This document discusses two projects: 1. Reducing the broken panel rate during the electroplating process by adjusting the width of the masking tape and rotating panels from the outer area to the center during rework to avoid broken panels. 2. Developing an internal nickel plating solution to reduce costs by designing an experiment that tests different concentrations of nickel chloride, nickel sulfamate, and boric acid and calculates the nickel concentration in the solution. The internal chemicals test reduced costs by 99.39% compared to sending chemicals to Murata Japan.