. Top flange can be lifted manually for
changing the targets or any maintenance of the sources or for chamber cleaning and maintenance. Suitable Lifting
Support Handles provided on the top flange to assist manual lifting. Optionally Motorized Lifting Mechanism can be provided
l 150 mm Quick access door with View Port for visual access to chamber interior as well as for loading and unloading
of substrates
l Magnetron sources tiltable from 0 to 30 Deg and manual adjustment of source to substrate distance with in 30mm to 80mm
l ISO 100 mm port on side wall for pumping system
l Necessary detachable chamber liners are provided to aviod deposition on the chamber walls
Substrate Holder with motorized rotation and manually adjustable source to substrate distance
l Substrate holder will have motorized rotation upto 20 rpm
l Substrate Holder will hold substrates of 3” Dia or smaller
l Substrate Holder can be adjusted manually enabling source to substrate distance to be varied between 30 to 80 mm
l Optionally available Substrate heater upto 500 Deg C is available to enable pre heating or continuous heating of the
substrate during deposition. (Higher temperature available on request) Heating done using radiation heater controlled
using PID controller (If substrate heater is provided chamber would be water cooled)
For Depositing Conductive and
Non Conductive Material Thin Films
APPLICATIONS:
l Thin film solar cells
l High-efficiency photovoltaics
l Gas sensors
l Catalysts
l Semiconductors
l Bio coating
l Medical devices
l Tribology
Magnetron Sputter Sources
l Two 2” Magnetron Sputter Sources with cross contami
nation shields for sputtering of thin films with manual
shutter assembly for depositing required target material
l Magnetron Sources have in-situ tilt from 0-30 Degree
Angle supported internally via bellow assemblies which can
be adjusted using thimbles on the top flange of the system
l Sputter Sources are water cooled without Magnets being
subjected to direct contact with water
l Argon gas is introduced directly through the cathode body
of the magnetron source
l The targets of 2” can be clamped in the sputter sources
which are compatible with DC/RF power supply
l Source & shutter assembly is easily removable for mainte
nance purpose
Power Supplies
l RF Power Supply
One RF Generator Unit, 300 Watts @ 13.56MHz
RF Generator is provided with automatic matching network for impedance matching
l DC Power Supply
One regulated DC Power Supply upto 1 kW (1000V, 1Amp) variable current & voltage
Vacuum Pumping System
Pumping System consisting of air-cooled 300 Lps Turbo Molecular Pump backed by Dry Scroll pump to get ultimate vacuum of
1x10-6
mbar or better
Gas Delivery Sub-System
Delivery System consists of two Mass Flow Controller with electronically control shut off valve for Argon with flow range 0-60 SCCM and
one Mass Flow Controller with electronically control shut off valve for Oxygen/Nitrogen with flow range 0-60 SCCM
Reactive Gases such as Oxygen or Nitrogen introduced inside the chamber via gas shower ring located above the substrate
Pneumatic Vent Valve for Nitrogen purging
Table Top Magnetron Sputter Deposition System.
Model MSD-22-2G2

Instrumentation
l Combination Pirani and Penning Gauge measuring atmosphere up to 10-8
mbar is provided
l ISO 100 Manual Gate Valve is provided to control pressure during deposition. Manual gate vales has fully open and fully closed
position sensors interlocked with system pumping and system vent cycles respectively (Optionally Closed Loop Throttle Gate Valve
can be provided)
l Electro Magnetic Right Angle Valves are provided to control roughing and backing cycles and to isolate the turbo pump when
chamber is brought to atmospheric pressure
Quartz Crystal Monitor with sensor and set of 10 crystals
Water-cooled sensor having 6MHz sensing crystal is located inside the chamber with Thickness Monitor on the front panel to digitally
display the rate of deposition and thickness. Accuracy of sensor is 0.5% typical, high rate resolution of 0.1 Å per second & 1 Å thickness
resolution. Set of 10 crystals are offered
Control Panel
l Control is conveniently located in one single bench top cabinet with necessary Safety Interlocks for ‘User Friendly’ operation.
Vacuum and Process Control is done via microprocessor based programmable logic interface and provides output to actuate system
pumps, MFC & gauges
l All displays of operating parameters will be on front panel of the Control Console Entire Magnetron Sputter Deposition Unit
including the chamber and the control cabinet is Table Top with compact footprint of 760 mm (L) X 560mm (W) X 1050mm (H)
Spares and Accessories
l Targets
l Set of Viton O-rings
Note: Other configurations such as change in size of magnetron from 2” dia to 3” dia or change in chamber from cylindrical geometry
to Box type D-shaped is well possible. Table top systems can accommodates upto 3 numbers of 2” magnetron sources or 2 numbers of
3” magnetron sources but number of power supplies in table top configuration is limited upto two. Other configurations with 3 or more
power supplies is well possible in standalone Magnetron Sputter Deposition Systems
Standalone Magnetron Sputter Deposition System
Model MSD-22-2G3
3D Model of UHV Multi-chamber Deposition System with Load Lock

NPD-22-1G2
NANOPARTICLE DEPOSITION
SYSTEMAPPLICATION
For Nanoparticle deposition on substrate
with varying film morphologies
The Nanoparticle deposition system NPD-22-1G2 is used to deposit Nanoparticles by “inert gas condensation” method. On account
of their unique catalytic, electronic, magnetic and optical properties being different from bulk species, Nanoparticles continue to
attract the attention of researchers. The optical, electronic, thermal and magnetic properties of Nanoparticles endow then with potential
applied in electronics, optical devices, solid dielectric material, Nano-biological material & high temperature conditions Nanofluids.
PROCESS
The size selected Nanoparticle deposition takes place through sputtering, aggregation and deposition process
CLUSTER SPUTTERING
The DC magnetron type discharge is used to generate clusters from the target clamped in the magnetron source. The magnetron
based source has an advantage in terms of wide cluster size range varying from fraction of nanometer to around 100 nanometer. DC
plasma is ignited in mixture of Argon & Helium and confined closed sputter target by magnetic field of the magnetron. A super saturated
vapor of sputtered atom is originated from sputter source in an inert gas atmosphere of Argon & Helium. The Nano-particle deposition
source containing the housing is kept at low temperature using Liquid Nitrogen (alternatively chilled water @ < 7 DegC). The deposition
chamber is pumped prior to deposition to vacuum level of 5 x 10-7
mbar or better. The Nanoparticle cluster size can be varied by
adjusting:
l The Length over which the clusters aggregate (by manually adjusting the length of magnetron source inside the aggregation zone)
via a linear motion drive
l The Magnetron Power; DC power supply is 1 KW (800 V, 1.4 Amp)
l Flow of the aggregation gases (Argon & Helium can be each adjusted from 0 - 60 sccm using dedicated mass flow controllers)
CLUSTER AGGREGATION
Sputtered clusters are swept through the aggregation zone, typically kept in vacuum level of 0.1-0.5 mbar by Argon & Helium gases
where clusters nucleate and grow. The sputtered atoms are cooled in the cooled aggregation zone and further by the Helium gas leading
to nucleation and growth of cluster depend on the length of the aggregation zone (resulting in changing resident time), the composition
of the Helium & Argon gas mixture and corresponding flow rates as well as the magnetron power. The nucleation & growth of clusters
cease after expansion through the nozzle into the deposition chamber where clusters expand at much lower pressure to of about
0.5 mtorr to 5 mtorr.
CLUSTER DEPOSITION
The focused cluster beam is then accelerated on to the substrate using bias; DC power supply is 1KW (800V, 1.4 Amp). The system is
capable of depositing Nanoparticle with low rates of 0.01 Å/sec to higher rates of about 1 Å/sec. The substrate can be rotated up to 20
rpm and can be heated up to 500⁰ Deg C using radiation heater and controlled using PID controller and thermocouple.
CHAMBER
Stainless steel electropolished spherical chamber of 12” diameter. Necessary table for mounting with leveling jacks and castor wheels
for mobility
SYSTEM DESCRIPTION
NANOPARTICLE DEPOSITION SOURCE
Nanoparticle source includes 2” DC Magnetron Sputter source enclosed in Liquid Nitrogen cooled (alternatively water cooled @ < 7 Deg
C) internal chamber, in which sputtered vapors are condensed under high pressure environment where nanoparticles are formed as the
thermalized atoms migrate towards the expansion zone of the source. The DC Magnetron source inside the Nanoparticle Deposition
Source assembly has a facility of linearly manipulation via Bellow sealed manually operated Linear Motion Drive within a distance of
± 50mm
VACUUM SYSTEM
An air-cooled 700 Lps Turbo Molecular Pump connected to Spherical deposition chamber, backed by 15 m3
/hr dry scroll pump to get an
ultimate vacuum of 5 x 10-7
mbar or better
An air-cooled 300 Lps Auxiliary Turbo Molecular Pump connected to Nanoparticle Source, backed by 10 m3
/hr dry scroll pump
SUBSTRATE HANDLING
Substrate holder capable to hold substrate of 4” dia and capable to rotate up to 20 rpm
The substrate can be heated up to 500 Deg C using Radiation heater assembly, controlled using PID Controller and thermocouple
Substrate holder has facility of being provided with a bias voltage
POWER SUPPLIES
Two DC Power supplies (one for magnetron source and second for substrate biasing) with 1KW power (800V, 1.4A) for depositing
conductive films such as copper, molybdenum, gold, etc. DC power supply will be voltage, current or power controlled and will have
automatic arc suppression circuitry and output accuracy of ±1% of nominal voltage, current or power. DC power supply has built in EMI
filter circuit.
QUARTZ CRYSTAL MONITOR WITH SENSOR HEAD & SET OF 10 CRYSTALS
Water-cooled sensor head, located inside the chamber with Thickness Monitor on the front panel to digitally display the rate of
deposition and thickness. Accuracy of sensor head is 0.5% typical.
INSTRUMENTATION
l Combination Pirani and Penning gauge capable of measuring pressure inside the deposition chamber from atmosphere to
1x10-8
mbar range
l Separate Pirani Gauge capable of measuring pressure inside the Nanoparticle Deposition Source from atmosphere to
1x10-3
mbar range
l Two Mass flow controllers calibrated for Argon & Helium (0 - 60 sccm)
l Electro-magnetic Vent valve for venting / nitrogen purging
CONTROL PANEL
Combination Control is conveniently located with necessary Safety Interlocks for ‘User Friendly’ operation
Process Control is done using 16 keys keypad controller with LCD display via user friendly microprocessor based programmable logic
interface to enable below operations of the system:
l Pumping & gauge readouts
l Vacuum pumping system control
l Substrate rotation
l Substrate heating
l Deposition thickness measurement
l Chamber venting/ gas purging
l Gas sensors
l Catalysts
l Semiconductors
l Bio coating
l Medical devices
Aluminum Nanoparticles deposited on SiliconCopper Nanoparticles deposited on Silicon
Image Courtesy:
University of Pune

TCS-0204
THERMAL COATING SYSTEM
High vacuum Thermal coating system TCS-0204 incorporates resistive heating source in form of tungsten, molybdenum or tantalum
boats, filaments, baskets etc., to evaporate the material to be deposited and raise its vapor pressure to a useful range. This is done in
high vacuum, both to allow the vapor to reach the substrate without reacting with or scattering against other gas-phase atoms in the
chamber, and reduce the incorporation of impurities from the residual gas in the vacuum chamber.
Thermal evaporation is the simplest way of depositing low melting point materials onto substrates.
FEATURES
l System chamber available in Stainless Steel Box Type D-shaped and Stainless Steel Cylindrical geometries
l Single source/Multi source/Co-evaporation
l Compatible to all types of evaporation source (boat, filaments, basket etc.)
l Substrate size upto maximum 6” diameter
l Substrate heating and rotation with height adjustment.
l Thickness measurement & control
l Standalone unit suitable for R&D setups and educational institutes
l High/Ultra high Vacuum environment based evaporation possible
TECHNICAL DATA
CHAMBER
Water cooled Box type D-shaped (Cylindrical geometry available optionally) Stainless steel vacuum chamber of about
350mmL x 350mmW x 450mmH. Chamber will havehinged typefront opening door sealed using Viton ‘O’ ring for loading &unloading of
substrates as well as evaporation material. Chamber will have viewport of ISO 63 with manual shutter for visual access to chamber
interior. Necessary detachable liners are provided to avoid deposition on chamber walls
THERMAL SOURCE
The source consists of 4 evaporation source holders, in the form of either Tungsten or Molybdenum boats. Evaporation sources are
powered using Electrolytic Pure Copper Electrodes. Necessary water cooled electrical feedthroughs are provided. Option for heating
single or maximum upto any two sources is possible with adequate power supplies and electrical contactor mechanism. Manually
operated mechanical shutters will be provided over the Evaporation sources. Evaporation sources are isolated by cross contamination
shields
POWER SUPPLY
Two power supplies with 10 Volts, 200 Amps (Optionally 12 Volts, 500 Amps) are provided. Necessary water cooled electrical
feed throughs to the electrodes made of electrolytic pure copper to enable single or co-evaporation is provided
SUBSTRATE HOLDER
Substrate Holder is capable of holding substrate up to maximum 6” Ø or squares or small sizes and capable of heating up to 800
degree C with an accuracy of ±5 °C with PID controller. Substrate has motorized rotation upto 60 rpm. Manually operated Substrate
shutter is provided. Source to Substrate distance can be varied manually between 150 to 200 mm. In-situ source to substrate distance
adjustment is also optionally available
PUMPING SYSTEM
Pumping System consisting of Turbo pump of 300 Lps backed by 12 m3
/hr Rotary Pump with oil-mist Filter (Optionally dry scroll pump
available) to get ultimate vacuum of 1 x 10-6
mbar
VACUUM GAUGES
Pirani & penning gauge combination capable to measure chamber pressure from atmosphere up to 10-8
mbar is provided
THICKNESS MEASUREMENT
Quartz Crystal Film Thickness Monitor with water cooled sensor and set of 10 crystals for monitoring Film Thickness. Water-cooled
sensor having 6MHz sensing crystal will be located inside the chamber with Thickness Monitor on the front panel to digitally display the
rate of deposition and thickness. Accuracy of sensor is 0.5% typical, high rate resolution of 0.1 Å per second & 1 Å thickness resolution
CHAMBER ISOLATION
Electro-pneumatic ISO 100 Gate Valve for the isolation is provided. Electro-magnetic vent valve is provided for purging dry Nitrogen
or air
TABLE & CONTROLLER
Necessary control for vacuum read-outs, current and voltage readouts and emergency shutdown switch are provided on the front panel
of the System. The entire System is mounted on Castor Wheels for mobility
SPARES & ACCESSORIES
Tungsten/ Molybdenum/ Tantalum Boats/ Baskets/ Filaments
Set of spare Viton O-rings
Set of chamber liners
For Evaporating Low Melting Point
Materials For Creating Multilayer &
Co-evaporated Thin Film
APPLICATION
l Gas sensors
l Catalysts
l Semiconductors
l Bio coating
l Medical devices
l Tribology

TVH-1500
THERMOVAC HEATER
For substrate heating & annealing
applications under vacuum or inert gas
environment
TVH-1500 is an ideal solution for R&D Laboratories and institutes, for vacuum based heating and annealing applications for
upto 3” substrates
Heating/ annealing can be done either in vacuum or under inert gas environment, typically under Argon
The heater is capable to heat substrate from ambient to 1500°C and inert gas purge can be done via needle valve
Typical applications include Semiconductors, Metallurgy and Surface Sciences
FEATURES
l Heating source made of high quality pyrolytic graphite
coated with pyrolytic boron nitride capable of reaching
temperatures up to 1500°C
l Heater made of high quality Molybdenum capable of
withstanding high temperatures
l Temperature control done via integrated PID controller
l Vacuum chamber consists of high quality quartz glass bell
jar, sealed to the base plate via L-shaped Viton O-ring.
Optionally water cooled stainless steel bell jar with quartz
glass view port is also available
l High current electrical feedthroughs are cooled via cooling
water channels provided in the Base plate
l System is pumped to 10-2
mbar vacuum range via rotary
vacuum pump
l Gas purge can be done via fine control needle valve
l Safety interlocked controls simplify operation ideal for
multi-user environment
TECHNICAL DATA
CHAMBER
Quartz glass bell jar of 200mm dia X 200mm height with sealed using necessary L type Viton gasket. Bell jar will have protective
cover for user safety (Optionally a 200 mm Dia X 200 mm height Stainless Steel water cooled bell jar with quartz glass view port is also
available)
VACUUM SYSTEM
Pump 12 m3
/hr Rotary Vacuum Pump
Base Pressure 1x10-2
mbar
Operating Pressure User Variable (0.02 torr upto 1 torr typical)
Pressure Regulation Via Needle valve
VACUUM MEASUREMENT Pirani gauge for measuring chamber pressure from atmosphere to
10-3
mbar range
HEATER Molybdenum heater of dia. 120mm capable of heating substrate up to 3” dia from ambient
to 1500 deg C with 1% temperature uniformity; heating source consists of pyrolytic graphite
coated with pyrolytic boron nitride. Typical time to reach 1500 deg C is about 15 min.
Maximum heating cycle time @ > 1000 deg C < = 1500 deg C: 30 min; Maximum heating cycle
time @ > 500 deg C < 1000 deg C: 60 min; Maximum heating cycle time @ < 500 deg C: 120
min
POWER INPUT 230V 50Hz 10Amp, Single Phase.
SUBSTRATE HANDLING Upto maximum 3” substrate
GAS SYSTEM Gas inlet via fine controlled needle valve
CONTROL PANEL ON/OFF, Pirani Gauge with temperature controller, display & emergency switch
SPARES & ACCESSORIES Thermocouple, L shaped Viton gasket
HLD - 1122L
PORTABLE HELIUM LEAK DETECTOR
(TURBO VERSION)
HOW IT WORKS
The HLD-1122L Leak Detector design is based on a proven technique that takes advantage of the differences in compression
pressures produced by the turbo pump for gases of different molecular weight. For example, the maximum pressure ratio of helium may
be 10 or 100, while for oxygen and other are normally far in excess of 1 million. The principle is implemented in the HLD-1122L Leak
Detector by introducing helium (another inlet gases such as those resulting from a leak in the test piece) into “turbo pump foreline”
rather than into the “normal pump inlet” as in conventional leak detectors. Helium, having a much lower maximum pressure ratio than
other gases contained in air, diffuses backwards though the turbo pump to reach the spectrometer tube where it is detected as a leak in
the normal manner. Mechanical pump is also attached to the turbo pump foreline and removes all inlet gases, including helium, there is no
appreciable loss of sensitivity in the HLD-1122L Leak Detector.
AUTOMATIC TAPPING ACTION
By optimizing the maximum pressure ratio between helium and the other gases of heavier molecular weights the turbo pump becomes
a trap that filters out the other gases and contamination, such as water vapor, introduced by the connection of the test piece to the leak
detector. This eliminates the need for any cryogenic trapping. A turbo pump used in this fashion also acts as a buffer that protects the
spectrometer tube that protects the spectrometer tube from pressure bursts that would normally endanger the mass spectrometer tube
and trigger protective devices. Interruption of testing due to pressure bursts is less frequent and the unit can be used at pressures about
1000 times than in conventional leak detector, allowing the measurement of gross leaks without the need for special throttling devices
or special test techniques.
For Non destructive leak testing using
Helium Mass Spectrometry

SPECIFICATIONS
SENSITIVITY
1 x 10-9
atm cc/sec for helium 8 x 10-11
atm cc/sec for air. Sensitivity equivalent to 2% of full scale deflection on most sensitive (x10)
range. Note : HLD - 1122L sensitivity is influenced by the speed of the mechanical pump. Above specifications are obtained with a
normal 12m3/hr pump
LEAK DETECTION RANGE
2 x 10-9
std. CC/s (Min) to 1 x 10-4
std cc/s (Max)
TIME CONSTANT
Less than 2 seconds for helium. The time constant is the time to reach 63% of full leak rate indication
SPECTROMETER TUBE
The spectrometer tube is constructed in quality aluminum alloy. Demountable pole pieces are used for quick access to the internal parts
of the tube. Dual filament ion source, cold cathode gauge and solid state preamplifier are built in with the tube
LEAK INDICATOR
Indicated as exponent value in Std cc/sec (choice of unit available)& corresponding horizontal bar graph on LCD
TEST PORT PRESSURE
Indicated as exponent value from atmosphere 1 x 10-3
mbar & corresponding bar graph on LCD
SPECTROMETER TUBE PRESSURE
Indicated as exponent value from 9.9 x 10-5
mbar to 1.0 x 10-6
mbar
AUDIBLE ALARM
Includes adjustable audio threshold and volume controls
VALVE BLOCK
Electromagnetic Valves for START, TEST and VENT cycles
VACUUM GAUGES
Cold cathode gauge indicates the vacuum in the spectrometer tube and thermocouple gauge monitors the TEST PORT PRESSURE
TEST PORT
NW 25 KF quick coupling for easy connection to HLD
OPERATING AND CONTROL OF HLD 1122L
Complete operational control using 89C51 Philips microcontroller that receives command from navigation keys and send
information to LCD
COMMUNICATION
RS232 interface is available that can communicate to PC. Dedicated software developed in Visual Basic that allows data logging and
operational control is available as an option
CONTROL & INDICATORS
LCD acts as interaction between operator & HLD. Operator uses information displayed on LCD & active functions available on LCD
can be scrolled & entered by operator. At start, there are only two keys required for operation, scroll & ENTER. All active functions &
operating modes are shown on LCD. With RS232 port & optionally available software, it is possible to operate HLD from PC. Software
is written using Visual Basic 6.0 & data logging and complete supervision along with full report generation & printing is possible.
Diagnostic LED display indicates status of valves & switches on HLD. This is useful to get information on the current operational status.
HLD tuning board enables tuning & calibration of HLD through specific procedures
OPERATION
The object to be tested is connected to the test port and evacuated when TEST OBJECT function is entered by operator. Helium
entering through a leak diffuses instantly into the foreline of the turbo pump. A constant pressure ratio is maintained between the
forelineandthespectrometertube,whichmeasurestheamountofheliuminthesystemandconvertsitintoanelectricalsignal.Thesignalis
measured and interpreted as leak rate value and bar. When the helium source is removed from the leak, the helium remaining in the
system is rapidly pumped away. Thus the effect is a rise and fall to the leak rate indication.
HLD-1122L CABINET
HELIUM LEAK TESTING SERVICES
H. Fillunger provides helium leak testing services to our clients as per requirement either on-site or in-house. Leak Testing is done
using Fillunger make Helium Mass Spectrometer Leak Detector Model HLD1122L which is capable to detect leaks up to 2.0 X 10-9
std
cc / sec
Leak testing services are provided by our technically qualified and Level II Engineers certified by American Standard for
Non Destructive Testing (ASNT)
Methods of Leak Testing
1. Evacuation Method:
This method of leak testing is used for components which are subjected to vacuum conditions in their normal operation. In this method
the test job is evacuated to a rough vacuum and helium is sprayed on the welding / sealing surfaces of the job, traces of which can be
detected in case of leaks.
This method of leak testing is typically used for all types of valves, bellows, vacuum chambers, welded pipes, etc.
2. Sniffer Probe Method:
This method of leak testing is used for components which are subjected to high pressure in their normal operation. In this method
Helium gas is pressurized inside the test component and traces of helium are detected using a sniffer probe.
This method of leak testing is typically used for all types of aluminum castings, pressure vessels, heat exchangers, intank tap changers,
vacuum interrupters/ circuit breakers/ switchgears, nuclear fuel tube bundles, pressure gauges, etc.
3. Bombing Method:
Components which can neither be evacuated nor pressurized but are required to be leak tested for hermetic sealing are tested by
this method. In this method hermetically sealed components are placed in a chamber which is pressurized with Helium gas. The
components are kept in the chamber for a predefined time after which they are removed from the chamber and tested using the Sniffer
probe to detect the traces of helium in case of individual components. In case components need to be tested in batches, after being
pressurized with Helium Gas, they need to be placed in another vacuum chamber which can be evacuated and traces of Helium in the
Chamber can be detected in case of any leaks.
This method of leak testing is typically used for Hermetically sealed electronic components like Saw filters, Resonators, Crystal
oscillators, Glass to Metal Seals, Ceramic to Metal seals, Vacuum tubes, Thermocouples, Diodes, Transistor Cans, etc.
Customized and Automated Special Purpose Leak Testing Setups for production lines can be designed as per requirement upon request.
Some of the major sectors we provide services to are
l Nuclear Power
l Thermal Power
l Petroleum and Petrochemical Industry
l Aeronautical and Space Research
l Heavy Electrical Equipment Industry
l Heat Exchanger / Pressure Vessels / Vapor Absorption
Chiller Manufacturers
l Hermetically sealed component manufacturers
l Manufacturers and Users of Vacuum Chambers for Re-
search applications like ultra high vacuum beam lines,
particle accelerators, surface science studies, plasma
and ion research, etc.
l Valve Manufacturers

COMPONENTS
ISO-KF FLANGES & FITTINGS
Fillunger offers wide range of quick couplings flanges & fittings ideally suited for high vacuum applications requiring rapid & frequent
assembly & dismantling. ISO-KF flanges comply with ISO specifications. The method of fastening & sealing is achieved by a radial
clamp that provides uniform compression of an elastomer gasket fitted between two symmetrical flanges. The elastomer gasket is
mounted on a center ring the extensions of which fit into grooves of mating flanges. Quick Coupling components are available in sizes
ranging from ½” to 2” diameters.
Features
l KF compatible design l Symmetric, non-rotatable geometries l Viton® / Neoprene O-rings
l Glass bead blasted finish l All high vacuum fittings are TIG welded & are leak tested
l Custom-built KF flanges & fittings are available on demand
Specifications
Materials
l Flanges / Tubing : AISI-304 (304L/316/316L available on request)
l O-rings : Viton ® / Neoprene elastomer
Vacuum
l Range : 1x10-7
Torr
l Leak Rate : < 2x10-9
std cc/sec of Helium
Temperature Range
l Viton up to 150⁰0
C l Neoprene up to 100⁰0
C
ISO FLANGES & FITTINGS
Fillunger offers large diameter ISO flanges& fittings which are available in bore sizes between 2 ½ “ to 25 “. ISO flange system is ideally
suited for applications requiring rapid & frequent assembly & dismantling. These flanges can operate in high vacuum environments to
pressures better than 1x10-7
Torr. The method of fastening & sealing in K-type flanges is achieved by using multiple double-claw clamp
assemblies that provide uniform compression of an elastomer gasket trapped between two mating flanges. The elastomer gasket is
mounted on a center ring the extension of which fit into grooves of mating flanges. The method of fastening & sealing in F-type flanges
is achieved by using bolts. These flanges are typically used where low profile geometry is required. ISO-F type rotatable flanges are also
available.
Features
l Fast connect & disconnect l Economical reusable fittings l Viton ® / Neoprene O-rings
l Varied fastening methods l Symmetric, non-rotatable geometries l Glass bead blasted finish
Specifications
Materials
l Flanges, center rings : AISI-304(304L/316/316L available on request)
l Clamps : Aluminium quick clamps
l Seal : Viton ® / Neoprene elastomer
Vacuum
l Range : 1x10-7
Torr
Temperature Range
l Viton up to 150⁰⁰0
C l Neoprene up to 100⁰0
C⁰
COMPONENTS
CF FLANGES & FITTINGS
Fillunger CF flanges & fittings are manufactured as per international vacuum standards. The UHV seal is made by trapping
a copper gasket between two flanges. The flanges have a sharp knife-edge on their operating face. When joined together with a set of
bolts, these knife-edges bite on flat surface of copper gasket to make UHV tight seal.
NON-ROTATABLE & ROTATABLE FLANGES
Non-rotatable flanges are often referred as fixed flanges & are constructed of a single machined piece. Once non-rotatable flanges are
welded in place, their bolt holes are fixed in position. The orientation is straddling the vertical centerline. Rotatable flanges are made
from two pieces with knife-edge part & external bolt holes ring being separate. Once the knife-edge is welded in position, it is very easy
to change the orientation of bolt holes relative to the axis of port. Thus, rotatable flanges are ideal for situations where alignment of a
component to a chamber needs to be set accurately before the flange mounting bolts are tightened.
Features
l Conflat ® compatible
l Rotatable & Non-rotatable geometries
l Through holes or tapped
l Double sided flanges
l Reducing flanges
l Clearance bolt holes
Specifications
Materials
l Flanges : AISI-304 (304L/316/316L available on request)
l Bolts : AISI-304
l Gasket : OFHC copper / Teflon
Vacuum
l OFHC copper seal : <1x10-8
Torr with bake-out up to 2500
C
Temperature Range
l OFHC Copper seal 250⁰ 0
C

HV / UHV VALVES
Fillunger manufactures vacuum valves both for High Vacuum and Ultra High vacuum applications. These include Gate valves, Right
Angle valves, Inline Valves, Straight through Valves, All metal valves. The valves are manufactured in manual, electro-pneumatic and
electromagnetic version. The material of construction can be Stainless Steel or Aluminum.
RIGHT ANGLE VALVES
Features
l Compact design
l High Vacuum series
l Manual or Electro-pneumatic (air-open & spring-close) actuators
l Hydro-formed bellow actuator seal
l Reducing flanges
Materials
l Body : One piece aluminum / Welded Stainless Steel
l Plate and bonnet : AISI-SS304
l Bellow : AISI-SS316
l Plate & bonnet seal : Viton ® elastomer
l Vacuum Range : 1x10-7
Torr
l End flanges : KF 16, 25, 40 & 50 type
BUTTERFLY VALVE
Features
l Quick opening/closing
l Positive O-ring sealing
l High conductance
l 1” & 2” bore sizes
Materials
l Body, retainer & shaft : AISI-304
l O-rings : Viton ®
l Bellow : AISI-SS316
l Vacuum Range : 1x10-7
Torr
l End flanges : KF 25, 40 & 50 type
ELECTRO-MAGNETIC BLOCK VALVES
Features
l Compact design
l Electro-magnetically open & spring-close actuators
l Viton bonnet & poppet seals
l One-piece body
Materials
l Body : Aluminum alloy
l Actuator : Stainless Steel
l Bonnet & poppet seal : Viton ® elastomer
l Vacuum Range : <1x10-7
Torr
l Leak Rate : 2x10-9
l Temperature Range : 125 deg C without coil in closed condition
l Electrical Power : 23 Watt / 24 VDC
l Loss of power : Valve closes
l End flanges : KF 16 / 25type
IN-LINE VALVES
Features
l Compact design
l Manual or Electro-pneumatic (air-open & spring-close) actuators
l Hydro-formed bellow actuator seal
l TIG welded joints
Materials
l Body : Aluminum alloy
l Plate : AISI-304
l Bellow : AISI-316
l Plate & bonnet seal : Viton ® elastomer
l Vacuum Range : < 1x10-7
Torr
l Temperature Range : vary from 60⁰ deg C -150 deg ⁰C depending on actuator & solenoid
l End flanges : KF type
ELECTRO-MAGNETIC VENT VALVES
Features
l Compact design
l Electro-magnetically close i.e. vacuum mode
Materials
l Body : AISI – 304
l Seal : Viton ® / Nitrile elastomer
l Temperature Range : 80⁰ deg C
l Electrical Power : 4.5 Watt / 24 VDC
l Loss of power : Valve allows venting into system
l End flanges : KF 16 type
GATE VALVES
Features
l Modular design with high conductance
l HV & UHV compatible
l Manual or Electro-pneumatic (air-open & air-close) actuators; Manual to electro-pneumatic interchangeability
l Edge welded bellow actuator seal and Viton ® gate seal
l TIG welded fusion joints
l Electro-polished internal & external surfaces
Materials
l Body : AISI-304L
l Gate & bonnet : AISI-304
l Bellow : AISI-347
l Air cylinder : Aluminum, black anodized
l Gate seal : Viton ® elastomer
l Bolts + Nuts : AISI-304
Torr
std. cc/sec of Helium
l Temperature Range : vary from 60 deg ⁰C -150 deg ⁰C depending on actuator & solenoid
l Differential pressure on the gate : 1bar in either direction
l End flanges : CF 35 to CF 150 for UHV type & ISO 63 to ISO 160 for HV type
l Orientation : Either vertical or horizontal position
l Manual actuation : by means of hand wheel driven square threaded screw Mechanism
l Electro-pneumatic Valve options : Mechanical position indicators with two micro-switches
l Electrical power requirements : 230 V A.C. , 50Hz , 8 Watts….for electro-pneumatic version
l Air pressure : 5 to 7 bar ……for electro-pneumatic version

ALL-METAL VALVES
Features
l UHV compatible
l Manual actuation
l Edge welded bellow actuator seal, OFHC bonnet & poppet seal
l End flanges – CF35, CF16
l One-piece valve body
l Whole assembly bakeable
Materials
l Body, Flanges : AISI-304L
l Bellow : AISI-347 / 350
l Bonnet & poppet seal : OFHC copper
l Bolts + Nuts : AISI-304
Torr
l Torque : > 1.5 Kg-m
SAMPLE MANIPULATION & MOTIONS
Fillunger manufactures Linear Motion Drives for linear displacement of samples in U.H.V. environment.
Compact Z-stages are manufactured for precise sample manipulation inside UHV conditions. Besides Rotary
drives, X Y Z manipulations and wobble sticks are also manufactured for the precise movement and transfer of
sample in UHV.
Torr
l Temperature Range : -20 deg ⁰C to 230⁰ deg C
CHAMBERS
Fillunger is equipped to build custom vacuum chambers to meet your exact specifications from a rough hand-sketch / detailed
engineering drawing. Fillunger has the facility to produce 3D models of almost any type of chamber based on the information received
from the customer. Custom-built chambers are manufactured using state-of-art welding equipment & conventional machine tools.
Unless otherwise specified, dimensional tolerances applied to chamber are as follows….
Linear tolerances +/- 0.5 mm for length < 600 mm
Angular tolerances +/- 0.5⁰ deg
MATERIALS
Fillunger uses SS304 stainless steel for vacuum chamber construction because of its machining characteristics, excellent corrosion
resistance & cost effectiveness. (SS304L, SS316 & SS316 L are also available on request)
WELDING
Fillunger uses advanced tungsten inert gas (TIG) welding method with high purity Argon as an inert gas medium. TIG fusion welding is
carried out internally without filler metal wherever possible. External staggered weld joints are used for structural reinforcement. When
internal weld joint is not feasible, a full penetration external weld is used. All weld joints are leak tested using a mass spectrometer
helium leak detector with a sensitivity of < 2x10-9
std. cc/sec.
SURFACE FINISHES
UHV chambers have better than Ra 0.8 surface finishes from inside & Ra 1.6 surface finish from outside. Machined components have Ra
1.6 surface finish overall; sealing surfaces have better than Ra 0.8 surface finish suitable for standard metal sealing. All UHV chamber
shells & pipes are electro-polished to get stain free clean surfaces & remove high points.
CLEANING
After final machining, all components are washed with soap solution followed by tap water to remove water soluble cutting oils. After
rinsing, parts are blown dry with air & cleaned with tissue paper.
LEAK TESTING
Fillunger offers optional UHV performance for custom-built chambers / components. The UHV performance to level of 10-9
Torr is
demonstrated in-house using UHV pumping. Vacuum measurements are carried out using compatible vacuum gauges.
PACKAGING
Protective plastic caps are used on flanges to prevent seal surface damage during transit. Oil-free aluminum foils are wrapped around
all open ports. Plastic air bubble film & thermocol is used inside the packaging box as an extra care to avoid transit damage.

Our Valued Customers
Testimonials
March 18, 2014
To Whom It May Concern
This is to certify that we purchased a UHV chamber for molecular beam instrument on 2002
from H. Fillunger and Co. Pvt. Ltd., Pune. It was working fine and we were able to maintain a
vacuum of 10-10
Torr with just a turbomolecular pump (220 l/s) backed by a rotary pump.
Very recently we dismantled the above unit and a redesigned UHV chamber is in place to
integrate the molecular beam with PM-IRAS. Even without any bake out, a vacuum of 10-9
Torr could be maintained. We used the old and using new UHV chambers to measure
surface catalysis reactions on metal single crystals. Both the chambers were made according
to given specifications by H. Fillunger and Co. Pvt. Ltd., Pune.
Dr. C. S. Gopinath
Senior Principal Scientist at Catalysis Division,
Head, Center of Excellence on Surface Science
NCL, Pune 411 008, India
Ph: 020-2590 2043
Fax: 020-2590 2633
cs.gopinath@ncl.res.in
nclwebapps.ncl.res.in/csgopinath/

*Specifications subject to change without notice.
Sales & Service Locations:
Pune (Head Office and Factory)
New Delhi
Mumbai
Chennai
Bengaluru
Kolkata
H Fillunger & Co. Pvt. Ltd.
Mumbai-Pune Road, Opp. Empire Estate,
Near Premier Ltd., Pimpri, Pune 411 018 INDIA
Tel.: +91-20-27468616/17
+91-9763718050 / 51
Fax: +91-20-27468614
vacuum-export@fillunger.com
vacuum-sales@fillunger.com
www.fillunger.com

Fillunger All Product Booklet 2014

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