Raju Biswas has over 10 years of experience in embedded systems software development. He currently works as a Technical Lead at Samsung R&D Institute India in Bangalore. Prior to this, he worked at Broadcom Communication Technologies, Harman International India, and Wipro Technologies in roles involving embedded software development. He has expertise in areas like embedded Linux, device driver development, and working with RTOS platforms.

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Raju Biswas
No # 60, SLV Temple Road, Mangammanapalya, Bommanahalli, Bangalore - 68
E-mail id: biswas.raju@gmail.com Phone +91- 8861436939
PROFESSIONAL EXPERIENCE:
Over 10 years of Semiconductor Industry experience in Embedded Systems Software.
Currently working with Samsung R&D Institute India, Bangalore (SRI - B) designated as Technical Lead since
09th December 2013 - till date.
Worked with Broadcom Communication Technologies Pvt Ltd, Bangalore designated as Engineer Staff II from
14th
December 2011 till 08th
November 2013.
Worked with Harman International India (Pvt) Ltd, Bangalore designated as Senior Engineer I from 19th
April
2010 till 12th
December 2011 and also undergone training program in Harman, Karlsbad, Germany for 1 month.
Worked with Wipro Technologies Ltd, Bangalore designated as Project Engineer from 21st
August 2006 till 16th
April 2010.
Experience mainly in the areas of Embedded Systems Software which includes device driver development in Linux
and RTOS (QNX & RTXC) platforms, development of Board Support Package, working with boot loaders (u-boot ,
propitiatory boot loader) , good in Linux kernel up-gradation & Linux porting, Linux kernel debugging, hands on
experience of development and testing on various ARM , SHARC customized boards for automotive telematics
applications.
Experience working on Mobile software platform which includes device driver development in Linux for Audio
driver in ALSA SOC and ALSA PCM Interface, debugging with various kernel tools, Audio driver bring up activity
on FPGA Platform and on mobile platform hardware, worked on various kernel enhancement based on customer
requirements, debugging and successfully solving various customer related issues on various Broadcom mobile
platforms.
Experience of working on commercialization project on Mobile software platform on customized Samsung board
which includes working on various kernel enhancements ,debugging and successfully solving various issues to
achieve productization. Experience of working on boot loader enhancements for customized Samsung boot loader.
Experience of end to end design and development of generic secondary boot loader for firmware download using
customized protocol for IoT product.
Quick learner and desire to master in embedded system software development. Proactive team player with excellent
communication and interpersonal skills. Hard working nature and patience to solve any kind of problem
Experience of working on multiple projects.

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CAREER OBJECTIVE:
Seeking a software research or development position to apply my knowledge in the area of System Design and
Embedded Systems.
SUMMARY:
 Total experience in software research, design and development: Over 10 years.
 Proficient in C, RTOS (QNX) and Embedded Linux and having good knowledge of software architectures.
 Experience of working on Audio Mobile Platform Software for various Broadcom customized hardware.
 Experience of working on BSP (Kernel and Boot loader) on Samsung Platforms Software for commercialization
project.
 Experience of working on Firmware down loader for IoT products.
 Having good knowledge of embedded development and expertise on device driver development and low level
drivers on RTOS and Embedded Linux for various embedded products like ECU in Car Infotainment
Automotives systems having customized ARM and SHARC boards. Projects executed for clients who are global
leaders in automotive based in USA, Europe.
 Experience of working on standard protocols as SPI, I2C,I2S
 Good work experience of standard software process during requirements analysis, preparation of designs
specifications, review process, coding, unit testing and system integration testing phases.
 Hands on experience on various Hardware Debuggers, Emulators, Oscilloscope.
 Experience in debugging low level embedded software in a real-time, embedded, multi-processor environment.
 Proactively took up a few software activities to simplify the repetitive processes.
 Conduct/attend knowledge sharing sessions on different technologies
 Strong qualitative analysis, problem analysis and resolution skills.
 Worked as an individual contributor and take responsibility to satisfy customers.
AREA OF INTEREST:
 Embedded Linux ,Device driver development
 C Programming Language, Operating System Concepts
SKILL SETS:
 Programming Languages and framework:
o C, Assembly Language
o Metrowerks CodeWarrior IDE v5.1 ,VmWare
o Rational Clear Case , Rational Clear Quest ( Software Configuration Management )
o Image Base Language - v7 , GNU Tools
o Analog Devices Visual DSP ++ v5.0 IDDE , QNX Momentics Tool Suite v6.5
o Elvis , Perforce ( Software Configuration Management )
o Audacity , Cross Platform Sound Editor
o GIT , Source Insight, Broadcom Tools , Samsung Internal Tools
o Kernel debugging tools.

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 Processor Architecture:
o Power PC ( MPC52xx )
o ARM (i.MX35 processor with ARM1136 as core )
o SHARC ADSP 21469
o ST ConneXt
o Dual Core Broadcom BB SOC
o Intel Atom
 Platform:
o Unix, Linux
o Knowledge of Unix internals & Linux drivers
 RTOS:
o RTXC (Real Time Execution in C)
o Device Driver development on RTXC / Linux (Embedded Linux )
o Linux porting , Linux Kernel upgradation
o QNX Neutrino RTOS
 Device Drivers:
o MPC52xx SPI Controller Driver in Linux
o DIO driver for customized MPC52xx board in Linux
o External Watchdog Driver in Linux
o BTCS ( Boot time Critical Services ) Misc driver in Linux
o MAX7325 I2C Port Expander Driver.
o I2C Library for TI Jacinto and ST-ConneXt in QNX.
o Audio Routing on SHARC ADSP 21469.
o Power Monitor utility to notify USB and USB HUB over current in QNX to applications.
o Audio driver with ALSA and ALSA SoC Interface.
 Interface Standards:
o I2C , SPI , I2S
 Debugger:
o JTAG (BDI 2000 )
o Analog Devices ICE
 Domain knowledge:
o MOST, Automotive Domain , Mobile Platform
EDUCATION:
 P G Diploma in Embedded System Design from Doeacc Centre (formally CEDTI) ,NIT ,Calicut
[http://calicut.nielit.gov.in/ ] with 79.04 % in Aug 2006
 Base Module, (Certificate Course) from North Eastern Regional Institute of Science and Technology, Deemed
University [ http://www.nerist.ac.in/ ] with 87.6 % in May 2001.
 XII standard from Assam Higher Secondary Education Council, Guwahati with 70.2 % in June 1999
 B.Tech in Electronics & Communication Engineering from North Eastern Regional Institute of Science and
Technology, Deemed University [ http://www.nerist.ac.in/ ] with 77.4 % in May 2005.

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 X standard ( HSLC ) from Board of Secondary Education , Assam with 69.44 % in June 1997
ACHIEVEMENT AND AWARDS:
 Selected for recruitment by Wipro Technologies, Bangalore in the very first campus interview.
 Has successfully cleared the FCG C 101 with 70 %, FCG C 201 with 74 %,Veloci – Q 101, Review and Testing,
Rational Clear Case conducted by Wipro Technologies.
 Received “Feather in my Cap” award from Wipro Technologies for Customer Satisfaction and project
contribution.
 Won the best project prize in the whole Embedded System Group during PG Course.
 Got merit certificate from National Cadet Corps NCC, NERIST during B.Tech
 Has completed Emergency Response Team (ERT) by Wipro Technologies after undergoing training in Fire
fighting and safety aids that could help save lives.
 Have attended trainings in Wipro on Communication Skills, Linux Device drivers, Board Bring Up.
 Had Training for initial 3 months on Embedded Boot Design in Wipro Technologies.
 Have attended trainings in Harman International on Behavioral and Communication Skills, QNX Operating
System, Team Building Skills.
 Had successfully organized “Programming Contest” in Technical festival at Harman International.
 Received participation certification in White paper Contest organized at Harman International.
 Received “Spot Awards” multiple times for project achievements and contribution at Broadcom.
 Has undergone training on “Linux Driver Development” and “ARM” at Broadcom.
 Has attended training on “Samsung Process Compliance” at Samsung.
 Received “Employee of the Month” award for outstanding contribution at Samsung.
WORK EXPERIENCE (PROJECT PROFILE):
COMPANY: Samsung R&D Institute, Bangalore, (09th December 2013 – till date)
GROUP: Samsung AP R&D System
Samsung R&D Institute, Bangalore is a product based company and is a global leader in mobile and electronics
products. AP R&D system is one of mobile division which provides complete mobile solution on Android and
other platforms on various SoC
A Global leader in Mobile and Electronics based in Korea December 2013 to till date
Title: Samsung Mobile Platforms
Description: Samsung customized mobile which provided complete mobile product. Samsung is responsible for
end to end commercialization of products, based on market requirements. Various smart phone / tablet are
developed on various mobile platforms. It is targeted for Mobile / Tablet customers worldwide.
Team Size: 03
Role: Part of the BSP team in the mobile platform group and responsible for working mainly on Linux Kernel and
Boot loader.
a) Involved in parallel download implementation in boot loader on x86 SMP architectures.
b) Worked in fixing various issues at different stages of the project to achieve commercialization.
c) Involved in kernel porting and integration for different Android upgrades.

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d) Worked on LTP and benchmarking tool integration to Samsung Test Platform.
e) Worked on secondary boot loader development for firmware download for IoT platform
f) Involved on fixing various issues as well as implementation of new features related to battery module on
Android platforms.
Skills: C, device driver development and debugging, Linux
COMPANY: Broadcom Communication Technologies Pvt Ltd, (14th December 2011 – 08th
Nov 2013)
GROUP: Broadcom Mobile Platform Software Division
Broadcom Communications Technologies Pvt Ltd is a product based company and is a global leader in
semiconductor solutions for wired and wireless solution. Broadcom Mobile Platform Software is a mobile
division which provides complete mobile solution on Android platforms.
A Global leader in Semiconductor based in US December 2011 to Nov 2013
Title: Rhea / Hawaii / Java Broadcom Platforms
Description: Rhea / Hawaii and Java are Broadcom based complete mobile platform. Broadcom is responsible for
end to end product, based on the customer requirements. It is a smart phone developed on Android based
platform. It is targeted for Mobile users worldwide.
Team Size: 13
Role: Part of the Audio team in the mobile platform group and responsible for working mainly on Linux Kernel
and the Audio software.
a) Involved in the Linux kernel audio driver development on ALSA PCM Interface and ALSA SoC Interface.
b) Involved in fixing customer related issues and audio related issues.
c) Involved in various kernel enhancements which includes audio data dumping for Music and Voice Call,
Implementation of BT grouping, Stereo Music and Voice Call on Speaker, setting audio gains based on
audio profiles, various audio driver kernel enhancements, multiple recording feature , implementation of
device tree for audio driver.
d) Audio bring-up during broad bring up activity on FPGA and later on the hardware.
e) Worked on various kernel tools for debugging features to fix audio issues.
f) Involved on writing ALSA Plugins.
Skills: C, device driver development and debugging, Linux.
COMPANY: Harman International India Pvt Ltd, Bangalore (19th April 2010 – 12th December 2011)
GROUP: Harman Becker Automotive Division
Harman International India Private Limited is a product based company in diversified technology and
manufacturing leader, serving customers worldwide with Audio technologies for home, professional and
automotive domains. The Harman Becker Automotive Systems (HBAS) is automotive division of Harman
International provides car infotainment solutions worldwide.
A Global leader in Automotive Systems based in Europe April 2011 to till date
Title: JLR
Description: JLR is an audio Amplifier is used in cars as an audio entertainment device. This product is ECU

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connected in-car entertainment system’s head unit to amplify the audio signal. Audio amplifier is capable of
amplifying audio source devices like MTP/iPOD players, Mic in the car entertainment systems. The amplifier is
connected and controlled by head unit via MOST networks. It is targeted mainly for European car markets.
Team Size: 02
Role: Involved in the design of audio routing engine on SHARC ADSP 21469.
a) It involves understanding the Audio routing possibilities which had various sources and drains in the product
having 4 ADSP - 21469.
b) Involved in design, development and testing of the SHARC digital audio interface from scratch. It includes
receiving audio (TDM) data from various sources by implementation of ping pong DMA buffer mechanism and
then putting the data in proper format to possible sinks which in turn goes to the speaker/headphones.
c) It also includes sending bit patterns and sinus tones from input present at the RAM to various TDM channels
and then checking the patterns in the Oscilloscope and sine tone to the speakers.
d) Develop a BIOS interface to test the audio routing which in turn is to be used in production phase to test the
boards. The project is on-going on.
Skills: C, low level driver development.
A Global leader in Automotive Systems based in Europe April 2010 to Feb 2011
Title: NBT / NTG5
Description: NBT is Electronic Control Unit (ECU) based on QNX platform having dual processor Intel and TI-
Jacinto. It has various capabilities which include graphics infrastructure, media broadcast, media processing,
online services, connectivity, speech, navigation, driver assistance. It enables control from car head unit via
MOST communication protocol. It is targeted mainly for European car markets.
Team Size: 04
Role:
a) Involved in development, debugging testing of power monitor utility to notify over current / cleared condition
in USB root port and USB HUB port connected to USB port. The driver was developed in QNX driver
framework.
b) It involves unit testing on multi-client environment and various possible unit test scenarios.
c) Involved in design of the software architecture of I2C library which can be directly accessed by the I2C
applications / slaves. It includes development of the I2C low level driver on Intel and TI- Jacinto architecture
using DMA. The library interface was developed on top of that which will be accessed by the I2C applications /
slaves. The design was made to work with multiple I2C bus interface having multiple I2C slaves on each bus.
Skills: C, low level driver development, QNX
COMPANY: Wipro Technologies, Bangalore (21st August 2006 – 16th April 2010)
GROUP: Wipro Automotive Division
Wipro Technologies Ltd. is a leading IT service provider to deliver wide range of technology and business
solutions and services, providing low-cost software development and faster time to market for thousands of
diverse customer applications worldwide

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A Global leader in Automotive Systems based in USA May 2007 to April 2010
Title: UCI2
Description: UCI is Electronic Control Unit (ECU) capable of connecting Apple iPod, USB Mass Storage
Devices, MTP-based Mobile Music Players devices to the car entertainment system’s head unit. UCI box enables
control of the above discussed devices from car head unit via MOST communication protocol. Apple’s iPod
devices are connected over RS-232 and USB. UCI provides playback and browsing functionality of Consumer
Electronic devices (like Apple’s iPod, MSC USB and MTP device). It is targeted mainly for European car
markets.
It has open source and off the shelf components. Develop the foundational software distribution with off the shelf
components including Open Source and Third Party.
Team Size: 05
Role:
a) Involved in the development, testing and validation of Electrical and Diagnostic Wakeup Pulse which
included a BTCS package addition, BTCS driver in kernel and BTCS included u-boot.
b) Involved in the driver development, debugging, testing and of NAND Flash Driver, MAX7325 I2C Port
Expander Driver, External Watchdog Driver for customized ARM (i.MX35 processor ARM1136 core) in
Linux platform (linux-2.6.24).
Skills: C, Device driver in Linux, Embedded Linux, GNU Tools.
Title: CSP
Description: The objective of this project is supporting existing products/customers and be extend able to add new
features It has open source and off the shelf components. Develop the foundational software distribution with off
the shelf components including Open Source and Third Party.
Team Size: 03
Role: Involved in the complete driver development, debugging and testing for MPC52xx SPI Controller Driver in
Linux and DIO driver for customized MPC52xx board in Linux (linux-2.6.24).
Skills: C, Device driver in Linux, Embedded Linux, GNU Tools.
Title: BSP/BL
Description: The purpose of BSP/BL is to provide development and support for software components which
form part of the BSP and Boot Loader functionality. This contains the BSP drivers, BSP Services and
configurations according to the customer requirements. The BSP/BL component includes the following core
components.
• BSP Drivers Library • BSP Services • BL engine • Re-flash methods and solutions • Pass-Through Audio
subsystems
Team Size: 03
Role: Involved working on various driver modules and broadly contributed in bug fixing activity of NAND
(K9F5608xxx) flash driver in RTXC.
Skills: Code Warrior, C, RTXC, Real-time debugging, GNU Tools

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Title: Linux to be ported on ARM9 processor along with the application (B Sample)
Description The objective of this project was to bring up the board using customized Linux Porting of Linux in
ARM 9 Processor.
Team Size: 03
Role: Involved in building an Embedded Linux which involved building a GNU/Linux ARM Tool Chain and
porting of Linux kernel (linux-2.6.10) to ARM 9 Platform.
Skills: Linux kernel, ARM9 (at91rm9200ek)
A Global leader in Semiconductor Devices in Europe Dec 2006 to May 2007
Title: Characterization of Padlib Test Chip I/O
Description: The objective of this project was to Test the I/O Test Chip in Teradyne Catalyst ATE and to deliver
Characterization across different samples. It involved understanding the device specification; test algorithm and
test program and do characterization of the I/O Test Chip
Team Size: 05
Role: Involved in the flow of the characterization of Test Chip I/O in development of test plan, Post and Pre ESD
Test, Characterisation of the Chip
Skills: Teradyne Image Tool, Image Base Language in Solaris
INTRESTS AND ABOUT MYSELF:
 Father’s Name: Late Kamal Biswas
 Date of Birth: March 07, 1981
 Sex: Male
 Marital Status Married
 Nationality & Religion: Indian, Hindu
 Language Known: English, Bengali , Hindi & Assamese
 Strengths: Dedication towards responsibilities, Hardworking nature
Adaptability to all situations, Great Team player.
 Passport No: G8550068 (Expire Date 07/05/2018) , Bangalore (Has US B1 Visa)
 References: Furnished upon request
I am self-motivated and proactive, good in communication skill. Have the ability to share knowledge and mentor team
members. I hereby declare that the information furnished above is true and correct to the best of my knowledge and belief.
Many Thanks,
Raju Biswas