Linkedin Defense And Aerospace Procurement

The following presentation contains proprietary information regarding The SMT Corp stringent quality control program, in-house testing procedures, and documentation.
Distribution of this presentation outside the intended recipients without permission from SMT Corp is strictly prohibited.
Confidentiality

SMT Overview
Established in 1995.
Independent Stocking Distributor of Electronic Components and Peripherals.
Located in S.W. Connecticut approximately 1.5 hours from N.Y.C. and 2.5 hours from Boston.
Woman Owned Small Business

Facility Overview
72,000 sf. facility specifically engineered for the proper storage, inspection, and distribution of ESD and humidity sensitive electronic components
Over 100,000 line items in-stock from over 600 manufacturers.
Actives, Passives, IC’s, Discrete’s, Connectors, LCD’s and Peripherals.

Facility Security

Dehumidification System

ESD Floor Treatments

ESD Air-lock

SMT Corporation Certifications & Memberships
ISO9001:2000 CERTIFIED
AS9120:2002 CERTIFIED
ISO14001:2004 CERTIFIED
OHSAS 18001:2007 CERTIFIED
ANSI/ESD-20.20:2007 CERTIFIED
WBENC CERTIFIED
IDEA MEMBER
ERAI MEMBER
EPA REGISTERED

CHINESE COUNTERFEIT MARKETS
First hand look at the problem of counterfeit components created in Shantou China and sold into the Shenzhen China Global Market.
Pictures by Tom Sharpe of
SMT CORP

Electronic Debris Stored in Front and Back Yards seen while driving through city streets (SHANTOU)

Shantou Warehouse: Boards stacked, waiting for chip removal

Components Being Washed in River & Laid on Bank to Dry (Shantou)

Washing components in river

Components on river bank drying

Pulled Components Drying on City Sidewalks, Then Separated by Type

0402 Case Size Capacitors ( $.005 ea from Fran. Disty)

Components Sorted by Sifting

Components Being Made Ready for Refurbishment or Counterfeiting

Counterfeiting District where Refurbishing, Remarking, and Repackaging occurs. Residence housing located above

Remarked counterfeit components ready for counterfeit packaging and distribution thru Shenzhen’s global market

City of Shenzhen: Counterfeit Component Marketplace - Entry point into the global electronics market

Scope of Counterfeit Problem
Business Week, October 13 th 2008:
“ Robert P. Ernst who heads Research into Counterfeit Parts for the Naval Air Systems Command’s aging aircraft program in Patuxent River, Maryland, estimates as many as 15% of all spare microchips the Pentagon buys are counterfeit.”

Approximately 5% to 7% of the world trade is in counterfeit goods.
Source: IACC
Current value of counterfeit components ranges from $1b and $10b annually.
Source: IACC
Scope of Counterfeit Problem continued

Scope of Counterfeit Problem continued
ERAI Inc, receives 200 suspect counterfeit part complaints per month
ERAI Inc, has confirmed more than 2800 brokers selling counterfeit components

Development of a Stringent Counterfeit Mitigation Process

Equipment Required for Component Authentication & Quality
Real Time X-ray
Acid Etch Decapsulation
Microscopy Equipment
XRF Tester (RoHS)
Solderability Tester
Baking & Dry packing equipment

Visual Inspection Documented And Retained Data

Please Note: The following Photos, X-Ray Images, Video Clips and Test Data are from SMT Corp’s in-house component lab.

CERTIFIED INSPECTORS
1 year of on-site training in the proper handling, inspection, and authentication of electronic components is required before an employee is eligible to take the IDEA ICE 3000 certification exam at SMT Corp.

Preliminary Visual Inspection Checklist

Packaging Inspection

Counterfeit Label Red Flags
Misspelling
Inconsistent Logo Fonts or Layouts
Inconsistent Packaging Materials
Non-Factory ESD indicators
Specs inconsistent with normal manufacturers specs.

Counterfeit factory box

LOGO AUTHENTICATION FAKE REAL

Counterfeit OCM “Certificates of Compliance” (C of C)

Counterfeit C of C

Inspection Continued
Visual Inspection and comparison to manufacturers product specifications.

Datasheet Comparison

Mechanical Verification

Component Package Verification & Condition

Microscopy Inspection Documented Images of Microscopic Inspection

Microscopic Inspection

FRONT IMAGE REAR IMAGE

Visual Inspection Marking Permanency & Black Topping

Marking Permanency

Sanded Surface Area Original Original

1997 parts remarked as 2006: Nine years difference

After part permanency test Before part permanency test Different Part Number and Date code 1 2 3

Before After

Sanding Marks Under Black-Topping

Contamination

Laser-Etch remarking still visible after black topping has been removed

After Black-Top Removal Laser-Etch Still Remains

Baked-On Black-Topping Scraping required to remove finish

Correct Part Remarked with Wrong Date Code & Revision = POTENTIAL DISASTER
Black topped / remarked parts of the same manufacturer and part number may have substantial functional differences.

Example: Your product was designed with the functionality features of revision “C2”, although you unknowingly have remarked components from die revision “B1”.

B1 has 13 bugs that C2 does not

New features may not be present in older devices
“ Show stopper” bugs may be present in older devices
ERRATA

Decapsulation & DIE Verification Documented Photographic Data Obtained

The following slides demonstrate the value of overlaying the mfg’s pin-out schematic onto the actual die photo to aid in DIE verification.

Metal Can Decap

SOT-23 (3mm) 3mm

2.11mm 35 Micro-X (2.11mm)

Real Time X-Ray Imaging Documented images using Real Time X-Ray

X-Ray Inspection Goals
DIE presence
Wire bond pattern & condition
Lead frame pattern & condition
Detect ESD damage
Verify pin-out vs. data sheet
Verify die & bond-out match

Match pin-out to datasheet

Match bond-out to mask

ESD damage seen by X-Ray

No ESD Damage

ESD Damage

BGA wire bonds

Images taken through mfg’s tubes

Components as seen through manufacturer’s tubes

Images taken through sealed bags

Components in trays as seen through sealed bags

Die Example of a 82C55A from four different manufacturers
Distinguishing Features:
Die size and shape
Bond-out patterns
Distinctive irregular spacing
Doubled bond wires for power and ground

Intel Harris Intersil OKI

Intel Harris Intersil OKI Doubled power & ground bond wires

Intel 8255A NEC 8255A GND GND
8255A Bond wire connections to the die paddle
From lead frame
From die

Side View X-Ray
Per MIL-STD-883G Method 2012
Reveals
Taut and loose bond wires
Die attachment

XRF RoHS Testing Documented Verification Leaded vs. Non-Leaded Components

Solderability Testing Documented Verification Component Solderability

Bath Test Globule Test

Wetting Curve Time Force Minimum amount of force required to pass PASS

Documented and retained test data

Unreliable “ Dip & Look” Method

No Captured Data Captured Data

Baking & Dry Packing

Large lots

Small lots

In-House Tape & Reel

Robotic Tape & Reel with Automated Optical Inspection for High-Reliability Applications

DOCUMENTED INSPECTION REPORT PROVIDED WITH ORDER
Summary of all data collected utilizing the previous inspection process and test equipment.
Test & inspection data verifying quality and authentication.

Sustained level of business maturity Established track record and quality recognition Recognized quality management system established ANSI ESD S20.20 Certification ISO 9001 Certification AS-9100 / AS-9120 Certification Recently audited and approved by third party accreditation Customer audited and approved with site visit In-house test equipment for counterfeit detection Product Liability & Errors and Omissions insurance AS5553 SMT QUALITY LAYERS (Additional)

Thank You

Linkedin Defense And Aerospace Procurement

by cyanarella on Feb 16, 2009

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