Jian-Hau Chen
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Ti product introduction

Deloitte Consulting • 8 years ago

China ic design industry report，2010

ResearchInChina • 13 years ago

Wire bonding

Nanoelectronic Materials • 11 years ago

Basics of Bonding Wire Manufacturing

Christopher Breach • 10 years ago

Book review copper wire bonding

Chong Leong Gan • 8 years ago

Ic 封裝新技術發展趨勢

Kent Yang • 7 years ago

Effects of Wire Type and Mold Compound on Wearout Reliability of Fineline BGA Package in Microelectronics Packaging

CL Gan • 10 years ago