Bosch BME280 environmental sensor is the evolution of BMP280 pressure sensor. Assembled in a 8-pins LGA 2.5 x 2.5 x 0.93mm package, the BME280 is a digital humidity, pressure and temperature sensor equipped with two MEMS dies and an amplification ASIC. It is designed by CMOS process and it has operating ranges of -40…+85°C, 0…100 % relative humidity and 300…1100 hPa. The MEMS pressure sensor is manufactured with Bosch APSM process with the flexible pressure membrane and temperature diodes on Si substrate. The relative humidity sensors presents an innovative resistive measurement technology which allows a very fast and precise response in very compact size. This device represents a new type of combo sensor for mobile phones: its open package is a quite new features respect to close packaged combos. In the report it is performed a exhaustive package analysis. The report presents deep technological and cost analysis of BME280 and a technical comparison with BMP280 MEMS and ASIC and with Sensirion SHTC1 humidity MEMS. More information on that report at http://www.i-micronews.com/reports.html

1. DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not
bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The
quoted trademarks are property of their owners.
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Electronic Costing & Technology Experts
www.systemplus.fr
21 rue la Nouë Bras de Fer
44200 Nantes – France Phone : +33 (0) 240 180 916 email : info@systemplus.fr
February 2015 – Version 1 – Written by Elena Barbarini

2. Bosch BME280 barometric pressure sensor
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Glossary
1. Overview / Introduction 4
– Executive Summary
– Reverse Costing Methodology
2. Company Profile 7
– Bosch Sensortec
– BME280 Characteristics
3. Physical Analysis 13
– Synthesis of the Physical Analysis
– Physical Analysis Methodology
– Package 16
– Package Views, Dimensions & Pin Out
– Bond Pad Opening & Bond Pad
– Package Opening
– Package Cross-Section
– ASIC 28
– View, Dimensions & Marking
– Delayering
– Main Blocks Identification
– Process Identification
– Cross-Section
– Process Characteristics
– MEMS Pressure 40
– View, Dimensions & Marking
– Sensing Area Details
– Cross-Section
– Process Characteristics
– MEMS Humidity 55
– View, Dimensions & Marking
– Sensing Area Details
– Cross-Section
– Process Characteristics
4. BME280 Vs BMP280 Comparison 62
5. BME280 Vs Sensirion SHTC1 Comparison 66
6. Manufacturing Process Flow 69
– Global Overview
– ASIC Process Flow
– ASIC Wafer Fabrication Unit
– MEMS Pressure Process Flow
– MEMS Pressure Wafer Fabrication Unit
– MEMS Humidity Process Flow
– MEMS Humidity Wafer Fabrication Unit
– Packaging Process Flow & Assembly Unit
7. Cost Analysis 85
– Synthesis of the cost analysis
– Main steps of economic analysis
– Yields Hypotheses
– ASIC 90
– ASIC Front-End Cost
– ASIC Die Cost
– MEMS Pressure 95
– MEMS Front-End Cost
– MEMS Front-End Cost per process steps
– MEMS Probe Test & Dicing Cost
– MEMS Wafer & Die Cost
– MEMS Humidity 104
– MEMS Front-End Cost
– MEMS Front-End Cost per process steps
– MEMS Probe Test & Dicing Cost
– MEMS Wafer & Die Cost
– Packaging Cost 119
– Back-End : Final Test & Calibration Cost
– BME280 Component Cost
8. Estimated Price Analysis 116
– Manufacturer Financial Ratios
– Estimated Selling Price
Contact 122

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• This full reverse costing study has been conducted to provide insight on technology data,
manufacturing cost and selling price of the BME280 integrated environmental sensor supplied by
Bosch for mobile application.
• Assembled in a 8-pins LGA 2.5 x 2.5 x 0.93mm package, the BME280 is a digital humidity, pressure
and temperature sensor equipped with two MEMS dies and an amplification ASIC. It is designed by
CMOS process and it has operating ranges of -40…+85°C, 0…100 % relative humidity and 300…1100
hPa
• The MEMS pressure sensor is manufactured with Bosch APSM process with the flexible pressure
membrane and temperature diodes on Si substrate. The relative humidity sensors presents an
innovative resistive measurement technology which allows a very fast and precise response in very
compact size.
• Since BME280 is an evolution of BMP280 sensors, the report presents a comparison between the
ASIC and the MEMS pressure sensors of the two devices.
• The report presents also a comparison with Sensirion Humidity sensor SHTC1.

4. Bosch BME280 barometric pressure sensor
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The reverse costing analysis is conducted in 3 phases:
Teardown
analysis
• Package is analyzed and measured
• The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin
out, die marking
• Setup of the manufacturing process.
Costing
analysis
• Setup of the manufacturing environment
• Cost simulation of the process steps
Selling price
analysis
• Supply chain analysis
• Analysis of the selling price

5. Bosch BME280 barometric pressure sensor
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• Package: metal lid LGA 8-pads
• Dimensions: 2.5 x 2.5 x 0.93 mm
• Pitch: 0.65mm
Package top view Package bottom view
Package Side View
2.5 mm
0.95mm
2.5mm
• Marking: 020
UP
325 µm

6. Bosch BME280 barometric pressure sensor
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7. Bosch BME280 barometric pressure sensor
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• The die marking includes:
CMP460M
2012
<Bosch logo>
MEMS Die Marking

8. Bosch BME280 barometric pressure sensor
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9. Bosch BME280 barometric pressure sensor
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10. Bosch BME280 barometric pressure sensor
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ASIC
Front-End Cost
ASIC
Probe Test Cost
ASIC
Dicing Cost
Packaging Cost
Final Test Cost
Environmental
sensor
• We perform the economic analysis of the IC with the IC Price+ tool.
• We perform the economic analysis of the MEMS and packaging with the MEMS CoSim+ tool.
MEMS
Front-End Cost
MEMS
Probe Test Cost
MEMS
Dicing Cost
Subcontractor
Subcontractor

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12. Bosch BME280 barometric pressure sensor
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13. Bosch BME280 barometric pressure sensor
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14. Bosch BME280 barometric pressure sensor
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15. Bosch BME280 barometric pressure sensor
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Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates
completed by industry experts.
Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the
manufacturing cost (if all parameters are cumulated).
These results are open for discussion. We can reevaluate this circuit with your information. Please contact us:
• Consulting and Specific Analysis
– North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc.
Email: laferriere@yole.fr
– Japan: Yutaka Katano, General Manager, Yole Japan & President, Yole K.K.
Email: katano@yole.fr
– RoW: Jean-Christophe Eloy, President & CEO, Yole Développement
Email: eloy@yole.fr
• Report business
– North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc.
Email: laferriere@yole.fr
– Europe: Fayçal El Khamassi, Headquarter Sales Coordination & Customer Service
Email: khamassi@yole.fr
– Japan & Asia: Takashi Onozawa, Sales Asia & General Manager, Yole K.K.
Email: onozawa@yole.fr
– Korea: Hailey Yang, Business Development Manager, Korean Office
Email: yang@yole.fr
• Financial services
– Jean-Christophe Eloy, CEO & President
Email: eloy@yole.fr
• General
– Email: info@yole.fr