One man foxconn
- 3. Content Warning • Thispresentation contains explicit material • Audience discretion is advised
- 4. One Man Foxconn Misadventuresin PCB Design and Manufacturing
- 5. About Me • ComputerEngineering student at a local university • NUS Hackers student society at said local university, dedicated to the spread of the hacker culture • Relative noob at hw • Maintainer of local mirror download.nus.edu.sg
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- 7. Was ist das? •Appreciate how a complete PCB turnaround works • Conception/ Ideation • Design • Prototyping • Assembly
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- 9. • Translates to •thinking about (what happened) “that” year • It was a friday september evening @ Sapore NUS…
- 10. Coffee.js • Idea ofa PCB badge for *ahem* everyone at Hack&Roll 2016 • Inspired by • Defcon • Chaos Communication Camp(s) • R0ket Rad1o • Bunnie Huang
- 13. Hauptgedanke • Programmable badge(no prior experience needed) • Promotes social interaction • Fully utilitarian • Paperweight
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- 15. >> FAST FWD •Late October 2015
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- 17. Constraints • Money • Time/Manpower • Space • Laws of • Physics • Intellectual Property (not applicable to most hobbyist projects)
- 18. Constraints • Money • Time/Manpower • Space • Laws of • Physics • Intellectual Property (not applicable to most hobbyist projects)
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- 23. Constraints • Money • Time/Manpower • Space • Laws of • Physics • Intellectual Property (not applicable to most hobbyist projects)
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- 25. Bill of Materials •Recommended columns • Item Description • Part Number • Quantity • Cost • Supplier
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- 30. LETS DO THISTHING YO!
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- 36. RAISON D’ETRE • Pilgrimageto Hacker’s Mecca
- 37. • pic ofCCCH
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- 44. Back to thedrawing board • Simpler Design • Switch to ATTINY85 • Fully utilitarian • Paperweight
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- 52. Assembly • 1 week •200 boards • >4400 components
- 53. Assembly Process • SolderPaste Application • Pick and Place • Reflow Soldering • Programming • Soldering (Thru Hole Components) • Reprogramming <if needed> • Packaging
- 55. Assembly Process • SolderPaste Application • Pick and Place • Reflow Soldering • Programming • Soldering (Thru Hole Components) • Reprogramming <if needed> • Packaging
- 58. Assembly Process • SolderPaste Application • Pick and Place • Reflow Soldering • Programming • Soldering (Thru Hole Components) • Reprogramming <if needed> • Packaging
- 61. Assembly Process • SolderPaste Application • Pick and Place • Reflow Soldering • Programming • Soldering (Thru Hole Components) • Reprogramming <if needed> • Packaging
- 64. Assembly Process • SolderPaste Application • Pick and Place • Reflow Soldering • Programming • Soldering (Thru Hole Components) • Reprogramming <if needed> • Packaging
- 67. This process isRIGGED
- 68. Assembly Process • SolderPaste Application • Pick and Place • Reflow Soldering • Programming • Soldering (Thru Hole Components) • Reprogramming <if needed> • Packaging
- 71. Assembly Process • SolderPaste Application • Pick and Place • Reflow Soldering • Programming • Soldering (Thru Hole Components) • Reprogramming <if needed> • Packaging
- 74. Assembly Process • SolderPaste Application • Pick and Place • Reflow Soldering • Programming • Soldering (Thru Hole Components) • Reprogramming <if needed> • Packaging
- 75. Assembly Process • SolderPaste Application • Pick and Place • Reflow Soldering • Programming • Soldering (Thru Hole Components) • Reprogramming <if needed> • Packaging 30 Boards/day
- 76. Assembly Process • SolderPaste Application • Pick and Place • Reflow Soldering • Programming • Soldering (Thru Hole Components) • Reprogramming <if needed> • Packaging 100 Boards/day
- 77. Stats • Yield • PrototypingPhase 1 -> 1.5/3.5 boards • Assembly • Phase 1 -> 1/1 • Phase 2 -> 0/5 • Phase 3 -> 190/190
- 78. Ja Ja GibMir eine Grund
- 79. Takeaways • Be anidiot • Make mistakes • Have a fallback plan
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- 81. PCB Vendors? • ServicesI used • Smart Prototyping • DirtyPCBs
- 82. Recommended PCB Fabrication Options •ENIG (not HASL) • Stencil • Hot plate
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- 84. • Vishnu Prem •Varun Patro • Jiayee • Yeo Kheng Meng • NUS Hackers • Sponsors for Hack&Roll
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