AT&S Investor and Analyst Presentation May 2018

AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Fabriksgasse 13 | A-8700 Leoben
Tel +43 (0) 3842 200-0
www.ats.net
AT&S
First choice for advanced applications
Investor and Analyst Presentation
May 2018

Investor and Analyst Presentation 1
Table of Contents
Company Overview
Strategy & Market
FY 2017/18 & Outlook
Annex

AT&S – outstanding 2017/18 results
High-end interconnect solutions
for
Mobile Devices, Automotive, Industrial, Medical
Applications and Semiconductor Industry
Highest revenue
in AT&S history
€ 991.8 m (+21.7%)
EBITDA
€ 226.0 (+72.6%)
22.8%
EBITDA margin
46.5%
Equity ratio
9,981
employees
Dividend proposal
0.36 €

Market Segments & Product Applications served by AT&S
3
Computer,
Communication,
Consumer
Smartphones, Tablets,
Wearables, Ultrabooks,
Cameras
…
Industrial
Machine-2-Machine
Communication,
Robots, Industrial
Computer,
X2X Communication
…
Automotive
Advanced Driver
Assistance Systems,
Emergency-Call, X2X
Communication
…
Medical
Patient
Monitoring,HearingAids,
Pacemaker,
Neurostimulation, Drug
Delivery, Prosthesis
…
IC substrates
High Performance
Computer, Microserver
…
Segment Mobile Devices & Substrates Segment Automotive, Industrial, Medical

Our competitive advantages
Strategic focus on high-end technologies and applications
Outstandingprocess know-how and process efficiency
First high-end IC substrates manufacturer in China
Scale innovation and technology leverage between customer segments
Highest quality

AT&S – Key Facts
542
590
667
763
815
992
102 127
168 168
131*
226
31 54
90 77*
7*
90
2012/13 2013/14 2014/15 2015/16 2016/17 2017/18
Revenue EBITDA EBIT
Good track record1 Balanced portfolio/Global customer base2
7%
Split revenue: Business Unit, FY 2017/18
Split revenue: Customer Region, FY 2017/18
based on sold to party
+9%
+13%
+14%
+7%
* Based on ramp-up effects for new plants in China
Revenue growth
€ in millions
66%
34%
Mobile Devices & Substrates
Automotive, Industrial, Medical
63%
21%
10%
6% Americas
Germany/Austria
Asia
Other European countries
+21.7%

Global footprint ensures proximity
to supply chain & cost efficiency
1,008* 394* 1,143* 2,361* 4,694* 307*
Plant Shanghai
China
Plant Ansan
Korea
Plant Chongqing
China
Plant Leoben, Headquarters
Austria
Plant Fehring
Austria
Plant Nanjangud
India
AT&S plant & sales office
AT&S sales office
AT&S Headquarters
*Staff, Average, FTE, FY 2017/18; 73 employees in other locations

Table of Contents
Company Overview
Strategy & Market
Annex

From vision to strategy
Targets/Key Performance
Indicators
Strategy
Expansion of technology leadership
• Leading provider of new interconnect solutions
• Innovation revenue rate: > 20%
 Focus on high-end technologies and applications
 Focus on innovative solutions “More than AT&S”
Medium-term profitable growth
• Medium-term revenue target of € 1.5 billion
• Medium-term EBITDA margin target of 20-25%
 Focus on fast-growing and profitable applications
 Highest service level and customer orientation
 Operational excellence
 Focus on cash flow generation
Creation of shareholder value
• Long-term ROCE ≥ 12%
 Sustainable business development with focus on ROCE
 Transparent dividend payout
Vision:
“First choice
for advanced
application”
Sustainable Management
• Fulfill and further develop standards in the area
of quality, environment, health & safety…
 Human resource development
 Uphold business ethics

Strategic focus on high-end technologies
AT&S Revenue structure in FY 2017/18 – based on technologies
High-end
HDI PCBs and
IC substrates
~ 30%
Single-sided (SS), double-sided (DS), multilayer- (ML),
flex and rigid-flex (RF) PCBs
~ 70%
High-end technology share > 75%
HDI and any-layer PCBs, Embedding, IC
Substrates
Complementary technology
share: < 25%
SS, DS, ML,
Flex, RF
Structure of general PCB market – based on technologies
Source: Prismark PCB Report 2Q17/ August 2017; AT&S Controlling

Market trends
Miniaturization and modularization still the main trends
10
Yole , AT&S AG (2018)
Mobile Phone
Desktop
Notebook
Smartphone
Tablet
Convertible
Internet
of
Things
AR&VR
Virtual
Reality
Artificial
Intelligence
(AI)
Smart Home
Smart Cities
Smart Speaker
Smartwatch
Datacenter/
Server
Vehicle
electrification
Autonomous
driving
“real time”
Connectivity
(5G)
~ 2000 ~ 2010
COMPUTING &
CONNECTIVITY
+ SENSING + ACTUATING
~ 2020+

PCB & IC substrates market – Overview
15.3 16.4
18.6
21.4
8.3
9.8
5.5
6.43.9
4.4
2.5
2.7
5.6
6.1
2018 2022
IC Substrates
Military/Aerospace
Industrial/Medical
Automotive
Consumer
Communication
Computing
3.1%
3.9%
4.3%
1.8%
3.5%
2.3%
59.7
67.2
Forecast for the total PCB & IC substrates market
until 2022: CAAGR of 3.0%
2.2%
USD in
billions
11
AT&S outperformed a flat market in the past 6 years and is set to
continue to do so also in the future.
100.8 103.2 96.4 94.6 103.2
108.9
123.1
140.8 150.4
183.0
60
80
100
120
140
160
180
200
2012* 2013 2014 2015 2016 2017
Index (2012 = 100)*
PCB & substrates market AT&S revenue
* Basis 2012:
PCB & substrates market: USD 55.7bn
AT&S revenue: € 542m
AT&S outperformed the market by scaling high-end any-layer technology and by leveraging
HDI technology to the Computer-, Consumer-, Automotive-, Industrial and Medical market.
Source: Prismark, February 2018, Yole April 2017

Driving the industry: miniaturization & modularization
?
2003/04 2013 2017 202X
TYPE Mobile Phone Smartphone Smartphone All in One
PCB 125x55mm 85x20mm 80x20mm 25x25mm?
FORM FACTOR 1 0.25 0.23 0.06?
LINE/SPACE 100/100µm 40/40µm 30/30µm 10/10µm
TECHNOLOGY 1-n-1 Any-layer mSAP – Any-layer FO/SAP/mSAP

Future positioning
as leading high-end interconnect solutions provider
Core business
New technologies
and interconnect
solutions
Extended technology
toolbox
Additional customers
Additional applications
Broader positioning in the
value chain
+
MorethanAT&S
Overview of the transformation from a high-end
PCB manufacturer to a high-end interconnect
solutions provider:

Table of Contents
Company Overview
Strategy & Market
Annex

Highlights in the financial year 2017/18
 Very successful year 2017/18
 Growth in all business segments above market average
 High operating performance (utilization, yield, efficiency)
 Position as technology leader in a challenging industry strengthened
 Ramp-up of the new mSAP lines in record time
 Operational improvement in the area of IC substrates
 Successful positioning in the high-frequency segment
 Balance sheet structure significantly strengthened through hybrid bond (€ 173.0 million)
 AT&S again listed on the Austrian lead index ATX
 Among the top performers of the Vienna Stock Exchange with share price gaining 113.8 % in FY 2017/18
Record levels for revenue, EBITDA and EBIT
15

Preliminary results for the financial year 2017/18
 Revenue up 21.7% to € 991.8 million
 High-end printed circuit boards for mobile devices, especially mSAP and IC substrates, contributed to revenue growth
 Strong demand in the automotive, industrial, medical segments
 Negative exchange rate effects amounting to €-46.8 million had an impact on revenue
 Generally high operating performance and product mix improve earnings
 EBITDA margin: 22.8% (PY: 16.1%)
 EBIT margin: 9.1% (PY: 0.8%)
 EPS improved from €-0.59 to €1.38
 Capex of € 141.7 million financed from cash flow from operating activities
 Equity ratio increased to 46.5% due to issue of hybrid bond
 Debt repayment period (net debt/EBITDA) improved to 0.9 years
 Dividend of € 0.36 (PY: € 0.1) proposed
Record levels for revenue and EBITDA
16

Revenue and EBITDA development
€ in millions
17
Split revenue FY 2017/18: Business Unit
Split revenue FY 2017/18: Customer Region
17
66%
34%
Mobile Devices & Substrates
Automotive, Industrial,
Medical
63%
21%
10%
6%
Americas
Germany/Austria
Asia
Other European countries
Revenue: YoY: + 21.7%: very good product mix, high demand and additional revenue from all plants
EBITDA: YoY: + 72.6 %: expansion capex, high operational performance, successful introduction & optimization of mSAP
199.8 199.6
286.0 280.2
225.9
814.9
991.8
28.8 29.7
74.7 85.9
35.7
130.9
226.0
Q4
2016/17
Q1
2017/18
Q2
2017/18
Q3
2017/18
Q4
2017/18
FY
2016/17
FY
2017/18
Revenue EBITDA and margin
16.1%30.7%26.1%14.9%14.4% 15.8% 22,8%

Net CAPEX & Staff
Net CAPEX
FY 2017/18: CAPEX at a high level due to mSAP
upgrade and Chongqing phase 1
€ in millions
90.3
164.8
254.3
240.7
141.7
2013/14 2014/15 2015/16 2016/17 2017/18
* incl. contractors, FTE, average for the period
Staff*
Increase in number of employees by more than 2,900
7,027
7,638
8,759
9,526
9,981
2013/14 2014/15 2015/16 2016/17 2017/18

Business Development – Mobile Devices & Substrates
113.7 113.6
197.6 199.6
137.2
486.5
648.0
12.4 20.9
59.4 75.0
23.7
68.5
179.0
Q4 2016/17 Q1 2017/18 Q2 2017/18 Q3 2017/18 Q4 2017/18 FY 2016/17 FY 2017/18
Revenue EBITDA
 Successful introduction of mSAP technology
 Operational improvements in IC substrates
 EBITDA improvements as a result of product mix
 Very strong Q2 and Q3, seasonality in Q4
 Price pressure on IC substrates remains
€ in millions (unless
otherwise indicated)
FY 2016/17 FY 2017/18 Change in %
Revenue 573.0 738.9 29.0%
Revenue with external
customers
486.5 648.0 33.2%
EBITDA 68.5 179.0 161.3%
EBITDA margin 12.0% 24.2% -
€ in millions; * Revenue with external customers
Revenue* and EBITDA

84.9 85.0 87.3 79.3 87.7
324.1 339.3
14.5 9.7 13.2 9.3 14.5
51.5 46.8
Q4 2016/17 Q1 2017/18 Q2 2017/18 Q3 2017/18 Q4 2017/18 FY 2016/17 FY 2017/18
Revenue EBITDA
Business Development – Automotive, Industrial, Medical
 Continued growth path in all sub-segments,
particularly in Industrial and Medical
 EBITDA 2016/17: € 44.3 m (included a reversal
of provision of € 7.2 m)
 EBITDA margin impacted by negative FX effects,
higher raw material prices
€ in millions (unless
otherwise indicated)
FY 2016/17 FY 2017/18 Change in %
Revenue 351.5 364.9 3.8%
Revenue with external
customers
324.1 339.3 4.7%
EBITDA 51.5 46.8 (9.1%)
EBITDA margin 14.6% 12.8% -
Revenue* and EBITDA
€ in millions; * Revenue with external customers

Outlook for 2018/19
 Seasonality expected for mobile devices segment, especially in Q1
 Technology development projects in CHQ I as preparation of second phase in implementation
 Further expansion in CHQ II depending on market development – next evaluation in mid-2018
 Technology expansion and capacity increase in the area of autonomous driving at the sites in Nanjangud (India)
and Fehring (Austria) currently implemented
 Maintenance investments and minor technology upgrades of roughly € 70 to 100 million
 Investments in capacity and technology expansion by another € 100 million depending on market development
 Outlook 2018/19: Revenue growth by up to 6% and EBITDA margin at 20 to 23%
Core business with stable and growing demand in a competitive environment

Medium-term strategy – More than AT&S
 Path of value-added growth will be pursued consistently
 Focus on leading position in terms of technology, quality and results
 New revenue target of € 1.5 billion
 EBITDA margin of 20 to 25%
Positioning as a leading high-end interconnect provider

Table of Contents
Company Overview
Strategy & Market
Annex

AT&S – Stock Profile
Listing: Vienna Stock Exchange,
Prime Standard
Indices: ATX Prime, WBI
Thomson Reuters (A): ATSV.VI
Bloomberg (A): ATS:AV
Publication of the Annual Report 2017/18 06 June 2018
Record date Annual General Meeting 25 June 2018
24th Annual General Meeting 05 July 2018
Ex-dividend day 24 July 2018
Record date dividend 25 July 2018
Dividend payment day 26 July 2018
Results for the first quarter 2018/19 31 July 2018
Results for the second quarter 2018/19 31 July 2018
Financial Calendar Shareholder structure
# of shares outstanding 38.85m
Average daily volume*: ~ 115,000 shares
Performance 1 year*: +107%
Dividend proposal 2017/18: € 0.36 per share
* 02/05/2017 – 30/04/2018

Market development
 Communication
 Decline in smartphone sales volume by 2.3% for the first time in 2017
 2018 – 2020 5G-capable smartphones provide for above-average growth of 2.8% p.a.
 Computer
 Slight decline of overall market by approx. 2.5% in 2017
 Slight increase forecast for servers in 2018, while tablet sales stagnate
 2018 – 2020 average growth of roughly 1.8% p.a.
 Consumer
 Market trend is the interconnection of devices (“Connected Devices”, “Internet of Things” – “IoT”)
 2018 – 2020 average annual growth of roughly 4.3% p.a.
 IC substrates
 2017 slight growth with a total market volume of $ 5.4 billion
 “System-in-package” or “all-in-one” modules for the integration of functions are the growth drivers for the future
 2018 – 2020 growth rate of 2.8% p.a.
Development in the customer segments in the calendar year 2017

Market development
 Automotive electronics
 Strong growth due to continuous increase in the proportion of electronics in vehicles
 Electrification, interconnection and autonomous driving are the growth drivers
 2018 – 2020 growth of 3.9% p.a.
 Industrial electronics
 Stable growth in 2017 at 2.9% due to automation and energy efficiency
 Driven by robotics, automation and Industry 4.0 activities
 2018 – 2020 growth by up to 3.4% p.a.
 Medical electronics
 Growth in 2017 by roughly 4.8% in mobile diagnostic equipment and therapy devices
 High complexity in applications such as diagnostic and imaging devices, mobile devices on and in the body
 2018 – 2020 growth rates of 2.1% p.a.
Development in the customer segments in the calendar year 2017
26

Financials FY 2017/18
Hybrid bond issue (€ 173.0m)
Full Capex financed from operating cash flow
€ in thousands
01 Apr 2016 – 31 Mar 2017 01 Apr 2017 – 31 Mar 2018
Change
YoY
STATEMENT OF CASH FLOWS
Operating result (EBIT) 6,649 90,286 >100%
Paid/received interests (15,962) (13,875) 13.1%
Income taxes paid (12,370) (26,015) (>100%)
Non cash bearing of profit or loss 112,207 141,705 26.3%
Cash flow from operating activities
before changes in working capital
90,524 192,101 >100%
Changes in working capital 45,892 (48,910) (>100%)
Cash flow from operating activities 136,416 143,191 5.0%
Cash flow from investing activities (161,148) (193,389) (20.0%)
Cash flow from financing activities 54,872 135,547 >100%
Change in cash and cash equivalents 30,140 85,349 >100%
Operating free cash flow1)
(104,253) 1,492 >100%
Free cash flow2)
(24,732) (50,198) (>100%)
1)
Cash flow from operating activities minus Net CAPEX
2)
Cash flow from operating activities minus cash flow from investing activities

Increase as a result of hybrid bond issue and
net profit
Negative FX effects (mainly RMB-EUR and
USD-EUR) of € 53.5 m. Positive: Hybrid bond
issue (€ 173.0m)
In 2016/17 special net debt optimization
program
Hybrid bond issue (€ 173.0m)
€ in thousands (unless otherwise stated)
31 Mar 2017 31 Mar 2018 Change
STATEMENT OF FINANCIAL
POSITION
Non-current assets 1,029,363 944,267 (8.3%)
Current assets 407,331 586,172 43.9%
Equity 540,094 711,391 31.7%
Non-current liabilities 569,849 515,276 (9.6%)
Current liabilities 326,751 303,772 (7.0%)
Total assets 1,436,694 1,530,439 6.5%
Net debt 380,549 209,237 (45.0%)
Net debt/EBITDA 2.9x 0.9x (2.0pp)
Net gearing 70.5% 29.4% (41.1pp)
Net working capital 24,374 72,437 >100%
Net working capital per revenue 3.0% 7.3% 4.3pp
Equity ratio 37.6% 46.5% 8.9pp

High demand, additional revenue contribution
mainly from both plants in Chongqing,
Negative FX impact of € 46.8 m.
Generally high operational performance,
successful implementation & optimization of
mSAP technology
Further reduction mainly due to positive FX
impact
Significantly higher earnings
Capitalization of deferred taxes in Austria
Reduced tax scheme in Shanghai effected
€ in thousands (unless otherwise stated)
01 Apr 2016 – 31 Mar 2017 01 Apr 2017 – 31 Mar 2018
Change
YoY
STATEMENT OF PROFIT OR LOSS
Revenue 814,906 991,843 21.7%
produced in Asia 82% 84% 2pp
produced in Europe 18% 16% (2pp)
EBITDA 130,933 225,977 72.6%
EBITDA margin 16.1% 22.8% 6.7pp
EBIT 6,649 90,286 >100%
EBIT margin 0.8% 9.1% 8.3pp
Finance costs – net (17,499) (14,775) 15.6%
Income taxes (12,047) (18,992) (57.6%)
Profit/(loss) for the year (22,897) 56,519 >100%
Cash earnings 101,764 192,211 88.9%
Earnings per share (€ 0.59) € 1.38 >100%

Key credit figures
299
372
405
523
593
540
82
261 274
260
212
331
217
111
131
263
381
209
2012/13 2013/14 2014/15 2015/16 2016/17 2017/18
Gross debt Financial assets and cash Net debt
0.9 0.8
1.6
2.9
0.9
2013/14 2014/15 2015/16 2016/17 2017/18
 Target: < 3x
Net debt/EBITDA
 Net debt decrease based on lower net capex
(Chongqing phase I finished) & Hybrid bond issue
€ in millions
Gross debt, financial assets and cash, net debt
Multiple

Net Working Capital Management
€ in millions; % of revenue
Net Working Capital development
103
92 95
88
24
72
19.0%
15.6%
14.3%
11.6%
3.0%
7.3%
2012/13 2013/14 2014/15 2015/16 2016/17 2017/18
Net working capital Net working capital per revenue

AT&S Product Portfolio – I
ECP®:
Embedded Component Packaging IC substrates Substrate-like printed circuit boards
mSAP
Embedded Component Packaging allows to embed
active/passive components (e.g. wafer level dies) within
the layers of a PCB – contributes to miniaturization.
IC substrates serve as interconnection platform with
higher density (Line/Space < 15 micron) between
semiconductors (Chips) & PCBs .
Substrate-like PCBs (mSAP technology) are the next
evolution of high-end HDI PCBs with higher density:
Line/Space < 30 micron.
Production site
Leoben, Shanghai Chongqing Chongqing, Shanghai
Applications
Devices such as smartphones, tablets, digital
cameras and hearing aids
High-end processors for
Computer, Communication, Automotive, Industrial
Mobile applications like smartphones

HDI
any-layer printed circuit
boards
HDI microvia printed
circuit boards – high
density interconnect
Multilayer printed circuit
boards
Double-sided printed
circuit boards
IMS printed circuit boards
– insulated metal
substrate
Further technological
enhancement to HDI microvia:
All electrical connections in HDI
any-layer boards consist of laser-
drilled microvias. Advantage:
further miniaturization, and
higher performance and
reliability. AT&S produces HDI
any-layer in 4 to 12 layers.
HDI: high density interconnect,
meaning
laser-drilled connections
(microvias). HDI is first step
towards miniaturization.
AT&S can produce 4-layer
laser PCBs up to 6-n-6
HDI multi layer PCBs.
Found in almost every area of
industrial electronics. AT&S
produces printed circuit boards
with 4 to 28 layers, in quantities
from individual prototypes to
small batches and mass
production.
Used in all areas of electronics.
AT&S focuses on double-sided
printed circuit boards with
thicknesses in the range of 0.1-
3.2mm.
IMS: insulated metal substrate.
Primary function: heat
dissipation for use mainly with
LEDs and power components.
Production site
Shanghai Shanghai, Leoben Leoben, Nanjangud, Fehring Fehring, Nanjangud Fehring
Applications
Smartphones, Tablets,
Notebooks
Mobile phones and nearly all
electronic applications including
automotive (navigation,
infotainment and driver
assistance systems)
Used in all electronic
applications including touch
panels, and in products ranging
from aircraft to motorcycles,
from storage power plants to
solar arrays
Primarily industrial and
automotive applications
Lighting industry
AT&S Product Portfolio – II

Flexible printed
circuit boards
Semi-flexible printed
circuit boards
Rigid-flex printed
circuit boards
Flexible printed circuit
boards on aluminum
AT&S patented
technologies
Used to replace wiring and
connectors, allowing for
connections and geometries that
are not possible with rigid
printed circuit boards.
More limited bend radius than
flexible printed circuit
boards. The use of a
standard thin laminate
makes them a cost-effective
alternative.
Combine the
advantages of flexible
and rigid printed circuit
boards, yielding benefits
for signal transmission,
size and stability.
Used when installing LEDs
in car headlights, for
example, where the
printed circuit board is
bonded to an aluminum
heat sink to which the
LEDs are then attached.
Production site
Ansan, Fehring Fehring Leoben, Ansan Ansan
Applications
Nearly all areas of
electronics, including
measuring devices and
medical applications
Automotive applications Industrial electronics,
such as production
machines and industrial
robots
Lighting, automotive,
building lighting
AT&S Product Portfolio – III
ECP®: Embedded
Component Packaging
ECP® is a patented AT&S packaging
technology used to embed active
and passive electronic components
in the inner layers of a printed circuit
board. ECP® technology is used in
ever smaller, more efficient and
more powerful devices, such as
smartphones, tablets, digital
cameras and hearing aids.
Production sites: Leoben, Shanghai
2.5D® Technology
Platform
Combines mechanical and electronic
miniaturization, and enables partial
reduction of the thickness of a
circuit board. Advantage: populated
assemblies have a thinner profile.
Can be also used to make cavities in
the printed circuit board, e.g. for
acoustic channels. Major application
for this technology is the 2.5D® rigid-
flex printed circuit board, a lower
cost alternative for flex-to install
applications.
Production sites: Leoben, Shanghai

Management
Andreas
Gerstenmayer, CEO
 Joined AT&S as CEO in 2010
 Previous positions include:
 18 years of work experience at Siemens,
including Managing Director with
Siemens Transportation Systems GmbH
Austria and CEO of the Drive Technology
business unit in Graz from 2003 to 2008
 Partner at FOCUSON Business
Consulting GmbH after leaving Siemens
 Education:
 Degree in Production Engineering from
Rosenheim University of Applied
Sciences
Monika Stoisser-
Göhring, CFO
 CFO since 2017
 Since 2011 with AT&S in senior
positions in Finance and Human
Resources
 Various positions at international
accounting and tax consulting
companies
 Education:
 Training as Tax Consultant
 Degree in Business Administration
from Karl-Franzens University Graz
Heinz Moitzi,
COO
 COO since 2005; with AT&S since
19811)
 Various management positions
within AT&S
 Measurement engineer with Leoben
University of Mining and Metallurgy
 Education:
 Degree from Higher Technical
College of Electrical Engineering
1)He was already with the founding company of AT&S

Milestones in the Group’s history
1987
Founding of the Group, emerging
from several companies owned by
the Austrian State Owned
Industries
1994
Privatization and
acquisition by Messrs
Androsch, Dörflinger, Zoidl
1999
Initial public offering on Frankfurt Stock Exchange
(„Neuer Markt“). Acquisition of Indal Electronics
Ltd., largest Indian printed circuit board plant
(Nanjangud) – today, AT&S India Private Limited
2002
Start of production at new Shanghai
facility – one of the leading HDI
production sites in the world
2010
Start of production
at plant II in India
2009
New production direction: Austrian
plants produce for high-value niches
in the automotive and industrial
segment; Shanghai focuses on the
high-end mobile devices segment
2008
AT&S change
to Vienna Stock
Exchange 2006
Acquisition of Korean
flexible printed circuit
board manufacturer,
Tofic Co. Ltd. – today,
AT&S Korea Co., Ltd.
2015
AT&S again achieves record high sales and earnings for
financial year 2014/15 and decides to increase the investment
program in Chongqing from € 350 million to € 480 million
2011
 Construction starts on new
plant in Chongqing, China
 Capacity increase in
Shanghai by 30%
2013
AT&S enters the IC substrate
market in cooperation with a
leading manufacturer of
semiconductors
2016
AT&S starts serial production of
IC substrates at the plant in
Chongqing

A sustainability benchmark in the industry
37
“Highest resource
efficiency“
“Highest standards at all
locations worldwide“
“Highest
transparency“
* Basis for CO2 output: 2015/16
 Sustainability reporting since 2012/13
 Gold recognition from the Responsible
Business Alliance
 Conflict minerals reporting
 Public CDP reporting on climate change
(C score) and water (B score)
Resource
consumption
stable/declining
Revenue growth  Environment: ISO 14001
 Safety: OHSAS 18001
 Energy: ISO 50001
 Quality: ISO 9001, ISO/TS 16949
AS/EN 9100, DS/EN 13485

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IR contact
Gerda Königstorfer
Tel: +43 3842 200 5925
Mobile: +43 676 8955 5925
Fax: +43 3842 200 15909
g.koenigstorfer@ats.net
Johannes Mattner
Tel: +43 3842 200 5450
Mobile: +43 676 8955 6093
Fabriksgasse 13,
8700 Leoben/Austria
www.ats.netVisit: www.ats.net; @AT&S IR_PR; AtundS

Disclaimer
This presentation is provided by AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, having its headquarter at Fabriksgasse 13, 8700 Leoben, Austria (“AT&S”), and the
contents are proprietary to AT&S and for information only.
AT&S does not provide any representations or warranties with regard to this presentation or for the correctness and completeness of the statements contained therein, and no
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This presentation may contain forward-looking statements which were made on the basis of the information available at the time of preparation and on management‘s expectations
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AT&S Investor and Analyst Presentation May 2018

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AT&S Investor and Analyst Presentation May 2018