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4/16/2014 MS&T VISA Page
http://apps.aist.org/asp/visaletters/mst.aspx 1/1
16 Apr 2014
PRASHANT KUMAR
INDIAN INSTITUTE OF TECHNOLOGYB.H.U VARANASI
166 E Nankari
I.I.T KANPUR
166 E Nankari
KANPUR UTTAR PRADESH 208016
India
Passport #: Z2673173
Passport Exp Date: 07-Oct-2013
Date of Birth: 09-Mar-1992
To: United States of America Embassy in India
Subject: Invitation to MS&T14, 12-16 October 2014, Pittsburgh, Pa., USA
On behalf of the sponsoring organizations (ACerS, AIST, ASM, and TMS), we look forward to your participation at MS&T14, the most
comprehensive forum for materials science and engineering technologies.
MS&T’14 is being held 12–16 October 2014, at the David L. Lawrence Convention Center in Pittsburgh, Pa., USA. With technical sessions,
exhibition floor and 3,000 expected attendees, MS&T14 represents a unique opportunity to explore a broad spectrum of activity in the
materials science community.
As the sponsoring organizations are nonprofit, it is understood that all expenses related to attendance, such as travel, lodging and registration
fees, are the responsibility of the attendee.
I am confident that attendance and participation in MS&T14 will be informative and productive. We look forward to seeing you in Pittsburgh in
October.
On behalf of MS&T,
Ronald E. Ashburn
Executive Director

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MS&T MEETING INVITATION LETTER

  • 1. 4/16/2014 MS&T VISA Page http://apps.aist.org/asp/visaletters/mst.aspx 1/1 16 Apr 2014 PRASHANT KUMAR INDIAN INSTITUTE OF TECHNOLOGYB.H.U VARANASI 166 E Nankari I.I.T KANPUR 166 E Nankari KANPUR UTTAR PRADESH 208016 India Passport #: Z2673173 Passport Exp Date: 07-Oct-2013 Date of Birth: 09-Mar-1992 To: United States of America Embassy in India Subject: Invitation to MS&T14, 12-16 October 2014, Pittsburgh, Pa., USA On behalf of the sponsoring organizations (ACerS, AIST, ASM, and TMS), we look forward to your participation at MS&T14, the most comprehensive forum for materials science and engineering technologies. MS&T’14 is being held 12–16 October 2014, at the David L. Lawrence Convention Center in Pittsburgh, Pa., USA. With technical sessions, exhibition floor and 3,000 expected attendees, MS&T14 represents a unique opportunity to explore a broad spectrum of activity in the materials science community. As the sponsoring organizations are nonprofit, it is understood that all expenses related to attendance, such as travel, lodging and registration fees, are the responsibility of the attendee. I am confident that attendance and participation in MS&T14 will be informative and productive. We look forward to seeing you in Pittsburgh in October. On behalf of MS&T, Ronald E. Ashburn Executive Director