1. List of publications:
1. European Master Programs in Nanoelectronics and Microsystems, Ivan Ring Nielsen et al, Proceedings of the 10th
European Workshop on Microelectronics Education, 2014
2. Trends in University Programs in Nanoelectronics and Microsystems, Ivan Ring Nielsen et al, Proceedings of the 31st
IEEE NORCHIP Conference, 2013
3. EuroTraining - Supporting University Programmes in Nanoelectronics, Ivan Ring Nielsen et al, Proc. 8th European
Workshop on Microelectronics Education, pp. 86-88, Darmstadt, Germany, May 10-12, 2010
4. A model for the development of university curricula in nanoelectronics, Ivan Ring Nielsen et al, European Journal of
Engineering Education, Taylor & Francis, vol. 35, pp 655-666, Dec. 2010.
5. University Curricula in Nanoelectronics, Ivan Ring Nielsen et al, Proc. 20th EAEEIE Annual Conference (European
Association for Innovation in Education for Electrical and Information Engineering), pp. 1-6, Valencia, Spain, May 22-24,
2009.
6. Presentation of a Nanoelectronics Curricula Study , Ivan Ring Nielsen et al, Proceedings of the 7th European Workshop on
Microelectronics Education, EWME 2008, Budapest, Hungary, ISBN
7. Multicore Processing and ARTEMIS - An incentive to develop the European Multiprocessor research, Ivan Ring Nielsen, et
al, IST Conference 2006, Helsinki, Finland
8. Survey on Lead Free Solder Systems, Environmental Project No. 778, 2003, EPA
9. SoC-Mobinet –A project for Collaborative System-on-Chip Curricula Development with Industrial Support, Ivan Ring
Nielsen et al, Proceedings of the 4th European Workshop on Microelectronics Education, EWME 2002, Baiona, Spain,
ISBN 84-267-1325-4
10. Environmental and Technical Characteristics of Conductive Adhesives versus Soldering, ISBN 87-982637-3-0, 2000,
Report 16/2000, Miljøstyrelsen
11. Continued microelectronics training for the future, Ivan Ring Nielsen et al, BEC Conference Proceedings, 2000, Tallinn,
Estonia
12. Managing Microelectronics Education for the Future and Tackling the Information Overflow, Ivan Ring Nielsen et al,
Springer Journal on Microelectronics Education, 2000, pp 235-238
13. The Nordic Electronics Packaging Guideline (editor), IVF, Sweden 2000
14. Environmental and technical characteristics of conductive adhesives versus soldering, Ivan Ring Nielsen et al, Danish
Environmental Protection Agency, Report 16/2000
15. Microsensor for ammonia", Ivan Ring Nielsen et al, 12th International Symposium by the Society for Analytical Chemistry
(SAC) 99, July 1999, Dublin, Ireland.
16. Adoption and utilisation of ASIC technologies in European SMIs, Ivan Ring Nielsen et al, 7th IEEE ASIC Conference and
Exhibit, Rochester, NY, USA, 1994, ISBN: 0-7803-2020-4
17. Conductive adhesives as solder replacement. ISBN 87-984446-1-1, 1993
18. Handbook on Processing Data in Municipal and Industrial Waste Water Systems (editor). ISBN 87-984446-0-3, 1993
19. Analog Integrated Circuits and Signal Processing journal, Springer Academic Publishers, Boston (Since 1992 editor on
several issues). ISSN 0925-1030
20. IEEE NORCHIP Conference Proceedings (annual editor since 1987) ISBN 87-982637-0-6
21. Assessmens of Ship Performance in a Seaway, 1987 (editor). ISBN 87-982637-1-4
Client references:
1. ABB Corporate Research, Norway and Sweden
2. Nokia Research Center Oy, Finland
3. The Nordic Fund for Technology and Industrial Development, Norway
4. CEA-LETI, France
5. Fraunhofer Gesellschaft - IIS, Germany
6. Ericsson Components AB, Sweden
7. I Krüger AS, Denmark
8. The Danish National Agency of Industry and Trade, Denmark
9. The European Commission
10. CNM, Spain
11. DELTA, Denmark
12. Brüel & Kjær A/S, Denmark
13. MODULEX A/S, Denmark
14. Technical University of Denmark (MIC, Elektro, IMM), Denmark
15. Technical University of Tampere, Finland

2. 16. Technical University of Helsinki, Finland
17. University of Oslo, Norway
18. Norwegian University of Science and Technology, Norway
19. Lund University, Sweden
20. Swedish Institute of Microelectronics, IM, Sweden
21. Ericsson Telecom AB, Sweden
22. ABB Automation AB, Sweden
23. Danfoss A/S, Denmark
24. Elbau A/S, Denmark
25. Design and Reuse SA, France
26. Edacentrum GmbH, Germany
27. Water Quality Institute, VKI, Denmark
28. MODULEX Software A/S, Denmark
29. Nokia Mobile Phones Oy, Finland
30. VTT Semiconductor Laboratory, Finland
31. VTT Electronics Laboratory, Finland
32. Fincitec Oy, Finland
33. Nordic VLSI AS, Norway
34. ABB Fläkt AB, Sweden
35. SINTEF Electronics & Cybernetics, Norway
36. The Swedish Institute of Environmental Research, IVL, Sweden
37. ABB Environmental Control AS, Norway
38. Danish Maritime Institute, Denmark
39. Danish Hydraulic Institute, Denmark
40. CME, The Netherlands
41. IAM, Germany
42. Alcatel Microelectronics, Belgium
43. Swedish Gate Arrays AB, Sweden
44. SensoNor ASA, Norway
45. Navision Software A/S, Denmark
46. MICROTRONIC A/S, Denmark
47. IMEC vzw, Belgium
48. Chalmers University of Technology, Sweden
49. The Environmental Protection Agency, Denmark
50. NKT Research Center, Denmark
51. Grundfos, Denmark
52. Technology for Industry, UK
53. ITEK, Denmark
54. Royal Institute of Technology, Sweden
55. University of Turku, Finland
56. Ministeriet for Videnskab, Teknologi og Udvikling
57. RFIDSec A/S, Denmark
58. COREP, Italy
59. BME, Hungary
60. LETI/IPNG/Minatec, France
61. STMicroelectronics, Italy
62. Sensocure as, Norway