1. Computer and Heat Sink
What is Use of Heat Sink in Computer?
A component designed to lower the temperature of an electronic device by dissipating heat
into the surrounding air. All modern CPUs require a heat sink. Heat sink is also computer
component and its more use plz tell me about that.Some also require a fan. A heat sink
without a fan is called a passive heat sink; a heat sink with a fan is called an active heat sink.
Heat sinks are generally made of an aluminum alloy and often have fins. We call it extruded
aluminium heatsink.
How Heat Sink Works in Computer?
A heat sink is a purposefully shaped piece of metal terminally sealed against to be cooled
computer component, be it memory, a CPU, or something else.
The function of the heat sink is to optimize the heat exchange between the component and
the surrounding air by maximizing the contact surface between heat sink and air.
Heat travels quickly through metal, and also through the special thermal seal connecting the
aluminium heatsink extrusions with the component, ensuring effective transport of heat from
the component to the surface of the heat sink, effectively making the surface of the heat sink
an extended surface of the component. This extended surface allows the component to more
easily give of heat to the surrounding air, which is important because air is not good in
transporting heat, like for instance metal or water is.
Because air transports heat badly (it's actually a very good isolator) standing air (without any
flow at all) is not good for cooling a component, and a lot of cooling capacity can be gained
by moving the air, to help it transport the heat. This is why airflow is important to keep a
computer cool, and why a CPU heat sink normally has a fan attached to it.

2. Flat and Smooth Heat Sink
Mass-produced CPU heat spreaders and heat sink bases are never perfectly flat or smooth;
if these surfaces are placed in the best contact possible, there will be air gaps which reduce
heat conduction. This can easily be mitigated by the use of thermal compound, but for the
best possible results surfaces must be as flat as possible. This can be achieved by a
laborious process known as lapping, which can reduce CPU temperature by typically 5 °C.
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