In order to meet the needs of EDFA (Erbium-Doped Fiber Amplifier) applications, HYC has recently launched hybrid series product for the miniaturized EDFA. The product line includes 980/1550nm IWDM Hybrid (Isolator+WDM), GFF (Gain Flattening Filter), IGFF (Isolator + GFF), etc..

1. HYC launches ultra-small Hybrid devices for EDFA
In order to meet the needs of EDFA (Erbium-Doped Fiber Amplifier) applications,
HYC has recently launched hybrid series product for the miniaturized EDFA. The
product line includes 980/1550nm IWDM Hybrid (Isolator+WDM), GFF (Gain
Flattening Filter), IGFF (Isolator + GFF), etc..
Based on the optical simulation design technology and fiber mode field beam
expansion technology, the IL of hybrid device can be greatly reduced and its
performance stability can be improved. The typical value of reflection IL can be
controlled below 0.15dB (-5~+75℃), and the typical value of transmission IL can
be controlled at 0.30dB (-5~+75℃). HYC has extensive experience in basic
packaging processes and stress models for glue & materials, which greatly
contribute to the reliability and robustness of products. All hybrid devices fully
meet the reliability requirements of Telcordia GR-1221-CORE, and meet the 168-
hour PCT experiment (tested at 120 ° C, 2 atmospheres, 100% humidity).

2. Now we have two versions, one is miniaturized + ultra-high reliability version( fully
meets PCT test), another is ultra-miniature (φ2.5xL19mm) version, which can
also meet the requirements of GR-1221-CORE.

3. The EDFA components provided by HYC not only ensure low loss, ultra-high
reliability, and ultra-miniaturization, but also adopt a low-cost strategy to reduce
costs by 30% through functional integration, and truly providing customers with
competitive product solutions.
HYC has always pay high attention to R&D investment and has a professional R&D
team, owns a number of domestic and foreign patents and has a comprehensive
six core technology platforms.
1. Optical design, simulation and ray tracing capability based on Zemax, Matlab
and Mathcad;
2. Free space optics design, submicron alignment / coupling/assembly capabilities;
3. High precision mechanical design, mold and injection design & precision
manufacturing capabilities;
4. High density parallel optics Design and manufacturing capabilities (such as FA
fiber array &MPO and integration with isolators, etc.);
5. Optical substrate and wafer post-processing capabilities, and the
corresponding capabilities for analyzing optical glass geometry and stress;
6. Automatic precision assembly and testing ability, software programming
ability.
For more information: http://www.hyc-system.com