Data Capture Hardware.pdf

Sample on Global Data Capture Hardware Market - Global Industry
Analysis, Size, Share, Growth Opportunities, Future Trends, Covid-19
Impact, SWOT Analysis, Competition and Forecasts 2022 to 2030

Copyright @ 2022, Contrive Datum Insights Page 2
Global Data Capture Hardware Market, 2023-2030
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Projectinitiation
Secondary
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with panel of
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Post-delivery
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Market Size Estimation
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Data Source
Secondary Sources
In the secondary research process, various secondary sources, such as D&B Hoovers,
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information for this study. Secondary sources included annual reports, press releases, and
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 To validate our data in terms of accuracy and acceptability
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 Olympus
 Otsuka Holdings Co., Ltd.
 Etcetera
 Others
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Data Triangulation Techniques
Source: Secondary Literature, Expert Interviews, and Contrive Datum Insights Analysis 2023
Data Source Triangulation
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from multiple type of
secondary and primary
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After arriving at the overall market size using the market size estimation processes as explained
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demand and supply sides.
Global
Market
Value
Add up all Country Market Sizes
to Derive Regional Market Size
Market Size for a Country = Add up of Total
Company Revenues
Primary: Demand and Supply Side Experts
Secondary: Annual Reports, Presentations,
Press Release, Journals, Paid Databases,
and A2Z Market Research database
Primary: Demand & Supply Side Experts
Secondary: Annual Reports, Presentations,
Press Releases, Journals, Paid Databases,
and A2Z Market Research database
Bottom-upApproach (Segmental Analysis) Global Market

Top Down Approach
Report Objectives
 To define, describe, and forecast the {Keyword} Market by segments, and region
 To provide detailed information about the major factors (drivers, restraints, opportunities,
and challenges) influencing the growth of the market
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contributions to the total market
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landscape of the market
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as North America, Europe, Asia Pacific (APAC), Middle East & Africa and South America.
 To profile the key players and comprehensively analyze their recent developments and
positioning in {Keyword} market.
Global Market ($ Million)
Geographical Split
Percent Split for Type and
Application Segments for
Market
Country Split
Global Market Size Through Primaries(Demand and
Supply Side Experts)
Secondary: Annual Reports, Presentations, Press
Release, Journals, Paid Databases, and A2Z Market
Research
Secondary: Annual Reports, Presentations, Press
Release, Journals, Paid Databases, and A2Z Market
Research database
Primary: Demand &and Supply Side Experts
Secondary: Company Websites, Press Releases, and
News Articles
Top-Down Approach (SegmentalAnalysis) Global Market

 To analyze competitive developments, such as mergers and acquisitions, new product
developments, and Research and Development (R&D) activities, in the market

Market Overview
Market Synopsis
Thermo compression bonder, also known as diffusion bonding, pressure bonding, hot compression
welding, and solid welding, is a method for connecting wafers. Thermal compression machines use
pressure and vacuum to bond or fuse together semiconductor wafers. As the crystal lattice vibrates,
atoms approach one another. These atomic contacts hold together interfaces. Surface diffusion, particle
boundary diffusion, and bulk diffusion are the three common terms for diffusion processes. The concept
behind this technology is to employ a rapid temperature rise followed by a rapid temperature drop,
resulting in extremely precise processing at high speeds. These devices are also available in semi-
automatic and fully-automatic configurations. It provides the same functionality as wire bonding, but at
a much higher throughput because no human processes or specialized apparatus are required.
"The semiconductor industry will propel market expansion"
Increasing demand from a variety of end-user segments, such as semiconductor, flat panel display (FPD),
photovoltaic (PV) cell, and packaging substrate, is one of the main trend factors driving this expansion.
More and more semiconductor manufacturing processes are being outsourced, resulting in a rise in
demand for thermal compression. Increasing requirements for automation in manufacturing processes,
increasing popularity of automated equipment, and increasing government support for expansion of
production capacity are the main trends that are driving the market and serving as a catalyst for market
growth. Traditional producers are under greater pressure than ever before to adopt cutting-edge
technologies and restructure their operations and organizations as a result of rising demand and
competitive pressures. In addition, industry is a significant trend driving commodity sales.
Request Sample Copy of Report “Thermo Compression Bonder Market Insights, Size, Share,
Growth, Future Trends, Covid-19 Impact, SWOT Analysis, Top Key Players and Industry
Forecasts 2022 to 2030”, published by Contrive Datum Insights.
Key Developments
In June of 2019, ASE, TSMC, Leti/STMicroelectronics, and a few other companies described recent
advancements in advanced IC packaging, such as 3D, 2.5D, and fan-out technologies, which support high
bandwidth memory (HBM).
In 2019, Alter Technology UK invested in ball bonder apparatus to expand the capacity of wire bonding
operations. The IConn ProCu PLUS (automatic ball bonder) features an ultra-fine pitch of 40 microns for
copper wire diameters spanning from 15 to 30 microns, as well as bonding capabilities for gold wire with
a pitch of 35 microns and a diameter of 15 microns.

In July 2021, Amkor Technology, Inc. supplied TSMC company with wire bond and flip chip packaging for
0.13-micron, low-k processes-based advanced devices.
In August 2021, QP Technologies installed a Bondjet BJ855 fine wire wedge bonder and a Bondjet BJ939
heavy wire wedge bonder to provide fully automated assembly processing for RF and high-frequency
components, chip-on-board (COB), multichip modules (MCM), hybrids, optical, and automotive
electronics.
In 2021, Würth Elektronik GmbH & Co. The company's primary objective in the global electronic
semiconductor market is to consolidate its dominant market share and position.
In the report on the global wire bonding market, we discuss individual strategies, followed by profiles of
sputtering target suppliers. The 'Competition Landscape' section of the report has been included to
provide readers with a comprehensive view and company market share analysis of the major players
operating in the global wire bonding market.
Regional Outlook:
Geographically, the global Thermo Compression Bonder market has been divided into North America,
Europe, Asia-Pacific, Latin America, and the Middle East and Africa (MEA).
With a CAGR of 5.5% between 2022 and 2030, Asia-Pacific is expected to be the fastest-growing region.
This growth can be attributed to the increasing demand for thermo compression bonder in various
applications. China is anticipated to remain a significant market in the Asia-Pacific region as construction
activities increase due to its large manufacturing sector and rapid urbanization. In addition, India has
experienced substantial growth over the past few years, as well as the opposite influence of the
economic policies pursued by each government over the past few years.
Asia-Pacific grew at a 5.7% CAGR between 2008 and 2030, trailing Europe. This is predominantly
attributable to the account recovery witnessed in 2016/2017, following a severe economic downturn in
2008/09. And despite the fact that the European construction industry still confronts a number of
obstacles, such as Brexit, high unemployment, and stringent environmental regulations, it is expected to
expand at a moderate rate during the forecast period.
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Market Scope
On the basis of By Type, the market has been segmented as follows:
 Automatic Thermo Compression Bonder
 Manual Thermo Compression Bonder
On the basis of By Application, the market has been segmented as follows:
 IDMs
 OSAT
On the basis of Companies
 ASMPT (AMICRA),
 K&S,
 Besi,
 Shibaura,
 SET,
 Hanmi,
 others.
On the basis of Geography
 NORTH AMERICA
 EUROPE
 ASIA PACIFIC
 MIDDLE EAST AFRICA
 SOUTH AMERICA
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