Discover cutting-edge IC packaging solutions in Singapore with Intech Technologies. Our advanced packaging services ensure optimal performance and reliability for your integrated circuits. Trust us for innovative technology and precision in semiconductor packaging. Explore Intech today for world-class IC packaging services.
2. Intech Technologies International, based in
Singapore since 2008, boasts over 15 years of
experience in providing innovative prototype
build, IC packaging services and assembly
solutions, and semiconductor services. Our
expertise in wafer preparation includes back
grinding, dicing, and die sorting. Additionally, we
offer die attach and wire bonding services using
aluminum and gold. Our capabilities extend to
reliable semiconductor failure analysis, further
bolstering product reliability and quality. Having
successfully executed over 200 device
production runs and over 1,000 unique assembly
jobs, we’ve catered to a diverse customer base,
including over 1,200 satisfied customers, with a
significant focus on serving universities and
research institutes globally.
WE ARE INTECH
TECHNOLOGIES
INTERNATIONAL
3. PACKAGE ASSEMBLY
Intech Technologies International leads the industry in package assembly, providing
precise and efficient solutions for semiconductor packaging.
4. Die attach is a critical process in semiconductor
packaging, where the die or chip is securely
bonded to the substrate or package. It plays a
crucial role in ensuring the electrical and
mechanical integrity of the packaged device. Die
attach methods include adhesive bonding, solder
attach, and solder reflow flip-chip bonding, each
offering distinct advantages and considerations.
DIE ATTACH &
DIE BONDING
5. Die Attach & Die Bonding Services We Offer
Adhesive Bonding (Epoxy Die Attach):
● Uses epoxy adhesives for a reliable bond.
● Offers good electrical insulation and stability.
● Suitable for diverse applications with good thermal conductivity.
Solder Attach:
● Uses solder materials for high thermal conductivity.
● Ideal for devices requiring strong bonds and good electrical conductivity.
Solder Reflow Flip-Chip Bonding:
● Specialized for flip-chip packaging.
● Provides high-density connections and compact size.
● Regardless of the method, factors like die size, substrate material, and reliability are crucial.
Intech's Die Attach Services:
● Offers adhesive bonding, solder attach, and solder reflow flip-chip bonding.
● Emphasizes expertise, advanced equipment, and quality control.
● Ensures high-quality, reliable semiconductor packaging.
● Trusted partner for secure and accurate die attachment.
6. Intech Technologies, a leading provider of
semiconductor assembly and packaging
solutions, offers a comprehensive range of
advanced wire bonding services. Our expertise
includes various wire bonding techniques, such
as ball bonding, wedge bonding, down bonding,
reverse bonding, and stud bumping. With state-
of-the-art equipment and a team of skilled
professionals, we deliver high-quality wire
bonding solutions for diverse applications in the
semiconductor industry. WIRE BONDING
7. Wire Bonding Services We Offer
Ball Bonding:
● Precise attachment of gold wires for robust connections.
● 0.8 mil wire diameter, ensuring excellent electrical conductivity and mechanical strength.
Wedge Bonding:
● Expertise in aluminum wedge bonding for reliable, cost-effective connections.
● 0.7 mil wire diameter with 3 sigma control for consistent results.
Down Bonding:
● Specialized technique for vertical connections with various wire materials and sizes.
Reverse Bonding:
● Known as stitch bonding, connecting wires to the reverse side of bond pads for specific applications.
Stud Bumping:
● Specialized wire bonding for flip-chip packaging with gold bumps for high-density interconnections.
8. Wire Bonding Services We Offer
COB Bonding:
● Chip-on-Board bonding for mounting semiconductor chips directly onto substrates, offering cost-effective solutions.
SIP Bonding:
● System-in-Package bonding integrates multiple components for highly functional and miniaturized solutions.
Die Bonding:
● Critical process in semiconductor assembly for precise positioning and attachment of chips to substrates.
Gel Pak Bonding:
● Specialized technique for handling and protecting sensitive components during assembly using gel paks.
Flip Chip Bonding:
● Technology for high-density interconnections, specializing in both solder attach and solder reflow processes.
9. Intech Technologies is a leading provider of
semiconductor assembly and packaging
solutions, offering a wide range of advanced
services to meet the diverse needs of the
industry. One of our key offerings is epoxy
encapsulation, a crucial process in semiconductor
packaging that provides protection, environmental
isolation, and mechanical support to delicate
electronic components. With our expertise in
epoxy encapsulation, we ensure the highest
quality and reliability for your encapsulation
needs.
EPOXY
ENCAPSULATION
10. Importance of Epoxy Encapsulation:
Epoxy encapsulation is crucial for safeguarding semiconductor devices from environmental factors, enhancing durability,
extending lifespan, and improving overall performance.
Epoxy Encapsulation Process at Intech:
● Material Selection:
Careful choice of epoxy resins based on thermal conductivity, electrical insulation, adhesion, and resistance to environmental
factors.
● Dispensing:
Uniform coverage of epoxy onto the semiconductor device to minimize voids or air bubbles.
● Curing:
Controlled heating process for optimal hardness and stability.
● Trimming and Finishing:
Precision trimming and finishing for accurate dimensions and a professional appearance.
Customized Solutions:
Intech provides tailored epoxy encapsulation services, including standard, low-stress, or hermetic sealing, addressing unique
application needs for exceptional protection and reliability.
11. Intech Technologies is a trusted provider of
semiconductor packaging solutions, offering a
wide range of advanced services to meet the
diverse needs of the industry. We specialize in lid
assembly for open cavity plastic packages,
providing customized solutions for both ceramic
and plastic lids. With our expertise and state-of-
the-art facilities, we ensure the highest quality
and reliability for your lid assembly requirements.
LID ASSEMBLY
&
PACKAGE
SEALING
12. Importance:
Crucial for protecting electronic components from external factors like moisture and dust, ensuring
optimal performance and reliability.
Ceramic Lids for Enhanced Protection:
● Provide superior protection with excellent thermal and mechanical properties.
● Highly resistant to temperature fluctuations, moisture, and chemicals.
● Precision placement and bonding for a hermetic seal, enhancing reliability.
Plastic Lids for Cost-Effective Solutions:
● Cost-effective alternative suitable for less stringent environmental conditions.
● Options include epoxy molding compounds (EMC) and other polymers.
● Expertise in precise placement and bonding to maintain device integrity.
Customized Lid Assembly Solutions:
● Tailored lid assembly to meet specific application needs, including hermetic sealing and low-
profile lids.
● Focus on exceptional protection and reliability in customized solutions.
13. Quality Assurance and Reliability:
● Adherence to stringent quality control processes.
● Advanced equipment, skilled technicians, and comprehensive testing.
● Ensures accurate placement, secure bonding, and reliable protection.
Applications of Lid Assembly:
● Widely used across industries like automotive, aerospace, telecommunications, and
medical devices.
● Common for packaging ICs, sensors, microcontrollers, and semiconductor devices
requiring environmental protection.
Environmental Considerations:
● Commitment to eco-friendly practices with recyclable materials.
● Adherence to regulatory standards for sustainable lid assembly solutions.
