The document discusses techniques for reworking printed circuit boards (PCBs) including ball grid array (BGA) component replacement. It describes methods such as using a stay-in-place stencil, flux paste dipping, component printing stencils, and solder paste printing with flexible adhesive stencils to accurately place replacement BGAs and meet customer acceptance criteria. The document is from a company that provides PCB testing, rework, repair services, and soldering training and tools.
2. BGA Rework-the process
Placement
Objective is to as accurately as possible place the
BGA so that customer acceptance criteria are met
Your BEST choice in PCB Test/ Rework/Repair and Solder Training & Tools www.solder.net
3. BGA Rework-the process
Placement using stay in place stencil
http://www.youtube.com/watch?v=PRO03Jv3qRo
Your BEST choice in PCB Test/ Rework/Repair and Solder Training & Tools www.solder.net
4. BGA Rework-the process
Placement
Objective is to as accurately as possible place the
BGA so that customer acceptance criteria are met.
Your BEST choice in PCB Test/ Rework/Repair and Solder Training & Tools www.solder.net
7. BGA Rework-the process
Placement- Paste Printing on Site
Your BEST choice in PCB Test/ Rework/Repair and Solder Training & Tools www.solder.net
8. BGA Rework-the process
PlacementSolder Paste Printing w/Flex Adhesive Stencil
Your BEST choice in PCB Test/ Rework/Repair and Solder Training & Tools www.solder.net
WE are going to need either flux or paste on the siote or device to place
Adds time and adds tooling cost for paste printing
Level of skil and dexterity required increases if you use solde rpaste
Lack of coplanarity causes smearing
Does not fit as lots of device ssurrounding the stencil
One try otherise smears
When lifting can msear