Presentation regarding the standards Independent Electronic Component Distributors should utilize to mitigate risk and financial exposure of there primes and subs.

6. Facility Security

7. Dehumidification System

8. ESD Floor Treatments

9. ESD Air-lock

13. Electronic Debris Stored in Front and Back Yards seen while driving through city streets (SHANTOU)

18. Shantou Warehouse: Boards stacked, waiting for chip removal

21. Components Being Washed in River & Laid on Bank to Dry (Shantou)

22. Washing components in river

23. Components on river bank drying

24. Pulled Components Drying on City Sidewalks, Then Separated by Type

26. 0402 Case Size Capacitors ( $.005 ea from Fran. Disty)

27. Components Sorted by Sifting

31. Components Being Made Ready for Refurbishment or Counterfeiting

36. Counterfeiting District where Refurbishing, Remarking, and Repackaging occurs. Residence housing located above

38. Remarked counterfeit components ready for counterfeit packaging and distribution thru Shenzhen’s global market

40. City of Shenzhen: Counterfeit Component Marketplace - Entry point into the global electronics market

48. Development of a Stringent Counterfeit Mitigation Process

50. Visual Inspection Documented And Retained Data

51. Please Note: The following Photos, X-Ray Images, Video Clips and Test Data are from SMT Corp’s in-house component lab.

56. Preliminary Visual Inspection Checklist

57. Packaging Inspection

59. Counterfeit factory box

60. LOGO AUTHENTICATION FAKE REAL

63. Counterfeit OCM “Certificates of Compliance” (C of C)

64. Counterfeit C of C

65. Counterfeit C of C

66. Counterfeit C of C

69. Datasheet Comparison

70. Mechanical Verification

71. Component Package Verification & Condition

72. Microscopy Inspection Documented Images of Microscopic Inspection

73. Microscopic Inspection

74. FRONT IMAGE REAR IMAGE

75. Visual Inspection Marking Permanency & Black Topping

76. Marking Permanency

77. Sanded Surface Area Original Original

78. 1997 parts remarked as 2006: Nine years difference

79. After part permanency test Before part permanency test Different Part Number and Date code 1 2 3

80. Before After

81. Sanding Marks Under Black-Topping

82. Contamination

83. Laser-Etch remarking still visible after black topping has been removed

84. After Black-Top Removal Laser-Etch Still Remains

85. Baked-On Black-Topping Scraping required to remove finish

87. Example: Your product was designed with the functionality features of revision “C2”, although you unknowingly have remarked components from die revision “B1”.

88. B1 has 13 bugs that C2 does not

91. Decapsulation & DIE Verification Documented Photographic Data Obtained

100. The following slides demonstrate the value of overlaying the mfg’s pin-out schematic onto the actual die photo to aid in DIE verification.

108. PLCC

111. BGA

114. Metal Can Decap

115. SOT-23 (3mm) 3mm

116. 2.11mm 35 Micro-X (2.11mm)

117. Real Time X-Ray Imaging Documented images using Real Time X-Ray

121. Match pin-out to datasheet

122. Match pin-out to datasheet

123. Match bond-out to mask

126. ESD damage seen by X-Ray

127. No ESD Damage

128. ESD Damage

129. ESD Damage

131. BGA

132. BGA wire bonds

133. Images taken through mfg’s tubes

134. Components as seen through manufacturer’s tubes

135. Images taken through sealed bags

136. Components in trays as seen through sealed bags

138. Intel Harris Intersil OKI

139. Intel Harris Intersil OKI Doubled power & ground bond wires

144. XRF RoHS Testing Documented Verification Leaded vs. Non-Leaded Components

151. Solderability Testing Documented Verification Component Solderability

153. Bath Test Globule Test

154. Wetting Curve Time Force Minimum amount of force required to pass PASS

156. Documented and retained test data

157. Unreliable “ Dip & Look” Method

158. No Captured Data Captured Data

159. Baking & Dry Packing

160. Large lots

162. Small lots

168. In-House Tape & Reel

170. Robotic Tape & Reel with Automated Optical Inspection for High-Reliability Applications

185. Sustained level of business maturity Established track record and quality recognition Recognized quality management system established ANSI ESD S20.20 Certification ISO 9001 Certification AS-9100 / AS-9120 Certification Recently audited and approved by third party accreditation Customer audited and approved with site visit In-house test equipment for counterfeit detection Product Liability & Errors and Omissions insurance AS5553 SMT QUALITY LAYERS (Additional)

186. Thank You