3DIC & 2.5D TSV Interconnect for Advanced Packaging 2014 Report by Yole Developpement

Copyrights © Yole Développement SA. All rights reserved.
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3DIC & 2.5D TSV Interconnect for
Advanced Packaging
Advanced Packaging Team
YOLE DEVELOPPEMENT
COLLABORATION
INNOVATION
NEW PERSPECTIVES
FROM TECHNOLOGIES TO MARKET
2014 – Business Update Report

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Yole’s research is focused on:
 Applicative Packaging: moving to high performance, low cost, application driven
packaging techniques
 Advanced Packaging: moving to high performance, low cost, collective wafer
level packaging techniques
Semiconductor Packaging
Camera Level Packaging Power Module Packaging MEMS Packaging LED Packaging
Lead-Frame LCC Wirebonding BGA WLCSP 3D WLP SIP
QFN PGA Flip Chip POP FOWLP 2.5D Interposer
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From TECHNOLOGIES to MARKET
Copyright @ Yole Developpement SA.. All rights reserved
FOCUS of this report
3DIC

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The Evolution of Semiconductor Packaging
A bridging technology between ICs and PCBs
Feature sizes CMOS
transistors: 28nm
Feature sizes of PCBs
1970
through
hole
technology
1980
Surface mount
devices
DevelopmentinCMOSprocessingcapabilities
DevelopmentinPCBprocessingcapabilities
1990
CSPs/BGAs
SiPs
2000
WLCSP
more SiPs
Flip Chip BGA
PoP
2010
3DIC
TSV
Fan-out WLCSP
Cu pillars
Silicon interposers

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The Evolution of Semiconductor Packaging
A bridging technology between ICs and PCBs
Feature sizes CMOS
transistors: 28nm
Feature sizes of PCBs
1970
through
hole
technology
1980
Surface mount
devices
DevelopmentinCMOSprocessingcapabilities
DevelopmentinPCBprocessingcapabilities
1990
CSPs/BGAs
SiPs
2000
WLCSP
more SiPs
Flip Chip BGA
PoP
2010
3DIC
TSV
Fan-out WLCSP
Cu pillars
Silicon interposers
….across several markets
Mobile:
High-end Multimedia
Smart-phones / PMP
High-density
Solid State
Storage & µ-Cards
Computing: Notebooks / MID
‘connectivity’ devices
Consumer:
Gaming / Graphic
application engines
Industrial: HPC/
Network,
Servers
Consumer: High-performance
Digital Video
Wireless:
Connectivity /
Network Center
Medical Military & AerospaceTransportation:
Automotive,
Trains,
HEV/EV
Renewable Energy:
Photovoltains, Wind
Turbines…
Telecom: Power
Supplies…
Industrial

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Silicon / Interconnection trend
500
020406080100
Number
I/O per
cm²
20.000
10.000
1500
CMOS90 CMOS45
CMOS28
CMOS16
CMOS65
FinFET
Technology Node
CMOS [nm]
Scaling of Transistor
Nodes => I/Os Density
Increase

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TSV in a nutshell
Logic Memory
CMOS
Image
Sensors
MEMS
Photonics
Others
(Power,
LED, RF…)
Through
Silicon
Via
TSV

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Global 3DIC / TSV Activity Worldwide
Broad range of key players involved in 3D Technology from different business
models (Fabless, IDMs, OSATs, Foundries...)

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Landscape Via Middle (non exhaustive list)
0
5
10
15
20
25
0 10 20 30 40 50 60 70 80 90 100 110 120 130
Diameter[µm]
Depth [µm]
VIA MIDDLE
2.5D
Interposer
3DIC
…and again much more players
with others TSV features!!!

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Logic
CMOS
Image
Sensors
MEMS
Photonics
Others
(Power,
LED, RF…)
Memory
TSV in a nutshell
Memory
Through
Silicon
Via
TSV

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DRAM Technology Trends
2010 2011 2012 2013 2014 2015 2016 2017 2018 2019
From JEDEC specifications
LPDDR1
DDR3
LPDDR2
LPDDR3
Wide I/O
DDR4
LPDDR4 / Wide I/O2
Technology(density/bandwithperdie)
 Depending on requirements in voltages and data transfer speeds different
types of DDR memory are being developed to fulfill the future needs

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2010 2011 2012 2013 2014 2015 2016 2017 2018 2019
Mobile DRAM Memory Trends
PC DRAM DDR3 DDR4
Graphics
DRAM GDDR5 HBM
3D Mobile
DRAM Wide I/O1 Wide I/O2
Mobile
DRAM LPDRR2 LPDRR3 LPDRR4
3D
Technology
From JEDEC specifications

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Markets Demand: High Performance, Lower Power Consumption
High Performance Computing (HPC)
•Game Consoles
•Microprocessors
•Networking
Networking, Wired Applications
•Servers, Storage
•Graphics
•Digital TV Networking
Consumer, Wireless, Mobile Computing
•Smartphones
•Tablets
•Portable Consumer

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Logic
MEMS
Photonics
Others
(Power,
LED, RF…)
Memory
TSV in a nutshell
Through
Silicon
Via
TSV
CMOS
Image
Sensors

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Main Trends in CMOS Image Sensor
From FSI to BSI to 3D Stacked
SOC FSI Imager
I/Os
I/Os
I/Os
I/Os
Power Management
Analog
Analog
BSI Imager
Readout circuit
Hybridization
I/Os
I/Os
I/Os
I/Os
Power Management
Analog
Analog
 BSI is a key enabling technology to go to 3D integration
• Pads of the read-out layer are located on the same side of the image sensor processing chip (DSP).
• That configuration makes the integration easier by having direct access to each pixel site.
 With FSI sensors, the 3D integration would be very difficult because TSVs should cross
through the whole active pixel array.
 End of 2012, Sony released the first stacked image sensor (see right picture).
 In the future, 3D stacking will become more used as more functionalities will be
required.
Mainstream since the
2000s
All BSI players since 2009 October 2012: Sony to release
the first hydrid CIS “EXMOR
RS”

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CMOS Image Sensor Evolution
FSI BSI 3D Stacked BSI
20122008
TSV Hole to replace shell
case approach
Wafer Level Packaging
Interconnection
Trench TSV
BEOL Interconnection
TSV BEOL and DSP
Interconnection
« Real 3D »
TSVCross-sectionSEMTSVNeedsIntegrationScheme

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Comparison with previous 8Mp sensors
Significant Improvement brought by Sony
Phone Ref. (Year)
CIS
Manufacturer
Resolution/
Techno
Pixel size
Pixel Array
Area
CIS Area
Dies per wafer
(12-inch)
Motorola Razor (2011) Omnivision 8Mp/BSI 1.4µm 16mm² 43mm² 1,500
Apple iPhone 4S (2011) Sony 8Mp/BSI 1.4µm 16mm² 35.4mm² 1,816
Samsung Galaxy SII (2011) Samsung 8Mp/BSI 1.4µm 16mm² 34.2mm² 1,884
Apple iPhone 5S (2013) Sony 8Mp/BSI 1.5µm 18mm² 28.5mm² 2,268
Courtesy System Plus Consulting
~50% ~60% ~60% ~90%
Increase of pixel area

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Our Global Presence
Yole Inc.
Yole
Europe
30%
40%
30% Yole Korea
Yole KK Japan
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Offices in Lyon (HQ),
Nantes, Nice & Paris
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MEDIA
News feed / Webcasts
Technology Magazines
www.yole.fr
FINANCE
M&A / Valuation / Due Diligence /
Technology brokerage
www.yolefinance.fr
www.i-micronews.com
REPORTS
Market & technology
Patent Investigation
Reverse costing
CONSULTING
Market research
Technology & Strategy
Patent Investigation
Reverse costing
WORKSHOPS
Focused seminars
Yole Group Activities
5%

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The company is involved in the following areas:
 30 full time global analysts with technical, marketing and management
background
 35000 interviews per year
Field of Research
Advanced Packaging Photovoltaics LED & Compound Semi Power Electronics
Microfluidics & Bio Tech MEMS & Sensors Semiconductor Manufacturing: Equipment & Materials
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Overview of Our Main Services
 Technical comparison of new processes at
material or device level
 Detailed analysis of the cost structure of a
specific technology
 Analysis of technology evolutions and industrial
implementation
 Identification of new applications, services
and markets
 Set-up market segmentation a
 Proposal of marketing and action plans
Market
research &
marketing
analysis
Technical
& reverse
costing
analysis
Strategic
analysis
Business
Development
Specific
Services for
Investors
Media &
Communi-
cations
 Analysis of positioning to create value
 Development of action plans to improve
company performance
 Support in implementation and fund raising
 Contact with interesting companies and
possible partners
 Set up meetings (face to ace of by phone)
 Follow up in order to implement the decision
taken
 Evaluation and analysis of business plans
 Evaluation of production infrastructure
 Expertise and due diligence before M&A
 Technology brokerage
 Providing forum and journalistic support with
publishing articles
 Organizing and coordinating webcasts
 Providing journalistic help and coordination
with focused on multiple action magazines
 On-line Advertisement on i-Micronews website

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Breadth of the analysis
Depthoftheanalysis
Yole
Custom
Analysis
Yole
Annual Actions
Yole Standard Reports
Multiple reports
(> 3) offer can be
acquired through
annual subscription
offer
Direct access
to Yole’s
analyst
to discuss
and obtain
specific
information
quickly
throughout the
year
Custom projects are designed to meet your specific needs:
Business development, Teardown reverse engineering & costing
analysis, IP analysis, Strategic analysis, new product marketing
analysis and segmentation of your market, due diligence, M&A, etc.
Workshops
Yole
Workshops
Q&A
Services
Instead of buying 3-5 different reports to cover your
list of questions, Yole analysts can prepare a
“custom presentation” to be presented face-to-face
to your company

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 Yole Developpement consultants provide market analysis, technology
evaluation, and business plan along the entire value chain
Institutions,
Investors
and
Advocates
Materials
and
Equipment
Suppliers
Component
and
Device
Makers
Integrators
and
End Users
Serving the Entire Value Chain

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….Some of our Customers

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Our team
 Thibault Buisson, Technology and Market Analyst
Thibault is a member of the Advanced Packaging team at Yole Développement. He graduated from INPG with a
Master of Research in Micro and Nano electronics and from Polytech’ Grenoble with an engineering degree in
Material Sciences. He then joined NXP semiconductors as R&D process engineer in the thermal treatment area
to develop CMOS technology node devices from 65 to 45nm. Afterwards, he joined IMEC Leuven and worked for
more than 5 years as process integration engineer in the field of 3D technology. During this time, he has worked
on several topics from TSV to micro-bumping and stacking. He has authored or co-authored fifteen international
publications in the semiconductor field.
 Rozalia Beica, CTO and Business Unit Director
Rozalia Beica is the CTO and Business Unit Director leading Advanced/3D Packaging and Semiconductor
Manufacturing activities within Yole Développement. For more than 15 years she has been involved in the
research, strategic marketing and application of WLP and 3D/TSV at materials (Rohm and Haas), equipment
(Semitool, Applied Materials, Lam Research) and device manufacturing (Maxim IC) organizations. Rozalia has
authored over 50 papers and publications and she is actively participating in several 3D & Advanced Packaging
Committees worldwide. Rozalia has a M.Sc in Chemical Engineering (Romania), a M. Sc. In Management of
Technology (USA) and a GXMBA from IE University (Spain).
 Amandine Pizzagalli, Technology and Market Analyst
Amandine Pizzagalli is in charge of equipment & material fields for the Advanced Packaging & Manufacturing
team at Yole Développement after graduating as an engineer in Electronics, with a specialization in
Semiconductors and Nano Electronics Technologies. She worked in the past for Air Liquide with an emphasis on
CVD and ALD processes for semiconductor applications.
 Jérôme Azémar, Technology and Market Analyst
Jérôme Azémar is a member of the Advanced Packaging & Manufacturing team. Upon graduating from INSA
Toulouse with a master’s in Microelectronics and Applied Physics, he joined ASML and worked in Veldhoven for
three years as an Application Support Engineer, specializing in immersion scanners. During this time he acquired
Photolithography skills which he then honed over a two year stint as a Process Engineer at STMicroelectronics.
While with ST he developed new processes, co-authored an international publication and worked on metrology
structures embedded on reticules before joining Yole Développement in 2013.

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Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting,
media in addition to corporate finance services. With a strong focus on emerging applications using silicon and/or micro manufacturing
(technology or process), Yole Développement group has expanded to include more than 50 associates worldwide covering MEMS, Compound
Semiconductors, LED, Image Sensors, Optoelectronics, Microfluidics Medical, Photovoltaics, Advanced Packaging, Manufacturing,
Nanomaterials and Power Electronics. The group supports industrial companies, investors and RD organizations worldwide to help them
understand markets and follow technology trends to develop their business.
CONSULTING
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analysis
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www.i-micronews.com/reports
MEDIA EVENTS
• i-Micronews.com, online disruptive technologies website
• @Micronews, weekly e-newsletter
• Technology Magazines dedicated to MEMS, Advanced Packaging,
LED and Power Electronics
• Communication webcasts services
• Events: Yole Seminars, Market Briefings…
More information on www.i-micronews.com
CONTACTS
For more information about :
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3DIC & 2.5D TSV Interconnect for Advanced Packaging 2014 Report by Yole Developpement

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3DIC & 2.5D TSV Interconnect for Advanced Packaging 2014 Report by Yole Developpement