Apple iPhone 12 series mmWave 5G Chipset and Antenna

©2021 by System Plus Consulting | SPR21587 – Apple iPhone 12 series mmWave 5G Chipset | Sample 1
22 bd Benoni Goullin
44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr
Apple iPhone 12 series mmWave 5G Chipset
Complete analysis of 5G mmWave chipset from antenna to baseband
SPR21587 – RF report by Stéphane ELISABETH
Laboratory analysis by Nicolas RADUFE & Léo VATANT
February 2021 – Sample
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

Table of Contents
Overview / Introduction 4
o Executive Summary
o Key Take Away
o Reverse Costing Methodology
Company Profile 12
o Apple
o Apple History
o Qualcomm
o 5G mmWave Handset Challenges
o Apple iPhone 12 Pro Teardown
Market Analysis 30
o RF Front-End Module Supply Chain
o Connectivity Market Forecast
o 5G Commercial Rollout Summary
Physical Analysis 34
o Synthesis of the Physical Analysis
Physical Analysis of the Main Board 36
o Main Board 37
✓ Views: Dimensions, Marking, CT Scan
✓ Routing Study
✓ 5G Chipset Bloc Diagram
Physical Analysis of the Digital Components 46
o Baseband Module 48
✓ Package Views: Dimensions, marking, Opening
✓ Package Cross-Section: Dimensions, PCB Substrate
✓ Summary of Physical Data
✓ Die View, Dimensions, Delayering & main Blocs IDs
✓ Die Process & Cross-Section
✓ Die Process Characteristic
o Modulator Die 73
✓ Package Views: Dimensions, marking, Opening
✓ Package Cross-Section: Dimensions, PCB Substrate
✓ Die View, Dimensions, Delayering & main Blocs IDs
✓ Die Process & Cross-Section
Physical Analysis of the mmWave Component 90
o Antenna-on-package SiP 92
✓ Package Views: Dimensions, marking, Opening, Bill of Materials
✓ Package Overview & 3D X-Ray deprocessing: Patch Antenna, Shielding, Routing, Cross-
Section
✓ Package Cross-Section: PCB Substrate, Patch Antenna, Shielding
o Front-End Module SiP 113
✓ Package Views: Dimensions, marking, Opening, Bill of Materials
✓ Package Overview & Cross-Section: PCB Substrate, Shielding
o Antenna SiP active dies 121
✓ Die View & Dimensions
✓ Die Delayering & main Blocs
✓ Die Process: On Board Isolation, Transceiver
✓ Die Cross-Section
o Antenna Systems 159
✓ Package Views & Dimensions
✓ Package Overview & 3D X-Ray deprocessing: Patch Antenna, Shielding, Routing
✓ Package Cross-Section: PCB Substrate, Patch Antenna, Resonator Antenna
Physical Comparison 176
✓ Apple iPhone 12 series Antenna Systems: EIRP, Antenna size
✓ Apple 5G Chipset vs. Qualcomm Second/Third Generation:
Integration, Chipset, Baseband Die, AoP, Transceiver
Manufacturing Process 187
o Synthesis of the main parts
o Baseband Processor, Modulator, Transceiver, PMIC Die Front-End Process & Fabrication Unit
o SiP, FCBGA, AoP, FEM process & Fabrication Unit
Cost Analysis 207
o Synthesis of the cost analysis
o Yields Explanation & Hypotheses 210
o Baseband Processor Module 212
✓ Dies Front-End Cost
✓ Dies Wafer and Die Cost
✓ Baseband SiP Packaging and Component Cost
o Modulator 219
✓ Packaging and Component Cost
o AoP & FEM SiP Packaging 225
✓ AoP & FEM SiP Packaging and Component Cost
o Chipset estimated manufacturer cost 236
Cost Comparison 237
✓ Apple’s System vs. Qualcomm’ 2nd Generation mmWave Chipset :
Baseband, Antenna Module, Chipset
Feedbacks 242
Related Reports 243
Company services 245

Overview / Introduction
o Executive Summary
o Reverse Costing
Methodology
o Glossary
Company Profile
Market Analysis
Physical Analysis
Physical Comparison
ManufacturingProcess Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Feedback
Related Analyses
About System Plus
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the
Apple 5G Chipset: AiP, FEM, Front and Rear Facing antenna, Qualcomm X55M and SMR526.
With a projected Compound Annual Growth Rate (CAGR) of 72 % in shipped units between 2020 and 2025, the 5G market is expected
to be profitable in the next few years. In this context, following competitors like Samsung, Apple has also started to gamble on
mmWave 5G communication. In its latest generation of iPhone, the twelfth, the company decided to implement a 5G mmWave chipset
for US-only models. For this to happen, Apple and Qualcomm made an arrangement despite their previous lawsuit.
Since 2016 no iPhone generation has featured Qualcomm’s components. But this year, Apple has allowed the company to supply 5G
components to enable mmWave communication in US versions of the iPhone Mini, Standard, Pro and Pro Max. All the series features
custom designs for the first time. The chipset in the iPhone 12 series comes with six sub systems spread throughout the smartphone.
The two first Systems-in-Packages (SiPs) in the chain are the baseband processor X55M and the modulator Intermediate Frequency (IF)
circuit, SMR526. Both came from Qualcomm. The other devices are a Front-End Module (FEM) specially designed to work with a rear
and a front facing passive antenna system and an Antenna-on-Package (AoP) at the side.
In this chipset, Qualcomm still supplies the transceiver and the Power Management Integrated Circuit (PMIC) included in the FEM and
the AoP. But Apple has totally rethought the architecture with arrangements like in-house antenna designs, custom Printed Circuit
Board (PCB) substrates for the AoP, and separated FEM and antenna systems. All of this enables 5G communication like every other
smartphone but Apple could integrate more functions with its system, such as human body detection or Machine-to-Machine (M2M)
communication.
This report includes a full investigation of the system, featuring a detailed study of the SiPs, including die analyses, processes and board
cross-sections. It contains a complete cost analysis and a selling price estimation of the system. Finally, it features a light technical
comparison with the latest 5G mmWave AoP and a cost comparison with the second generation of 5G mmWave chipset from
Qualcomm.
Executive Summary

o Executive Summary
o Reverse Costing
Methodology
o Glossary
Company Profile
Market Analysis
Physical Analysis
Physical Comparison
Cost Analysis
Cost Comparison
Feedback
Related Analyses
About System Plus
Note on Chipset
With the Apple iPhone 12 series, we have a discovered a 5G mmWave system like we have never seen before.
The system is built for high-speed communication with human safety consideration all controlled by only one chipset.
For the first time, the mmWave transceiver (RxTx) is separated from the antenna array in the design.
Indeed, this chipset comprise several types of devices: a modem, an intermediate frequency (IF) IC, a front-end module (FEM), two
antenna array and an Antenna-in-Package (AiP).
A mmwave antenna system working on the 28/32 GHz frequency band is implemented at the front. The goal of this device could be
for human safety, to detect any human body and prevent any heavy radiation from the 5G mmWave communication system or for
Machine to Machine (M2M) or Device to device (D2D) communication. This system uses antenna on flex design controlled by a FEM
packaged by Murata that also controlled the radiation of the rear facing antenna used for mmWave communication. The rear facing
antenna is simply a system of 16 passive antenna built on an 8-layer PCB substrate with only 10 % of the bumps linked to the main
board.
At the side, a traditional AiP is integrated in the frame for side communication. This AiP is very similar to Qualcomm’s devices
(QTM525 and QTM535). The only differences are in the size and the antenna design. By using USI or Murata for the packaging, Apple
managed to lower the width by 12 points and the length by 7 points with the same z-height compared the last QTM535 from
Qualcomm. Although, a question remains, why only half of the I/O is used on the RxTx?
Finally, first X-ray observations has given the identity of the internal integrated circuit (IC) implemented in the design. And in fact,
Qualcomm has a total design win in the Apple iPhone 12 series. The Modem, and the IF IC is clearly supply by Qualcomm. But the
RxTx and the power management IC (PMICs) are also supply by Qualcomm. Moreover, the RxTx and the PMIC seems to be exactly
the same as the one implemented in the QTM525 and even in the QTM535. Finally, we could say that the impact of this supply chain
is more on the packaging manufacturer.
Indeed, for the QTM535 or QTM525, SPIL and Amkor was involved in the supply chain, which is not the case here. They have been
replaced by USI and Murata, which are historical packaging supplier for Apple.

Company Profile
o Apple
o Qualcomm
o 5G technology
o 5G mmWave challenges
o 5G mmWave configuration
o Apple iPhone 12 Pro Teardown
Market Analysis
Physical Analysis
Physical Comparison
Cost Analysis
Cost Comparison
Feedback
Related Analyses
About System Plus
Apple iPhone 12 Pro Teardown
Apple iPhone 12 Pro – X-Ray View
©2021 by System Plus Consulting
5G AntennaModule
5G PassiveAntenna
5G PassiveAntenna

Company Profile & Supply Chain
Market Analysis
Physical Analysis
o Board Analysis
▪ Overview
▪ CT Scan
▪ Bloc Diagram
o Digital Components
▪ Baseband Processor
▪ Modulator
o mmWave Components
▪ AoP: Overview, X-Ray,
Package Cross-Section
▪ FEM: Overview, Package
Cross-Section
▪ Transceiver and PMIC Dies
▪ Antenna Systems
Physical Comparison
Cost Analysis
Cost Comparison
Feedbacks
About System Plus
Physical Analysis Methodology
Board
analysis
CT Scan
Bloc Diagram Estimation
Digital
Component
analysis
Baseband Processor
Package & Die Analysis
Modulator
Package & Die Analysis
mmWave
Component
analysis
AiP
Package & Dies Analysis
Passive Antenna systems
Package Analysis

Company Profile
Market Analysis
Physical Analysis
o Board Analysis
▪ Overview
▪ CT Scan
▪ Bloc Diagram
▪ Modulator
o mmWave Components
Cross-Section
▪ Transceiver and PMIC
Dies
▪ Antenna Systems
Physical Comparison
Cost Analysis
Cost Comparison
Feedback
Related Analyses
About System Plus
Main Board CT Scan
Layer #1
Main Board – Top, and Bottom view
Main Board – X-Ray view
IF Circuit
5G mmWave FEM
F2B Connector
RxTx Circuit
PMIC Circuit

Company Profile
Market Analysis
Physical Analysis
o Board Analysis
▪ Overview
▪ CT Scan
▪ Bloc Diagram
▪ Modulator
o mmWave Components
Cross-Section
Dies
▪ Antenna Systems
Physical Comparison
Cost Analysis
Cost Comparison
Feedback
Related Analyses
About System Plus
Baseband Processor Module – Modem Die Process – FinFET Transistor

Company Profile
Market Analysis
Physical Analysis
o Board Analysis
▪ Overview
▪ CT Scan
▪ Bloc Diagram
▪ Modulator
o mmWave Components
Cross-Section
Dies
▪ Antenna Systems
Physical Comparison
Cost Analysis
Cost Comparison
Feedback
Related Analyses
About System Plus
Modulator – Die Overview

Company Profile
Market Analysis
Physical Analysis
o Board Analysis
▪ Overview
▪ CT Scan
▪ Bloc Diagram
▪ Modulator
o mmWave Components
Cross-Section
Dies
▪ Antenna Systems
Physical Comparison
Cost Analysis
Cost Comparison
Feedback
Related Analyses
About System Plus
Antenna Module – Package X-Ray View – PCB Substrate – Antenna
Package Overview – Antenna Structure

Company Profile
Market Analysis
Physical Analysis
o Board Analysis
▪ Overview
▪ CT Scan
▪ Bloc Diagram
▪ Modulator
o mmWave Components
Cross-Section
Dies
▪ Antenna Systems
Physical Comparison
Cost Analysis
Cost Comparison
Feedback
Related Analyses
About System Plus
mmWave FEM – Package Cross-Section
Package Top/Bottom View
Package Cross-Section – Optical View
• Package Total Thickness (Without Balls): XX µm
• Molding Thickness: XX µm
• PCB Thickness: XX µm
• The module has a X-layer PCB substrate.
• The PMIC and the RxTx are soldered on the PCB substrate.

Company Profile
Market Analysis
Physical Analysis
o Board Analysis
▪ Overview
▪ CT Scan
▪ Bloc Diagram
▪ Modulator
o mmWave Components
Cross-Section
Dies
▪ Antenna Systems
Physical Comparison
Cost Analysis
Cost Comparison
Feedback
Related Analyses
About System Plus
Transceiver Die Overview

Company Profile
Market Analysis
Physical Analysis
o Board Analysis
▪ Overview
▪ CT Scan
▪ Bloc Diagram
▪ Modulator
o mmWave Components
Cross-Section
Dies
▪ Antenna Systems
Physical Comparison
Cost Analysis
Cost Comparison
Feedback
Related Analyses
About System Plus
Rear facing Antenna System – CT Scan – Antenna

Company Profile
Market Analysis
Physical Analysis
o Board Analysis
▪ Overview
▪ CT Scan
▪ Bloc Diagram
▪ Modulator
o mmWave Components
Cross-Section
Dies
▪ Antenna Systems
Physical Comparison
Cost Analysis
Cost Comparison
Feedback
Related Analyses
About System Plus
Front facing Antenna System – Cross-Section
XX mm XX mm
XX mm
XX mm
XX mm
Dielectric
Material
Copper
Electrode
Plastic
Support
Hole
Metal Ankor
X-Layer Flex PCB Substrate
Component Cross-Section Plan – Top view
XX mm

Company Profile
Market Analysis
Physical Analysis
Physical Comparison
o Apple vs.Qualcomm’ 2nd.
Gen.
Cost Analysis
Cost Comparison
Feedback
Related Analyses
About System Plus
Apple iPhone 12 Series Antenna Systems
• Based on FCC data, estimation of radiative power can be study to give an idea of application of each radiative system in the chipset.
EIRP measurement and simulation of antenna systems
FCC Certification

Company Profile
Market Analysis
Physical Analysis
Physical Comparison
Gen.
Cost Analysis
Cost Comparison
Feedback
Related Analyses
About System Plus
Apple 5G Chipset vs. Qualcomm Second/Third Generation – Integration
Samsung Galaxy S20 Ultra 5G
Opening View
Samsung Galaxy S21 Ultra 5G
X-Ray View
Apple iPhone 12 Pro X-Ray View

Company Profile
Market Analysis
Physical Analysis
Physical Comparison
Gen.
Cost Analysis
Cost Comparison
Feedback
Related Analyses
About System Plus
Apple 5G Chipset vs. Qualcomm Second/Third Generation – Chipset
V1 – RxTx + PMIC
AoP
V2 – RxTx + PMIC
2x AoP
Modem + Memory
SiP
Modulator
FCBGA
Qualcomm’s Second Gen. Qualcomm’s Third Gen. Apple’s First Gen.
Modulator
FCBGA
Modem + Memory
SiP
Modulator
FCBGA
RxTx + PMIC
2x AoP
RxTx + PMIC
AoP
Passive
Antenna
Passive
Antenna
RxTx + PMIC
Front-End Module

Company Profile
Market Analysis
Physical Analysis
Physical Comparison
Cost Analysis
o Cost Analysis Summary
o Yields Explanation &
Hypotheses
o Baseband Processor
Component Cost
o Modulator Component Cost
o Transceiver/PMIC FE Cost &
Wafer/Die Cost
o AoP & FEM SiP Packaging Cost
o AoP & FEM SiP Component Cost
o 5G Chipset Cost Estimation
Cost Comparison
Feedback
Related Analyses
About System Plus
Baseband Processor Module – Modem Front-End Cost

Company Profile
Market Analysis
Physical Analysis
Physical Comparison
Cost Analysis
Hypotheses
Component Cost
Wafer/Die Cost
Cost Comparison
Feedback
Related Analyses
About System Plus
Modulator Packaging Cost

Company Profile
Market Analysis
Physical Analysis
Physical Comparison
Cost Analysis
Hypotheses
Component Cost
Wafer/Die Cost
Cost Comparison
Feedback
Related Analyses
About System Plus
Antenna Module & FEM – Transceiver Front-End Cost

Company Profile
Market Analysis
Physical Analysis
Physical Comparison
Cost Analysis
Hypotheses
Component Cost
Wafer/Die Cost
Cost Comparison
Feedback
Related Analyses
About System Plus
Antenna Module & FEM – Bill-of-Material Cost

Company Profile
Market Analysis
Physical Analysis
Physical Comparison
Cost Analysis
Hypotheses
Component Cost
Wafer/Die Cost
Cost Comparison
Feedback
Related Analyses
About System Plus
Chipset estimated Manufacturer Cost

Company Profile
Market Analysis
Physical Analysis
Physical Comparison
Cost Analysis
Cost Comparison
o Apple Vs. Qualcomm’ 2nd
Gen.
Feedback
Related Analyses
About System Plus
Qualcomm’s First vs. Second Generation mmWave Chipset

R E L A T E D
A N A L Y S E S
R E L A T E D
A N A L Y S E S

Company Profile
Market Analysis
Physical Analysis
Physical Comparison
Cost Analysis
Cost Comparison
Feedback
Related Analyses
About System Plus
Related Analyses
25
TEARDOWNTRACKS
REVERSE COSTINGREPORTS
By System Plus Consulting:
• Qualcomm’s Second 5G
mmWave Chipset: SDX55M and
QTM525
• Qualcomm’s First 5G mmWave
Chipset: SDX50M and QTM052
• Mediatek Autus R10 (MT2706)
77/79 GHz eWLB/AiP Radar
Chipset
By Yole Développement:
• 5G’s Impact on RF Front-End and
Connectivity for Cellphones 2020
• System-in-Package Technology
and Market Trends 2020
By System Plus Consulting:
• Consumer Track – Phone

COMPANY
SERVICES
COMPANY
SERVICES

Company Profile
Market Analysis
Physical Analysis
Physical Comparison
Cost Analysis
Cost Comparison
Feedback
Related Analyses
About System Plus
o Company services
o Contact
A Structure, Process and Cost Analysis
Reverse Costing® consists in disassembling a device or a system, in order
to identify its technology and determine its manufacturing processes and
cost, using in-house models and tools.
Our Core Activity : The Reverse Costing®

Company Profile
Market Analysis
Physical Analysis
Physical Comparison
Cost Analysis
Cost Comparison
Feedback
Related Analyses
About System Plus
o Company services
o Contact
Fields Of Expertise

Company Profile
Market Analysis
Physical Analysis
Physical Comparison
Cost Analysis
Cost Comparison
Feedback
Related Analyses
About System Plus
o Company services
o Contact
Business Model
29
Teardown
Track
205+
teardowns per
year
Monitor
1 per year
quarterly
updated
Custom
Analysis
150 custom
analyses per
year
Report
60+ per year
Costing
Tools
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and 3 parametric
costing tools
Cost
Methods
Training
On demand

Company Profile
Market Analysis
Physical Analysis
Physical Comparison
Cost Analysis
Cost Comparison
Feedback
Related Analyses
About System Plus
o Company services
o Contact
Worldwide presence
100+ collaborators in 8 different countries
Headquarters
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Company Profile
Market Analysis
Physical Analysis
Physical Comparison
Cost Analysis
Cost Comparison
Feedback
Related Analyses
About System Plus
o Company services
o Contact
Contact
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