2. WBI | Semiconductor Innovation Programme
Dear Colleague,
We are pleased to invite you at our flagship Semiconductor Innovation Programme (SIP).
Semiconductor industry has reached an inflection point where traditional design-to-
manufacturing process is no longer sustainable. Increased chip complexity and rising
production costs have caused companies to consolidate, form partnerships or simply
abandon manufactuing.
Our goal is to help you connect across complex supply chains, reduce procurement costs
and free you to focus on what you do best: design cutting-edge products. Further, we aim
to promote innovation through lateral thinking by creating an open atmosphere for
exchanging knowledge between industry, academia and the regulators.
We look forward to welcoming you in spectacular Shanghai!
A NOTE FROM THE 2015 ADVISORY BOARD
5REASONS WHY YOU CANNOT AFFORD TO MISS
15+Industry speakers including VP & C-Level
industry thought leaders.
12+ Hours of connecting industry together in one
insipiring meeting place.
100+Attendees from Semiconductor, Led and PV industry.
Advisory Board Member
NXP
SMIC
Epistar
Belleds
Micron Technology
Fairchild Semiconductors
A great opportunity to meet Semiconductor, LED and PV companies from all over the
world and to hear about their future technological advancements.
Vice President Central Operation at SMIC.
BUILD
RELATIONSHIPSTI
THAT MATTER
15+Thought-provoking sessions and workshops with
industry thought leaders.
SIP | 01
Take home real world ideas and best practices to implement
at your site.
3. Delegates | 02
ConferenceProgrammeDayOne
Presentations&InteractiveSessionsLedBy
www.worldbil.com/CTIP2015
Rajan Raj gopal
Vice President Global Quality
Josef Riedlberger
Senior Manager
Bruce Yu
Vice President /Central Operation
Ventaka Simhadri
CEO
Daren Keller
Principle R&D Engineer
Qian Sun
Vice President
Tjerk Reijenga
Principal
Paul Ni
VP of Technology and
R&D
Wenqi Zhang
Technical Director, National Center
For Advanced Packaging
Alan Zhen Zhou
Co-Founder / CEO
4. Programme Day One | 03
Conference Programme Day One
www.worldbil.com/SIP2015
How To Minimize An IC Chip's Time To Market? What A Semiconductor
Foundry Can Do.
Hong Wu, Asst. R&D Director, SMIC.
KeynotePresentation1
08:45 - 09:15
KeynotePresentation2
09:15 - 09:45
KeynotePresentation3
09 : 45- 10:15
Development In Lean Manufacturing To Support Operational Productivity.
Daren Keller, Principle R&D Engineer, Fairchild Semiconductor.
KeynotePresentation5
13:50 -14:20
KeynotePresentation 6
14:20 -14:50
Intellectual Property.
Meng-Chun Kuo, Director , Epistar.
KeynotePresentation7
16:30-17: 00
KeynotePresentation8
17:00 -17:30
10:15 -11:55 Networking Coffee Break
PartnerPresentation1
12:25 - 12:55
TBC.
Thomas Gebhart, CEO, Semiconsulting Process Engineering .
14:50 -16:30 Networking Coffee Break
07:30 - 08:30 RegistrationOpens
Chair Closing Remarks & End Of Day One17:30 -17:45
KeynotePresentation4
11:55 - 12:25
Challenges In Module Manufacturing From a Designer Perspective.
Tjerk Reijenga, Principal, Bear Id Sustainable Urban Planners + Architects.
Enabling 3D Packaging Through Collaborative Innovation In Chinese Industry.
Wenqi Zhang, Technical Director, National Center For Advanced
Packaging (NCAP China).
Development Of Innovative Technologies For Advancing Productivity And Performance.
Ventaka Simhadri, CEO, Gigacom Semiconductor.
12:55 -13:50 Networking Lunch
08:30 - 08:45 Chairman’sWelcomeRemarks
Exploring Strategies For Improving Quality In Semiconductor Manufacturing
Process.
Rajan Rajgopal, Vice President Global Quality, Micron Technology.
How Effective Testing Can Improve Yield Of Semiconductor Manufacturing.
Josef Riedlberger, Senior Manager, NXP Semiconductor.
5. Programme Day Two | 04
Conference Programme Day Two
www.worldbil.com/SIP2015
KeynotePresentation9
08:45 - 09:15
KeynotePresentation10
09:15 - 09:45
KeynotePresentation11
09: 45- 10:15
IoT Could Be A Perfect Business Enabler Of 8'' Fab.
Antonio J Jara, CEO, HOP Ubiquitous .
KeynotePresentation13
13:50 -14:20
KeynotePresentation 14
14:20 -14:50
Copper Pillar Bumping Technology - The Promising Ecosystem Changer.
Meng-Chun Kuo, Director , Epistar.
KeynotePresentation15
14:50 -15: 20
10:15 -11:55 Networking Coffee Break
PartnerPresentation2
12:25 - 12:55
TBC.
Benvenuti Giacomo, Founder, ABCD Technology.
07:30 - 08:30 RegistrationOpens
Chair Closing Remarks & End of SIP - See You Next Event!17:00
KeynotePresentation12
11:55 - 12:25
New Developments In LED And OLED Lighting Industry.
Ma Dongge, Professor, Chinese Academy Of Sciences.
Manufacturing Of High Efficiency Solar Cell.
Paul Ni, VP of Technology and R&D, Talesun Solar Co. Ltd.
12:55 -13:50 Networking Lunch
08:30 - 08:45 Chairman’sWelcomeRemarks
Impact Of IoT On Semiconductor Device, Process And Packaging.
Alan Zhen Zhou, Co-Founder / CEO, Belleds Technology.
GaN-on-Silicon For LED Lighting And Power Electronics.
Qian Sun, VP Of GaN-on-Si LEDs, Lattice Power Corporation.
IoT And Wearable.
Yifeng Zhang, CTO, Quintic Corporation.
15:20 -17:00 Networking Coffee Break
6. Sponsorship Package | 06
WBI | Semiconductor Innovation Programme
A Package
Full of Possibilities
MAKE A
SMART INVESTMENT
FOR YOUR FUTURE
ROI
€$ £¥
* Plus applicable VAT and service charges of 2.5%
Phone:
Fax:
Email:
+44 (0) 207 789 1100
+44 (0) 207 980 4989
info@worldbil.com
• Assembly and Packaging
• Clean Rooms
• Component Fabrication
• Thermal Solutions
• Software
Sponsorship Categories
• Materials and Substrates
• Mechanical Systems
• Metrology, Inspection and Monitoring
• Sensors and Controllers Test
• Analogue And Digital Signals
Business
Development
Marketing&
Branding
Meeting
Partner
Branding on website & forum literature
150 words catalogue profile
Full list of delegates with profiles
A4 page advert in SIP event brochure
Attendance to the conference programme
Lunch & Gala dinner seats
On-site personal account manager
Post event follow up report
Number of Attendees
£ 5, 990
1
8
Delegate
Partner
1
-
£1,490Investment
One-on-One Meetings
Sponsorship Packages
