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THE PROJECT ARA IS LEAD BY
PAUL EREMENKO
The project was originally
headed by the Advanced
Technologies and
Projects team
within Motorola
Mobility while it was a
subsidiary of Google.
PROJECT ARA IS
THE
CODENAME
FOR AN
INITIATIVE BY
GOOGLE
THAT AIMS TO
DEVELOP A
FREE ,
OPEN
HARDWARE
PLATFORM FOR
CREATING
HIGHLY
It is made up of
swappable and
replaceable parts. The
phone is designed to be a
long-term sustainable
product tailored to
It's a philosophy that's imported from
the Defense Advanced Research Projects
Agency (DARPA),where Eremenko and
his boss, Regina Dugan, once worked.
Dugan came to Google in 2012,where she
was put in charge of ATAP , which was
then meant to help reinvigorate the
Motorola division. When Motorola was
sold off to Lenovo in January 2014
Google kept ATAP and Project Ara,
which became Google Ara.
PROJECT ARA HAS TWO CORE
COMPONENTS :
1. THE ENDOSKELETON AND
2. THE MODULE
The ENDOSKELETON is made
of aluminium to provide
strength . Also it means different
sizes and different types of
components can be added and
permits ‘growth of device’ from,
for example, phone to phablet,
according to Google. ‘The
framework of the endoskeleton
and interchangeable modules
promise to democratize
hardware in the same way that
the app opened up the world of
software.
MODULES CAN BE ANYTHING THAT USERS
CAN THINK OF BATTERY , SPEAKER ,
CAMERA , ETC . THEY CAN BE DEVELOPED BY
ANYONE; 3D-PRINTED ON DEMAND, USED,
REPLACED AND EVEN RE-SOLD ENSURING
YOUR PHONE IS COMPLETELY MADE FOR
EACH USER. MODULE DEVELOPMENT IS
OPEN-SOURCE AND THERE IS A TOOLKIT
PROVIDED TO HELP DEVELOPERS
UNDERSTAND THE HIERARCHY
OF FUNCTIONS AND HOW
COMPONENTS CAN BE
INTEGRATED.
PROJECT ARA'S PROTOTYPE APPLICATION
PROCESSOR MODULE, WHICH HOUSE THE CPU,
MEMORY, SD CARD SLOT, AND OTHER THINGS.
Three new technologies that
make Project Ara work –
1. UniPro
2. Capacitive M-PHY
3. ElectroPermanent Magnets
THE FIRST IS UNIPRO, WHICH IS A HIGH - SPEED
INTERFACE PROTOCOL THAT PROJECT ARA USES
TO ALLOW ITS MODULES TO SPEAK TO EACH OTHER,
THOUGH THE HARDWARE OF THE ENDO.THEY SHARE
A COMMON LOW-LEVEL LANGUAGE FOR COMMUNICATING
AND BUILDING A NETWORK. THE UNIPRO PROTOCOL
HAS BEEN IN DEVELOPMENT FOR SEVERAL YEARS
AS A WAY TO BUILD A STANDARD FOR MOBILE PHONE
ACCESSORIES--THINK OF IT LIKE THE USB PROTOCOL,
BUT OPTIMIZED FOR MOBILE . ITS DEVELOPMENT IS
OVERSEEN BY THE MIPI ALLIANCE,AN ORGANIZATION
COMPOSED OF OVER 250 MOBILE COMPANIES, AND
PROJECT ARA IS TAPPING INTO THE LATEST UNIPRO
1.6 SPEC, WHICH OFFER HIGH-BANDWIDTH AND LOW
POWER CONNECTIONS BETWEEN THE MODULES.
EVEN THOUGH THE MODULES KNOW HOW
TO SPEAK TO EACH OTHER, THEY NEED A
WAY TO PHYSICALLY CONNECT TO THE
ENDO. THE SECOND TECHNOLOGY PROJECT
ARA USES IS CAPACITIVE M-PHY, A
PHYSICAL LAYER SPEC ALSO DEVELOPED BY
THE MIPI ALLIANCE AND MADE TO WORK
WITH UNIPRO. FOR PROJECT ARA, M-PHY IS
A CAPACITIVE INTERFACE, WHICH MEANS
THAT THE CONNECTION POINTS WON'T BE
WORN DOWN OVER TIME FROM
SWAPPING MODULES IN AND OUT OF THE
PHONE.
THE FINAL TECHNOLOGY IN PROJECT ARA'S
MODULE DESIGN IS THE USE
OF ELECTROPERMANENT MAGNETS FOR
AFFIXING THE MODULES IN PLACE IN THE
ENDO. NORMAL ELECTROMAGNETS
MAGNETIZE DEPENDING ON IF CURRENT IS
RUNNING THROUGH THEM - THAT WOULD
BE A BATTERY DRAIN, BUT
ELECTROPERMANENT MAGNETS ONLY USE
CURRENT TO FLIP MAGNETIZATION ON AND
OFF; IT'S ABLE TO RETAIN ITS MAGNETIZED
STATE WITHOUT DRAINING ADDITIONAL
POWER.
1.SIZE
2.INBUILT BATTERY ALONG
WITH EXTERNAL ONE
3.BUYING MODULES ON AN E-
COMMERCE SITE WHICH
WOULD LOOK LIKE GOOGLE
PLAY STORE
4.MODULES CAN HAVE
MULTIPLE FUNCTIONS
5.LONG LIFE
1. PHONE IS VERY
CHEAP
2.YOU ONLY BUY THE
FEATURES THAT YOU
WANT
3.YOUR PHONE COULD
LAST INDEFINITELY
4.REPAIRS ARE EASIER
AND CHEAPER
1.IT WILL BE BIGGER AND
HEAVIER THAN THE
STANDARD PHONE
2.THE CONNECTORS ARE
BOUND TO CAUSE
PROBLEMS
3.CERTAIN COMBINATIONS
WON’T WORK
THE BENEFITS OF A MODULAR
PHONE WILL BECOME
COMPELLING TO CONSUMERS
ONCE ATAP CAN GET ISSUES
OF WEIGHT, BATTERY LIFE,
AND SIZE REDUCED DOWN TO
A CERTAIN POINT . ALSO
CUSTOM ENCLOSURES AND
SUPER-CHARGED BATTERIES
MAY APPEAL TO THE HIGH
END OF THE MARKET .
1. ARTICLE ON www.files.tested.com
BY NORMAN CHAN ON APRIL 15, 2014 AT 5:53 P.M
2. www.marketwatch.com
3. www.phonearena.com
4. www.projectara.com
5. www.techtimes.com
Hi 140810112940-phpapp01
Hi 140810112940-phpapp01

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Hi 140810112940-phpapp01

  • 1.
  • 2.
  • 3. THE PROJECT ARA IS LEAD BY PAUL EREMENKO The project was originally headed by the Advanced Technologies and Projects team within Motorola Mobility while it was a subsidiary of Google.
  • 4.
  • 5. PROJECT ARA IS THE CODENAME FOR AN INITIATIVE BY GOOGLE THAT AIMS TO DEVELOP A FREE , OPEN HARDWARE PLATFORM FOR CREATING HIGHLY It is made up of swappable and replaceable parts. The phone is designed to be a long-term sustainable product tailored to
  • 6.
  • 7. It's a philosophy that's imported from the Defense Advanced Research Projects Agency (DARPA),where Eremenko and his boss, Regina Dugan, once worked. Dugan came to Google in 2012,where she was put in charge of ATAP , which was then meant to help reinvigorate the Motorola division. When Motorola was sold off to Lenovo in January 2014 Google kept ATAP and Project Ara, which became Google Ara.
  • 8.
  • 9. PROJECT ARA HAS TWO CORE COMPONENTS : 1. THE ENDOSKELETON AND 2. THE MODULE
  • 10. The ENDOSKELETON is made of aluminium to provide strength . Also it means different sizes and different types of components can be added and permits ‘growth of device’ from, for example, phone to phablet, according to Google. ‘The framework of the endoskeleton and interchangeable modules promise to democratize hardware in the same way that the app opened up the world of software.
  • 11. MODULES CAN BE ANYTHING THAT USERS CAN THINK OF BATTERY , SPEAKER , CAMERA , ETC . THEY CAN BE DEVELOPED BY ANYONE; 3D-PRINTED ON DEMAND, USED, REPLACED AND EVEN RE-SOLD ENSURING YOUR PHONE IS COMPLETELY MADE FOR EACH USER. MODULE DEVELOPMENT IS OPEN-SOURCE AND THERE IS A TOOLKIT PROVIDED TO HELP DEVELOPERS UNDERSTAND THE HIERARCHY OF FUNCTIONS AND HOW COMPONENTS CAN BE INTEGRATED.
  • 12. PROJECT ARA'S PROTOTYPE APPLICATION PROCESSOR MODULE, WHICH HOUSE THE CPU, MEMORY, SD CARD SLOT, AND OTHER THINGS.
  • 13.
  • 14. Three new technologies that make Project Ara work – 1. UniPro 2. Capacitive M-PHY 3. ElectroPermanent Magnets
  • 15. THE FIRST IS UNIPRO, WHICH IS A HIGH - SPEED INTERFACE PROTOCOL THAT PROJECT ARA USES TO ALLOW ITS MODULES TO SPEAK TO EACH OTHER, THOUGH THE HARDWARE OF THE ENDO.THEY SHARE A COMMON LOW-LEVEL LANGUAGE FOR COMMUNICATING AND BUILDING A NETWORK. THE UNIPRO PROTOCOL HAS BEEN IN DEVELOPMENT FOR SEVERAL YEARS AS A WAY TO BUILD A STANDARD FOR MOBILE PHONE ACCESSORIES--THINK OF IT LIKE THE USB PROTOCOL, BUT OPTIMIZED FOR MOBILE . ITS DEVELOPMENT IS OVERSEEN BY THE MIPI ALLIANCE,AN ORGANIZATION COMPOSED OF OVER 250 MOBILE COMPANIES, AND PROJECT ARA IS TAPPING INTO THE LATEST UNIPRO 1.6 SPEC, WHICH OFFER HIGH-BANDWIDTH AND LOW POWER CONNECTIONS BETWEEN THE MODULES.
  • 16. EVEN THOUGH THE MODULES KNOW HOW TO SPEAK TO EACH OTHER, THEY NEED A WAY TO PHYSICALLY CONNECT TO THE ENDO. THE SECOND TECHNOLOGY PROJECT ARA USES IS CAPACITIVE M-PHY, A PHYSICAL LAYER SPEC ALSO DEVELOPED BY THE MIPI ALLIANCE AND MADE TO WORK WITH UNIPRO. FOR PROJECT ARA, M-PHY IS A CAPACITIVE INTERFACE, WHICH MEANS THAT THE CONNECTION POINTS WON'T BE WORN DOWN OVER TIME FROM SWAPPING MODULES IN AND OUT OF THE PHONE.
  • 17. THE FINAL TECHNOLOGY IN PROJECT ARA'S MODULE DESIGN IS THE USE OF ELECTROPERMANENT MAGNETS FOR AFFIXING THE MODULES IN PLACE IN THE ENDO. NORMAL ELECTROMAGNETS MAGNETIZE DEPENDING ON IF CURRENT IS RUNNING THROUGH THEM - THAT WOULD BE A BATTERY DRAIN, BUT ELECTROPERMANENT MAGNETS ONLY USE CURRENT TO FLIP MAGNETIZATION ON AND OFF; IT'S ABLE TO RETAIN ITS MAGNETIZED STATE WITHOUT DRAINING ADDITIONAL POWER.
  • 18.
  • 19.
  • 20.
  • 21. 1.SIZE 2.INBUILT BATTERY ALONG WITH EXTERNAL ONE 3.BUYING MODULES ON AN E- COMMERCE SITE WHICH WOULD LOOK LIKE GOOGLE PLAY STORE 4.MODULES CAN HAVE MULTIPLE FUNCTIONS 5.LONG LIFE
  • 22.
  • 23.
  • 24.
  • 25. 1. PHONE IS VERY CHEAP 2.YOU ONLY BUY THE FEATURES THAT YOU WANT 3.YOUR PHONE COULD LAST INDEFINITELY 4.REPAIRS ARE EASIER AND CHEAPER
  • 26.
  • 27. 1.IT WILL BE BIGGER AND HEAVIER THAN THE STANDARD PHONE 2.THE CONNECTORS ARE BOUND TO CAUSE PROBLEMS 3.CERTAIN COMBINATIONS WON’T WORK
  • 28.
  • 29. THE BENEFITS OF A MODULAR PHONE WILL BECOME COMPELLING TO CONSUMERS ONCE ATAP CAN GET ISSUES OF WEIGHT, BATTERY LIFE, AND SIZE REDUCED DOWN TO A CERTAIN POINT . ALSO CUSTOM ENCLOSURES AND SUPER-CHARGED BATTERIES MAY APPEAL TO THE HIGH END OF THE MARKET .
  • 30. 1. ARTICLE ON www.files.tested.com BY NORMAN CHAN ON APRIL 15, 2014 AT 5:53 P.M 2. www.marketwatch.com 3. www.phonearena.com 4. www.projectara.com 5. www.techtimes.com