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MCS-110EP
TWO COMPONENT SILVER FILLED
ELECTRICALLY CONDUCTIVE EPOXY ADHESIVE
The electrically conductive properties of the
MCS-110EP epoxy adhesive makes it paricularly
suitable for component attachment and termination
in membrane keypads and other electromechanical
assemblies where application efficiency is
important along with low resistivity.
MCS-110EP is ideally suited for dot dispense
applications and high speed dot dispense processes.
Adhesion to most metal and plastic materials is
excellent as its toughness and resistance to
temperature with lateral component push off
testing showing a 30-40% greater bond strength
compared to other conductive compound products.
Appearance
Consistency
Mix Ratio (by Weight)
Shelf Life
Pot Life
Volume Resistivity
Thermal Conductivity
Glass Transition Temperature
Tensile Sheer Strength
Solvent Resistance
Solderability
Specific Gravity
Silver
Paste
1 - 1
12 months @ 25°C in unopened unmixed containers
>4 days
0.0001 - 0.0004 W cm
0.065 (W cm K )
65°C
1500 psi min
Excellent
No
2.6 (g/cc)
(Time at Temperature) Complete Cure
80°C
100°C
120°C
150°C
90 Mins
30-45 Mins
15 Mins
5 Mins
The performance characteristics are influenced and affected by printing technique,
nature of substrate, curing time, curing temperature and type of drying equipment.
Before adopting our products for commercial use, the user assumes responsibility for
determining fitness of use in their particular application and process. Memcon makes
no warranties and assumes no liability in connection with any use of this information.
Printing
Dot Dispensing
Substrates
Solvent
Premix Parts A and B in original container prior to combining. Add Part
B to Part A and mix until uniform
Dot Dispense
Positive Displacement, Pneumatic or Syringes for hand held equipement
Most Metal and Plastic
Yes, can be thinned
Safety & Handling:
The following precautions should be exercised when handling:
Avoid prolonged contact with skin. If contact with skin occurs, wash immediately with soap and water
Use with adequate ventilation, avoid prolonged breathing of vapour.
Dangerous if swallowed - DO NOT CONSUME
-1 -1
Preparation
Compass House Vision Park Chivers Way HISTON
Cambridge CB24 9AD United Kingdom
T +44 1223 257724 F +44 1223 257800
www.memcon.eu sales@memcon.eu
Limited
6000 Red Arrow Hwy Unit I
Stevensville Michigan 49127 USA
T +1 269 281 0478 F +1 269 593 5952
www.memcon.net sales@memcon.net
North America
MEMCON is a registered trade mark of Memcon LimitedR
GB Issue 3
Units 5/6 6/F Westley Square
48 Hoi Yuen Rd Kwun Tong Hong Kong
T +852 3741 1411 F +852 3747 8980
www.memcon.asia sales@memcon.asia
(Asia) Limited

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Memcon Mcs110 ep silver conductive epoxy

  • 1. MCS-110EP TWO COMPONENT SILVER FILLED ELECTRICALLY CONDUCTIVE EPOXY ADHESIVE The electrically conductive properties of the MCS-110EP epoxy adhesive makes it paricularly suitable for component attachment and termination in membrane keypads and other electromechanical assemblies where application efficiency is important along with low resistivity. MCS-110EP is ideally suited for dot dispense applications and high speed dot dispense processes. Adhesion to most metal and plastic materials is excellent as its toughness and resistance to temperature with lateral component push off testing showing a 30-40% greater bond strength compared to other conductive compound products. Appearance Consistency Mix Ratio (by Weight) Shelf Life Pot Life Volume Resistivity Thermal Conductivity Glass Transition Temperature Tensile Sheer Strength Solvent Resistance Solderability Specific Gravity Silver Paste 1 - 1 12 months @ 25°C in unopened unmixed containers >4 days 0.0001 - 0.0004 W cm 0.065 (W cm K ) 65°C 1500 psi min Excellent No 2.6 (g/cc) (Time at Temperature) Complete Cure 80°C 100°C 120°C 150°C 90 Mins 30-45 Mins 15 Mins 5 Mins The performance characteristics are influenced and affected by printing technique, nature of substrate, curing time, curing temperature and type of drying equipment. Before adopting our products for commercial use, the user assumes responsibility for determining fitness of use in their particular application and process. Memcon makes no warranties and assumes no liability in connection with any use of this information. Printing Dot Dispensing Substrates Solvent Premix Parts A and B in original container prior to combining. Add Part B to Part A and mix until uniform Dot Dispense Positive Displacement, Pneumatic or Syringes for hand held equipement Most Metal and Plastic Yes, can be thinned Safety & Handling: The following precautions should be exercised when handling: Avoid prolonged contact with skin. If contact with skin occurs, wash immediately with soap and water Use with adequate ventilation, avoid prolonged breathing of vapour. Dangerous if swallowed - DO NOT CONSUME -1 -1 Preparation Compass House Vision Park Chivers Way HISTON Cambridge CB24 9AD United Kingdom T +44 1223 257724 F +44 1223 257800 www.memcon.eu sales@memcon.eu Limited 6000 Red Arrow Hwy Unit I Stevensville Michigan 49127 USA T +1 269 281 0478 F +1 269 593 5952 www.memcon.net sales@memcon.net North America MEMCON is a registered trade mark of Memcon LimitedR GB Issue 3 Units 5/6 6/F Westley Square 48 Hoi Yuen Rd Kwun Tong Hong Kong T +852 3741 1411 F +852 3747 8980 www.memcon.asia sales@memcon.asia (Asia) Limited