The impact of integrated circuits on our lives has been tremendous. ICs have become the main components of almost all electronic devices.

1. IC Components: Discover Its Types and Construction
An integrated circuit, generally referred to as an IC, is a microscopic collection of
electronic circuits and components that has been diffused or implanted onto the surface
of a single chip or crystal, of semiconducting material such as silicon. It is called an
integrated circuit because the circuits, components, and base material are all made
together, or integrated, out of a single element of silicon, as opposed to a discrete circuit
in which the components are made individually from different materials and assembled
later. ICs range in complexity from simple logic amplifiers and modules to complete
microcomputers containing millions of pieces.
The impact of integrated circuits on our lives has been tremendous. ICs have become
the main components of almost all electronic devices. These small circuits have
indicated high reliability, low cost, low power requirements, and high processing speeds
compared to the vacuum tubes and transistors which preceded them. IC
microcomputers are now used as controllers in equipment such as vehicle operating
systems, machine tools, and other applications where pneumatic, hydraulic, or
mechanical controls were previously used.
How Integrated Circuit Components Are Formed
In an integrated circuit, electronic components like resistors, capacitors, diodes, and
transistors are created directly onto the surface of a silicon crystal. The manufacturing

2. of an integrated circuit will make better sense if one first understands how IC
components SN74V3650-7PEU are formed.
Even before the first IC was developed, it was known that common electronic
components could be produced from silicon. The question was how to build them and
the connecting circuits from the same amount of silicon? The solution was to change, or
dope, the chemical composition of tiny areas on the silicon crystal surface by including
other chemicals called dopants. Some dopants bond with the silicon to make regions
where the dopant particles have one electron they can give up. These are called N
regions. Other dopants bond with the silicon to create regions where the dopant
particles have room to take one electron. These are called P regions. When a P region
connects an N region, the boundary between them is referred to as a PN junction.
Within a PN junction, the atoms of the two parts bond in such a manner as to make the
third region, called a depletion region, in which the P dopant particles capture all the N
dopant extra electrons, thus weakening them. One of the phenomena that result is that
a positive voltage used to the P region can cause an electrical current to flow via the
junction into the N region, but a similar positive voltage used to the N region will result in
little or no current flowing via the junction back into the P region. This ability of a PN
junction to either conduct or insulate depending on which side the voltage is applied can
be used to create IC components that direct and control current flows in the same way
as diodes and transistors.
Design
Once created, there is no additional design work needed. Some integrated circuits
SN74ABTH32501PZ can be considered standard, off-the-shelf items. Examples of
standard ICs would include voltage regulators, analog switches, amplifiers, and analog-
to-digital or digital-to-analog converters. These ICs are usually sold to other companies
who add them into printed circuit boards for various electronic products.
Other integrated circuits SN74VMEH22501ADGVR are unique and need extensive
design work. An example would be a new microprocessor for computers. This design
work may need research and development of new materials and new manufacturing
techniques to reach the final design.
Raw Materials
Pure silicon is the foundation for most integrated circuits. It provides the base or
substrate for the whole chip and is chemically doped to provide the N and P regions that
make up the IC components CD74HCT10E. The silicon must be so pure that only one
out of every ten billion particles can be impure.
The thin wire leading from the IC chip to its mounting package may be aluminum or
gold. Aluminum is generally used as a connector between the various IC components.
The mounting package itself may be made from plastic or ceramic materials.