Jeffrey A. Smith is a PhD student in electrical engineering at the University of Notre Dame. He received bachelor's degrees in physics and mathematics from Clarkson University, where he has worked as an undergraduate teaching assistant and tutor. His research focuses on semiconductor physics, CMOS IC design, and electro-thermal modeling of integrated circuits. He has published one journal article and presented his work at several conferences.

1. Jeffrey A. Smith
LOCAL ADDRESS
P.O. Box 6091
10 Clarkson Ave.
Potsdam, NY 13699-6091
jeasmith@clarkson.edu
PERMANENT ADDRESS
503 Deerwood Rd.
Utica, NY 13502-2017
(315) 733-0225
icepik38@gmail.com
Research Interests
Semiconductor Physics, CMOS IC Design, Electro-thermal modeling of ICs.
Education
University of Notre Dame, South Bend, IN
Ph. D., Electrical Engineering May 2020 (expected)
Clarkson University, Potsdam, NY
Bachelor’s of Science in Physics May 2015
Bachelor’s of Science in Mathematics May 2015
Minor in Electrical Engineering
Cumulative G.P.A.: 3.864/4.000
Teaching Experience
Undergraduate TA Clarkson University Math and Physics Depts. August 2012 - Present
Led one weekly recitation reviewing the material covered in lecture for Differential Equations, Physics
I (Spring 2013, 2014) and Physics II (Fall 2013, 2014). Duties include holding office hours, grading
homework and exams and leading a bi-weekly physics lab course. Graded homework and tests for
Electromagnetic Theory I, Thermal Physics and Quantum Physics I courses (2013-2015).
Tutoring Clarkson University Student Success Center February - December 2012
Tutored students on the concepts covered in Calculus I/II/III, Differential Equations, Physics I/II
and Chemistry I/II. Duties include holding a weekly one hour group session for students and a four
hour weekly drop-in tutoring session.
Research Experience
McNair Scholar’s Program Clarkson University May 2012 - Present
• Dynamic Electro-thermal Modeling of FinFET Devices
February 2014 - Present
Coupled developed steady-state thermal models for single fin FinFET structures with FinFET
electronic models to perform electro-thermal simulation. Current research also includes ex-
traction of thermal capacitance to study signal propagation delay time induced by self-heating
effects in FinFET digital logic devices.
• A Physics-based Thermal Model for Multi-gate Field Effect Transistors
June - November 2013
Used finite element simulations to construct and verify the accuracy of a proposed thermal
model on the single and multi-gate FinFET structures.
• Simulation of Quantum Well Structures in 3rd
-Generation PVs
May - August 2012
Simulated InGaAs PIN-diodes to study the quantum mechanical phenomena associated with
interband and subband transistions in photovoltaic materials.
Publications
1. M.-C. Cheng, J.A. Smith, W. Jia, and R. Coleman, ”An Effective Thermal Model for FinFET
Structure,” IEEE Trans. on Electron Devices, vol. 61, pp. 202-206, January 2014.

2. Conference Presentations
1. Jeffrey A. Smith and Ming-C. Cheng, ”A Physics-based Thermal Model for Dynamic Electro-
thermal Simulation of FinFET Devices,” IMPETUS Clarkson Discovery Challenge Undergrad-
uate Research Category, February 25, 2015, Clarkson University, Potsdam, NY, USA.
2. Jeffrey A. Smith and Ming-C. Cheng, ”A Physics-based Thermal Model for Dynamic Electro-
thermal Simulation of FinFET Devices,” St. Lawrence County College Career Symposium,
January 31, 2015, Clarkson University, Potsdam, NY, USA.
3. Jeffrey A. Smith and Ming-C. Cheng, ”A Physics-based Thermal Model for Dynamic Electro-
thermal Simulation of FinFET Devices,” Symposium for Undergraduate Research Experiences
(SURE), July 31, 2014, Clarkson University, Potsdam, NY, USA.
4. Jeffrey A. Smith, Ming-C. Cheng, ”A Physics-based Thermal Model for Dynamic Electro-
thermal Simulation of FinFET Devices,” University at Buffalo National McNair Scholars’
Conference, July 23-27, 2014, Buffalo, NY, USA.
5. Jeffrey A. Smith, Wangkun Jia and Ming-C. Cheng, ”A Physics-based Compact Thermal
Model for Single and Multi-gate Field Effect Transistor Structures,” 14th InterSociety Conf.
on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2014), pp.
18-25, May 27-30, 2014, Orlando, FL, USA.
6. Jeffrey A. Smith and Ming-C. Cheng, ”A Physics-based Thermal Model for Multi-gate Field
Effect Transistor Structures,” Mathematics Conference of Northern New York, February 28,
2014, Clarkson University, Potsdam, NY, USA.
7. Jeffrey A. Smith and Ming-C. Cheng, ”A Physics-based Thermal Circuit Model for Multi-
gate Field Effect Transistor Structures,” Symposium for Undergraduate Research Experiences
(SURE), August 1, 2013, Clarkson University, Potsdam, NY, USA.
8. Jeffrey A. Smith and Ming-C. Cheng, ”A Physics-based Thermal Circuit Model for Multi-gate
Field Effect Transistor Structures,” University at Buffalo National McNair Scholars’ Confer-
ence, July 10-14, 2013, Buffalo, NY, USA.
9. Jeffrey A. Smith and Ming-C. Cheng, ”Effective Thermal Modeling of FinFETs,” Symposium
for Undergraduate Research Experiences (SURE), April 13, 2013, Clarkson University, Pots-
dam, NY, USA.
10. Jeffrey A. Smith and Ming-C. Cheng, ”Simulation and Application of Quantum Well Struc-
tures in 3rd
Generation Photovoltaics,” McNair Scholar’s Conference of Northern NY at St.
Lawrence University, February 1, 2013, Canton, NY, USA.
11. Jeffrey A. Smith and Ming-C. Cheng, ”Simulation and Application of Quantum Well Struc-
tures in 3rd
Generation Photovoltaics,” Symposium for Undergraduate Research Experiences
(SURE), August 2, 2012, Clarkson University, Potsdam, NY, USA.
12. Jeffrey A. Smith and Ming-C. Cheng, ”Simulation and Application of Quantum Well Structures
in 3rd
Generation Photovoltaics,” University at Buffalo National McNair Scholars’ Conference,
July 18-22, 2012, Buffalo, NY, USA.
Computer Skills
• Knowledgeable in using Autodesk Inventor, AutoCAD, ANSYS APDL, LTSPICE, MATLAB,
Maple, Minitab, Xilinx PlanAhead and Nextnano3
for simulations and data fitting.
• Extensive experience using LATEX and Microsoft Office for professional presentations.
Activities
Student Member, American Physical Society August 2013 - Present
Student Member, Society for Industrial and Applied Mathematics January 2012 - Present
Physics Club Treasurer September 2011 - May 2012

3. Honors
Dean’s Fellowship, University of Notre Dame, Electrical Engineering Dept. March 2015
Honorable Mention, Mechanical/Electrical Engineering Poster Category, SURE August 2014
Teaching Assistant Recognition Award, Dept. of Physics, Clarkson University June 2014
Honorable Mention, Barry M. Goldwater Scholarship March 2014
Donald Clark Memorial Scholarship, Clarkson University October 2013
Best Poster, Computation and Modeling Poster Category, SURE August 2013
Inductee, Pi Mu Epsilon Mathematics Honor Society April 2013
Honorable Mention, Environmental Issues Poster Category, SURE August 2012
Presidential Scholar, Clarkson University, 5/7 semesters.
Selected Work Experience
Sales Representative Vector Marketing, Inc., Utica, NY July 2011 - April 2012
Presented applications of CutCo Cutlery to prospective clientel. Duties included book-keeping,
management of collected funds and the scheduling of appointments with prospective customers.
Attended local and national conferences for Vector Marketing, Inc.