1. Spectrum Integrity, Inc.
Advanced Interconnect Solutions
Overview and Introduction
Printed Circuit Design
January 2013
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2. Overview
Who we are:
• An experienced team of Engineers providing custom solutions for
Interconnect Applications from DC to 110GHz and beyond
• Our specialty is with High-Speed Digital, RF, and Millimeter-Wave signals
• Our main focus is in Circuit Design, PCB Design, Product Development, and
Test
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3. Design Capabilities
• Transmission Line Analysis and Design
• High Power RF and design for extreme environments
• Thermal Management
• 3D EM Modeling and Simulation
• Chip-on-board
• PCB Material Selection and Stackup Design
• RF Connector Transition Optimization and Design
• Burn-in and HTOL design. Both static and dynamic RF and High-Speed
• Re-engineering of existing designs to improve Signal Integrity and to make
more manufacturable
• Component Engineering
• Microwave Circuit Design: Filters, Couplers, Dividers, LNAs, etc.
• Flex Circuit Design
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4. PCBs for Ultra High-Speed Applications
(40Gbps to 100Gbps and beyond)
Transmission Line Design and Optimization – we have many
proven designs “cataloged” for re-use. Full EM field solvers
are utilized for the most demanding applications.
Spurious modes detected in CPW
Ansoft LLC XY Plot 3 HFSSDesign1
10000.00
Name X Y Curve Info
m1 1.0000 3.4812
S21= -0.28 dB @
ComplexMag_E
m2 3.0000 44.2367 Setup1 : LastAdaptive
Freq='20GHz' Phase='0deg'
40 GHz 1000.00
100.00
ComplexMag_E
m2
10.00
m1
1.00
Optimized CPW for a multilayer PCB
0.10
0.00 2.00 4.00 6.00 8.00 10.00
Distance [mm]
CPW performance after suppression of Ultra high-speed Diff Pair
spurious modes
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5. RF Connector Transition Design
(an often overlooked feature by many)
Careful attention is given to ensure signals efficiently “launch” onto and off of planar
structures. We have developed numerous designs that have proven performance.
A particular area of expertise is with
Transition Design for Multilayer PCBs
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6. Example of connector optimization
Before
S11= -13.5 dB @ 28 GHz (max)
Optimization
S21= -0.67 dB @ 40 GHz
After
Optimization
S11= -21 dB @ 28 GHz
S11= -19 dB @ 40 GHz (max)
S21= -0.58 dB @ 40 GHz
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7. Advanced Routing Capabilities
We have developed numerous custom
techniques that allow automated advanced
routing for arbitrary geometries, such as
tapered arcs, with full net intelligence, for
optimum performance.
Photo at left shows 1.5 mil (38um) lines
tapering smoothly to wider lines and filled
micro vias.
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8. Chip-on-board
We have completed many successful chip-on-
board designs from 10GHz up to 50GHz and can
make extensive use of modeling and simulation if
needed.
System model of components, transmission lines and wire bonds
S11, S22, S33, (dB)
Overall loss
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9. Dynamic Burn-in for at-speed HTOL
Design and development of dynamic burn-in boards is an area of particular expertise. We have
produced successful HTOL designs for up to 50GHz in a 150C environment for 8,000 hours.
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10. CAD Screenshots of PCB Examples
50GHz Chip-on-board PCB (14 layers and 9 cavities for bare die) 40GHz Characterization PCBs (12 to 16 layers)
28GHz Mixed-Signal PCB
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11. CAD Screenshots of PCB Examples
High Density design example.
This PCB is 2.5” x 1.8”, 14 layers, 758 components, 10Gbps signals
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12. Samples of Completed PCB Designs
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13. Samples of Completed PCB Designs
Example designs with die cavities. Capable of +/- 1mil depth tolerance (photos from scrap boards)
Multichip Module (MCM) Designs
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14. Sample Test Data From SI Designs
Eye diagram measured at 36GHz of an output signal path of a chip-on-board PCB. The path
included wire bonds, transmission line, and an optimized transition for the RF connector. This
particular PCB was for a 28GHz application but was measured at 36GHz to demonstrate margin of
the design.
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15. Sample Test Data From SI Designs
TDR plot of a transmission path of an RF Test Board
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16. Sample Test Data From SI Designs
Before and after test results showing Insertion Loss improvement with a replacement design done
by Spectrum. (Horizontal axis in GHz)
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17. Sample Test Data From SI Designs
Return Loss measurement of a Through-Line using optimized connector transitions.
(Horizontal axis in GHz)
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18. Sample Test Data From SI Designs
Return Loss of a 5GHz RF Power Amplifier PCB
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19. Industry Recognition
http://www.microwavejournal.com/blogs/1-rog-blog/post/17921-celebrating-rog-award-contest-winners-at-ims-2012
Spectrum named winner, at recent IMS show in Montreal, for Best Digital Application from
Rogers Corporation design contest. Our design entry was for a 100Gbps application.
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20. Thank You
For Sales:
Robert Blomquist
(805) 426-4267
robert@spectrumintegrity.com
For Engineering:
Michael Ingham
(619) 755-7869
michael@spectrumintegrity.com
http://www.spectrumintegrity.com/
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