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Device Modeling Report




COMPONENTS:MAGNETIC CORE
PART NUMBER:HS52
MANUFACTURER:TDK




                Bee Technologies Inc.


  All Rights Reserved Copyright (c) Bee Technologies Inc. 2004
MAGNETIC CORE


Pspice model
                                      Model description
 parameter
     A                          thermal energy parameter
     K                         domain anisotropy parameter
     C                           domain flexing parameter
     MS                          magnetization saturation




          All Rights Reserved Copyright (c) Bee Technologies Inc. 2004
Hysteresis Curve Characteristics

Evaluation Circuit




Simulation result




                                              Simulation




               All Rights Reserved Copyright (c) Bee Technologies Inc. 2004
Simulation result




                                                           Simulation




               All Rights Reserved Copyright (c) Bee Technologies Inc. 2004
Comparison Table


                          B(mT)                   B(mT)
      H(A/m)                                                            %Error
                       Measurement              Simulation

        100                   375                  383.355                2.228
        200                   405                  395.342                2.385
        300                   408                  407.329                0.164
        400                   410                  412.584                0.630
        500                   415                  414.739                0.063
        600                   418                  416.671                0.318
        700                   420                  417.643                0.561
        800                   422                  418.616                0.802
        900                   425                  419.317                1.337
        1000                  425                  419.91                 1.198




               All Rights Reserved Copyright (c) Bee Technologies Inc. 2004

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SPICE MODEL of HS52 in SPICE PARK

  • 1. Device Modeling Report COMPONENTS:MAGNETIC CORE PART NUMBER:HS52 MANUFACTURER:TDK Bee Technologies Inc. All Rights Reserved Copyright (c) Bee Technologies Inc. 2004
  • 2. MAGNETIC CORE Pspice model Model description parameter A thermal energy parameter K domain anisotropy parameter C domain flexing parameter MS magnetization saturation All Rights Reserved Copyright (c) Bee Technologies Inc. 2004
  • 3. Hysteresis Curve Characteristics Evaluation Circuit Simulation result Simulation All Rights Reserved Copyright (c) Bee Technologies Inc. 2004
  • 4. Simulation result Simulation All Rights Reserved Copyright (c) Bee Technologies Inc. 2004
  • 5. Comparison Table B(mT) B(mT) H(A/m) %Error Measurement Simulation 100 375 383.355 2.228 200 405 395.342 2.385 300 408 407.329 0.164 400 410 412.584 0.630 500 415 414.739 0.063 600 418 416.671 0.318 700 420 417.643 0.561 800 422 418.616 0.802 900 425 419.317 1.337 1000 425 419.91 1.198 All Rights Reserved Copyright (c) Bee Technologies Inc. 2004