1. DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not
bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The
quoted trademarks are property of their owners.
© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 1
Electronic Costing & Technology Experts
www.systemplus.fr
21 rue la Nouë Bras de Fer
44200 Nantes – France Phone : +33 (0) 240 180 916 email : info@systemplus.fr
September 2013 Version 1 – Written by Sylvain HALLEREAU

2. Infineon – F600R07A2E3 HybridPACK
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© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 2
Glossary
1. Overview / Introduction 4
– Executive Summary
– Reverse Costing Methodology
2. Company Profile 8
3. Physical Analysis 14
– Synthesis of the Physical Analysis
– Package analysis
– Characteristics and marking
– Housing
– Base Plate Cross-Section
– DBC Cross-Section
– IGBT Analysis
– Dimension
– Guard Ring
– Trench Gate Cross-Section
– Revelation
– Diode Analysis
– Dimension
– Guard Ring
– Revelation
4. Manufacturing Process Flow 54
– Overview
– IGBT and Diode Process Flow
– Description of the Wafer Fabrication Units
– IGBT Process Flow
– Diode Process Flow
– Package Process Flow
5. Cost Analysis 66
– Synthesis of the Cost Analysis
– Main Steps of Economic Analysis
– Yields Explanation
– Cost Analysis IGBT
– Wafer Cost Hypothesis
– IGBT Wafer Cost
– Breakdown per process step
– IGBT Equipment Cost per Family
– IGBT Material Cost per Family
– IGBT Probe Cost
– IGBT Die cost
– Cost Analysis Diode
– Cost Analysis FS600R07A2E3
– Assessing BOM
– DBC Cost
– FS600R07A2E3 Module Cost
– Yield Synthesis
6. Estimated Manufacturer Price Analysis 101
– Manufacturers ratios
– Estimated manufacturer Price
Contact

3. Infineon – F600R07A2E3 HybridPACK
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The reverse costing analysis is conducted in 3 phases:
Teardown
analysis
• Module is analyzed and measured.
• The dies are extracted in order to get overall data: dimensions, pad number, die marking.
• Set up of the manufacturing process.
Costing
analysis
• Setup of the manufacturing environment.
•Cost simulation of the process steps with different year scenarios.
Selling price
analysis
• Supply chain analysis.
• Analysis of the selling price.

4. Infineon – F600R07A2E3 HybridPACK
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The FS600R07A2E3 power module is a 3-phase Six-Pack configuration of 650V 600A.
Pin-Fin baseplate for direct liquid cooling
which significantly improves the thermal
cycles capability and extends the lifetime of
the power module. The Pin-Fin baseplate with
its excellent cooling properties enables a very
high power density of the HybridPACK™ 2
package. (Infineon Datasheet)

5. Infineon – F600R07A2E3 HybridPACK
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© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 5
Aluminum layer
Thickness: xxµm
Oxide layer 1
Thickness: xxµm
Oxide layer 2
Thickness: xxµm
Polysilicon layer
Thickness: XXµm
Guard Ring : Cross-Section SEM view
Guard Ring : Cross-Section SEM view
Aluminum layer
Thickness: xxµm
Polyimide layer
Thickness: xxµm
Silicon

6. Infineon – F600R07A2E3 HybridPACK
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© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 6
• The final IGBT die cost is between $xx and $xx according to yield
variations.
• The test and yield losses costs represent xx% of the total
manufacturing cost.
– The die cost includes the rejects at probe test and dicing.
– The yield losses represent the rejected finished dies cost.

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© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 7 Power-One TRIO-27.6-TL
• The Reverse costing analysis represents the best cost/price evaluation given the publically available
data, completed with industry expert estimates.
• These results are open for discussion. We can re-evaluate this circuit with your information. Please
contact us: