AT&S Company Presentation May 2016

1. AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Fabriksgasse13 | A-8700 Leoben
Tel +43 (0) 3842 200-0 | E-Mail info@ats.net
www.ats.net
AT&S
first choice for advanced applications
Company Presentation
May 2016

2. 1
Company Overview
Strategy & Market
Annex
Financials
Table of Contents

3. High-End Interconnection
Solutions
for
Mobile Devices, Automotive,
Industrial, Medical Applications
One of the
most profitable
Players in the
Industry:
EBITDA margin of 22%
Continuously
Outperforming
market growth
€ 762.9m
Revenue in FY 2015/16,
5.2 % organic growth
# 1
manufacturer in Europe
# 3
in High-End Technology
worldwide
8.759
employees
Cost-competitive production
footprint with
6
plants in Europe and Asia
2
AT&S – a world leading high-tech PCB company

4. Outstanding
process know-how
and process
efficiency
3
Our competitive advantages
Cost advantage as
first high-end IC
Substrates
manufacturer in
China
Strategic focus on
high-end
technologies and
applications
Technology
leverage between
customer segments
Quality

5. 4
What guides us
Vision First choice for advanced applications
Targets
 Strenghtening the technology leadership
 Long-term profitable growth with the target to be one of the most profitable
players in the industry
 Generation of shareholder value
Strategy
 Focus on high-end technologies and applications with above average
growth potential and long-term profitability
 Focus on highest service-level and customer orientation
 Focus on operational excellence
 Focus on cash flow generation

6. High-end PCBs for high-end applications
5
Auswahlkriterien
Mobile Devices & Substrates Automotive Industrial Medical
Smartphones, Tablets,
Ultrabooks, Wearables ..
Navigation, Advanced
Driver Assistance
Systems, Infotainment..
Machine-2-Machine
communication,
industry computer..
MRT, hearing aids,
pacemaker, patient
monitoring..
60% 40%Revenue share Revenue share

7. AT&S – Key Facts
Strong track record1 Balanced portfolio / Global customer base2
7%
€ in millions
6
Split revenue: Business Unit, 2015/16
Split revenue: Customer Region, 2015/16
based on sold to party
514
542
590
667
763
103 102 127
168 168
42 31 54
90 77
2011/12 2012/13 2013/14 2014/15 2015/16
Revenue EBITDA EBIT
+5% +9% +13% +14%
Revenue growth
60%
40%
Mobile Devices &
Substrates
Automotive,
Industrial, Medical
24%
6%
14%
56%
Germany/Austria
Other European
countries
Asia
Americas

8. 7
Global footprint ensures proximity to supply chain
& cost efficiency
 European production facilities: high mix/low volume
 Asian production facilities: high volume/low mix
 Sales network spanning three continents
 8,759 employees*
Plant Shanghai, China
Staff: 4,585*
Plant Ansan, Korea
Staff: 275*
Plant Nanjangud, India
Staff: 1,160*
Plant Chongqing, China
under construction
Staff: 1,380*
Plant Leoben, Austria
Headquarters
Staff: 918*
Plant Fehring, Austria
Staff: 368*
AT&S sales officesAT&S plants
*Average, FTE, FY 2015/16; 73 employees in other locations

9. PCB market - overview
8
15,654 17,146
16,203
17,543
7,676
8,084
3,638
4,3323,645
4,417
2,288
2,520
2016 2020
Computing Communication
Consumer Automotive
Industrial/Medical Military/Aerospace
4.9%
4.5%
1.3%
2.3%
2.0%
17,397 15,831
15,460
15,607
8,030
7,752
3,377
3,506
3,519
3,483
2,144
2,224
2014 2015
3.7%
-1.0%
3.8%
335
373
285
297
2014 2015 w/o FX
effects*
BU MS BU AIM
*
*
Source: Prismark, Feb. 2016
Moderate growth of 2.4% forecasted for the
total PCB market until 2020
Total PCB market 2015
declining
49,104
54,042
49,927
48,403
CAAGR 2016-
2020: 2.4%
2.4%
4.2%
11.3%
8.1%
-3.0%
-3.5%
1.0%
-9.0%
USD in billions € in millionsUSD in billions
AT&S 2015 with above-
average growth*
* Q4 2014/15 and Q1-Q3 2015/16, corresponds to calendar year 2015

10. 9
Company Overview
Strategy & Market
Annex
Financials
Table of Contents

11. 10
AT&S positioning - current
Strategic focus on high-end technologies
AT&S Revenue structure in 2015/16 - based on technologies
High-end
HDI PCBs and
IC Substrates
~30%
Single-sided (SS), double-sided (DS), multilayer- (ML),
flex and rigid-flex (RF) PCBs
~70%
High-end technology share > 70%
HDI and Anylayer PCBs, Embedding
Complementary technology
share: <30%
SS, DS, ML,
Flex, RF
Structure of general PCB market – based on technologies

12. 11
Market Player/Position HDI Technology
Source: Prismark, 2015; JMS 2015; NTI 2015; AT&S Strategy
Market position HDI Technology
Revenue (US$ in millions)
Rank Country Supplier HDI
Non HDI
PCBs
IC-
Substrates
Total
revenue
1 TWN Unimicron 738 634 758 2,130
2 TWN Compeq 624 486 - 1,110
3 AUT AT&S 557 329 - 886
4 JPN Ibiden 462 376 655 1,493
5 KOR SEMCO 392 200 970 1,562
6 USA TTM 376 1,046 - 1,422
7 TWN Zhen Ding 369 2,114 - 2,483
8 TWN Tripod 321 1,070 - 1,391
9 TWN Unitech 302 153 - 455
10 CHN Kingboard (E&E) 275 688 - 963

13. 12
Driving Future Trends: Internet of Things (IoT) Applications
Everything is going to be smart and/or connected
 Healthcare & Fitness
 Smart Watches and Glasses
Wearable Electronics
Smart Mobility  Autonomous Driving
 Car2X Communication
Smart City  Smart Lighting
Smart Buildings  Home/Building Automatization
 Smart Home Devices
Smart Production/Industry 4.0  Automatization/Robotics
 Machine-to-Machine Communication
Smart Healthcare  Connected Patient Monitoring Systems
 Connected Consumer Healthcare Devices
Smart Energy  Smart Metering
 Building Blocks of IoT Modules: Sensing, Connectivity, Energy Storage/Harvesting, Power Management
 30-50 billion of „Things“ will be connected in 2020
 Wearable electronic devices offer revenue opportunities of USD 61.7 billion beyond the smartphone
market in 2020
Source: Gartner Inc. 2016

14. The world is changing – miniaturisation &
modularisation as main drivers
13
2003/04 2013 2016 2024
?
Type Mobile Phone Smartphone System in Package All in One
PCB 125x55mm 85x20mm 30x30mm 20x20 ?
Form Factor 1 0.25 0.13 0.06 ?
Line/Space 100/100µm 40/40µm 30/30µm 20/20µm ?
Technology 1-n-1 Anylayer Anylayer&Embedding ?

15. From vision to strategy
14
Targets/Key performance
Indicators
Strategy
Strenghtening technology leadership
• Leading player in the high-end core
business
• Medium-term: leading player in new
business areas
• Innovation Revenue Rate: > 20 %
 Continuous innovation and focus on high-end
technologies and applications
 Focus on innovative solutions
Long term profitable growth/to be
one of the most profitable players in
the industry
• Medium-term EBITDA margin target of
18–20%
• Medium-term revenue target of
~€ 1 billion
 Focus on technologies and applications with above-
average growth potential and long-term profitability
 Focus on highest service-level and customer orientation
 Focus on operational excellence
 Focus on cash flow generation
Generation of shareholder value
• Medium term ROCE of 12%
 Sustainable development focusing on ROCE
 Stable dividend policy
Vision:
“First choice
for advanced
applications”
The best employees and
executives
• Talent Programs
• Trainings
• Leadership Excellence Programme
Sustainable management
To be the benchmark of the industry
by reduction of:
• 5% CO2 emissions p.a.
• 3% freshwater consumption p.a.
Capital Excellence
• Equity ratio: > 40 %
• Financing costs of < 2% (in a
corresponding interest
environment)
• Payback period of < 3 years

16.  19.6% of AT&S‘ total revenue in 2015/16 is generated by products with new, innovative
technologies introduced to the market within the last three years (Innovation Revenue
Rate). IRR decreased due to a generation of mature products and new technologies (IC
Substrates) were not yet revenue generating.
 AT&S now has 162 patent families, resulting in 212 patents.
 The expenses for research and development projects amounted to € 95.5m in the financial
year 2015/16. This corresponds to a R&D quota (i.e. relation to revenue) of 12.5%
compared to 8.7% in the previous year. Adjusted for project IC Substrates: 4.5%
Research and development as the key for
technological leadership
15
32.9
24.7
31.8
57.9
95.5
2011/12 2012/13 2013/14 2014/15 2015/16
15.0
19.2
26.5
29.2
19.6
2011/12 2012/13 2013/14 2014/15 2015/16
101
124
153
174
212
2011/12 2012/13 2013/14 2014/15 2015/16
IRR (Innovation Revenue Rate)
€ in millions in % Quantity
PatentsR&D expenses

17. 16
„New interconnection solutions“
> supporting miniaturization and
modularisation
„High-end Toolbox“
New and existing
Application Areas
New and existing
customers
 Semiconductors
 Packaging
companies (OSATS)
 Original Electronic
Manufacturers
(OEMs)
 Tier 1 suppliers
Future positionining as leading high-end
interconnection solutions provider
Mobile
Devices
Automotive
Industrial
Medical
INTERNET of
THINGS
NEW
TECHNOLOGIES
IC-Substrates
Advanced Packaging
Substrate-like PCBs
EXISTING
TECHNOLOGIES
Multilayer PCBs
HDI Anylayer PCBs
Embedding
Flexible PCBs
CORE BUSINESS
Multilayer PCBs,
HDI Anylayer PCBS,
Embedding,
Flexible PCBs
e- IC-Substrate
Advanced
Packaging /SLP
(SiB)
Advanced
Packaging / (SiP)
e- Interposer
16
„More comprehensive
positioning in the value chain“

18. 17
AT&S’ advanced technology solutions
General Description & Technology Application Areas Customer Base
High-End
(HDI) PCBs
PCBs are the interconnection platform for electric, electronic
& mechanical components (such as resistors , capacitors, IC’s,
connectors; etc.)
Density: Line/ Space > 35 micron
Computer, Consumer,
Communication, Automotive
Industrial, Medical
OEM´s
Tier 1
Tier 2
Substrate-like
PCBs
Substrate-like PCBs are the next evolution of high-end HDI
PCBs with higher density: Line/Space 20-30micron
Wearables and applications of
the “Internet of Things”
OEM’s
Tier 1
Tier 2

19. 18
General Description & Technology Application Areas Customer Base
IC Substrates
IC Substrates serve as interconnection platform with
higher density (Line/Space < 15 micron) between
semiconductors (Chips) & PCBs
High-end processors for
Computer, Communication,
Automotive, Industrial
OEM’s
Semiconductor
Industry
Embedded
Component
Packaging
(ECP®) Embedded Component Packaging allows to embed
active/passive components (e.g. wafer level dies) within the
layers of a PCB – contributes to miniaturisation
Power Electronics, e.g. for
Automotive, Industrial
OEM’s
Semiconductor
Industry
AT&S’ advanced technology solutions

20. Growth Project Chongqing
IC Substrate project
Investment* Phase 1: ~ € 280m
Investment* as of 31/03/2016: € 208.7m
Substrate-like PCB project
Investment*Phase 1: ~ € 200m
Investment* as of 31/03/2016: € 82.9m
19
Total investment: € 480m* in first phase (until mid 2017)
Expected CAPEX-revenue ratio: mean of 0.9** (at full expansion – incl. second phase)
Depreciation & Amortisation: average of 10 years; roughly additional € 40m in FY 2016/17
* Capex for tangible fixed assets **at full expansion (incl. a second phase not yet scheduled)

21. Q4 2015/16
(January – March 2016)
Challenge: Ramp of three production lines
within 12 months
Ramp: PRODUCTION LINE 1 - IC SUBSTRATES
Q1 2016/17
(April – June 2016)
Q2 2016/17
(July – August 2016)
Q3 2016/17
(September – December 2016)
Q4 2016/17
(January – March 2017)
Ramp: PRODUCTION LINE 1 – SUBSTRATE LIKE PCBs
Ramp:
PRODUCTION LINE 2 - IC SUBSTRATES
FY 2015/16 FY 2016/17
20

22. 21
Company Overview
Strategy & Market
Annex
Financials
Table of Contents

23. 22
Sound top-line growth, above industry margins
and increasing cash conversion
514
542
590
667
763
2011/12 2012/13 2013/14 2014/15 2015/16
103 102
127
168 168
20.1% 18.9%
21.6%
25.1%
22.0%
2011/12 2012/13 2013/14 2014/15 2015/16
87
72
105
144
137
2011/12 2012/13 2013/14 2014/15 2015/16
Revenue
Y-O-Y growth
Operating Cash Flow
Y-O-Y development
EBITDA and
EBITDA-margin
 Continuous growth path
 Revenue with products out of
Asian production increased from
69% in 2010/11 to 81% in Q1-Q3
2015/16
 EBITDA stable despite impact of project
Chongqing
 EBITDA margin guidance FY 2016/17: >
18-20% due to impact from ramp-up
Chongqing plant
 Strong cash flow generation. Slight
decrease in FY 15/16 based on
higher Working Capital out project
Chongqing. Operating cash flow
generation driven by strong
EBITDA performance
€ in millions € in millions€ in millions

24. 23
Capex & Staff
CAPEX
CAPEX reflects investments in Chongqing
project (whereof € 190.3m) and technology
investments in existing locations.
STAFF*
The increased headcount is primarily based on
the Chongqing project.
7,417 7,321
7,027
7,638
8,759
2011/12 2012/13 2013/14 2014/15 2015/16
123
60954 1,380
* incl. leased personnel, FTE, average for the period(€ in millions)
Core business Employees project Chongqing
113
40
90
165
254
2011/12 2012/13 2013/14 2014/15 2015/16

25. Financials FY 2015/16
24
€ in thousands (unless otherwise
indicated)
01.04.2015 – 31.03.2016 01.04.2014 – 31.03.2015
STATEMENT OF PROFIT OR LOSS
Revenue 762,879 667,010
produced in Asia 81.0% 79.0%
produced in Europe 19.0% 21.0%
EBITDA 167,488 167,571
EBITDA margin 22.0% 25.1%
EBIT 76,969 90,086
EBIT margin 10.1% 13.5%
Finance costs - net (8,135) (5,103)
Income Taxes (12,883) (15,634)
Profit for the period 55,951 69,349
Cash Earnings 146,470 146,763
EPS in € 1.44 1.78
Positive FX effects of € 13.0m included as
well as effects from Chongqing of € 12.7m
(2014/15: € 5.8m).
Revenue increase of 14.4%:
5.2% from organic growth and 8.8%
from FX effects.
EBITDA margin impacted by ramp costs
of Chongqing, adjusted for these costs:
23.7% (vs. 25.8%).
Stable tax rate of 18.7% (FY 14/15: 18.4%)

26. Financials FY 2015/16
25
€ in thousands (unless otherwise
indicated) 31.03.2016 31.03.2015
STATEMENT OF FINANCIAL POSITION
Non-current assets 866,338 712,757
Current assets 478,312 508,055
Equity 568,936 604,358
Non-current liabilities 421,407 413,070
Current liabilities 354,307 203,384
Total assets 1,344,650 1,220,812
Net debt 263,192 130,510
Net debt/EBITDA 1.6x 0.8x
Net gearing 46.3% 21.6%
Net working capital 88,427 95,319
Net working capital per revenue 11.6% 14.3%
Equity ratio 42.3% 49.5%
Improvement of net income to € 56.0m was
overcompensated by negative FX effects.
Includes additions of fixed assets to
Chongqing project of € 231.5m
Increase based on high investment acitivity
due to Chongqing and dividend paid.

27. 26
Financial debt, cash and net debt
273
299
372
405
435
31
82
261
274
172
243 217
111
131
263
2011/12 2012/13 2013/14 2014/15 2015/16
Gross debt Cash Net debt
2.3
2.1
0.9
0.8
1.6
2011/12 2012/13 2013/14 2014/15 2015/16
 Expected multiple in temporary peak of
Chongqing investments: < 3.5x
Net debt/EBITDA

28. 27
Overview Debt Portfolio Duration
Maturity
 Average debt portfolio duration: 3.9 years (2014/15: 3.8 years)
 € 247m of credit lines not utilised
Includes promissory note loans of € 287.2m
€ in millions < 1 Year 1-5 Years > 5 Years Total
Corporate Bond 76.8 - - 76.8
Export Loans 32.0 - - 32.0
Public funds and other 0.2 4.4 - 4.6
Bank Borrowings 52.4 280.9 76.3 409.6
Total 31/03/2016 161.4 285.3 76.3 523.0
Total 31/03/2015 46.0 321.6 37.7 405.3

29. Financials FY 2015/16
28
€ in thousands 01.04.2015 – 31.03.2016 01.04.2014 – 31.03.2015)
STATEMENT OF CASH FLOWS
Operating result 76,969 90,086
Paid /received interests (12,460) (12,193)
Paid taxes (10,308) (16,436)
Non cash bearing of profit or loss 91,727 83,499
Cash flow from operating activities
before changes in working capital 145,928 144,956
Changes in Working Capital (9,003) (1,086)
Cash flow from operating activities 136,925 143,870
Cash flow from investing activities (342,242) (164,779)
Cash flow from financing activities 111,073 11,943
Change in cash and cash equivalents (94,244) (8,966)
Strong operational cash flow generation
from operations.
Including long term investment of liquid
funds of € 89.5m - continuous high CAPEX
in Chongqing project and continuous
upgrades of existing production facilities.

30. 29
Net Working Capital Management
Net Working Capital Development - € in millions and in % of revenue
92
103
92 95
88
18.0%
19.0%
15.6%
14.3%
11.6%
2011/12 2012/13 2013/14 2014/15 2015/16
Net Working Capital development Net Working Capital % of revenue

31. AT&S - Stock Profile
Listing: Vienna Stock Exchange,
Prime Standard
Indices: ATX, WBI
ThomsonReuters (A): ATSV.VI
Bloomberg (A): ATS:AV
Record Date Annual General Meeting 27 June 2016
22nd Annual General Meeting 07 July 2016
Ex-Dividend Day 26 July 2016
Record Date Dividend 27 July 2016
Dividend Payment Day 28 July 2016
Results for the first quarter 2016/17 28 July 2016
Results for the first half-year 2016/17 03 November 2016
30
Financial Calendar Shareholder structure
# of shares outstanding 38.85m
Avg. daily volume: 63.300 shares
Performance ytd: -16.28%
Performance 1 year: -14.09%
Dividend 2014/15: EUR 0.36/per share
Dividend yield: 2.5%

32. 31
Outlook FY 2016/17
 Focus on capacity utilisation of first production line of IC substrates and ramp of two further
production lines (second production line of IC substrates, first production line of substrate like
PCB)
 Slower growth dynamic expected in certain customer segments, particularly in Mobile Devices &
Substrates as well as stronger seasonality in Q1 and Q4 and continuous low visibility
 Based on a macroeconomic stable environment, FX relation of USD-EUR on a similar level than FY
2015/16 and a stable demand in the core business, management expects revenue growth of 10-
12%. EBITDA margin should be on a level of 18-20 %, based on costs related to the ramp of
Chongqing. EBITDA margin in core business should be on a similar level than in FY 2015/16.
Higher depreciation for the new plants in Chongqing of additional ~ € 40m in FY 2016/17 will have
a clear impact on EBIT level.

33. 32
Company Overview
Strategy & Market
Annex
Financials
Table of Contents

34. 33
AT&S Product Portfolio
HDI
any-layer printed circuit
boards
HDI microvia printed
circuit boards – high
density interconnect
Multilayer printed
circuit boards
Double-sided printed
circuit boards
IMS printed circuit
boards – insulated
metal substrate
Further technological
enhancement to HDI
microvia: All electrical
connections in HDI any-layer
boards consist of laser-drilled
microvias. Advantage:
further miniaturisation, and
higher performance and
reliability. AT&S produces HDI
any-layer in 4 to 12 layers.
HDI: high
density interconnect,
meaning laser-drilled
connections (microvias).
HDI is first step
towards miniaturisation.
AT&S can produce 4-layer
laser PCBs up to 6-n-6
HDI multi layer PCBs.
Found in almost every area of
industrial electronics. AT&S
produces printed circuit
boards with 4 to 28 layers, in
quantities from individual
prototypes to small batches
and mass production.
Used in all areas of
electronics.
AT&S focuses on double-
sided printed circuit boards
with thicknesses in the range
of 0.1-3.2 mm.
IMS: insulated metal
substrate. Primary function:
heat dissipation for use
mainly with LEDs and power
components.
Production site
Shanghai Shanghai, Leoben Leoben, Nanjangud, Fehring Fehring, Nanjangud Fehring
Applications
Smartphones, Tablets,
Notebooks
Mobile phones and nearly all
electronic applications
including automotive
(navigation, infotainment and
driver assistance systems)
Used in all electronic
applications including touch
panels, and in products
ranging from aircraft to
motorcycles, from storage
power plants to solar arrays
Primarily industrial and
automotive applications
Lighting industry

35. 34
AT&S Product Portfolio
Flexible printed
circuit boards
Semi-flexible printed
circuit boards
Rigid-flex printed
circuit boards
Flexible printed circuit
boards on aluminium
AT&S patented
technologies
Used to replace
wiring and connectors,
allowing for connections
and geometries that are
not possible with rigid
printed circuit boards.
More limited bend radius
than flexible printed circuit
boards. The use of a
standard thin laminate
makes them a cost-effective
alternative.
Combine the
advantages of flexible
and rigid printed circuit
boards, yielding benefits
for signal transmission,
size and stability.
Used when installing LEDs
in car headlights, for
example, where the
printed circuit board is
bonded to an aluminium
heat sink to which the
LEDs are then attached.
Production site
Ansan, Fehring Fehring Leoben, Ansan Ansan
Applications
Nearly all areas of
electronics, including
measuring devices and
medical applications
Automotive applications Industrial electronics,
such as production
machines and industrial
robots
Lighting, automotive,
building lighting
ECP: Embedded
Component Packaging
ECP® is a patented AT&S packaging
technology used to embed
active and passive electronic
components in the inner layers
of a printed circuit board. ECP®
technology is used in
ever smaller, more efficient and
more powerful devices, such
as smartphones, tablets, digital
cameras and hearing aids.
Production site: Leoben
2.5D® Technology
Platform
Combines mechanical and
electronic miniaturisation, and
enables partial reduction of the
thickness of a circuit board.
Advantage: populated assemblies
have a thinner profile.
Can be also used to
make cavities in the printed circuit
board, e.g. for acoustic
channels. Major application
for this technology is the 2.5D®
rigid-flex printed circuit board,
a lower cost alternative for flex-to
install applications.
Production sites:
Leoben, Shanghai

36. Management
35
Andreas Gerstenmayer, CEO
 Born 1965; joined AT&S as CEO in 2010
 Previous positions include:
 18 years of work experience at Siemens, including Managing Director
with Siemens Transportation Systems GmbH Austria and CEO of the
Drive Technology business unit in Graz from 2003 to 2008
 Partner at FOCUSON Business Consulting GmbH after leaving Siemens
 Education and other positions:
 Member of the Research Council of Styria
 Degree in Production Engineering from Rosenheim University of
Applied Sciences
Heinz Moitzi, COO
 Born 1956; COO since 2005; with AT&S since 19811)
 Previous positions include:
 Various management positions within AT&S
 Measurement engineer with Leoben University of Mining and
Metallurgy
 Education:
 Degree from Higher Technical College of Electrical Engineering
Karl M. Asamer, CFO  Born 1970; joined AT&S as CFO in 2014
 Previous positions include:
 Managing Director of GEKA Group in Germany
 Managing Director of Sell GmbH in Germany
 Education:
 Degree: doctorate in business administration in Linz, Austria
1) He was already with the founding company of AT&S
 Responsibilities:
 Sales and Marketing
 Human Resources
 Investor Relations, Public Relations and
Internal Communications
 Business Development and Strategy
 Compliance
 CSR and Sustainability
 Responsibilities:
 Finance and Accounting, Treasury
 Controlling
 Legal Affairs, Risk Management and
Internal Audit
 IT/Organisation
 Procurement
 Responsibilities:
 Research and Development (R&D)
 Operations
 Quality Management
 Business Process Excellence
 Environment
 Safety

37. 36
Milestones in the Group’s history
1987
Founding of the Group, emerging
from several companies owned by
the Austrian State Owned
Industries
1994
Privatisation and
acquisition by Messrs
Androsch, Dörflinger, Zoidl
1999
Initial public offering on Frankfurt Stock Exchange
(„Neuer Markt“). Acquisition of Indal Electronics
Ltd., largest Indian printed circuit board plant
(Nanjangud) – today, AT&S India Private Limited
2002
Start of production at new Shanghai
facility – one of the leading HDI
production sites in the world
2010
Start of production
at plant II in India
2009
New production direction: Austrian
plants produce for high-value niches
in the automotive and industrial
segment; Shanghai focuses on the
high-end mobile devices segment
2008
AT&S change
to Vienna Stock
Exchange
2006
Acquisition of Korean
flexible printed circuit
board manufacturer,
Tofic Co. Ltd. – today,
AT&S Korea Co., Ltd.
2015
AT&S again achieves recordhigh sales and earnings for
financial year 2014/15 and decides to increase the investment
program in Chongqing from € 350 million to € 480 million
2011
 Construction starts on new
plant in Chongqing, China
 Capacity increase in
Shanghai by 30%
2013
AT&S enters the IC substrate
market in cooperation with a
leading manufacturer of
semiconductors
2016
 AT&S receives certification for
the serial production of IC
substrates at the plant in
Chongqing
 AT&S shares are admitted to
the Austrian lead index ATX

38. Five core dimensions of sustainability within AT&S
Energy and
carbon footprint
Water
AT&S – a learning
organisationResources
Thinking ahead –
shaping the future
CSR gains importance in long term success
 Improving efficiency
 Motivated and qualified staff
CSR as a key to sustainable business success
37
The importance of sustainability is rising within:
 Authorities
(basis for securing operation licences)
 Customers
(relevant for placing orders)

39. AT&S saves CO2 and Water…
38
Sustainability – Figures and Fields of Action
AT&S aims to minimise its
environmental footprint by
reducing the CO2 emissions
per m2 PCB attributable to
production processes by 5%
a year.
AT&S aims to reduce
the Group‘s annual
fresh water
consumption per m2
PCB by 3%.
765.2
834.7
783.9
734.0
718.6
2011/12 2012/13 2013/14 2014/15 2015/16
Freshwater consumption
In liters per sqm weighted PCB
1)
47.4
51.0
50.7
49.0
50.7
2011/12 2012/13 2013/14 2014/15 2015/16
CO2-Footprint
1)
In kg per sqm weighted PCB
1) Since 2012/13 calculation according to EICC standards
before that AT&S internal calculation

40. Visit: www.ats.net; Twitter @AT&S IR_PR; YouTube AtundS
39
AT&S – first choice for advanced applications
IR Contact:
Elke Koch
Fabriksgasse 13,
8700 Leoben/Austria
Tel: +43 3842 200 5925
Mobile: +43 676 8955 5925
Fax: +43 3842 200 15909
e.koch@ats.net
www.ats.net

41. Disclaimer
40
This presentation is provided by AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, having its headquarter at Fabriksgasse 13, 8700 Leoben, Austria
(“AT&S”), and the contents are proprietary to AT&S and for information only.
AT&S does not provide any representations or warranties with regard to this presentation or for the correctness and completeness of the statements contained therein,
and no reliance may be placed for any purpose whatsoever on the information contained in this presentation, which has not been independently verified. You are
expressly cautioned not to place undue reliance on this information.
This presentation may contain forward-looking statements which were made on the basis of the information available at the time of preparation and on management‘s
expectations and assumptions. However, such statements are by their very nature subject to known and unknown risks and uncertainties. As a result, actual
developments, results, performance or events may vary significantly from the statements contained explicitly or implicitly herein.
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