To request a copy of a paper, please just email me the titie and number.

1. RICHARD R. LATHROP JR.
104 Wilson Circle Home: (610) 594-8229
Exton, PA 19341 rlathrop2@verizon.net
ARTICLES, PUBLICATIONS & PRESENTATIONS
1. “c-Si Metallization Paste Rheology and Print Metrology Techniques for Achieving and
Quantifying Improved High Aspect Ratio Finger Topography” 27th EUPVSEC Conference.
Frankfurt, October 2012
2. “Novel c-Si Metallization Adhesion Testing using Module Assembly Materials” 27th
EUPVSEC Conference. Frankfurt, October 2012
3. “Novel Approaches to Benchmarking Solar Cell Tabbing Solderability” 26th EUPVSEC
Conference. Hamburg, September 2011
4. “The Digital Solder Paste” APEX West Conference. Las Vegas, April 2009
5. “Dippable Paste: A Robust Assembly Material and Enabling Technology” ISTC/CSTIC
Conference. Shanghai, China, March 2009
6. "Novel Approaches to Current Semiconductor Packaging Challenges" Electronic Packaging
Technology Conference. Singapore, December 2008
7. “Dippable Solder Paste Applications for PoP Assembly” MEPTEC Conference. San Jose,
November 2008
8. "Semiconductor Packaging Solutions Utilizing Fine Powder Solder Paste" International Wafer
Level Packaging Conference. San Jose, October 2008
9. "Fine Powder Solder Paste Applications for Semiconductor Packaging" APEX West
Conference. Las Vegas, May 2008
10. "Pin Transferability Testing of Dippable Solder Paste Formulations" International Conference
on Soldering and Reliability. Toronto, May 2008
11. "Novel Method of BGA Coplanarity Reduction at the Ball Attach Process" Pan Pacific
Conference. Maui, January 2008
12. "BGA Coplanarity Reduction during the Ball Attach Process" Semicon West Conference. San
Francisco, July 2007
13. "BGA Coplanarity Reduction during the Ball Attach Process" International Conference on
Soldering and Reliability. Toronto, March 2007
14. "Wafer Bumping Stenciling Techniques with Solder Paste" APEX West Conference. Los
Angeles, February 2007
15. "Lead Free Wafer Bumping Techniques with Solder Paste" IMAPS West Conference. San
Diego, October 2006
16. "New Generation Lead Free Solder Paste Void Performance" ICLFC Conference. Toronto,
May 2006
17. "Lead Free Wafer Bumping with Solder Paste" IMAPS Device Packaging Conference. Phoenix,
March 2006

2. RICHARD R. LATHROP JR.
104 Wilson Circle Home: (610) 594-8229
Exton, PA 19341 rlathrop2@verizon.net
18. "Achieving Sn/Pb Void Performance Utilizing Pb Free Solder Pastes" APEX West Conference.
Anaheim, February 2006
19. "High Density Wafer Bumping with Solder Paste" Advanced Packaging Magazine. May 2005.
(Lead article plus cover graphic)
20. "High Density Wafer Bumping with Solder Paste" APEX West Conference. Anaheim, February
2005
21. "Maximizing Lead Free Wetting" APEX West Conference. Anaheim, February 2005
22. "Solder Paste Printing and Stencil Design Considerations for Wafer Bumping" SEMICON
West Conference. San Jose, July 2004
23. "Optimizing Solder Paste Printing For Wafer Bumping" APEX West Conference. Anaheim,
February 2004
24. "Avoiding the Solder Void" APEX West Conference. Anaheim, March 2003
25. "Defining Solder Paste Performance via Novel Quantitative Methods" APEX West Conference.
Anaheim, March 2003
26. "Optimizing the Print Performance of SMT Adhesives" APEX West Conference. Anaheim,
March 2002
27. "Are You Still Dispensing Adhesives?" Etronix Conference. Chicago, February 2001
28. "The SMT Process Benchmarking Toolkit" APEX West Conference. Long Beach, January 2001
29. "A Novel Method for Determining the Pin Testability of Solder Flux Residue" NEPCON West
Conference. Anaheim, March 2000
30. "A Comprehensive Test Board for Benchmarking Your SMT Process" NEPCON West
Conference. Anaheim, March 2000
31. "Raising the Speed Limit of Your SMT Process" SMTA International Conference. San Diego,
September 1999
32. "Speed Printing of SMT Adhesives" NEPCON West Conference. Anaheim, March 1999
33. "Taking the Art Out of No Clean Solder Paste Benchmarking" NEPCON West Conference.
Anaheim, March 1999
34. "Quantifying the Printability of SMT Adhesives" SMI Conference. San Jose, August 1998
35. "No Clean Solder Paste Benchmarking from a Material Suppliers Viewpoint" SMI
Conference. San Jose, August 1998
36. "An Introduction to Solder Materials" SMT Magazine. March 1998
37. "The Art of Stencil Printing Adhesives" SMT Magazine. September 1997
38. "Solder Paste Design and Verification for Fine Pitch Printing" SMI Conference. San Jose,
September 1997

3. RICHARD R. LATHROP JR.
104 Wilson Circle Home: (610) 594-8229
Exton, PA 19341 rlathrop2@verizon.net
39. "Solder Paste Design and Performance Verification for Fine Pitch Printing" SMT Magazine.
March 1997
40. "The Printing of SMT Adhesives and Evaluation Techniques" NEPCON West Conference.
Anaheim, March 1997
41. "Solder Paste Print Qualification using Laser Triangulation" International Conference on
Electronic Assembly Material and Process Challenges at Georgia Tech. Atlanta, June 1996
42. “Novel High Performance Resistor Design for Telecommunication A.C. Surge Protection”
Advanced Material Technologies Conference. ISHM. Orlando 1989